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JPS55162246A - Resin-sealed semiconductor device - Google Patents

Resin-sealed semiconductor device

Info

Publication number
JPS55162246A
JPS55162246A JP6894679A JP6894679A JPS55162246A JP S55162246 A JPS55162246 A JP S55162246A JP 6894679 A JP6894679 A JP 6894679A JP 6894679 A JP6894679 A JP 6894679A JP S55162246 A JPS55162246 A JP S55162246A
Authority
JP
Japan
Prior art keywords
resin
discharge plate
heat
pellet
tab
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6894679A
Other languages
Japanese (ja)
Inventor
Kunihiko Nishi
Yoshiaki Wakashima
Hideo Inayoshi
Hiroshi Koyama
Fujio Ito
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Renesas Eastern Japan Semiconductor Inc
Original Assignee
Hitachi Tokyo Electronics Co Ltd
Hitachi Ltd
Hitachi Ome Electronic Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Tokyo Electronics Co Ltd, Hitachi Ltd, Hitachi Ome Electronic Co Ltd filed Critical Hitachi Tokyo Electronics Co Ltd
Priority to JP6894679A priority Critical patent/JPS55162246A/en
Publication of JPS55162246A publication Critical patent/JPS55162246A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H01L23/4334—Auxiliary members in encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

PURPOSE:To improve heat dissipation by the method wherein, when a resin-sealed semiconductor device is formed, a tab is provided in the center surface of a heat discharge plate, and on top of this is fixed a semiconductor pellet, a lead piece connected to the pellet is fixed to the heat discharge plate via a high heat conducting insulator. CONSTITUTION:Through hole 20a is opened on the outer edge of heat discharge plate 20 made of aluminum or phosphor bronze in order to improve the fluidity of resin when resin sealing is operated later. Tab 1 is provided in the center of the surface. Semiconductor pellet 3 is mounted and fixed on tab 1, and lead piece 2 with its end projecting outward is fixed to the edge of heat discharge plate 20 by using high heat conducting insulator 21 made of epoxy provided with an aluminum filler. Subsequently, the electrode of pellet 3 is connected to lead piece 2 by using bonding wire 4, and the whole body is sealed with resin 5. By this, the heat from pellet 3 is transferred to resin 5 through tab 1, heat discharge plate 20, insulator 21 and lead piece 2, so that the heat dissipation property is improved.
JP6894679A 1979-06-04 1979-06-04 Resin-sealed semiconductor device Pending JPS55162246A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6894679A JPS55162246A (en) 1979-06-04 1979-06-04 Resin-sealed semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6894679A JPS55162246A (en) 1979-06-04 1979-06-04 Resin-sealed semiconductor device

Publications (1)

Publication Number Publication Date
JPS55162246A true JPS55162246A (en) 1980-12-17

Family

ID=13388331

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6894679A Pending JPS55162246A (en) 1979-06-04 1979-06-04 Resin-sealed semiconductor device

Country Status (1)

Country Link
JP (1) JPS55162246A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6177350A (en) * 1984-09-22 1986-04-19 Rohm Co Ltd Semiconductor device
US4857989A (en) * 1986-09-04 1989-08-15 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
WO1994014194A1 (en) * 1992-12-17 1994-06-23 Vlsi Technology, Inc. Void-free thermally enhanced plastic package
EP0838091A4 (en) * 1995-07-03 1998-05-06
US6326678B1 (en) * 1993-09-03 2001-12-04 Asat, Limited Molded plastic package with heat sink and enhanced electrical performance
US6552417B2 (en) 1993-09-03 2003-04-22 Asat, Limited Molded plastic package with heat sink and enhanced electrical performance

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6177350A (en) * 1984-09-22 1986-04-19 Rohm Co Ltd Semiconductor device
US4857989A (en) * 1986-09-04 1989-08-15 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
WO1994014194A1 (en) * 1992-12-17 1994-06-23 Vlsi Technology, Inc. Void-free thermally enhanced plastic package
US6326678B1 (en) * 1993-09-03 2001-12-04 Asat, Limited Molded plastic package with heat sink and enhanced electrical performance
US6552417B2 (en) 1993-09-03 2003-04-22 Asat, Limited Molded plastic package with heat sink and enhanced electrical performance
US6724071B2 (en) 1993-09-03 2004-04-20 Asat, Limited Molded plastic package with heat sink and enhanced electrical performance
EP0838091A4 (en) * 1995-07-03 1998-05-06

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