JPH1174700A - Component imaging device - Google Patents

Abstract

(57) [Problem] To provide a component imaging apparatus capable of imaging each component sucked by a plurality of suction nozzles with high accuracy and high speed with a simple configuration. SOLUTION: The suction state of each component sucked by a plurality of suction nozzles 14a to 14d is imaged by imaging means provided corresponding to each suction nozzle. The image of the component sucked by the suction nozzle is guided by the scanning mirror 5 in the direction of the imaging unit. The scanning mirror sequentially enters the component position sucked by each suction nozzle by the mirror moving mechanisms 12 and 13. At this time, the scanning mirror is moved so that the video of the component captured by the imaging unit becomes a still image. The scanning mirror sequentially enters the lower part of the component sucked by each suction nozzle, and a still image of each component is imaged by the associated imaging means, so that high-accuracy and high-speed imaging can be performed.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a component image pickup device, and more particularly, to a device for automatically mounting an electronic component on a substrate. The present invention relates to a component imaging device for imaging.

[0002]

2. Description of the Related Art In an apparatus (mounter) for automatically mounting electronic components on a substrate, electronic components supplied from an electronic component supply section are picked up by a suction nozzle provided on a transfer head, and thereafter the transfer head is mounted on the substrate. The electronic component is mounted on the board by moving in the XY directions. Conventionally, a component recognition camera for imaging an electronic component is arranged on the main body side on the way to the board, and the transfer head temporarily stops at this component recognition camera or moves at a predetermined speed when moving in XY. Then, imaging of the electronic component is performed. This imaging result is processed by the image processing apparatus, and the orientation (inclination) of the component and the position of the center of gravity are calculated. Based on the calculated values, correction is performed so that the component and the board to be mounted have a predetermined orientation and position. The XY movement is performed to the substrate, and the electronic component is correctly mounted on the substrate.

However, in the above-described method, the transfer head must move XY and temporarily stop or pass at a predetermined speed to the place where the component recognition camera for imaging the electronic component is installed. However, there is a problem that the mounting speed is reduced.

In order to solve the above problem, Japanese Patent Application Laid-Open Nos. 3-265198, 4-107986 and 6-120694 propose a configuration in which a component recognition camera is mounted on the transfer head itself. . In these configurations, a mirror that guides an image of the electronic component to a component recognition camera is tilted and disposed directly below the electronic component sucked by the suction nozzle. This mirror has a structure such that when the suction nozzle sucks the electronic component supplied from the electronic component supply unit or when the electronic component is mounted on the board, the mirror is in a retracted position deviated from a position below the suction nozzle. Since the image of the electronic component sucked by the suction nozzle can be captured while the transfer head is moving to the substrate, the mounting speed of the electronic component on the substrate can be improved.

Japanese Patent Application Laid-Open No. 3-293800 discloses a transfer head equipped with a plurality of suction nozzles, a mirror inclined at a position directly below the electronic component sucked by the suction nozzle, and a video of the electronic component. There is a recognition unit that integrates the optical system leading to the camera with the component recognition camera, and this recognition unit moves to the suction nozzles sequentially and sequentially images the electronic components sucked by the plurality of suction nozzles. Recognizable. This method has a structure in which an image of the electronic component sucked by the suction nozzle can be captured while the transfer head is moving to the substrate, similarly to the above method.

[0006]

However, in order to simultaneously or individually pick up a plurality of electronic components from the electronic component supply unit in order to increase the mounting speed, a plurality of suction nozzles are transferred in a straight line. Must be installed on the head.

Therefore, according to the configurations disclosed in the above three publications, in order for the electronic component sucked by the plurality of suction nozzles to be recognized by the component recognition camera arranged on the transfer head, the suction nozzle is used. It is necessary to arrange a plurality of mirrors arranged obliquely at a position directly below the electronic component. Since electronic components can be mounted more quickly when the suction nozzle pitch is shortened for a substrate having a high mounting density, the mounting pitch of the suction nozzles is reduced when a plurality of suction nozzles are provided in the transfer head. In 265198 or JP-A-6-120694, if the suction nozzle pitch is shortened, it becomes impossible to secure a retreat space for the mirror.
There is a problem.

[0008] Japanese Patent Application Laid-Open No. 4-107798 also describes
A disadvantage is that the mirror, which is tilted and placed at the position directly below the sucked electronic component, must be moved with high precision to the position directly below the electronic component at the time of component recognition or component suction and mounting, which takes time. is there.

[0009] Regarding JP-A-3-293800,
Since the optical axis moves, it is necessary to position the optical system for guiding the image of the electronic component to the component recognition camera and the unit of the component recognition camera with high accuracy each time. Also, when capturing an image of the terminal surface of the electronic component sucked by the suction nozzle while the component recognition camera is moving as a unit, the component must be illuminated in a very short time. For example,
The moving speed of the unit for one component recognition camera is 500 m.
If m / s is set, recognition accuracy cannot be obtained unless it is at least several μs or less. This is the same even if an electronic shutter is adopted. Alternatively, the unit of the component recognition camera must be moved at a low speed, and in the former case, a very bright special illuminating device such as a strobe must be installed for each suction nozzle. Has the drawbacks that it is difficult in terms of space and that the cost and weight are considerably increased. In the latter case, the mounting speed may be reduced.

SUMMARY OF THE INVENTION Accordingly, the present invention has been made in order to solve such a problem, and has a simple structure to capture a still image with high accuracy and high speed for each component sucked by a plurality of suction nozzles. It is an object of the present invention to provide a component imaging device capable of performing the above.

[0011]

SUMMARY OF THE INVENTION In order to solve this problem, the present invention provides a component image pickup device for picking up the suction state of each component sucked by a plurality of suction nozzles. An imaging unit provided, a deflecting member for deflecting the image of the component sucked by the suction nozzle to the imaging unit, and a deflecting member moving mechanism for sequentially moving the deflecting member to the position of the component sucked by each suction nozzle,
The deflecting member moving mechanism employs a configuration in which the deflecting member is moved so that the image of the component imaged by the imaging unit via the deflecting member becomes a still image.

In such a configuration, the deflecting member sequentially enters the component position sucked by each suction nozzle, and a still image of each component is picked up by the associated image pickup means. Imaging becomes possible.

The image pickup means is provided for each suction nozzle individually or in common. Further, each imaging means has an imaging device (large-field, small-field CCD camera) having a different visual field so that an image can be captured in a different visual field according to the type (size) of the component, and a shutter mechanism is provided. It is configured to have.

When the deflecting member moves to the position of the component sucked by each suction nozzle, the component is subjected to reflection illumination or transmission illumination for a predetermined period of time, and an image is taken by an imaging device. At this time, the shutter is released to capture a still image.

The suction nozzle moves between the standby position and the recognition position according to the movement of the deflecting member, and the timing of returning from the recognition position to the standby position is changed according to the size of the sucked component. With such a configuration, for example, when the size of the component is smaller than the predetermined size, the timing of lowering from the recognition position to the standby position can be advanced, and the mounting tact can be improved.

Further, when a shift is detected between the imaging optical axis and the suction nozzle axis when the component is imaged, means for correcting the shift is provided. With this correction means, even when some acceleration is generated in the apparatus, even when the imaging optical axis and the suction nozzle axis are displaced compared to the stationary state, the displacement can be corrected, and accurate component mounting becomes possible.

[0017]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below in detail based on an embodiment shown in the drawings.

FIG. 1 is a schematic configuration diagram showing the overall configuration of a transfer head unit on which a component imaging device of the present invention is mounted.
1 is an X-axis frame, 2 is an X-axis moving rail, 3 is an X-axis slide guide, 4 is a head bracket, and the head bracket 4 is moved through the X-axis slide guide 3 by a mechanism (not shown). The X-axis frame 1 is configured to move along the use rail 2.

A bracket 11 for attaching a drive motor 12 is fixed to the head bracket 4. The drive motor 12 connects a support stay 8 fixed to a guide 9 via a belt transmission mechanism 13 to a rail 10. Move along. Since the scanning mirror bracket 6 is fixed to the support stay 8, the scanning mirror bracket 6 can be reciprocated along the rail 10 by the drive motor 12. In the scanning mirror bracket 6, the scanning mirror 5 is arranged at an angle such that a lower image of the component sucked by the suction nozzle can be projected to a component recognition camera described later. Further, cover glasses 7a and 7b are attached to the entrance and exit of light of the scanning mirror 5 of the scanning mirror bracket 6.

Nozzle brackets 16a to 16d are fixed to the head bracket 4, and suction nozzles 14a to 14d are attached to each nozzle bracket. Each suction nozzle has a hollow structure, and a positive pressure / negative pressure is applied by positive pressure / negative pressure means (not shown) from the positive / negative pressure supply couplings 15a to 15d. The supplied electronic component is sucked at the tip of the suction nozzle, and the component can be detached from the suction nozzle on the substrate.

Further, the suction nozzles 14a to 14d are rotatably supported by nozzle brackets 16a to 16d with respect to the suction nozzle axis, and the θ-axis couplings 17a to 17d
, And is rotated by θ by θ-axis drive motors 18a to 18d, so that the suction attitude (angle) of the component sucked by the suction nozzle can be changed.

The nozzle brackets 16a to 16d
Is fixed to the Z-axis slide guide 19 and the Z-axis rail 2
It is possible to move up and down freely above zero. The Z-axis slide guide 19 is connected to the Z-axis slide guide 19 via Z-axis couplings 21a to 21d.
By rotating the screw portions 23a to 23d of the ball screws by the shaft drive motors 22a to 22d, the ball nozzles are moved up and down along the Z-axis rail 20, and finally the suction nozzles 14a to 14d are moved up and down.

As is apparent from FIG. 1, the tips (axial centers) of the suction nozzles are arranged on the same straight line (plane) so that the electronic components can be simultaneously sucked from the electronic component supply section. .

The transfer head section 30 is constituted by the entire components arranged on the head bracket 4. The transfer head unit 30 is configured to be able to move in the X-axis direction and also in the Y-axis direction by a mechanism (not shown) to be able to move onto the substrate.

FIG. 2 shows a component image pickup unit disposed on the back of FIG. 1 of the present invention. The reflection illuminators 24a to 24d and the half mirror 2 correspond to the suction nozzles 14a to 14d.
5a to 25d, reflection mirrors 26a to 26d, small-field component recognition camera (CCD camera with built-in lens) 27a to 27
d, large-field component recognition cameras (CCD cameras with built-in lenses) 28a to 28d are provided, respectively. An imaging means for imaging the component sucked by the suction nozzle by each component recognition camera is configured. Further, the illumination units, the component recognition cameras, and the mirrors are unitized for each suction nozzle and fixed to a recognition bracket (not shown). The recognition bracket is fixed to the head bracket 4. Reference numerals 29a to 29d denote transmission illumination units that illuminate the back of the electronic component and obtain a shadow image. It is shown separately with suction nozzles to avoid clutter in the figure.

FIG. 3 is a block diagram of an electric circuit used. Z-axis control units 40a to 40d respectively drive Z-axis drive motors 22a to 22d to move the suction nozzles 14a to 14d in the Z-axis direction. Control. The θ-axis control units 41a to 41d respectively drive the θ-axis drive motors 18a to 18d to drive the suction nozzles 14a to 14d.
Control the θ axis rotation of d.

Further, the scanning mirror drive control section 42
The control unit drives the scanning mirror driving motor 12 via the scanning mirror driving motor driver 43 to reciprocate the scanning mirror 5 in the X-axis direction, and to control the components sucked by the suction nozzles 14a to 14d. Pass through the bottom. At this time, the positions of the scanning mirrors are detected by scanning mirror position detection sensors 44a to 44d provided corresponding to the suction nozzles 14a to 14d, respectively.

For example, if the scanning mirror 5 is
When the position is detected by the position detection sensor 44a (44b, 44c, 44d) corresponding to (14b, 14c, 14d), this information is input to the image capturing unit 45, whereby the image capturing unit 45 switches the camera switching unit 46. Through the small-field component recognition camera 27a (27b, 27c, 27d) or the large-field component recognition camera 28a (28b, 28c,
28d), and the reflected illumination unit 24a (24b, 24c, 2c) via the illumination switching and lighting means 47.
4d) or the transmitted illumination unit 29a (29b, 29c, 2
Switch to 9d). Whether to use the small-field component recognition camera or the large-field component recognition camera, or to use the reflection illumination unit or the transmission illumination unit is determined according to the type of the component to be sucked.

The size of the scanning mirror and its scanning speed are as follows:
When the scanning mirror is detected by the next position detection sensor and switched to the next recognition camera and the illumination unit, the image of the suction nozzle component illuminated by the illumination unit that was valid until then is recognized by the associated recognition camera. It is set so that the image can be captured as a still image, and the scanning mirror separates from the optical path of the imaging optical system that has been effective until then and enters the optical path of the next imaging optical system.

As described above, the suction parts of the suction nozzles 14a to 14d which are sequentially illuminated by the associated illuminating units as the scanning mirror 5 moves are moved to the associated recognition camera 27.
a to 27d or 28a to 28d are sequentially captured as still images, captured by the image capturing unit 45,
The image recognition processing unit 48 performs image processing, and detects a suction posture (a shift between the suction center and the center of the component, a tilt, and the like) of the component sucked by the suction nozzle.

The operation of the above configuration will be described according to the operation flow of FIG.

The transfer head unit 30 shown in FIG. 1 is moved to an electronic component supply unit (not shown) by an XY drive mechanism (not shown). After acquiring the component data in step S1, the suction nozzles 14a to 14d are selected (step S1).
2) The respective Z-axis drive motors 22a to 22d are driven by the Z-axis control units 40a to 40d, and the respective couplings 21 are driven.
suction nozzles 14a-1 selected through a-21d
4d descends to each electronic component suction position, a negative pressure is applied to each positive pressure / negative pressure supply coupling 15a to 15b, and each electronic component is sucked. This is continued until the suction operation is completed by all the suction nozzles (steps S3 and S4).

When all the Z-axis suction operations are completed, in step S5, each suction nozzle is moved to each Z-axis drive motor 22.
The electronic components are raised to the recognition positions corresponding to the respective electronic components that have been sucked by a to 22d. At this time, the height of the electronic component suction position and the recognition position is obtained by correcting the thickness of each sucked electronic component since the data of each sucked electronic component has been acquired in advance in step S1.

FIG. 5 shows the recognition positions of the suction nozzles 14a to 14d and the standby position. The recognition positions are the component recognition cameras 27a to 27d and 28a to 28c, in which the images of the electronic components at these positions are provided with built-in lenses. This is the position where the image is accurately captured at 28d. At this time, a standby position is set, which is set at a position where the height of the electronic component mounted on the substrate 31 positioned at a predetermined position escapes (a position where the transfer head unit 30 can move XY). If it is determined in step S6 that the Z-axis (suction nozzle) has risen higher than the standby position, the transfer head unit 30 starts XY movement toward the substrate 31 positioned at a predetermined location. (Step S7) In the meantime, the Z-axis ascent to the recognition position is entirely completed (Step S8).

While the transfer head 30 is moving in the X and Y directions, the scanning mirror 5 is moved by the scanning mirror driving motor 12 from right to left (from left to right when the mirror is at the left) from FIGS. Start (step S9).

The scanning mirror 5 is connected to the suction nozzle 14a (14
b, 14c, 14d) (step S10) when the position is detected by the scanning mirror position detection sensor 44a (44b, 44c, 44d) at a position corresponding to the position below (in this case, sequentially from right to left). Lighting unit 24 suitable for
a (24b, 24c, 24d) or the transmitted illumination unit 29
a (29b, 29c, 29d) are driven by the illumination switching and lighting means 47.

The still image of the electronic component illuminated by the illuminator driven in this manner is displayed while the scanning mirror 5 is moving.
Via a half mirror 25a (25b, 25c, 25d) and a reflection mirror 26a (26b, 26c, 26d), a small field-of-view component recognition camera 27a (27b, 27c, 27d) selected according to the size of an electronic component or The image is captured by the large-field component recognition camera 28a (28b, 28c, 28d). At this time, the terminal surfaces of the electronic components that are sequentially illuminated become images of the reflected light or the projections, and an accurate image (clear image) of the electronic components sucked by each suction nozzle can be obtained.

In this way, the images of the electronic components are sequentially captured by the corresponding recognition cameras. At this time, when it is confirmed by the scanning mirror position detection sensor that the scanning mirror has moved to the next suction nozzle, the previous suction nozzle is lowered to the standby position shown in FIG. 5 by the Z-axis drive motor (step S11). Subsequently, the above operation is repeated until all the picked-up component imaging is completed in steps S12 and S13.

While the suction nozzles are successively lowered, the images of the electronic components are sequentially captured via the image capturing unit 45, image-processed by the image recognition processing unit 48, and the attitude (tilt) and displacement of the electronic components are detected. Are sequentially calculated (step S14).

If it is determined in step S15 that the recognition process has been completed, a correction operation is started in steps S16 and S17. This correction operation is performed as follows.
Based on the above calculation results, the inclination correction is performed by sequentially rotating the suction nozzles 14a to 14b by θ in a predetermined direction by the θ-axis drive motors 18a to 18d via the θ-axis couplings 17a to 17b. Then, the transfer head 30
During the movement to the substrate 31 by the XY-axis motor of the XY movement mechanism, the displacement between the suction center and the component center is corrected. During this time, the suction nozzles are driven by the Z-axis drive motors 22a to 22d.
The electronic components sucked by the suction nozzles are sequentially positioned at respective predetermined locations on the board corresponding to the suction nozzle, and are mounted on the board. Is performed (step S18). This operation is continued until all the suction nozzles are completed (steps S19 and S20).

At this time, the electronic component mounting position (height) is
Since the picked-up electronic component data has been acquired in advance, the thickness of each picked-up electronic component is corrected.

The scanning mirror 5 is scanned from right to left, and
When the scanning mirror is waiting at the leftmost end, and when the next electronic component is to be sucked from the rightmost suction nozzle, the transfer head unit sends XY to the electronic component supply unit to suck the next electronic component. During the movement, the scanning mirror is moved from the leftmost position to the rightmost position to prevent a reduction in mounting speed. In addition, while the transfer head unit is moving XY to the substrate positioned at the predetermined position, the above-described θ rotation operation of each suction nozzle, the evacuation position lowering operation, and the electron suction by each suction nozzle are performed. By terminating the calculation of the component displacement, each suction nozzle can randomly mount the electronic component on the board, so that efficient mounting can be performed without reducing the mounting speed.

In the above example, each of the reflection illumination units 24a to 24a
4d or each of the transmission illuminators 29a to 29d is preferably turned on for a predetermined time when the scanning mirror comes to the position of the suction component. However, if each of the component recognition cameras 27 and 28 is provided with a shutter function, the suction nozzle is similarly turned on. It is possible to capture a still image of the electronic component adsorbed on the electronic component.

FIG. 6 shows another embodiment of the present invention, in which each of the electronic components sucked by the two suction nozzles is recognized by one (large-field or small-field) component recognition camera related to both the suction nozzles. Shows an optical system for imaging. 50, 51, 5
2, 55 are reflection mirrors, 53, 54 are half mirrors,
When the scanning mirror 5 scans the electronic component, the electronic component sucked by the one suction nozzle 14a is transmitted to the small-field component recognition camera 57 via the reflection mirror 50, the half mirrors 53 and 54, or to the reflection camera. The image is captured by the component recognition camera 58 having a large field of view via the mirror 55.

On the other hand, when the scanning mirror 5 moves to the position indicated by the dotted line, the electronic components sucked by the suction nozzle 14b are reflected by the reflecting mirrors 52 and 51, and then are reduced via the same optical system as described above. The image is captured by the component recognition camera 57 having a visual field or the component recognition camera 58 having a large visual field.

In this configuration, the reflection mirrors 50, 5
1 and 52 and a half mirror 53 are adopted to both the electronic components and the small-field component recognition camera (with a built-in lens) 57 and the large-field component recognition camera (with a built-in lens) 58 that are sucked by the two suction nozzles. By adjusting the distance between the objects and images,
A component recognition camera can be used in common for both suction nozzles, and the number thereof can be reduced.

FIG. 7 also shows another embodiment of an optical system in which an electronic component picked up by two suction nozzles is imaged by one (large-field or small-field) component recognition camera. As compared with the embodiment of FIG. 6, the branch to the component recognition camera 57 or 58 is performed via the common half mirror 59, and the same function is provided except that the component recognition camera is arranged on a plane. Have.

In the embodiment shown in FIG. 6 or FIG. 7, the component recognition camera is common, and the number of optical elements such as mirrors can be reduced.
The transfer head becomes lightweight, and high-speed component mounting becomes possible.

Also, by changing the timing of lowering the electronic component from the recognition position to the standby position according to the size of the electronic component, the mounting tact can be improved. This embodiment is illustrated in FIG. In the drawing, each of the suction nozzles 14a to 14d has a nozzle outer diameter W. For example, the suction nozzles 14a to 14d suck electronic components 70a to 70d having external dimensions A to D, respectively. And

Electronic component 7 sucked by suction nozzle 14a
Since the outer dimension A (including the suction error ΔX) of Oa is smaller than the nozzle outer diameter W, the suction nozzle 14 including the clearance F moves to the position P1 at the timing when the scanning mirror 5 moves to the position P1.
a is lowered from the recognition position M to the standby position N. In addition, the electronic components 70b to 70d sucked by the suction nozzles 14b to 14d.
Since the outer dimensions B to D (including the suction error ΔX) of the 70d are larger than the nozzle outer diameter W, the outer dimensions B to D include the clearance F (including the suction error ΔX) at the timing when the scanning mirror 5 moves to the positions P2 to P4. The suction nozzles 14b to 14d are lowered from the recognition position M to the standby position N. Each of the suction nozzles 14a to 14a when the scanning mirror 5 moves to the positions P1 to P4.
The distance between the axis of 14d and the end of the scanning mirror 5 is L1 to L4, respectively, and L1 is the minimum.

As described above, when the size of the electronic component is smaller than the predetermined size, the suction nozzle can be lowered from the recognition position to the standby position at the distance of L1, and the mounting timing is improved by hastening the lowering timing. be able to.

Further, when any acceleration is generated in the present apparatus, a phenomenon occurs that the distance between the imaging optical axis and the suction nozzle axis is shifted as compared with when the apparatus is stationary. In particular, if acceleration occurs during imaging, an error occurs in image recognition. That is, since the imaging optical axis and the axis of the suction nozzle are adjusted to coincide with each other at the time of rest, the image 81 of the suction nozzle is located at the center of the image input screen 80 of the recognition camera as shown in FIG. positioned. However, if any acceleration occurs in the apparatus, the imaging optical axis and the suction nozzle axis may be displaced. In this case, as shown in FIG. Is shifted as compared with the center at rest. If the center of the suction nozzle is always constant in the screen, the image 82 of the component is correctly recognized in the screen, so that it is possible to correct the suction deviation of the component and mount the component accurately. However, when a shift occurs at the center of the suction nozzle, the shift amount becomes a mounting error.

In order to solve this problem, as a means for detecting the shift amount of the optical axis, the image edge of the suction nozzle shown in FIG.
The shift amount of the suction nozzle in the screen is calculated by detecting the center of the suction nozzle from the outer shape. in this way,
Means for detecting edges simultaneously with video input include, for example,
This is known from Japanese Patent Publication No. Hei 7-113975, and is performed by the following procedure.

First, the center position O of the suction nozzle image 81 in the screen 80 in the stationary state is measured in advance, and this center position is registered as the origin. The radius of the nozzle image 81 is measured and stored. Next, when the production is started, an image of the suction nozzle is captured, and at the same time, all the observable edges of the nozzle are detected from the image 81 of the suction nozzle, and the nozzle center position O ′ is measured from the detected edge coordinates. Then, the difference from the nozzle center position O in the still image is added to the result of component recognition. In this way,
By calculating the nozzle center O 'each time an image is input, it is possible to correct the effect of the optical axis shift in the screen, and to accurately mount components even when the shift occurs due to acceleration. Guaranteed.

In the above description, the method of finding the center of the nozzle can be realized by detecting the edge of the nozzle. However, as another method, a specific mark or the like is provided on the nozzle and the nozzle is recognized. Can be calculated. It is also possible to store the image of the nozzle itself and calculate the amount of nozzle displacement by pattern matching.

In each embodiment, by increasing the scanning mirror in the moving direction, it is possible to reduce the shutter speed of the component recognition camera or to lengthen the illumination irradiation time. Special things,
For example, it is not necessary to use a strobe lamp, a xenon lamp, a halogen lamp, or the like.
Good imaging can be performed with the ED light source, and an inexpensive configuration can be achieved.

In the embodiment of FIG. 1, if the cover glass 7a is not attached, the suction nozzle is lowered from the component recognition position and enters the inside of the scanning mirror bracket so that the side of the electronic component can be recognized. The height of the suction nozzle can be detected and used to control the suction nozzle descent amount during mounting, and the type of suction nozzle can be determined.

In each embodiment, when the scanning mirror arrives below the electronic component of the next suction nozzle, that is, when the recognition of the next electronic component starts, the suction of the electronic component whose imaging has just finished is immediately completed. Since the nozzle is previously lowered to the standby position, the time for mounting the suction nozzle on the substrate can be shortened.

In each embodiment, since a component recognition camera having a large field of view or a small field of view is prepared, an electronic component image can be captured in an optimal field of view according to the size of the electronic component to be attracted. Even with such electronic components, the recognition accuracy does not decrease. In each embodiment, two kinds of recognition cameras are used. However, more recognition cameras may be provided, and one kind of camera may be used to make the field of view variable.

In each embodiment, each suction nozzle has a configuration capable of independently controlling the Z-axis, that is, a configuration having a drive motor independent of the Z-axis control of each suction nozzle. Thus, even when electronic components having different thicknesses are sucked, the image of the electronic components sucked by all the suction nozzles can be captured by the component recognition camera by one scan (movement) of the scanning mirror.

[0061]

As described above, in the component recognition device of the present invention, the suction nozzle can pick up the component supplied from the component supply unit and recognize the electronic component while transferring the component to the substrate.
The mounting speed of the parts can be improved. In that case,
Since the scanning mirror (deflecting member) sequentially enters the lower part of the component sucked by each suction nozzle and a still image of each component is imaged by the associated imaging means, high-accuracy and high-speed imaging is possible.

[Brief description of the drawings]

FIG. 1 is a perspective view illustrating an overall configuration of a transfer head on which a component imaging device is mounted.

FIG. 2 is a perspective view illustrating a configuration of an optical system of the component imaging device.

FIG. 3 is a block diagram illustrating a circuit configuration of an electric system of the component imaging device.

FIG. 4 is a flowchart showing a flow of operation.

FIG. 5 is a side view showing a relationship between a recognition position of the suction nozzle with respect to the substrate and a standby position.

FIG. 6 is a configuration diagram illustrating an optical configuration of a component imaging device including two suction nozzles and one recognition camera.

FIG. 7 is a configuration diagram illustrating another optical configuration of a component imaging device including two suction nozzles and one recognition camera.

FIG. 8 is an explanatory diagram illustrating a state in which the timing for lowering the suction nozzle from the recognition position to the standby position is changed according to the size of the suction component.

FIG. 9 is an explanatory diagram showing a video screen of the recognition camera in a stationary state and a video screen when the suction nozzle axis deviates from the imaging optical axis due to acceleration.

[Explanation of symbols]

 5 Scanning mirror 12 Scanning mirror drive motor 14a-14d Suction nozzle 18a-18d θ axis drive motor 22a-22d Z axis drive motor

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Hiroshi Anzai, Juku Corporation, 8-2-2 Kokuryo-cho, Chofu-shi, Tokyo

Claims (7)

[Claims] 1. A component image pickup device for picking up an image of a suction state of each component sucked by a plurality of suction nozzles, wherein: an image pickup means provided for each suction nozzle; and an image of the component sucked by the suction nozzle. A deflecting member for deflecting the image by the imaging means; and a deflecting member moving mechanism for sequentially moving the deflecting member into a component position sucked by each of the suction nozzles. A component imaging apparatus characterized in that a deflection member is moved so that a video of a component to be imaged becomes a still image. 2. The component imaging apparatus according to claim 1, wherein an imaging unit is provided for each of the suction nozzles or in common with each other. 3. The component image pickup apparatus according to claim 1, wherein the image pickup means includes image pickup apparatuses having different visual fields. 4. The component imaging apparatus according to claim 1, wherein a shutter mechanism is provided in the imaging unit. 5. The apparatus according to claim 1, wherein when the deflecting member moves to a position of the component sucked by each suction nozzle, the component is illuminated by reflection or transmission for a predetermined time. 2. The component imaging device according to claim 1. 6. The suction nozzle moves between a standby position and a recognition position in accordance with the movement of the deflecting member, and changes the timing of returning from the recognition position to the standby position in accordance with the size of the sucked component. Any one of claims 1 to 5
Item imaging device according to Item. 7. The apparatus according to claim 1, further comprising means for correcting a shift between the imaging optical axis and the suction nozzle axis when the shift is detected during imaging of the component. Component imaging device.