JPS4988665U - - Google Patents
Info
- Publication number
- JPS4988665U JPS4988665U JP13270372U JP13270372U JPS4988665U JP S4988665 U JPS4988665 U JP S4988665U JP 13270372 U JP13270372 U JP 13270372U JP 13270372 U JP13270372 U JP 13270372U JP S4988665 U JPS4988665 U JP S4988665U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/8119—Arrangement of the bump connectors prior to mounting
- H01L2224/81191—Arrangement of the bump connectors prior to mounting wherein the bump connectors are disposed only on the semiconductor or solid-state body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/8138—Bonding interfaces outside the semiconductor or solid-state body
- H01L2224/81385—Shape, e.g. interlocking features
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13270372U JPS4988665U (ja) | 1972-11-20 | 1972-11-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13270372U JPS4988665U (ja) | 1972-11-20 | 1972-11-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS4988665U true JPS4988665U (ja) | 1974-08-01 |
Family
ID=28396392
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13270372U Pending JPS4988665U (ja) | 1972-11-20 | 1972-11-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS4988665U (ja) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1998003990A1 (en) * | 1996-07-23 | 1998-01-29 | Seiko Epson Corporation | Method for mounting encapsulated body on mounting board and optical converter |
| JP2015211056A (ja) * | 2014-04-24 | 2015-11-24 | 日本電気株式会社 | 電子機器 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4942821A (ja) * | 1972-09-01 | 1974-04-22 |
-
1972
- 1972-11-20 JP JP13270372U patent/JPS4988665U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4942821A (ja) * | 1972-09-01 | 1974-04-22 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1998003990A1 (en) * | 1996-07-23 | 1998-01-29 | Seiko Epson Corporation | Method for mounting encapsulated body on mounting board and optical converter |
| JP2015211056A (ja) * | 2014-04-24 | 2015-11-24 | 日本電気株式会社 | 電子機器 |