JPS4857580A - - Google Patents
Info
- Publication number
- JPS4857580A JPS4857580A JP46093248A JP9324871A JPS4857580A JP S4857580 A JPS4857580 A JP S4857580A JP 46093248 A JP46093248 A JP 46093248A JP 9324871 A JP9324871 A JP 9324871A JP S4857580 A JPS4857580 A JP S4857580A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP46093248A JPS4945625B2 (fr) | 1971-11-18 | 1971-11-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP46093248A JPS4945625B2 (fr) | 1971-11-18 | 1971-11-18 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS4857580A true JPS4857580A (fr) | 1973-08-13 |
| JPS4945625B2 JPS4945625B2 (fr) | 1974-12-05 |
Family
ID=14077193
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP46093248A Expired JPS4945625B2 (fr) | 1971-11-18 | 1971-11-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS4945625B2 (fr) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01272491A (ja) * | 1988-04-25 | 1989-10-31 | Seiko Instr Inc | 半導体素子の実装構造 |
| WO1998003990A1 (fr) * | 1996-07-23 | 1998-01-29 | Seiko Epson Corporation | Procede de montage d'un corps encapsule sur une carte et convertisseur optique |
-
1971
- 1971-11-18 JP JP46093248A patent/JPS4945625B2/ja not_active Expired
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01272491A (ja) * | 1988-04-25 | 1989-10-31 | Seiko Instr Inc | 半導体素子の実装構造 |
| WO1998003990A1 (fr) * | 1996-07-23 | 1998-01-29 | Seiko Epson Corporation | Procede de montage d'un corps encapsule sur une carte et convertisseur optique |
| US6144507A (en) * | 1996-07-23 | 2000-11-07 | Seiko Epson Corporation | Method of mounting a sealed assembly on a mounting substrate and optical transducer |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS4945625B2 (fr) | 1974-12-05 |