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JPS5434774A - Article transfer device - Google Patents

Article transfer device

Info

Publication number
JPS5434774A
JPS5434774A JP10045677A JP10045677A JPS5434774A JP S5434774 A JPS5434774 A JP S5434774A JP 10045677 A JP10045677 A JP 10045677A JP 10045677 A JP10045677 A JP 10045677A JP S5434774 A JPS5434774 A JP S5434774A
Authority
JP
Japan
Prior art keywords
jig
transfer device
article transfer
heat
semiconductor wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10045677A
Other languages
Japanese (ja)
Inventor
Hiroto Nagatomo
Tetsuya Takagaki
Ryoichi Okuda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP10045677A priority Critical patent/JPS5434774A/en
Publication of JPS5434774A publication Critical patent/JPS5434774A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To make it possible to transfer a semiconductor wafer at a high speed without damaging the wafer by providing jig and heat-treatment jig in parallel onto one mounting table and by transferrring a semiconductor wafer contained in the washing jig to the heat-treatment jig by using a buffer receptacle.
COPYRIGHT: (C)1979,JPO&Japio
JP10045677A 1977-08-24 1977-08-24 Article transfer device Pending JPS5434774A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10045677A JPS5434774A (en) 1977-08-24 1977-08-24 Article transfer device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10045677A JPS5434774A (en) 1977-08-24 1977-08-24 Article transfer device

Related Child Applications (2)

Application Number Title Priority Date Filing Date
JP2851384A Division JPS6024034A (en) 1984-02-20 1984-02-20 Wafer reversal device
JP2851284A Division JPS6024033A (en) 1984-02-20 1984-02-20 Device for wafer arrangement

Publications (1)

Publication Number Publication Date
JPS5434774A true JPS5434774A (en) 1979-03-14

Family

ID=14274409

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10045677A Pending JPS5434774A (en) 1977-08-24 1977-08-24 Article transfer device

Country Status (1)

Country Link
JP (1) JPS5434774A (en)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5987138U (en) * 1982-12-01 1984-06-13 坪井　操 Wafer alignment jig
JPS60118238U (en) * 1984-01-19 1985-08-09 テル相模株式会社 Facet aligner fine adjustment device
JPS60245245A (en) * 1984-05-21 1985-12-05 Fujitsu Ltd Wafer transfer equipment
JPS615541A (en) * 1984-06-20 1986-01-11 Hitachi Electronics Eng Co Ltd Shifting device
US4597819A (en) * 1984-02-29 1986-07-01 Tomco Mfg., Ltd. Apparatus for altering pitch in arrangement of wafers
JPS62156830A (en) * 1985-12-28 1987-07-11 Toshiba Corp Wafer transfer device
JPH0284752A (en) * 1988-12-20 1990-03-26 Tel Sagami Ltd Wafer alignment device
US5164335A (en) * 1990-06-14 1992-11-17 Kabushiki Kaisha Toshiba Semiconductor manufacturing apparatus and method of manufacturing semiconductor device
JPH0992704A (en) * 1995-09-21 1997-04-04 Nakajima:Kk Transfer system for semiconductor silicon wafer
US5656088A (en) * 1991-08-28 1997-08-12 Dainippon Screen Mfg. Co., Ltd. Apparatus for dipping substrates in processing fluid

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5987138U (en) * 1982-12-01 1984-06-13 坪井　操 Wafer alignment jig
JPS60118238U (en) * 1984-01-19 1985-08-09 テル相模株式会社 Facet aligner fine adjustment device
US4597819A (en) * 1984-02-29 1986-07-01 Tomco Mfg., Ltd. Apparatus for altering pitch in arrangement of wafers
JPS60245245A (en) * 1984-05-21 1985-12-05 Fujitsu Ltd Wafer transfer equipment
JPS615541A (en) * 1984-06-20 1986-01-11 Hitachi Electronics Eng Co Ltd Shifting device
JPS62156830A (en) * 1985-12-28 1987-07-11 Toshiba Corp Wafer transfer device
JPH0284752A (en) * 1988-12-20 1990-03-26 Tel Sagami Ltd Wafer alignment device
US5164335A (en) * 1990-06-14 1992-11-17 Kabushiki Kaisha Toshiba Semiconductor manufacturing apparatus and method of manufacturing semiconductor device
US5656088A (en) * 1991-08-28 1997-08-12 Dainippon Screen Mfg. Co., Ltd. Apparatus for dipping substrates in processing fluid
JPH0992704A (en) * 1995-09-21 1997-04-04 Nakajima:Kk Transfer system for semiconductor silicon wafer

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