JPH1155009A - Irreversible circuit element - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a miniaturized, high-accuracy, high-performance, high- reliability and noise resistant concentrated constant type irreversible circuit element for mobile communication equipment. SOLUTION: On a ferrite 5 to which a DC magnetic field is impressed, plural central conductors 6 are arranged while being mutually insulated electrically and crossing with each other. Concerning the irreversible circuit element, a resistor element and/or laminated capacitor element 8 is connected between one port of central conductors 6 and the ground, and a laminated capacitor element 8 is connected between the other port and the ground, wherein the laminated plane of the laminated capacitor element 8 on this element is arranged parallel with the rotating axis of the ferrite 5.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a small, surface-mounted, lumped constant type nonreciprocal circuit device, which is a component of a mobile communication device using microwaves.

[0002]

2. Description of the Related Art Non-reciprocal circuit devices such as isolators and circulators are used in mobile communication devices using a frequency band of several hundred MHz to several tens of GHz, that is, PHS (Personal Handy Phone) base stations and mobile phone terminals. Is often used. This element has a function of transmitting microwaves in the forward direction with low loss and blocking microwaves in the reverse direction.

[0003] The nonreciprocal circuit element is required to be small and high in reliability especially in a portable device. That is, it is required that the structure has little malfunction due to external noise and can withstand severe vibration. In order to meet the demand, conventionally, the yoke of the magnetic circuit has a function of an electric field shield, or the inside of the component is fixed with a filler or the like after the component is assembled and completed. Also,
Accurate soldering was required, and a skilled technician was required to respond to this. However, it was still difficult to completely prevent accidents such as short circuits and poor connections.

Further, in the case of a non-reciprocal circuit device used for a high frequency application in a narrow frequency band such as a portable telephone, the fact is that it is not sufficient in spite of particularly requiring high-precision frequency characteristics. The explanation of this point is as follows. Small lumped constant type non-reciprocal circuit elements have been
The ferrite, the center conductor, the laminated capacitance element, the resistance element, and other members are provided in an iron case also serving as a yoke. This non-reciprocal circuit device is usually fine-tuned to complete a target characteristic standard at a specific frequency after the assembly operation is completed.

In other words, the generated magnetic field of the permanent magnet is adjusted by magnetizing and demagnetizing operations, the capacitance is adjusted by trimming the electrode pattern of the capacitor, or the wire ring interval of the air-core coil used together is adjusted. It was a common practice to match the target characteristics with a technique. Regardless of this magnetic field adjustment or capacity adjustment, once disassemble the non-reciprocal circuit element and make adjustments,
The method of assembling again, confirming the characteristics, and disassembling and adjusting has been adopted.

However, as long as such an adjusting means is employed, the variation caused by the assembling work must be excluded from the adjustment, so that the precise adjustment has to be abandoned. The non-reciprocal circuit element in which the wire spacing of the air-core coil is adjusted after the assembling work is liable to change in characteristics due to vibration, and is not practical in a mobile communication portable device.

In order to improve the efficiency of the adjustment work and the accuracy of the adjustment, a hole is temporarily formed in the upper part of the metal case of the non-reciprocal circuit element, and the electrode pattern of the horizontally fixed semi-fixed capacitor is replaced with the hole. If the capacitor is to be trimmed, the pattern of the capacitor must not be at least shadowed by a permanent magnet or the like, and must be spaced apart outside the permanent magnet. In other words, the size of the parts increases, and it is far from market demand. Further, the chips generated as a result of the trimming are scattered in the parts and cause a short circuit accident, which is a fatal defect in reliability. As a result, the above-described adjustment method is not practical at all.

Therefore, in order to adjust the performance variation to the target performance in the characteristic adjustment work, it is necessary to adjust the components with a great deal of time and labor when arranging the components, and the adjustment can be performed only with insufficient accuracy. This has resulted in delays in automation of production, securing reliability, performance of parts, accuracy, price, etc. in the product field, and has been a major factor hindering the development of this product field.

[0009]

In view of such circumstances, the problems to be solved by the present invention with respect to a small lumped constant type non-reciprocal circuit device are as follows.

That is, it is an object of the present invention to provide a non-reciprocal circuit device for a mobile communication device which meets the following requirements. A structure that contributes to downsizing of parts, a reduction in the number of parts, a structure that can accurately perform soldering work and is less likely to be displaced due to soldering work, and is highly resistant to vibration and prevents short circuits. And preferably the capacity adjustment is easy and precise. In addition, the structure must be excellent in performance, have little variation, be a structure that contributes to automation of the manufacturing process, be a structure that contributes to improvement in productivity and production efficiency, and the finished product must have a structure resistant to noise.

[0011]

Means for Solving the Problems As a result of earnest studies to solve the above-mentioned problems, the present inventors have conceived of a non-reciprocal circuit device having a remarkably improved configuration. That is, the first
According to the invention, a plurality of center conductors are arranged in a ferrite to which a DC magnetic field is applied in an electrically insulated state and in an intersecting manner, and a resistance element and / or a multilayer capacitance element are provided between one port of the center conductor and ground. In a non-reciprocal circuit device in which a laminated capacitive element is connected between each of the other ports and the ground, a non-reciprocal circuit element configured by arranging the laminated surface of the laminated capacitive element in parallel with the rotation axis of the ferrite. is there.

In the present invention, the resistor or the multilayer capacitor is an isolator if it is a resistor, and a circulator if it is a multilayer capacitor.
There is no need to distinguish between the two. The essential point of the configuration of the present invention is that the stacked capacitive element is used upright. The term "parallel" means substantially parallel, that is, it has an inclination of 30 degrees or less with respect to the direction of the rotation axis of the ferrite. Hereinafter, this expression is used synonymously throughout this specification unless otherwise defined.

In a second aspect based on the first aspect, the laminated capacitive element is electrically connected to the port or the ground via the first and second copper plates in an insulated state, and The first copper plate includes a first portion that is surface-connected to the outermost opposing electrode of the multilayer capacitive element by solder, a second portion that is connected to the port, and a third portion that is integrally formed with resin. And the second copper plate has
An irreversible structure having a first portion which is surface-connected to the outermost earth-side electrode of the multilayer capacitive element by solder, a second portion which is connected to the ground, and a third portion integrally formed with resin. Circuit element.

The copper plate may be any conductor as long as it is a conductor, and the surface of the copper plate is plated with another metal, Al, F
Other metals such as e, Sn, and Ti, light metals, and compounds thereof may be used. However, if it is copper, solder workability,
Excellent economy, workability, conductivity, and electromagnetic wave shielding.

In the present invention, a fourth portion having external input / output electrodes may be added to the first copper plate.
Alternatively, a fourth portion having an external ground electrode may be added to the second copper plate. And the second part and the third
May overlap.

In a third aspect based on the first or second aspect, the first portion of the first copper plate is arranged near the center conductor, and the first portion of the second copper plate is the non-reciprocal circuit. It is a non-reciprocal circuit device arranged and arranged on the outer surface of the device.

To explain the second and third inventions in another way, a copper plate in which the center conductor and the opposing electrode of the multilayer capacitive element are connected at the shortest distance is disposed inside, and a ground plate is disposed outside. An earth-side copper plate connected at the shortest distance is arranged, and a multilayer capacitive element is sandwiched between them. By adopting this structure, the laminated capacitor element and the conductor of the copper plate are so arranged that the noise component generated from the non-reciprocal circuit element or invading the non-reciprocal circuit element is damped and blocked, that is, the plane of the ferrite capacitor element and the copper plate are parallel to the central axis of the ferrite. It is to arrange the surface.

According to a fourth aspect of the present invention, in any one of the first to third aspects, the resin integrally formed with the third portion of each of the first and second copper plates has a heat resistance of 250 ° C. or more. This is a non-reciprocal circuit device configured using a device having

The gist of the present invention is that the resin integrally formed with the copper plate has heat resistance to withstand the temperature of the molten solder or the temperature of the reflow furnace. More preferably, the resin has water repellency to the molten solder, that is, a resin that repels the molten solder. Examples of such a resin include a liquid crystal aromatic polyester, an epoxy resin, Teflon, a peak resin, and a urea resin.

According to a fifth aspect of the present invention, there is provided the non-reciprocal circuit according to any one of the first to fourth aspects, wherein the resin integrally formed with the third portion of each of the first and second copper plates is formed as a single unit. Element.

According to a sixth aspect of the present invention, in any one of the first to fifth aspects, each port of the center conductor is connected to each port or ground.
This is a non-reciprocal circuit device in which the resin integrally formed with the respective third portions of the respective first and second copper plates is formed as one unit.

In the present invention, the arrangement of the ferrite may be corrected by bringing the resin into direct contact with the outer peripheral side of the ferrite or via a center conductor. For this purpose, it is more preferable to provide an appropriate concave portion in the resin molded product.

Alternatively, the integrally molded product of the copper plate and the resin may be disposed at a position corresponding to each port of the center conductor of the non-reciprocal circuit device, or the resin portion may be integrally formed. Alternatively, a ground plate or a ground-side external electrode may be integrally formed.

According to a seventh aspect of the present invention, in any one of the first to sixth aspects, the multilayer capacitance element is a semi-fixed capacitance element, and the capacitance adjustment unit trims the ground-side electrode on the outermost layer of the multilayer capacitance element. It is a non-reciprocal circuit device formed in a pattern and exposed on the outer surface of the non-reciprocal circuit device.

That is, the laminated capacitive element can be trimmed, and the trimming operation can be easily performed from the side after the non-reciprocal circuit element is assembled and fixed. The metal yoke that hinders the trimming operation is provided at a position excluding the working unit. Therefore, of course, there is only a copper plate locally outside the ground-side electrode of the multilayer capacitive element, and the metal yoke must not be covered.

[0026]

DESCRIPTION OF THE PREFERRED EMBODIMENTS In a non-reciprocal circuit device according to the present invention, a laminated capacitive element is used in a so-called vertical arrangement, that is, in an upright position. First and second copper plates are electrically connected to the opposite side electrode and the ground side electrode of the multilayer capacitive element by soldering, respectively. Naturally, these copper plates are vertically arranged at the above-mentioned connecting portions.

These two copper plates are fixed with resin so that the stacked capacitive elements are just filled between them and that they never short-circuit. Normally, this resin is made into a single unit, not independently for each port. This is because the overall arrangement is more accurate, the number of parts is reduced, and the number of assembly steps is reduced.

Further, the laminated capacitive element is arranged such that the opposing electrode of the laminated capacitive element faces the center conductor side inside the non-reciprocal circuit element (the laminated capacitive element is disposed outside the non-reciprocal circuit element). (The earth side electrode of the element is oriented). That is, the copper plate which is a conductor plate and the internal electrodes of the laminated capacitive element are arranged so as to block the noise arrival direction and the noise emission direction.

With this arrangement, the connection between the multilayer capacitive element and the center conductor becomes the shortest distance. In addition, since there is no extra wiring routing, it goes without saying that the number of parts can be reduced and the size can be reduced, and the antenna function of the wiring can be minimized. The antenna function of the wiring is a disadvantageous phenomenon with respect to transmission and reception of noise.

In particular, when the laminated capacitive element is a semi-fixed capacitive element, the non-reciprocal circuit element is arranged so that a trimming pattern is exposed on the outer surface thereof. Naturally, the trimming pattern is formed on the ground electrode, and the shape of the metal case is determined so that the trimming work area does not cover the metal case.

The structure of the first and second copper plates other than the first portion will be described. The first copper plate is folded back (ie, the second portion) so as to sandwich the extended portion of the center conductor at a portion other than the portion (ie, the first portion) where the opposing electrodes of the multilayer capacitive element are connected by soldering (ie, the first portion). The center conductor is temporarily fixed at this portion, and then the extending portion of the center conductor and the copper plate are fixed with solder and electrically connected. It is more convenient to keep the portion of the conductor facing the folded portion (ie, the second portion) substantially horizontal.

The first copper plate is provided in another portion (ie, the fourth copper plate).
), The external electrodes of the non-reciprocal circuit device are formed. Although this external electrode portion is substantially horizontal, it is more convenient to provide the external electrode on a different plane from the portion facing the folded portion (that is, the second portion). That is, during this time,
For example, it is folded twice.

A part (third part) of the second copper plate other than a part (that is, the first part) other than a part for connecting the ground side electrode of the multilayer capacitive element by soldering (that is, the first part) is integrally formed in a resin. The part (second part) is electrically connected to the ground plate or forms the ground plate, and a part (fourth part) is connected to the ground-side external electrode of the non-reciprocal circuit device or connects the ground-side external electrode. Form.

[0034]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The details of the present invention will be described below based on embodiments. FIG. 1 is an exploded perspective view of a non-reciprocal circuit device for explaining an embodiment of the present invention. FIG. 2 is an enlarged perspective view of the copper plate (10) shown in FIG.

First, an integrally molded product of the first and second copper plates (11, 12) and the resin (7) was separately prepared and fitted to the lower metal case (1). An earth plate (9) integrally formed with the resin (7) is exposed at the bottom of the central hole of the integrally formed product. The ground portion of the center conductor (6) was inserted into the center hole and soldered to the ground plate (9) below.

On the ground portion of the center conductor (6), a disc-shaped garnet (5) made of ferrite is disposed in the center hole of the integrally molded product, and one terminal of the center conductor (6) is arranged. Was bent so as to surround the garnet (5) (the terminal of the central conductor (6) here includes a mesh portion). Subsequently, another terminal of the center conductor (6) was bent in the same manner, an insulating film made of polyimide was sandwiched between the terminal and the other terminal, and the same procedure was repeated to fold the remaining terminals.

The extension of one terminal of the center conductor (6) is formed on the second copper plate (11) provided on the first copper plate (11).
(14) was temporarily fixed by being sandwiched between folded portions, which were part of (14), and then electrically connected with solder. Similarly, other terminals were connected to the folded portions of the other first copper plate (11).

Subsequently, the first and second copper plates (11, 12)
Then, paste solder was applied to the opposing portions of the respective first portions (13), the stacked capacitive elements (8) were set up and fitted, and heated and soldered and fixed in a reflow furnace.

At this time, since the multilayer capacitive element (8) is in a so-called vertical arrangement, the wraparound of the solder is limited to the lower surface of the multilayer capacitive element (8), and the lower surface of the multilayer capacitive element (8) is melted. Since it is in contact with the resin (7) having water repellency to the solder, the solder does not run around to the lower surface of the multilayer capacitive element (8). When a vibration test to be described later was performed and evaluated, no short circuit accident was found.

A trimming pattern (18), which is also a ground electrode (20), is provided on the outermost layer surface of the multilayer capacitive element (8).
The laminated capacitive element (8) was arranged so that the opposing electrode (19), which was the 2) side and the outermost layer surface on the opposite side, was on the first copper plate (11) side. It goes without saying that this second copper plate (12) has the same potential as the metal case (1) below.

A barium ferrite disk (3), which is a permanent magnet, is adhered to the upper metal case (1), the magnetization is adjusted by an electromagnet, and then irreversible by fitting to the lower metal case (1). It was a circuit element.

In turn, a method for forming an integrally molded product of the first and second copper plates (11, 12) and the resin (7) separately prepared will be described in detail. One copper plate having a thickness of 0.1 mm is punched out and bent using a continuous press machine so as to become the development surface in FIG.
16) was formed to prepare first and second copper plates (11, 12). Further, similarly, symmetrical first and second copper plates, first and second copper plates for ports connected to the resistance element, and the like were prepared.

The first and second copper plates (11, 12)
Was integrally molded with the resin (7) using a transfer molding machine. The shape of the resin (7) is such that a hole for inserting the garnet (5) and the center conductor (6) is provided at the center, the outer size is set to fit inside the lower metal case (1), and the external electrode is formed. A recess was provided on the lower surface so as to straddle the lower part of the lower metal case (1) other than around (23).

In the case where the non-reciprocal circuit device is provided with the trimming adjustment function of the present invention, a trimming pattern (18) is provided on the surface of the multilayer capacitor (8), and the second copper plate (12) is It was made small so as not to come into contact with the trimming pattern (18). The trimming operation was performed by pressing a resin-bonded grindstone with a sharp tip at a high-speed rotation against a portion to be removed while observing with a microscope.

The upper and lower metal cases (1) were punched and bent from a 0.2 mm thick iron plate using a continuous press.
It was prepared by applying high conductivity treatment to the surface. The shape of the lower metal case (1) was formed of two portions, a narrow bottom plate and two relatively wide side plates connected to and opposed to each other. In short, the upper surface and the two opposing surfaces are open.

The non-reciprocal circuit device assembled as described above was measured for basic performance and noise resistance using a network analyzer. In the measurement of noise resistance, the internal dimensions are approximately 800 mm × 600 mm × 600 m
This was performed by installing a mobile phone and a transmission / reception antenna equipped with the non-reciprocal circuit device of the present invention in an m-wave electromagnetic shield anechoic box. In the test for evaluating the vibration resistance, a change in basic performance was confirmed after applying a predetermined vibration using a vibration tester.

(Confirmation of Results) The outer shape of the prepared non-reciprocal circuit device is the same as the conventional one in height, and the width is about 1 m each.
m, that is, about 25% smaller. This is the effect of using the thin stacked capacitive element (8) standing up and the effect of partially omitting the metal case in the trimming work area and the like.

The number of parts was greatly reduced, and a great economic effect was obtained. With the first and second copper plates (11, 12) pertaining to one port, an external electrode, a lead-out wiring to the external electrode, a relay line extending from the central conductor extension and the lead-out wiring, and a laminated capacitive element (8) There is no need for a relay wire or the like from the opposing electrode (19) to the lead-out wiring on the left, and a similar effect is obtained on the corresponding ground side, such as connection to the ground plate (9). The same effect was obtained for the copper plate (10). Due to such a reduction in the number of parts, the man-hour for the soldering operation is reduced by 10 to 20%, and the quality variation is also reduced.

For trimming, the number of adjustment steps has been drastically reduced to about one third of the conventional one. Moreover, the average value of the insertion loss was improved by 0.23 dB as compared with the conventional case. This is because the trimming position is on the outer surface of the element, so that adjustment is easy and adjustment accuracy is high, the above-mentioned relay parts which are likely to cause loss are reduced, and the above-mentioned soldering work which is likely to cause loss is performed. This is attributable to the decrease, the fact that the garnet (5) can be easily and accurately arranged.

Even in a vibration test for 24 hours using a vibration tester, there was no deterioration of various characteristics, and a great improvement was obtained.
Since the first and second copper plates (11, 12) and the resin (7) are integrally molded, even if strong vibrations are applied, displacement of wiring and the like hardly occurs, and the stability of component arrangement is dramatically improved. It is due to improvement.

When the isolator according to the present invention was mounted on a mobile telephone mobile station (terminal) and evaluated for noise, it was found that there was no malfunction due to external noise and the noise resistance was excellent. Further, it was also found that the amount of noise generated was small. This is considered to be an effect due to the fact that conductors such as a laminated capacitive element and a copper plate are arranged perpendicular to the electromagnetic wave propagation direction.

[0052]

The lumped constant type non-reciprocal circuit device for mobile communication equipment has the following effects by applying the present invention. The product has become smaller. The number of parts has been greatly reduced.
The displacement due to the soldering work has been reduced. I became more resistant to vibration. Short circuit was prevented and reliability was improved. Easy and precise capacity adjustment is now possible. A product with excellent performance and little variation was obtained.

As a result, automation and mechanization of the manufacturing process became possible. Improvements in productivity and production efficiency were significant, contributing significantly to a reduction in manufacturing costs.

[Brief description of the drawings]

FIG. 1 is an exploded perspective view of a non-reciprocal circuit device according to one embodiment of the present invention.

FIG. 2 is a perspective view of a main part of the non-reciprocal circuit device according to one embodiment of the present invention.

FIG. 3 is a perspective view of a semi-fixed capacitive element according to one embodiment of the present invention.

[Explanation of symbols]

REFERENCE SIGNS LIST 1 metal case, 3 permanent magnet, 5 garnet (ferrite), 6 center conductor, 7 resin, 8 laminated capacitive element, 11 first copper plate, 12 second copper plate, 18 trimming pattern

Continued on the front page (72) Inventor Akinori Misawa 70-2, Minamisakaemachi, Tottori-shi, Tottori Prefecture Hitachi Metals Co., Ltd.Tottori Plant In-house (72) Inventor Shiro Murakami 5200 Sankajiri, Kumagaya-shi, Saitama Magnetic Materials Research Laboratory, Hitachi Metals, Ltd.

Claims (7)

[Claims] 1. A ferrite to which a DC magnetic field is applied, a plurality of center conductors are arranged in an electrically insulated state and in an intersecting manner, and a resistance element and / or a laminated capacitor are connected between one port of the center conductor and ground. In a non-reciprocal circuit device in which a device is connected and a laminated capacitor is connected between each of the other ports and the ground, a laminated surface of the laminated capacitor is arranged parallel to a rotation axis of the ferrite. Circuit element. 2. The multilayer capacitive element is electrically connected to the port or the ground via first and second copper plates in an insulated state from each other, and the first copper plate is connected to the uppermost of the multilayer capacitive element. A first portion that is surface-connected to the opposing electrode of the outer layer by solder, a second portion that is connected to the port, and a third portion that is integrally formed with a resin;
Wherein the copper plate has a first portion connected to the outermost layer ground-side electrode of the multilayer capacitive element by soldering, a second portion connected to the ground, and a third portion formed integrally with the resin. The non-reciprocal circuit device according to claim 1, wherein: 3. The non-reciprocal circuit device according to claim 3, wherein the first portion of the first copper plate is disposed near the center conductor, and the first portion of the second copper plate is disposed on the outer surface of the non-reciprocal circuit device. Item 3. The non-reciprocal circuit device according to item 1 or 2. 4. The resin according to claim 1, wherein the resin integrally formed with the third portion of each of the first and second copper plates has a heat resistance of 250 ° C. or more. The non-reciprocal circuit device according to claim 1. 5. The third of each of the first and second copper plates.
The non-reciprocal circuit device according to any one of claims 1 to 4, wherein the resin integrally formed with the portion (1) is one. 6. The resin integrally formed with each third portion of each of the first and second copper plates, which is connected to each port of the center conductor or the ground, is one unit. The non-reciprocal circuit device according to any one of claims 1 to 5. 7. The multilayer capacitive element is a semi-fixed capacitive element,
The capacitance adjusting section is a trimming pattern of an earth-side electrode on an outermost layer of the multilayer capacitive element and is exposed on an outer surface of the non-reciprocal circuit element.
7. The non-reciprocal circuit device according to any one of 6.