[go: up one dir, main page]

JPS54133878A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS54133878A
JPS54133878A JP4167678A JP4167678A JPS54133878A JP S54133878 A JPS54133878 A JP S54133878A JP 4167678 A JP4167678 A JP 4167678A JP 4167678 A JP4167678 A JP 4167678A JP S54133878 A JPS54133878 A JP S54133878A
Authority
JP
Japan
Prior art keywords
terminal
power
lead
supply
electrode terminals
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP4167678A
Other languages
Japanese (ja)
Other versions
JPS6125215B2 (en
Inventor
Susumu Sato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP4167678A priority Critical patent/JPS54133878A/en
Publication of JPS54133878A publication Critical patent/JPS54133878A/en
Publication of JPS6125215B2 publication Critical patent/JPS6125215B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Wire Bonding (AREA)

Abstract

PURPOSE: To increase the number of electrode terminals for a power supply without increasing the number of external container leads, by leading out several power- supply electrode terminals from one lead.
CONSTITUTION: One surface of lead 21 made of copper foil is covered with polyimide film 24 and the other is with polyimide resin as well, but opening 26 is provided here which is used for a contact with terminal 13 for a power supply provided to the semiconductor element. Semiconductor substrate 11 used here is provided with signal terminal 12, power terminal 13 for supplying a reference potential and power, elements 14 and 15 adjoining to it, and elements 16 and 17 which are away from terminal 13, but close to power terminal 19 of the same potential as terminal 13. Then, lead 21 of the film carrier is composed of power wiring 18 from terminal 13, power wiring 20 from terminal 19, power-supply lead 21 connecting terminal 13 to an external container, and internal lead 22 extending from it to make a connection with terminal 19.
COPYRIGHT: (C)1979,JPO&Japio
JP4167678A 1978-04-07 1978-04-07 Semiconductor device Granted JPS54133878A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4167678A JPS54133878A (en) 1978-04-07 1978-04-07 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4167678A JPS54133878A (en) 1978-04-07 1978-04-07 Semiconductor device

Publications (2)

Publication Number Publication Date
JPS54133878A true JPS54133878A (en) 1979-10-17
JPS6125215B2 JPS6125215B2 (en) 1986-06-14

Family

ID=12615007

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4167678A Granted JPS54133878A (en) 1978-04-07 1978-04-07 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS54133878A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5735051U (en) * 1980-08-07 1982-02-24
JPS57112854A (en) * 1980-12-29 1982-07-14 Fujitsu Ltd Ultrasonic diagnostic apparatus
JPS57184226A (en) * 1981-05-08 1982-11-12 Nec Corp Semiconductor device
JPS5832442A (en) * 1981-08-20 1983-02-25 Nec Corp Hybrid integrated circuit device
JP2010103535A (en) * 2008-10-23 2010-05-06 Samsung Electronics Co Ltd Semiconductor package
JP2013210646A (en) * 2013-05-08 2013-10-10 Japan Display Inc Driver
US9372375B2 (en) 2000-07-25 2016-06-21 Japan Display Inc. Liquid crystal display device

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3009562U (en) * 1994-09-28 1995-04-04 山田車体工業株式会社 Opening and closing mechanism of rear door of luggage box in lorry

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5284969A (en) * 1976-01-07 1977-07-14 Hitachi Ltd Electrode connection method and lead tape used for the same

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5284969A (en) * 1976-01-07 1977-07-14 Hitachi Ltd Electrode connection method and lead tape used for the same

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5735051U (en) * 1980-08-07 1982-02-24
JPS57112854A (en) * 1980-12-29 1982-07-14 Fujitsu Ltd Ultrasonic diagnostic apparatus
JPS57184226A (en) * 1981-05-08 1982-11-12 Nec Corp Semiconductor device
JPS5832442A (en) * 1981-08-20 1983-02-25 Nec Corp Hybrid integrated circuit device
US9372375B2 (en) 2000-07-25 2016-06-21 Japan Display Inc. Liquid crystal display device
JP2010103535A (en) * 2008-10-23 2010-05-06 Samsung Electronics Co Ltd Semiconductor package
JP2013210646A (en) * 2013-05-08 2013-10-10 Japan Display Inc Driver

Also Published As

Publication number Publication date
JPS6125215B2 (en) 1986-06-14

Similar Documents

Publication Publication Date Title
JPS54133878A (en) Semiconductor device
JPS5513933A (en) Circuit element substrate and its manufacturing method
JPS5231758A (en) Liquid display device
JPS5277684A (en) Exeternal wiring of integrated circuit
JPS5211767A (en) Semiconductor device
JPS551153A (en) Semiconductor fitting device
JPS5561046A (en) Packaging device for semiconductor integrated circuit
JPS54133877A (en) Semiconductor device
JPS5561041A (en) Packaging device for semiconductor integrated circuit
JPS5412263A (en) Semiconductor element and production of the same
JPS556852A (en) Semiconductor device
JPS5375762A (en) Semiconductor device
JPS5265666A (en) Semiconductor device
JPS5326585A (en) Production of mis semiconductor device
JPS5561044A (en) Packaging device for semiconductor integrated circuit
JPS5212572A (en) Semi-conductor device
JPS5571053A (en) Circuit device
JPS57187955A (en) Sealing structure of semiconductor element
JPS5546561A (en) Method of fabricating hybrid integrated circuit
JPS52116073A (en) Hermetic structure in which integrated circuit element is sealed up ai rtightly
JPS53108372A (en) Substrate for wireless bonding
JPS54107267A (en) Vessel for semiconductor integrated circuit unit
JPS5544755A (en) Semiconductor container
JPS5368163A (en) Production of flip chip
JPS52108774A (en) Fitting material for integrated circuit