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JPS55164117A - Resin molding method for electronic component - Google Patents

Resin molding method for electronic component

Info

Publication number
JPS55164117A
JPS55164117A JP7078879A JP7078879A JPS55164117A JP S55164117 A JPS55164117 A JP S55164117A JP 7078879 A JP7078879 A JP 7078879A JP 7078879 A JP7078879 A JP 7078879A JP S55164117 A JPS55164117 A JP S55164117A
Authority
JP
Japan
Prior art keywords
case
resins
electronic component
resin
charged
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7078879A
Other languages
Japanese (ja)
Other versions
JPS6121817B2 (en
Inventor
Takeshi Watanabe
Yasuaki Sugiyama
Sadaharu Nishimori
Atsufumi Kinoshita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mahle Electric Drive Systems Co Ltd
Original Assignee
Kokusan Denki Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kokusan Denki Co Ltd filed Critical Kokusan Denki Co Ltd
Priority to JP7078879A priority Critical patent/JPS55164117A/en
Publication of JPS55164117A publication Critical patent/JPS55164117A/en
Publication of JPS6121817B2 publication Critical patent/JPS6121817B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Moulds For Moulding Plastics Or The Like (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)

Abstract

PURPOSE: To control a resin amount reliably, by a method wherein a resin molding system, in which an electronic component is housed in a case and resins are charged through an opening to mold the electronic component, is equipped with a photoelectric detector detecting the amount of charged resins and controls a resin-charging pump.
CONSTITUTION: An electronic component is housed in a case 1 whose one end is open, and resins 2 are charged into the case 1 to mold the component. A notched portion 3, which is open to the inside of the case 1 or to an open end side of the case 1, is made in a position which is equivalent to the specified level of an upper surface of the resins charged into the case 1. A state of the notched portion 3 is detected by a photoelectric detector consisting of a projector 4, a light-receiver 6, and with it a resin-charging pump 8 is driven for pouring the resins 2 into the case 1. If the detector detects that the notched portion 3 is covered with the resins, it regulates a control circuit 9 to suspend operation of the resin-charging pump 8.
COPYRIGHT: (C)1980,JPO&Japio
JP7078879A 1979-06-06 1979-06-06 Resin molding method for electronic component Granted JPS55164117A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7078879A JPS55164117A (en) 1979-06-06 1979-06-06 Resin molding method for electronic component

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7078879A JPS55164117A (en) 1979-06-06 1979-06-06 Resin molding method for electronic component

Publications (2)

Publication Number Publication Date
JPS55164117A true JPS55164117A (en) 1980-12-20
JPS6121817B2 JPS6121817B2 (en) 1986-05-29

Family

ID=13441610

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7078879A Granted JPS55164117A (en) 1979-06-06 1979-06-06 Resin molding method for electronic component

Country Status (1)

Country Link
JP (1) JPS55164117A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5236637A (en) * 1984-08-08 1993-08-17 3D Systems, Inc. Method of and apparatus for production of three dimensional objects by stereolithography
US5358673A (en) * 1990-02-15 1994-10-25 3D Systems, Inc. Applicator device and method for dispensing a liquid medium in a laser modeling machine
US5651934A (en) * 1988-09-26 1997-07-29 3D Systems, Inc. Recoating of stereolithographic layers
US5902537A (en) * 1995-02-01 1999-05-11 3D Systems, Inc. Rapid recoating of three-dimensional objects formed on a cross-sectional basis
JP2009010093A (en) * 2007-06-27 2009-01-15 Tdk Corp Coil component manufacturing method and coil component manufacturing apparatus
JP2016073040A (en) * 2014-09-29 2016-05-09 京セラ株式会社 Terminal box and solar cell module using the same

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6147138U (en) * 1984-08-31 1986-03-29 東洋ゴム工業株式会社 vibration absorber

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5236637A (en) * 1984-08-08 1993-08-17 3D Systems, Inc. Method of and apparatus for production of three dimensional objects by stereolithography
US5651934A (en) * 1988-09-26 1997-07-29 3D Systems, Inc. Recoating of stereolithographic layers
US5891382A (en) * 1988-09-26 1999-04-06 3D System, Inc. Recoating of stereolithographic layers
US6048487A (en) * 1988-09-26 2000-04-11 3D Systems, Inc. Recoating stereolithographic layers
US5358673A (en) * 1990-02-15 1994-10-25 3D Systems, Inc. Applicator device and method for dispensing a liquid medium in a laser modeling machine
US5902537A (en) * 1995-02-01 1999-05-11 3D Systems, Inc. Rapid recoating of three-dimensional objects formed on a cross-sectional basis
JP2009010093A (en) * 2007-06-27 2009-01-15 Tdk Corp Coil component manufacturing method and coil component manufacturing apparatus
JP2016073040A (en) * 2014-09-29 2016-05-09 京セラ株式会社 Terminal box and solar cell module using the same

Also Published As

Publication number Publication date
JPS6121817B2 (en) 1986-05-29

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