JPH115895A - Reinforced resin composition excellent in durability against epoxy resin-curing agent and its molded product - Google Patents
Reinforced resin composition excellent in durability against epoxy resin-curing agent and its molded productInfo
- Publication number
- JPH115895A JPH115895A JP9162928A JP16292897A JPH115895A JP H115895 A JPH115895 A JP H115895A JP 9162928 A JP9162928 A JP 9162928A JP 16292897 A JP16292897 A JP 16292897A JP H115895 A JPH115895 A JP H115895A
- Authority
- JP
- Japan
- Prior art keywords
- polyphenylene ether
- resin composition
- weight
- parts
- reinforced resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011342 resin composition Substances 0.000 title claims abstract description 47
- 239000003795 chemical substances by application Substances 0.000 title claims abstract description 24
- 239000004593 Epoxy Substances 0.000 title claims abstract description 17
- 229920001955 polyphenylene ether Polymers 0.000 claims abstract description 55
- 229920005989 resin Polymers 0.000 claims abstract description 47
- 239000011347 resin Substances 0.000 claims abstract description 47
- DRDVZXDWVBGGMH-UHFFFAOYSA-N zinc;sulfide Chemical compound [S-2].[Zn+2] DRDVZXDWVBGGMH-UHFFFAOYSA-N 0.000 claims abstract description 30
- 239000005083 Zinc sulfide Substances 0.000 claims abstract description 22
- 229910052984 zinc sulfide Inorganic materials 0.000 claims abstract description 22
- 239000011256 inorganic filler Substances 0.000 claims abstract description 18
- 229910003475 inorganic filler Inorganic materials 0.000 claims abstract description 18
- 239000000203 mixture Substances 0.000 claims abstract description 14
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims abstract description 12
- 150000001875 compounds Chemical class 0.000 claims abstract description 10
- JTHZUSWLNCPZLX-UHFFFAOYSA-N 6-fluoro-3-methyl-2h-indazole Chemical compound FC1=CC=C2C(C)=NNC2=C1 JTHZUSWLNCPZLX-UHFFFAOYSA-N 0.000 claims abstract description 6
- -1 imidazole compound Chemical class 0.000 claims description 26
- 239000003822 epoxy resin Substances 0.000 claims description 7
- 229920000647 polyepoxide Polymers 0.000 claims description 7
- 238000000465 moulding Methods 0.000 claims description 6
- 150000008065 acid anhydrides Chemical class 0.000 claims description 5
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 claims 2
- 230000000704 physical effect Effects 0.000 abstract description 14
- 229920001577 copolymer Polymers 0.000 abstract description 10
- 239000011521 glass Substances 0.000 abstract description 6
- 229920001519 homopolymer Polymers 0.000 abstract description 6
- 125000000217 alkyl group Chemical group 0.000 abstract description 4
- 239000002245 particle Substances 0.000 abstract description 2
- 239000004014 plasticizer Substances 0.000 abstract description 2
- 239000004094 surface-active agent Substances 0.000 abstract description 2
- 238000013329 compounding Methods 0.000 abstract 1
- 238000012360 testing method Methods 0.000 description 42
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 24
- NXXYKOUNUYWIHA-UHFFFAOYSA-N 2,6-Dimethylphenol Chemical compound CC1=CC=CC(C)=C1O NXXYKOUNUYWIHA-UHFFFAOYSA-N 0.000 description 16
- 239000004793 Polystyrene Substances 0.000 description 11
- 229920002223 polystyrene Polymers 0.000 description 11
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 9
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 8
- 238000000034 method Methods 0.000 description 8
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 8
- 239000011162 core material Substances 0.000 description 7
- 229920005990 polystyrene resin Polymers 0.000 description 7
- 229920002554 vinyl polymer Polymers 0.000 description 7
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 6
- 150000008064 anhydrides Chemical class 0.000 description 6
- 229920001400 block copolymer Polymers 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 238000002156 mixing Methods 0.000 description 6
- 229920000642 polymer Polymers 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000006116 polymerization reaction Methods 0.000 description 5
- 239000002253 acid Substances 0.000 description 4
- 238000004040 coloring Methods 0.000 description 4
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 4
- 239000003063 flame retardant Substances 0.000 description 4
- 239000003365 glass fiber Substances 0.000 description 4
- 229910052739 hydrogen Inorganic materials 0.000 description 4
- 239000001257 hydrogen Substances 0.000 description 4
- 239000000178 monomer Substances 0.000 description 4
- QWVGKYWNOKOFNN-UHFFFAOYSA-N o-cresol Chemical compound CC1=CC=CC=C1O QWVGKYWNOKOFNN-UHFFFAOYSA-N 0.000 description 4
- 230000001590 oxidative effect Effects 0.000 description 4
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 4
- 150000007934 α,β-unsaturated carboxylic acids Chemical class 0.000 description 4
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 3
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 239000003086 colorant Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 229920001971 elastomer Polymers 0.000 description 3
- 229910052736 halogen Inorganic materials 0.000 description 3
- 150000002367 halogens Chemical class 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 229910052742 iron Inorganic materials 0.000 description 3
- 239000003381 stabilizer Substances 0.000 description 3
- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 3
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 3
- MUTGBJKUEZFXGO-OLQVQODUSA-N (3as,7ar)-3a,4,5,6,7,7a-hexahydro-2-benzofuran-1,3-dione Chemical compound C1CCC[C@@H]2C(=O)OC(=O)[C@@H]21 MUTGBJKUEZFXGO-OLQVQODUSA-N 0.000 description 2
- QQOMQLYQAXGHSU-UHFFFAOYSA-N 2,3,6-Trimethylphenol Chemical compound CC1=CC=C(C)C(O)=C1C QQOMQLYQAXGHSU-UHFFFAOYSA-N 0.000 description 2
- SBYMUDUGTIKLCR-UHFFFAOYSA-N 2-chloroethenylbenzene Chemical compound ClC=CC1=CC=CC=C1 SBYMUDUGTIKLCR-UHFFFAOYSA-N 0.000 description 2
- JLBJTVDPSNHSKJ-UHFFFAOYSA-N 4-Methylstyrene Chemical compound CC1=CC=C(C=C)C=C1 JLBJTVDPSNHSKJ-UHFFFAOYSA-N 0.000 description 2
- OMIHGPLIXGGMJB-UHFFFAOYSA-N 7-oxabicyclo[4.1.0]hepta-1,3,5-triene Chemical group C1=CC=C2OC2=C1 OMIHGPLIXGGMJB-UHFFFAOYSA-N 0.000 description 2
- 229930185605 Bisphenol Natural products 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 description 2
- ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Chemical compound O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 2
- JQVDAXLFBXTEQA-UHFFFAOYSA-N dibutylamine Chemical compound CCCCNCCCC JQVDAXLFBXTEQA-UHFFFAOYSA-N 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- 150000002431 hydrogen Chemical group 0.000 description 2
- 238000005984 hydrogenation reaction Methods 0.000 description 2
- 150000002460 imidazoles Chemical class 0.000 description 2
- 230000001771 impaired effect Effects 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 150000004706 metal oxides Chemical class 0.000 description 2
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 150000001451 organic peroxides Chemical class 0.000 description 2
- 239000008188 pellet Substances 0.000 description 2
- 229910052698 phosphorus Inorganic materials 0.000 description 2
- 239000011574 phosphorus Substances 0.000 description 2
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 239000012744 reinforcing agent Substances 0.000 description 2
- 239000005060 rubber Substances 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- 238000004513 sizing Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 2
- 229920005992 thermoplastic resin Polymers 0.000 description 2
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 2
- 125000002889 tridecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- KNDQHSIWLOJIGP-UMRXKNAASA-N (3ar,4s,7r,7as)-rel-3a,4,7,7a-tetrahydro-4,7-methanoisobenzofuran-1,3-dione Chemical compound O=C1OC(=O)[C@@H]2[C@H]1[C@]1([H])C=C[C@@]2([H])C1 KNDQHSIWLOJIGP-UMRXKNAASA-N 0.000 description 1
- OUPZKGBUJRBPGC-UHFFFAOYSA-N 1,3,5-tris(oxiran-2-ylmethyl)-1,3,5-triazinane-2,4,6-trione Chemical compound O=C1N(CC2OC2)C(=O)N(CC2OC2)C(=O)N1CC1CO1 OUPZKGBUJRBPGC-UHFFFAOYSA-N 0.000 description 1
- IVSZLXZYQVIEFR-UHFFFAOYSA-N 1,3-Dimethylbenzene Natural products CC1=CC=CC(C)=C1 IVSZLXZYQVIEFR-UHFFFAOYSA-N 0.000 description 1
- OEVVKKAVYQFQNV-UHFFFAOYSA-N 1-ethenyl-2,4-dimethylbenzene Chemical compound CC1=CC=C(C=C)C(C)=C1 OEVVKKAVYQFQNV-UHFFFAOYSA-N 0.000 description 1
- QEDJMOONZLUIMC-UHFFFAOYSA-N 1-tert-butyl-4-ethenylbenzene Chemical compound CC(C)(C)C1=CC=C(C=C)C=C1 QEDJMOONZLUIMC-UHFFFAOYSA-N 0.000 description 1
- XRUGBBIQLIVCSI-UHFFFAOYSA-N 2,3,4-trimethylphenol Chemical compound CC1=CC=C(O)C(C)=C1C XRUGBBIQLIVCSI-UHFFFAOYSA-N 0.000 description 1
- GVJRTUUUJYMTNQ-UHFFFAOYSA-N 2-(2,5-dioxofuran-3-yl)acetic acid Chemical compound OC(=O)CC1=CC(=O)OC1=O GVJRTUUUJYMTNQ-UHFFFAOYSA-N 0.000 description 1
- AOBIOSPNXBMOAT-UHFFFAOYSA-N 2-[2-(oxiran-2-ylmethoxy)ethoxymethyl]oxirane Chemical compound C1OC1COCCOCC1CO1 AOBIOSPNXBMOAT-UHFFFAOYSA-N 0.000 description 1
- KUAUJXBLDYVELT-UHFFFAOYSA-N 2-[[2,2-dimethyl-3-(oxiran-2-ylmethoxy)propoxy]methyl]oxirane Chemical compound C1OC1COCC(C)(C)COCC1CO1 KUAUJXBLDYVELT-UHFFFAOYSA-N 0.000 description 1
- ZJRAAAWYHORFHN-UHFFFAOYSA-N 2-[[2,6-dibromo-4-[2-[3,5-dibromo-4-(oxiran-2-ylmethoxy)phenyl]propan-2-yl]phenoxy]methyl]oxirane Chemical compound C=1C(Br)=C(OCC2OC2)C(Br)=CC=1C(C)(C)C(C=C1Br)=CC(Br)=C1OCC1CO1 ZJRAAAWYHORFHN-UHFFFAOYSA-N 0.000 description 1
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- RUMACXVDVNRZJZ-UHFFFAOYSA-N 2-methylpropyl 2-methylprop-2-enoate Chemical class CC(C)COC(=O)C(C)=C RUMACXVDVNRZJZ-UHFFFAOYSA-N 0.000 description 1
- SYIUWAVTBADRJG-UHFFFAOYSA-N 2H-pyran-2,6(3H)-dione Chemical compound O=C1CC=CC(=O)O1 SYIUWAVTBADRJG-UHFFFAOYSA-N 0.000 description 1
- AYKYXWQEBUNJCN-UHFFFAOYSA-N 3-methylfuran-2,5-dione Chemical compound CC1=CC(=O)OC1=O AYKYXWQEBUNJCN-UHFFFAOYSA-N 0.000 description 1
- OFNISBHGPNMTMS-UHFFFAOYSA-N 3-methylideneoxolane-2,5-dione Chemical compound C=C1CC(=O)OC1=O OFNISBHGPNMTMS-UHFFFAOYSA-N 0.000 description 1
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical compound C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 1
- DDTHMESPCBONDT-UHFFFAOYSA-N 4-(4-oxocyclohexa-2,5-dien-1-ylidene)cyclohexa-2,5-dien-1-one Chemical compound C1=CC(=O)C=CC1=C1C=CC(=O)C=C1 DDTHMESPCBONDT-UHFFFAOYSA-N 0.000 description 1
- KFDVPJUYSDEJTH-UHFFFAOYSA-N 4-ethenylpyridine Chemical compound C=CC1=CC=NC=C1 KFDVPJUYSDEJTH-UHFFFAOYSA-N 0.000 description 1
- MWSKJDNQKGCKPA-UHFFFAOYSA-N 6-methyl-3a,4,5,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1CC(C)=CC2C(=O)OC(=O)C12 MWSKJDNQKGCKPA-UHFFFAOYSA-N 0.000 description 1
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- LCFVJGUPQDGYKZ-UHFFFAOYSA-N Bisphenol A diglycidyl ether Chemical compound C=1C=C(OCC2OC2)C=CC=1C(C)(C)C(C=C1)=CC=C1OCC1CO1 LCFVJGUPQDGYKZ-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- 241000723347 Cinnamomum Species 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 239000004609 Impact Modifier Substances 0.000 description 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- LGRFSURHDFAFJT-UHFFFAOYSA-N Phthalic anhydride Natural products C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- PJANXHGTPQOBST-VAWYXSNFSA-N Stilbene Natural products C=1C=CC=CC=1/C=C/C1=CC=CC=C1 PJANXHGTPQOBST-VAWYXSNFSA-N 0.000 description 1
- 229910010413 TiO 2 Inorganic materials 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 125000000218 acetic acid group Chemical group C(C)(=O)* 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- XUCHXOAWJMEFLF-UHFFFAOYSA-N bisphenol F diglycidyl ether Chemical compound C1OC1COC(C=C1)=CC=C1CC(C=C1)=CC=C1OCC1CO1 XUCHXOAWJMEFLF-UHFFFAOYSA-N 0.000 description 1
- MPMBRWOOISTHJV-UHFFFAOYSA-N but-1-enylbenzene Chemical compound CCC=CC1=CC=CC=C1 MPMBRWOOISTHJV-UHFFFAOYSA-N 0.000 description 1
- JHIWVOJDXOSYLW-UHFFFAOYSA-N butyl 2,2-difluorocyclopropane-1-carboxylate Chemical compound CCCCOC(=O)C1CC1(F)F JHIWVOJDXOSYLW-UHFFFAOYSA-N 0.000 description 1
- DKVNPHBNOWQYFE-UHFFFAOYSA-N carbamodithioic acid Chemical class NC(S)=S DKVNPHBNOWQYFE-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 150000001735 carboxylic acids Chemical class 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229940114081 cinnamate Drugs 0.000 description 1
- 235000017803 cinnamon Nutrition 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 125000002704 decyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- LSXWFXONGKSEMY-UHFFFAOYSA-N di-tert-butyl peroxide Chemical compound CC(C)(C)OOC(C)(C)C LSXWFXONGKSEMY-UHFFFAOYSA-N 0.000 description 1
- 229920003244 diene elastomer Polymers 0.000 description 1
- 150000001993 dienes Chemical class 0.000 description 1
- 238000002845 discoloration Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- JDVIRCVIXCMTPU-UHFFFAOYSA-N ethanamine;trifluoroborane Chemical compound CCN.FB(F)F JDVIRCVIXCMTPU-UHFFFAOYSA-N 0.000 description 1
- 125000001033 ether group Chemical group 0.000 description 1
- SUPCQIBBMFXVTL-UHFFFAOYSA-N ethyl 2-methylprop-2-enoate Chemical compound CCOC(=O)C(C)=C SUPCQIBBMFXVTL-UHFFFAOYSA-N 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000001530 fumaric acid Substances 0.000 description 1
- ANSXAPJVJOKRDJ-UHFFFAOYSA-N furo[3,4-f][2]benzofuran-1,3,5,7-tetrone Chemical compound C1=C2C(=O)OC(=O)C2=CC2=C1C(=O)OC2=O ANSXAPJVJOKRDJ-UHFFFAOYSA-N 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 239000008187 granular material Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 229910052945 inorganic sulfide Inorganic materials 0.000 description 1
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- 150000002734 metacrylic acid derivatives Chemical class 0.000 description 1
- 229910052976 metal sulfide Inorganic materials 0.000 description 1
- 125000005395 methacrylic acid group Chemical group 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 238000005691 oxidative coupling reaction Methods 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 125000000843 phenylene group Chemical group C1(=C(C=CC=C1)*)* 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- AQSJGOWTSHOLKH-UHFFFAOYSA-N phosphite(3-) Chemical class [O-]P([O-])[O-] AQSJGOWTSHOLKH-UHFFFAOYSA-N 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- FZHAPNGMFPVSLP-UHFFFAOYSA-N silanamine Chemical compound [SiH3]N FZHAPNGMFPVSLP-UHFFFAOYSA-N 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- PJANXHGTPQOBST-UHFFFAOYSA-N stilbene Chemical compound C=1C=CC=CC=1C=CC1=CC=CC=C1 PJANXHGTPQOBST-UHFFFAOYSA-N 0.000 description 1
- 235000021286 stilbenes Nutrition 0.000 description 1
- WGPCGCOKHWGKJJ-UHFFFAOYSA-N sulfanylidenezinc Chemical compound [Zn]=S WGPCGCOKHWGKJJ-UHFFFAOYSA-N 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 230000001256 tonic effect Effects 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- SRPWOOOHEPICQU-UHFFFAOYSA-N trimellitic anhydride Chemical compound OC(=O)C1=CC=C2C(=O)OC(=O)C2=C1 SRPWOOOHEPICQU-UHFFFAOYSA-N 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Insulating Of Coils (AREA)
- Organic Insulating Materials (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明は、エポキシ樹脂と接
触して用いられるような構造材料用途、例えばイグニッ
ションコイルボビン芯材などにおいて、エポキシ硬化剤
の耐性に優れる強化樹脂組成物および成形体に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a reinforced resin composition and a molded article having excellent resistance to an epoxy curing agent in structural material applications such as used in contact with an epoxy resin, for example, in an ignition coil bobbin core.
【0002】[0002]
【従来の技術】ポリフェニレンエーテル系樹脂は耐熱
性、電気特性、耐酸、耐アルカリ性等に優れ、しかも低
比重、低吸水性である等の優れた特性を有する樹脂であ
る。近年、電気特性、高耐熱の特性を生かし、無機充填
剤を配合した強化樹脂組成物材料が、電機部品のコイル
ボビンの芯材等に使われている。上記用途において強化
ポリフェニレンエーテル系樹脂組成物は、判別のため各
種の色に着色されて使用されることが多い。2. Description of the Related Art Polyphenylene ether resins are resins having excellent properties such as excellent heat resistance, electrical properties, acid resistance and alkali resistance, and low specific gravity and low water absorption. 2. Description of the Related Art In recent years, a reinforced resin composition material containing an inorganic filler has been used as a core material of a coil bobbin of an electric component, taking advantage of electric characteristics and high heat resistance. In the above applications, the reinforced polyphenylene ether-based resin composition is often used in various colors for discrimination.
【0003】しかしながら、この着色材料を用いてコイ
ルボビン芯材を得る場合、芯材の周りを形成するエポキ
シ樹脂を硬化させるために用いる硬化剤により、該着色
材料からなる芯材にクレーズやクラックが発生し、酷い
場合には芯材の破壊に至ることがあった。特開昭60−
233150号公報にはポリエチレンテレフタレート系
樹脂にガラス繊維および硫化亜鉛を配合してなる組成物
が開示され、酸化チタンで着色された組成物と比べ耐熱
性、機械特性に優れると明示されている。特開平6−1
92563号公報等にはポリフェニレンエーテル樹脂に
無機充填剤を配合した成形性、剛性、寸法安定性に優れ
た組成物が明示され、さらにイグニッションコイルボビ
ン用途の規定がある。しかしながら、これらの公報、そ
の他文献等にて、強化ポリフェニレンエーテル系樹脂組
成物をエポキシ樹脂にて包埋する際のエポキシ硬化剤の
耐性について検討された報告は見たらず、エポキシ硬化
剤の耐性に優れる強化樹脂組成物、強化ポリフェニレン
エーテル樹脂組成物の発明には至っていなかった。However, when a core material of a coil bobbin is obtained by using this coloring material, crazes and cracks are generated in the core material made of the coloring material due to a curing agent used for curing an epoxy resin forming around the core material. However, in severe cases, the core material was sometimes destroyed. JP-A-60-
JP-A-233150 discloses a composition in which a glass fiber and zinc sulfide are blended with a polyethylene terephthalate-based resin, and discloses that the composition is excellent in heat resistance and mechanical properties as compared with a composition colored with titanium oxide. JP-A-6-1
No. 92563 discloses a composition excellent in moldability, rigidity and dimensional stability in which an inorganic filler is blended with a polyphenylene ether resin, and further specifies the use of an ignition coil bobbin. However, in these publications, other documents, etc., there was no report examining the resistance of the epoxy curing agent when embedding the reinforced polyphenylene ether-based resin composition with the epoxy resin, and the resistance to the epoxy curing agent was not observed. The invention of an excellent reinforced resin composition and a reinforced polyphenylene ether resin composition has not been achieved.
【0004】[0004]
【発明が解決しようとする課題】本発明の目的は、エポ
キシ樹脂を硬化させるために用いられるエポキシ硬化剤
性の耐性に優れ、耐熱性、機械物性のバランスに優れる
強化樹脂組成物、強化ポリフェニレンエーテル系樹脂組
成物を提供することである。SUMMARY OF THE INVENTION It is an object of the present invention to provide a reinforced resin composition having excellent resistance to an epoxy curing agent used for curing an epoxy resin, and having an excellent balance of heat resistance and mechanical properties, and a reinforced polyphenylene ether. It is to provide a system resin composition.
【0005】[0005]
【課題を解決するための手段】本発明者らは上記目的を
達成すべく鋭意検討した結果、本発明に至った。すなわ
ち、本発明は、(A)ポリフェニレンエーテル系樹脂1
00重量部に対し、(B)無機質充填剤5〜200重量
部、(C)必要量の硫化亜鉛を配合してなる強化樹脂組
成物。および該組成物から成形された成形体に関するも
のである。Means for Solving the Problems The present inventors have made intensive studies to achieve the above object, and as a result, have reached the present invention. That is, the present invention relates to (A) polyphenylene ether-based resin 1
A reinforced resin composition comprising (B) 5-200 parts by weight of an inorganic filler and (C) a required amount of zinc sulfide with respect to 00 parts by weight. And a molded article molded from the composition.
【0006】本発明の(A)成分として用いるポリフェ
ニレンエーテル系樹脂とは、一般式(a)及び/又は
(b)で表される繰り返し単位を有するポリフェニレン
エーテル樹脂の単独重合体あるいは共重合体である。The polyphenylene ether resin used as the component (A) in the present invention is a homopolymer or a copolymer of a polyphenylene ether resin having a repeating unit represented by the general formula (a) and / or (b). is there.
【0007】[0007]
【化1】 Embedded image
【0008】(ここで、R1、R2、R3、R4、R
5、R6は独立に炭素1〜4のアルキル基、アリール
基、ハロゲン、水素を表す。但し、R1とR2、R5と
R6は同時に水素ではない。) ポリフェニレンエーテル樹脂の単独重合体の代表例とし
ては、ポリ(2,6−ジメチル−1,4−フェニレン)
エーテル、ポリ(2−メチル−6−エチル−1,4−フ
ェニレン)エーテル、ポリ(2,6−ジエチル−1,4
−フェニレン)エーテル、ポリ(2−エチル−6−n−
プロピル−1,4−フェニレン)エーテル、ポリ(2,
6−ジ−n−プロピル−1,4−フェニレン)エーテ
ル、ポリ(2−メチル−6−n−ブチル−1,4−フェ
ニレン)エーテル、ポリ(2−エチル−6−イソプロピ
ル−1,4−フェニレン)エーテル、ポリ(2−メチル
−6−ヒドロキシエチル−1,4−フェニレン)エーテ
ル、ポリ(2−メチル−6−クロロエチル−1,4−フ
ェニレン)エーテル等が挙げられる。(Where R1, R2, R3, R4, R
5, R6 independently represent an alkyl group having 1 to 4 carbon atoms, an aryl group, halogen, or hydrogen. However, R1 and R2, and R5 and R6 are not simultaneously hydrogen. A typical example of the homopolymer of the polyphenylene ether resin is poly (2,6-dimethyl-1,4-phenylene).
Ether, poly (2-methyl-6-ethyl-1,4-phenylene) ether, poly (2,6-diethyl-1,4
-Phenylene) ether, poly (2-ethyl-6-n-)
Propyl-1,4-phenylene) ether, poly (2,
6-di-n-propyl-1,4-phenylene) ether, poly (2-methyl-6-n-butyl-1,4-phenylene) ether, poly (2-ethyl-6-isopropyl-1,4-) Phenylene) ether, poly (2-methyl-6-hydroxyethyl-1,4-phenylene) ether, poly (2-methyl-6-chloroethyl-1,4-phenylene) ether and the like.
【0009】この中で、ポリ(2,6−ジメチル−1,
4−フェニレン)エーテルが特に好ましい。ポリフェニ
レンエーテル共重合体とは、フェニレンエーテル構造を
主単量単位とする共重合体である。その例としては、
2,6−ジメチルフェノールと2,3,6−トリメチル
フェノールとの共重合体、2,6−ジメチルフェノール
とo−クレゾールとの共重合体あるいは2,6−ジメチ
ルフェノールと2,3,6−トリメチルフェノール及び
o−クレゾールとの共重合体等がある。Among them, poly (2,6-dimethyl-1,1)
4-Phenylene) ether is particularly preferred. The polyphenylene ether copolymer is a copolymer having a phenylene ether structure as a main unit. For example,
Copolymer of 2,6-dimethylphenol and 2,3,6-trimethylphenol, copolymer of 2,6-dimethylphenol and o-cresol, or 2,6-dimethylphenol and 2,3,6- Examples include a copolymer with trimethylphenol and o-cresol.
【0010】本発明に用いるポリフェニレンエーテル系
樹脂の単独重合体あるいは共重合体の製造方法は特に限
定されるものではないが例えば米国特許4,788,2
77号明細書(特願昭62−77570号公報)に記載
されている方法に従って、ジブチルアミンの存在下に、
2,6−キシレノールを酸化カップリング重合して製造
することができる。また、分子量および分子量分布も本
発明の要件を満たす限り、特に限定されるものではない
が、30℃クロロホルム溶媒下での還元粘度が0.3〜
0.7dl/gのものが好ましく用いられる。0.3d
l/g未満の還元粘度のものでは熱安定性が悪くなる傾
向があり、また0.7dl/gを越える還元粘度のもの
では成形加工性が損なわれる傾向がある。The method for producing the homopolymer or copolymer of the polyphenylene ether resin used in the present invention is not particularly limited. For example, US Pat. No. 4,788,2.
According to the method described in Japanese Patent Application No. 77 (Japanese Patent Application No. 62-77570), in the presence of dibutylamine,
It can be produced by oxidative coupling polymerization of 2,6-xylenol. The molecular weight and the molecular weight distribution are not particularly limited as long as the requirements of the present invention are satisfied.
Those having 0.7 dl / g are preferably used. 0.3d
When the reduced viscosity is less than 1 / g, the thermal stability tends to deteriorate, and when the reduced viscosity exceeds 0.7 dl / g, the moldability tends to be impaired.
【0011】また、本発明のポリフェニレンエーテル樹
脂中には、本発明の主旨に反しない限り、従来ポリフェ
ニレンエーテル樹脂中に存在させてもよいことが提案さ
れている他の種々のフェニレンエーテルユニットを部分
構造として含んでいても構わない。少量共存させること
が提案されているものの例としては、特願昭63−12
698号公報及び特開昭63−301222号公報に記
載されている、2−(ジアルキルアミノメチル)−6−
メチルフェニレンエーテルユニットや、2−(N−アル
キル−N−フェニルアミノメチル)−6−メチルフェニ
レンエーテルユN−アレキル−N−フェニルアミノメチ
ル)−6−メチルフェニレンエーテルユニット等が挙げ
られる。また、ポリフェニレンエーテル樹脂の主鎖中に
ジフェノキノン等が少量結合したものも含まれる。In the polyphenylene ether resin of the present invention, various other phenylene ether units which have been proposed to be allowed to exist in the polyphenylene ether resin so far as they do not contradict the gist of the present invention are partially incorporated. It may be included as a structure. Japanese Patent Application No. 63-12 / 1988 discloses an example of the proposal for coexistence in a small amount.
No. 698 and JP-A-63-301222, 2- (dialkylaminomethyl) -6-
Examples thereof include a methylphenylene ether unit and a 2- (N-alkyl-N-phenylaminomethyl) -6-methylphenylene ether U-alkyl-N-phenylaminomethyl) -6-methylphenylene ether unit. Also included are polyphenylene ether resins in which a small amount of diphenoquinone or the like is bonded in the main chain.
【0012】さらに、ポリフェニレンエーテル樹脂に
は、一般にガラス繊維、炭素繊維等の繊維状補強剤との
密着性を改良するためなどに用いられる下記のα, β不
飽和カルボン酸またはその無水物等により変性されたポ
リフェニレンエーテル樹脂も含むことができる。α, β
不飽和カルボン酸またはその無水物の例として、特公昭
49−2343号公報、特公平3−52486号公報等
に記載される無水マレイン酸、フタル酸、無水イタコン
酸、無水グルタコン酸、無水シトラコン酸、無水アコニ
ット酸、無水ハイミツク酸、5−ノルボルネン−2−メ
チル−2−カルボン酸あるいはマレイン酸、フマル酸等
が挙げられ、これらに限定されるものではないが、無水
マレイン酸が特に好ましい。Further, polyphenylene ether resins may be mixed with the following α, β unsaturated carboxylic acids or anhydrides thereof which are generally used for improving the adhesion to fibrous reinforcing agents such as glass fibers and carbon fibers. Modified polyphenylene ether resins can also be included. α, β
Examples of unsaturated carboxylic acids or anhydrides thereof include maleic anhydride, phthalic acid, itaconic anhydride, glutaconic anhydride, citraconic anhydride described in JP-B-49-2343 and JP-B-3-52486. , Aconitic anhydride, himic anhydride, 5-norbornene-2-methyl-2-carboxylic acid, maleic acid, fumaric acid, and the like, but are not limited thereto, but maleic anhydride is particularly preferred.
【0013】無水マレイン酸等のα, β不飽和カルボン
酸またはその無水物とポリフェニレンエーテル樹脂との
反応は、有機過酸化物の存在下または非存在下で両者を
混合しポリフェニレンエーテル重合体のガラス転移温度
以上の温度まで加熱することによって製造できる。本発
明の強化ポリフェニレンエーテル系樹脂組成物を製造す
る際には、あらかじめ無水マレイン酸等のα, β不飽和
カルボン酸またはその無水物を結合したポリフェニレン
エーテル樹脂を用いても良いし、強化ポリフェニレンエ
ーテル系樹脂組成物を製造する際に同時に、無水マレイ
ン酸等のα, β不飽和カルボン酸またはその無水物を添
加することによりポリフェニレンエーテル重合体と反応
させる方法でも良い。The reaction between an α, β unsaturated carboxylic acid such as maleic anhydride or an anhydride thereof and a polyphenylene ether resin is carried out by mixing the two in the presence or absence of an organic peroxide to form a glass of a polyphenylene ether polymer. It can be produced by heating to a temperature above the transition temperature. When producing the reinforced polyphenylene ether-based resin composition of the present invention, a polyphenylene ether resin in which an α, β unsaturated carboxylic acid such as maleic anhydride or an anhydride thereof is bonded in advance may be used, or a reinforced polyphenylene ether may be used. A method may be used in which an α, β unsaturated carboxylic acid such as maleic anhydride or the like or an anhydride thereof is added at the same time as the production of the resin composition to react with the polyphenylene ether polymer.
【0014】さらに、ポリフェニレンエーテル系樹脂と
しては、エチレン性不飽和化合物により変性されたポリ
フェニレンエーテル系樹脂を含むことが出来る。本発明
において、無機充填剤を多く含ませると成形加工性が悪
くなる傾向にあるが、該エチレン性不飽和化合物により
変性されたポリフェニレンエーテル樹脂または強化樹脂
組成物は、成形流動時および成形加工時の変色抑制に優
れるため、それを用いることがより好適である。Further, the polyphenylene ether-based resin may include a polyphenylene ether-based resin modified with an ethylenically unsaturated compound. In the present invention, when a large amount of an inorganic filler is contained, molding processability tends to be deteriorated.However, the polyphenylene ether resin or the reinforced resin composition modified with the ethylenically unsaturated compound is used during molding flow and molding process. It is more preferable to use it because it is excellent in suppressing discoloration.
【0015】エチレン性不飽和化合物の例として、アク
リル酸のメチル、エチル、プロピル、ブチル、イソブチ
ル、t−ブチル、2−エチルヘキシル、オクチル、イソ
デシル、ラウリル、ラウリルートデシル、トリデシル、
セチル−ステアリル、ステアリル、シクロヘキシル、ベ
ンジルエステル等のアクリル酸エステル類、メタクリル
酸のメチル、エチル、プロピル、ブチル、イソブチル、
t−ブチル、2−エチルヘキシル、オクチル、イソデシ
ル、ラウリル、ラウリルートデシル、トリデシル、セチ
ル−ステアリル、ステアリル、シクロヘキシル、ベンジ
ルエステル等のメタクリル酸エステル類、アクリルアミ
ド、アクリロニトリル、スチレン、α−メチルスチレ
ン、クロルスチレン、メチルスチレン、スチルベン、ケ
イ皮アルコール、ケイ皮酸ニトリル、4−ビニルピリジ
ン等が挙げられる。これらに限定されるものではない
が、なかでもアクリル酸ステアリルおよび/またはスチ
レンを用いた場合が最も好ましい。Examples of ethylenically unsaturated compounds include the acrylates methyl, ethyl, propyl, butyl, isobutyl, t-butyl, 2-ethylhexyl, octyl, isodecyl, lauryl, laurilute decyl, tridecyl,
Acetyl esters such as cetyl-stearyl, stearyl, cyclohexyl, and benzyl esters; methyl, ethyl, propyl, butyl, and isobutyl methacrylates;
Methacrylic esters such as t-butyl, 2-ethylhexyl, octyl, isodecyl, lauryl, lauryl decyl, tridecyl, cetyl-stearyl, stearyl, cyclohexyl, benzyl ester, acrylamide, acrylonitrile, styrene, α-methylstyrene, chlorostyrene , Methylstyrene, stilbene, cinnamon alcohol, cinnamate nitrile, 4-vinylpyridine and the like. Although not limited thereto, it is most preferable to use stearyl acrylate and / or styrene.
【0016】エチレン性不飽和化合物はポリフェニレン
エーテル樹脂100重量%に対して、0.1〜15重量
%、より好ましくは0.5〜10重量%の割合で配合さ
れる。0.1重量%より少ないと成形流動性、着色性等
の効果が小さくなり、15重量%より多すぎると耐熱性
の低下が大きくなり好ましくない。アクリル酸ステアリ
ル等のエチレン性不飽和化合物とポリフェニレンエーテ
ル樹脂との反応は、有機過酸化物の存在下または非存在
下で両者を混合しポリフェニレンエーテル重合体のガラ
ス転移温度以上の温度まで加熱することによって製造で
きる。The ethylenically unsaturated compound is blended in a proportion of 0.1 to 15% by weight, more preferably 0.5 to 10% by weight, based on 100% by weight of the polyphenylene ether resin. If the amount is less than 0.1% by weight, the effects such as molding fluidity and coloring properties are reduced. The reaction between an ethylenically unsaturated compound such as stearyl acrylate and a polyphenylene ether resin is performed by mixing both in the presence or absence of an organic peroxide and heating the mixture to a temperature equal to or higher than the glass transition temperature of the polyphenylene ether polymer. Can be manufactured by
【0017】本発明の強化樹脂組成物を製造する際に
は、あらかじめエチレン性不飽和化合物を結合したポリ
フェニレンエーテル樹脂を用いても良いし、強化樹脂組
成物を製造する際に同時にアクリル酸ステアリル等のエ
チレン性不飽和化合物を添加することによりポリフェニ
レンエーテル重合体と反応させる方法でも良い。さらに
(A)成分のポリフェニレンエーテル系樹脂にはポリス
チレン系樹脂を混合したものを含むことが出来る。ポリ
スチレン系樹脂とは、一般式(c)In producing the reinforced resin composition of the present invention, a polyphenylene ether resin to which an ethylenically unsaturated compound has been previously bound may be used, or simultaneously with the production of the reinforced resin composition, such as stearyl acrylate. The reaction may be carried out by adding an ethylenically unsaturated compound of the formula (1) to react with the polyphenylene ether polymer. Further, the polyphenylene ether-based resin as the component (A) may include a mixture of a polystyrene-based resin. The polystyrene resin is represented by the general formula (c)
【0018】[0018]
【化2】 Embedded image
【0019】(式中、Rは水素、低級アルキルまたはハ
ロゲンを示し、Zはビニル、水素、ハロゲン及び低級ア
ルキルよりなる群から選択され、pは0〜5の整数であ
る。)で表される芳香族ビニル系単量体単位50重量%
以上から構成される単独重合体または共重合可能な他の
ビニル系単量体またはゴム質重合体との共重合体であ
り、これら単独重合体の具体例としては、スチレン、α
−メチルスチレン、2,4−ジメチルスチレン、モノク
ロロスチレン、p−メチルスチレン、p−tert−ブ
チルスチレン、エチルスチレン等が挙げられる。また、
芳香族ビニル系単量体と共重合可能な他のビニル系単量
体としてはメチルメタクリレート、エチルメタクリレー
ト等のメタクリル酸エステル類、無水マレイン酸等の酸
無水物等が挙げられ、またゴム質重合体としては共役ジ
エン系ゴムあるいは共役ジエンと芳香族ビニル化合物の
コポリマーあるいはエチレン−プロピレン共重合体系ゴ
ム等が挙げられる。(Wherein, R represents hydrogen, lower alkyl or halogen, Z is selected from the group consisting of vinyl, hydrogen, halogen and lower alkyl, and p is an integer of 0 to 5). 50% by weight of aromatic vinyl monomer unit
It is a homopolymer or a copolymer with another copolymerizable vinyl monomer or rubbery polymer composed of the above, specific examples of these homopolymers, styrene, α
-Methylstyrene, 2,4-dimethylstyrene, monochlorostyrene, p-methylstyrene, p-tert-butylstyrene, ethylstyrene and the like. Also,
Examples of other vinyl monomers copolymerizable with the aromatic vinyl monomer include methacrylates such as methyl methacrylate and ethyl methacrylate, and acid anhydrides such as maleic anhydride. Examples of the union include a conjugated diene rubber, a copolymer of a conjugated diene and an aromatic vinyl compound, and an ethylene-propylene copolymer rubber.
【0020】(A)成分においては、ポリフェニレンエ
ーテル系樹脂とポリスチレン系樹脂を任意の割合で配合
することが出来るが、通常その配合比率はポリフェニレ
ンエーテル系樹脂99〜1重量部に対してポリスチレン
系樹脂1〜99重量部であり、好ましくは、ポリフェニ
レンエーテル系樹脂85〜20重量部に対してポリスチ
レン系樹脂15〜80重量部である。In the component (A), the polyphenylene ether-based resin and the polystyrene-based resin can be blended in an arbitrary ratio, and the blending ratio is usually 99 to 1 part by weight of the polyphenylene ether-based resin and the polystyrene-based resin. The amount is from 1 to 99 parts by weight, and preferably from 15 to 80 parts by weight of the polystyrene resin based on 85 to 20 parts by weight of the polyphenylene ether resin.
【0021】本発明の(B)成分に用いる無機質充填剤
の種類は、従来熱可塑性樹脂の補強剤として慣用されて
いるもの、例えば、無機塩、ガラス、カーボン、金属、
セラミックスなどの中から任意のものを、要求特性に応
じて適宜選択して用いることが出来る。また、その形態
は粉末状、粒状、繊維状、ウィスカー状などのいずれで
あってもよい。例えば、低寸法異方性が要求される場合
にはガラスビーズやガラスフレークを、高剛性、高耐衝
撃性が要求される場合にはガラス繊維やウィスカー類を
導電性付与の目的には金属繊維を、高比重が要求される
場合には酸化鉄を選択して用いることが好ましい。The kind of the inorganic filler used in the component (B) of the present invention is selected from those conventionally used as reinforcing agents for thermoplastic resins, for example, inorganic salts, glass, carbon, metal, and the like.
Any one of ceramics and the like can be appropriately selected and used according to required characteristics. Further, the form may be any of powder, granule, fiber, whisker, and the like. For example, when low dimensional anisotropy is required, glass beads and glass flakes are used. When high rigidity and high impact resistance are required, glass fibers and whiskers are used. When high specific gravity is required, it is preferable to select and use iron oxide.
【0022】前記無機質充填剤は1種用いても良いし、
2種以上を組み合わせて用いてもよく、また、本発明の
目的を損なわない範囲で、所望に応じシラン系カップリ
ング剤による表面処理や、集束剤による集束処理が施さ
れたものも用いることができる。この無機質充填剤は、
前記した基本樹脂成分の合計量100重量部に対し、5
〜200重量部の割合で配合することが必須である。こ
の配合量が5重量部未満では剛性及び寸法精度の改良効
果が不十分であるし、200重量部を超えると該充填剤
間の接合のための樹脂量が不足し、著しく機械的強度が
低下する。The inorganic filler may be used alone,
Two or more of them may be used in combination, and those subjected to a surface treatment with a silane-based coupling agent or a sizing agent with a sizing agent may be used as long as the object of the present invention is not impaired. it can. This inorganic filler is
With respect to 100 parts by weight of the total amount of the above basic resin components, 5
It is indispensable to mix in a proportion of 200 parts by weight. When the amount is less than 5 parts by weight, the effect of improving rigidity and dimensional accuracy is insufficient. When the amount exceeds 200 parts by weight, the amount of resin for bonding between the fillers is insufficient, and the mechanical strength is significantly reduced. I do.
【0023】本発明の(C)成分に用いる硫化亜鉛は、
本発明の強化樹脂組成物を有彩色に着色のするために、
従来一般的に用いられている酸化チタンの代わりに用
い、目的の着色に必要な量使用することが出来る。通常
は0.5〜5重量%、好ましくは0.5〜3重量%であ
る。硫化亜鉛は、一般的には、0.2〜0.5μmの平
均粒子径であり、湿潤性および分散特性を向上させるた
めに有機界面活性剤でコーティングされたものが用いら
れる。さらに製法、形状に特に制限はなく、従来熱可塑
性樹脂、熱硬化性樹脂の着色剤、または安定剤として慣
用されているものを用いることが出来る。また、その成
分中に硫酸バリウム等の他の金属硫化物、酸化亜鉛等の
他の金属酸化物を不純物として含んでいても構わない。The zinc sulfide used for the component (C) of the present invention is
In order to color the reinforced resin composition of the present invention into a chromatic color,
It can be used in place of titanium oxide generally used in the prior art, and can be used in an amount necessary for the intended coloring. Usually, it is 0.5 to 5% by weight, preferably 0.5 to 3% by weight. Zinc sulfide generally has an average particle diameter of 0.2 to 0.5 μm, and one coated with an organic surfactant to improve wettability and dispersion properties is used. Further, there is no particular limitation on the production method and shape, and those conventionally used as coloring agents or stabilizers for thermoplastic resins and thermosetting resins can be used. In addition, other metal sulfides such as barium sulfate and other metal oxides such as zinc oxide may be contained in the components as impurities.
【0024】本発明の強化樹脂組成物および成形体が耐
性を示すエポキシ硬化剤としては、電気部品、電気絶縁
材料に一般的に用いられる酸無水物、イミダゾール化合
物、BF3 錯体等のエポキシ硬化剤を挙げることができ
る。酸無水物系としては無水フタル酸、無水ピロメリッ
ト酸、無水トリメリット酸、ヘキサヒドロ無水フタル
酸、メチルテトラヒドロ無水フタル酸、無水メチルナジ
ック酸等であり、イミダゾール化合物系としてはイミダ
ゾール、2−メチルイミダゾール等であり、BF 3 錯体
としては3フッ化ホウ素エチルアミン錯体であり、特に
酸無水物系のエポキシ硬化剤に効果を示す。The reinforced resin composition and molded article of the present invention are resistant to
Epoxy curing agents showing electrical properties include electrical parts and electrical insulation
Acid anhydrides and imidazole compounds commonly used in materials
Things, BFThreeEpoxy curing agents such as complexes
You. The acid anhydrides include phthalic anhydride and pyromellitic anhydride.
Tonic acid, trimellitic anhydride, hexahydrophthalic anhydride
Acid, methyltetrahydrophthalic anhydride, methylnadi anhydride
Acid, etc., and imidazole compounds
Sol, 2-methylimidazole, etc., and BF ThreeComplex
Is a boron trifluoride ethylamine complex,
Effective for acid anhydride type epoxy curing agents.
【0025】本発明の硫化亜鉛を含む組成物がエポキシ
硬化剤に耐性を示す理由は現時点では不明であるが、何
らかの弱い化学結合が生じている可能性もある。また、
適応されるエポキシ樹脂の例としては、ビスフェノール
Aジグリシジルエーテル、ヘキサヒドロビスフェノール
Aジグリシジルエーテル、テトラブロムビスフェノール
Aジグリシジルエーテル、ビスフェノールFジグリシジ
ルエーテル、ビスフェノールSジグリシジルエーテル、
ポリプロピレングリコールジグリシジルエーテル、ネオ
ペンチルグリコールジグリシジルエーテル、フタル酸ジ
グリシジルエーテル、ビスフェノールヘキサブロロアセ
トンジグリシジルエーテル、トリグリシジルイソシアヌ
レート、テトラグリシジルメタキシレンジアミン、クレ
ゾールノボラックポリグリシジルエーテル等が挙げら
れ、1種以上を組み合わせて用いられる。The reason why the composition containing zinc sulfide of the present invention is resistant to an epoxy curing agent is unknown at present, but it is possible that some weak chemical bond has occurred. Also,
Examples of applicable epoxy resins include bisphenol A diglycidyl ether, hexahydrobisphenol A diglycidyl ether, tetrabromobisphenol A diglycidyl ether, bisphenol F diglycidyl ether, bisphenol S diglycidyl ether,
Polypropylene glycol diglycidyl ether, neopentyl glycol diglycidyl ether, phthalic acid diglycidyl ether, bisphenol hexabroloacetone diglycidyl ether, triglycidyl isocyanurate, tetraglycidyl metaxylene diamine, cresol novolak polyglycidyl ether, and the like. These are used in combination.
【0026】本発明の組成物には、他の添加剤、例え
ば、耐衝撃性付与剤、可塑剤、安定剤、紫外線吸収剤、
難燃剤、着色剤、離型剤を添加することができる。耐衝
撃性付与剤としては、ブロック共重合体、水添ブロック
共重合体を単独でまたは組み合わせて使用することが出
来る。ブロック共重合体としては、芳香族ビニル化合物
を主体とする重合体ブロックXおよび共役ジエン化合物
を主体とする重合体ブロックYとからなるブロック共重
合体であり、これに水素添加反応して得られるものが水
添ブロック共重合体である。各部ブロックの結合形式
は、例えばX−Y、X−Y−X、X−Y−X−Y、(X
−Y−)4 −Si、X−Y−X−Y−Xなどである。The composition of the present invention may contain other additives such as impact modifiers, plasticizers, stabilizers, ultraviolet absorbers,
Flame retardants, colorants and release agents can be added. As an impact resistance imparting agent, a block copolymer or a hydrogenated block copolymer can be used alone or in combination. The block copolymer is a block copolymer composed of a polymer block X mainly composed of an aromatic vinyl compound and a polymer block Y mainly composed of a conjugated diene compound, and is obtained by a hydrogenation reaction. These are hydrogenated block copolymers. The connection format of each block is, for example, XY, XYX, XYXY, (X
-Y-) 4- Si, XYXYX and the like.
【0027】安定剤としては、亜リン酸エステル類、ヒ
ンダードフェノール類、アルカノールアミン類、酸アミ
ド類、ジチオカルバミン酸金属塩類、無機硫化物、金属
酸化物類の中から単独でまたは組み合わせて使用するこ
とができる。難燃剤としては、芳香族リン酸エステル、
赤燐、芳香族ハロゲン化合物、三酸化アンチモン等が特
に有効である。As the stabilizer, phosphites, hindered phenols, alkanolamines, acid amides, metal salts of dithiocarbamic acid, inorganic sulfides and metal oxides are used alone or in combination. be able to. As the flame retardant, aromatic phosphate esters,
Red phosphorus, aromatic halogen compounds, antimony trioxide and the like are particularly effective.
【0028】本発明を構成する各成分を混合する方法は
通常公知の方法が用いられ、例えば、押出機、加熱ロー
ル、バンバリーミキサー、ニーダー等を使用することが
出来るが、特にサイドフィーダーを備えた押出機を用
い、無機充填剤をサイドフィーダーを介して混合する方
法が好ましい。本発明の成形体を作製する方法は、通常
公知である例えば溶融射出成形、加熱圧縮成形等の手法
をとることが出来る。As a method for mixing the components constituting the present invention, a generally known method is used. For example, an extruder, a heating roll, a Banbury mixer, a kneader, and the like can be used. In particular, a side feeder is provided. A method of mixing an inorganic filler through a side feeder using an extruder is preferable. As a method for producing the molded article of the present invention, generally known techniques such as melt injection molding and heat compression molding can be employed.
【0029】本発明の成形は耐熱性、耐電気特性を要求
され、接着剤としてエポキシ樹脂が使用されるフライバ
ックトランスなどのコイルボビン、パソコン用電源に用
いられるバックアップ電源ボックスの一部の部品として
使用される。The molding of the present invention is required to have heat resistance and electric resistance, and is used as a part of a coil bobbin such as a flyback transformer using an epoxy resin as an adhesive and a backup power supply box used for a power supply for a personal computer. Is done.
【0030】[0030]
【発明の実施の形態】以下、実施例によって本発明を具
体的に説明するが、本発明は以下の例に限定されるもの
ではない。 成分(A):ポリフェニレンエーテル系樹脂 A−1 :2,6−キシレノールを酸化重合して得た還
元粘度0.54のポリフェニレンエーテル。 A−2 :2,6−キシレノールを酸化重合して得た還
元粘度0.42のポリフェニレンエーテル。 A−3 :2,6−キシレノールを酸化重合して得た還
元粘度0.54のポリフェニレンエーテル100重量部
に対して、アクリル酸ステアリル2重量部を320℃に
設定したベントポート付き二軸押出機(PCM−30;
池貝鉄工(株))を用いて溶融混練しアクリル酸ステア
リル変性ポリフェニレンエーテル樹脂を得たもの。 A−4 :2,6−キシレノールを酸化重合して得た還
元粘度0.54のポリフェニレンエーテル100重量部
に対して、無水マレイン酸1.0重量部、パーブチルD
0.5重量部を均一に混合した後、二軸押出機(PCM
−30;池貝鉄工(株))を用い、窒素雰囲気下で30
0℃にて溶融混練しマレイン酸変性ポリフェニレンエー
テル樹脂を得た。該樹脂を赤外分光光度計により分析し
た結果、0.4重量%の無水マレイン酸が付加してい
た。 A−5 :ポリスチレン(旭化成工業(株)製、商品
名、旭化成ポリスチレン685) A−6 :ゴム変性ポリスチレン(旭化成工業(株)
製、商品名、旭化成ポリスチレン494) 成分(B):無機充填剤 B−1 :アミノシラン処理された直径13μm、3m
mチョップドストランドのガラス繊維 B−2 :ガラスフレーク(日本板硝子(株)製、商品
名、CEF150A) 成分(C):硫化亜鉛 C−1 :硫化亜鉛(SACHTLEBEN CHEM
IE GMBH 製;ドイツ国、商品名、Sachto
lith HD) その他の成分 HTR :ポリスチレン(1)−水素添加されたポリブ
タジエン−ポリスチレン(2)の構造を有し、結合スチ
レン量55%、数平均分子量57,000、分子量分布
1.06、ポリスチレン(1)の数平均分子量16,0
00、ポリスチレン(2)の数平均分子量15,35
0、ポリブタジエン部の水素添加率が99.9%の水添
ブロック共重合体。 リン系難燃剤:ビスフェノールA−ポリクレジルホスフ
ェート:化学式(d)(n=1〜3の混合物)DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be specifically described by way of examples, but the present invention is not limited to the following examples. Component (A): polyphenylene ether-based resin A-1: polyphenylene ether having a reduced viscosity of 0.54 obtained by oxidative polymerization of 2,6-xylenol. A-2: polyphenylene ether having a reduced viscosity of 0.42 obtained by oxidative polymerization of 2,6-xylenol. A-3: A twin-screw extruder equipped with a vent port in which 2 parts by weight of stearyl acrylate is set at 320 ° C. with respect to 100 parts by weight of polyphenylene ether having a reduced viscosity of 0.54 obtained by oxidative polymerization of 2,6-xylenol. (PCM-30;
Melted and kneaded using Ikegai Iron Works Co., Ltd. to obtain stearyl acrylate-modified polyphenylene ether resin. A-4: 100 parts by weight of polyphenylene ether having a reduced viscosity of 0.54 obtained by oxidative polymerization of 2,6-xylenol, 1.0 part by weight of maleic anhydride, and perbutyl D
After uniformly mixing 0.5 parts by weight, a twin-screw extruder (PCM
-30; Ikegai Iron Works, Ltd.) under nitrogen atmosphere.
The mixture was melt-kneaded at 0 ° C. to obtain a maleic acid-modified polyphenylene ether resin. Analysis of the resin with an infrared spectrophotometer revealed that 0.4% by weight of maleic anhydride had been added. A-5: Polystyrene (Asahi Kasei Kogyo Co., Ltd., trade name, Asahi Kasei Polystyrene 685) A-6: Rubber modified polystyrene (Asahi Kasei Kogyo Co., Ltd.)
Manufactured by Asahi Kasei Polystyrene 494) Component (B): inorganic filler B-1: aminosilane-treated 13 μm, 3 m
m chopped strand glass fiber B-2: glass flakes (trade name, CEF150A, manufactured by Nippon Sheet Glass Co., Ltd.) Component (C): zinc sulfide C-1: zinc sulfide (SACHLEBEN CHEM)
Made by IE GMBH; Germany, trade name, Sachto
lith HD) Other components HTR: Polystyrene (1) -hydrogenated polybutadiene-polystyrene (2) structure, bonded styrene content 55%, number average molecular weight 57,000, molecular weight distribution 1.06, polystyrene ( 1) number average molecular weight of 16,0
00, number average molecular weight of polystyrene (2) 15,35
0, a hydrogenated block copolymer having a hydrogenation rate of the polybutadiene portion of 99.9%. Phosphorus-based flame retardant: bisphenol A-polycresyl phosphate: chemical formula (d) (a mixture of n = 1 to 3)
【0031】[0031]
【化3】 Embedded image
【0032】酸化チタン:TiO2 (Tioxide
(株)商品名、R−TC30)) 本実施例中の物性値または特性値は下記の方法により測
定した。 荷重たわみ温度(DTULと略す。):ASTM D2
56に基づき、荷重18.6Kg/cm2 にて測定し
た。 耐衝撃性:4分の1インチ厚試験片を用いてASTM
D638に従ってノッチ付きIZOD衝撃強さを測定し
た。 耐エポキシ硬化剤性:ASTM1号ダンベル試験片を曲
げ歪み治具に取り付け、試験片中央部にエポキシ硬化剤
を浸み込ませたガーゼを乗せる。サンプルにクラック、
クレーズが発生するまでの時間を測定することにより耐
エポキシ硬化剤性を評価した。測定はエポキシ硬化剤に
ヘキサヒドロ無水フタル酸系硬化剤を用い、360分ま
で測定を行った。クラック、クレーズが発生するまでの
時間が長いほど、エポキシ硬化剤に対する耐性に優れ
る。Titanium oxide: TiO 2 (Tioxide)
(Trade name, R-TC30)) The physical property values or characteristic values in this example were measured by the following methods. Deflection temperature under load (abbreviated as DTUL): ASTM D2
The measurement was carried out based on No. 56 at a load of 18.6 kg / cm 2 . Impact resistance: ASTM using 1/4 inch thick test specimen
The notched IZOD impact strength was measured according to D638. Epoxy curing agent resistance: A test piece of ASTM No. 1 dumbbell was attached to a bending strain jig, and a gauze impregnated with an epoxy curing agent was placed on the center of the test piece. Crack on sample,
The epoxy curing agent resistance was evaluated by measuring the time until the occurrence of craze. The measurement was performed up to 360 minutes using a hexahydrophthalic anhydride-based curing agent as the epoxy curing agent. The longer the time until cracks and crazes occur, the better the resistance to the epoxy curing agent.
【0033】[0033]
【実施例1】(A)成分のポリフェニレンエーテル系樹
脂(A−1)及び(A−4)、それぞれ35重量部、3
重量部、ポリスチレン系樹脂(A−5)及び(A−6)
各31部、(B)成分の無機充填剤(B−1)20重量
部、(C)成分の硫化亜鉛(C−1)1.5重量部をサ
イドフィーダー付き二軸押出機(PCM−87 池貝鉄
工(株))を用い、サイドフィーダー部より無機充填剤
を投入、上流のメインフィーダーより残り全ての原料を
投入し300℃の温度にて溶融混練して強化樹脂組成物
をペレットとして得た。このペレットを用いて290〜
310℃に設定したインラインスクリュー型射出成形機
に供給し、金型温度90℃または120℃の条件で試験
用テストピースを射出成形した。該強化樹脂組成物の物
性試験結果を表1に示す。Example 1 35 parts by weight of each of the polyphenylene ether resins (A-1) and (A-4) of the component (A)
Parts by weight, polystyrene resin (A-5) and (A-6)
31 parts each, 20 parts by weight of the inorganic filler (B-1) of the component (B), and 1.5 parts by weight of zinc sulfide (C-1) of the component (C) were introduced into a twin-screw extruder with side feeder (PCM-87). Using Ikegai Iron Works Co., Ltd., an inorganic filler was charged from a side feeder portion, all remaining raw materials were charged from an upstream main feeder, and melt-kneaded at a temperature of 300 ° C. to obtain a reinforced resin composition as pellets. . 290 using these pellets
The test piece was supplied to an in-line screw type injection molding machine set at 310 ° C., and a test test piece was injection-molded at a mold temperature of 90 ° C. or 120 ° C. Table 1 shows the physical property test results of the reinforced resin composition.
【0034】[0034]
【実施例2】(A)成分、ポリフェニレンエーテル系樹
脂(A−1)及び(A−4)、それぞれ60重量部、5
重量部、ポリスチレン系樹脂(A−5)及び(A−6)
各17.5部、(B)成分の無機充填剤(B−1)20
重量部、(C)成分の硫化亜鉛(C−1)1.5重量部
を実施例1と同様の操作により強化樹脂組成物および試
験用テストピースを得た。該強化樹脂組成物の物性試験
結果を表1に示す。Example 2 Component (A), polyphenylene ether resins (A-1) and (A-4), each 60 parts by weight, 5 parts by weight
Parts by weight, polystyrene resin (A-5) and (A-6)
17.5 parts for each, inorganic filler (B-1) 20 of component (B)
A reinforced resin composition and a test piece for testing were obtained in the same manner as in Example 1 by using 1.5 parts by weight of zinc sulfide (C-1) as the component (C). Table 1 shows the physical property test results of the reinforced resin composition.
【0035】[0035]
【実施例3】実施例2の(A−1)成分を(A−2)
へ、(C)成分の硫化亜鉛(C−1)を5重量部へ代え
た以外は、実施例2と同様の操作により強化樹脂組成物
および試験用テストピースを得た。該強化樹脂組成物の
物性試験結果を表1に示す。Example 3 The component (A-1) of Example 2 was replaced with (A-2)
In addition, a reinforced resin composition and a test test piece were obtained in the same manner as in Example 2, except that zinc sulfide (C-1) as the component (C) was changed to 5 parts by weight. Table 1 shows the physical property test results of the reinforced resin composition.
【0036】[0036]
【実施例4】実施例2の(A−1)成分を(A−3)
へ、(C)成分の硫化亜鉛(C−1)を10重量部へ代
えた以外は、実施例2と同様の操作により強化樹脂組成
物および試験用テストピースを得た。結果を表1に示
す。Example 4 The component (A-1) of Example 2 was replaced with (A-3)
In addition, a reinforced resin composition and a test test piece were obtained in the same manner as in Example 2, except that zinc sulfide (C-1) as the component (C) was changed to 10 parts by weight. Table 1 shows the results.
【0037】[0037]
【実施例5】実施例2の(B−1)成分を、30重量部
へ代えた以外は、実施例2と同様の操作により強化樹脂
組成物および試験用テストピースを得た。該強化樹脂組
成物の物性試験結果を表1に示す。Example 5 A reinforced resin composition and a test piece for testing were obtained in the same manner as in Example 2, except that the component (B-1) in Example 2 was changed to 30 parts by weight. Table 1 shows the physical property test results of the reinforced resin composition.
【0038】[0038]
【実施例6】(A)成分のポリフェニレンエーテル系樹
脂(A−1)及び(A−4)、それぞれ60重量部、5
重量部、ポリスチレン系樹脂(A−5)及び(A−6)
各17.5部、(B)成分の無機充填剤(B−1)及び
(B−2)を、それぞれ20重量部、10重量部、
(C)成分の硫化亜鉛(C−1)1.5重量部を実施例
1と同様の操作により強化樹脂組成物および試験用テス
トピースを得た。該強化樹脂組成物の物性試験結果を表
1に示す。Example 6 The polyphenylene ether resins (A-1) and (A-4) of the component (A) were each 60 parts by weight, and 5 parts by weight.
Parts by weight, polystyrene resin (A-5) and (A-6)
17.5 parts of each, 20 parts by weight, 10 parts by weight of the inorganic fillers (B-1) and (B-2) of the component (B), respectively.
1.5 parts by weight of zinc sulfide (C-1) as the component (C) was obtained in the same manner as in Example 1 to obtain a reinforced resin composition and a test piece for testing. Table 1 shows the physical property test results of the reinforced resin composition.
【0039】[0039]
【実施例7】(A)成分ポリフェニレンエーテル系樹脂
(A−1)及び(A−4)、それぞれ60重量部、5重
量部、ポリスチレン系樹脂(A−5)及び(A−6)各
15部、その他の成分としてHTRを5重量部、(B)
成分の無機充填剤(B−1)20重量部、(C)成分の
硫化亜鉛(C−1)1.5重量部を実施例1と同様の操
作により強化樹脂組成物および試験用テストピースを得
た。該強化樹脂組成物の物性試験結果を表1に示す。Example 7 Component (A) Polyphenylene ether resins (A-1) and (A-4), 60 parts by weight and 5 parts by weight, respectively, and polystyrene resins (A-5) and (A-6) each having 15 parts by weight Parts, 5 parts by weight of HTR as other components, (B)
20 parts by weight of the inorganic filler (B-1) as the component and 1.5 parts by weight of zinc sulfide (C-1) as the component (C) were prepared in the same manner as in Example 1 to obtain a reinforced resin composition and a test piece for testing. Obtained. Table 1 shows the physical property test results of the reinforced resin composition.
【0040】[0040]
【実施例8】(A)成分、ポリフェニレンエーテル系樹
脂(A−1)及び(A−4)、それぞれ55重量部、5
重量部、ポリスチレン系樹脂(A−5)及び(A−6)
各10部、その他の成分として、リン系難燃剤を15重
量部、(B)成分の無機充填剤(B−1)、20重量
部、(C)成分の硫化亜鉛(C−1)、1.5重量部を
実施例1と同様の操作により強化樹脂組成物および試験
用テストピースを得た。該強化樹脂組成物の物性試験結
果を表1に示す。Example 8 Component (A), 55 parts by weight of each of polyphenylene ether-based resins (A-1) and (A-4),
Parts by weight, polystyrene resin (A-5) and (A-6)
10 parts each, 15 parts by weight of phosphorus-based flame retardant, 20 parts by weight of inorganic filler (B-1) of component (B), zinc sulfide (C-1) of component (C), A reinforced resin composition and a test test piece were obtained in the same manner as in Example 1 except that 0.5 part by weight was used. Table 1 shows the physical property test results of the reinforced resin composition.
【0041】[0041]
【比較例1】実施例1中の(C)成分、硫化亜鉛(C−
1)を、酸化チタンへ代える他は実施例1と同様の操作
により強化樹脂組成物および試験用テストピースを得
た。該強化樹脂組成物の物性試験結果を表2に示す。Comparative Example 1 The component (C) in Example 1, zinc sulfide (C-
A reinforced resin composition and a test test piece were obtained in the same manner as in Example 1 except that 1) was replaced with titanium oxide. Table 2 shows the physical property test results of the reinforced resin composition.
【0042】[0042]
【比較例2】実施例2中の(C)成分、硫化亜鉛(C−
1)を、酸化チタンへ代える他は実施例1と同様の操作
により強化樹脂組成物および試験用テストピースを得
た。該強化樹脂組成物の物性試験結果を表2に示す。Comparative Example 2 The component (C) in Example 2, zinc sulfide (C-
A reinforced resin composition and a test test piece were obtained in the same manner as in Example 1 except that 1) was replaced with titanium oxide. Table 2 shows the physical property test results of the reinforced resin composition.
【0043】[0043]
【比較例3】実施例3中の(C)成分、硫化亜鉛(C−
1)を、酸化チタンへ代える他は実施例1と同様の操作
により強化樹脂組成物および試験用テストピースを得
た。該強化樹脂組成物の物性試験結果を表2に示す。Comparative Example 3 The component (C) in Example 3, zinc sulfide (C-
A reinforced resin composition and a test test piece were obtained in the same manner as in Example 1 except that 1) was replaced with titanium oxide. Table 2 shows the physical property test results of the reinforced resin composition.
【0044】[0044]
【比較例4】実施例4中の(C)成分、硫化亜鉛(C−
1)を、酸化チタンへ代える他は実施例1と同様の操作
により強化樹脂組成物および試験用テストピースを得
た。該強化樹脂組成物の物性試験結果を表2に示す。Comparative Example 4 The component (C) in Example 4, zinc sulfide (C-
A reinforced resin composition and a test test piece were obtained in the same manner as in Example 1 except that 1) was replaced with titanium oxide. Table 2 shows the physical property test results of the reinforced resin composition.
【0045】[0045]
【比較例5】実施例5中の(C)成分、硫化亜鉛(C−
1)を、酸化チタンへ代える他は実施例1と同様の操作
により強化樹脂組成物および試験用テストピースを得
た。該強化樹脂組成物の物性試験結果を表2に示す。Comparative Example 5 The component (C) in Example 5, zinc sulfide (C-
A reinforced resin composition and a test test piece were obtained in the same manner as in Example 1 except that 1) was replaced with titanium oxide. Table 2 shows the physical property test results of the reinforced resin composition.
【0046】[0046]
【表1】 [Table 1]
【0047】[0047]
【表2】 [Table 2]
【0048】[0048]
【発明の効果】本発明の組成物、及び成形体は、従来の
強化ポリフェニレンエーテル系樹脂組成物では達し得な
かった高い耐エポキシ硬化剤性、耐熱性、機械物性のバ
ランスに優れ、イグニッションコイルボビン芯材用途
等、産業上有用である。EFFECTS OF THE INVENTION The composition and molded article of the present invention are excellent in the balance of high epoxy curing agent resistance, heat resistance and mechanical properties which cannot be achieved by the conventional reinforced polyphenylene ether-based resin composition, and have an ignition coil bobbin core. It is industrially useful for material applications.
Claims (4)
00重量部に対し、(B)無機質充填剤5〜200重量
部、(C)必要量の硫化亜鉛を配合してなる強化樹脂組
成物。(A) Polyphenylene ether-based resin 1
A reinforced resin composition comprising (B) 5-200 parts by weight of an inorganic filler and (C) a required amount of zinc sulfide with respect to 00 parts by weight.
樹脂が、エチレン性不飽和化合物により変性されたポリ
フェニレンエーテル系樹脂である請求項1記載の強化樹
脂組成物。2. The reinforced resin composition according to claim 1, wherein the polyphenylene ether resin as the component (A) is a polyphenylene ether resin modified with an ethylenically unsaturated compound.
物がアクリル酸ステアリルまたはスチレンである請求項
1記載の強化樹脂組成物。3. The reinforced resin composition according to claim 1, wherein the ethylenically unsaturated compound is stearyl acrylate or styrene.
F3 錯体の1種以上のエポキシ硬化剤を用いるエポキシ
樹脂と接着された、請求項第1〜3項記載の組成物から
成形された成形体およびイグニッションコイルボビン芯
材。4. An acid anhydride, an imidazole compound and B
F 3 is adhered with epoxy resin to use at least one epoxy curing agent of the complex, moldings molded from the composition of any of Claims 1 to 3 claims and ignition coil bobbin core.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16292897A JP3640503B2 (en) | 1997-06-19 | 1997-06-19 | Reinforced resin composition having excellent resistance to epoxy curing agent and molded article thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16292897A JP3640503B2 (en) | 1997-06-19 | 1997-06-19 | Reinforced resin composition having excellent resistance to epoxy curing agent and molded article thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH115895A true JPH115895A (en) | 1999-01-12 |
| JP3640503B2 JP3640503B2 (en) | 2005-04-20 |
Family
ID=15763906
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16292897A Expired - Lifetime JP3640503B2 (en) | 1997-06-19 | 1997-06-19 | Reinforced resin composition having excellent resistance to epoxy curing agent and molded article thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3640503B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004128335A (en) * | 2002-10-04 | 2004-04-22 | Asahi Kasei Chemicals Corp | Ignition coil bobbin |
| JP2009016638A (en) * | 2007-07-06 | 2009-01-22 | Kyocera Chemical Corp | High-voltage transformer, and manufacturing method thereof |
| JP2010270277A (en) * | 2009-05-25 | 2010-12-02 | Mitsubishi Engineering Plastics Corp | Highly insulating polyphenylene ether resin molded product |
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|---|---|---|---|---|
| JPS4957044A (en) * | 1972-06-02 | 1974-06-03 | ||
| JPS60233150A (en) * | 1984-05-07 | 1985-11-19 | Mitsubishi Rayon Co Ltd | Glass-fiber reinforced polyethylene terephthalate based resin composition colored to white |
| JPS61158116A (en) * | 1984-12-29 | 1986-07-17 | Asahi Chem Ind Co Ltd | Resin sealed transformer |
| JPS63258950A (en) * | 1987-02-17 | 1988-10-26 | ゼネラル・エレクトリック・カンパニイ | Polyphenylene ether composition having improved adhesiveness to epoxy resin |
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| JPH07196869A (en) * | 1994-01-05 | 1995-08-01 | Mitsubishi Gas Chem Co Inc | Antibacterial resin composition with discoloration prevented |
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| JPS4957044A (en) * | 1972-06-02 | 1974-06-03 | ||
| JPS60233150A (en) * | 1984-05-07 | 1985-11-19 | Mitsubishi Rayon Co Ltd | Glass-fiber reinforced polyethylene terephthalate based resin composition colored to white |
| JPS61158116A (en) * | 1984-12-29 | 1986-07-17 | Asahi Chem Ind Co Ltd | Resin sealed transformer |
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| JPH03163164A (en) * | 1989-09-07 | 1991-07-15 | Basf Ag | Filled thermoplastic resin |
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| JPH07196869A (en) * | 1994-01-05 | 1995-08-01 | Mitsubishi Gas Chem Co Inc | Antibacterial resin composition with discoloration prevented |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004128335A (en) * | 2002-10-04 | 2004-04-22 | Asahi Kasei Chemicals Corp | Ignition coil bobbin |
| JP2009016638A (en) * | 2007-07-06 | 2009-01-22 | Kyocera Chemical Corp | High-voltage transformer, and manufacturing method thereof |
| JP2010270277A (en) * | 2009-05-25 | 2010-12-02 | Mitsubishi Engineering Plastics Corp | Highly insulating polyphenylene ether resin molded product |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3640503B2 (en) | 2005-04-20 |
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