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JPS5587517A - Method and apparatus for cleaning resin-molding mold - Google Patents

Method and apparatus for cleaning resin-molding mold

Info

Publication number
JPS5587517A
JPS5587517A JP15987578A JP15987578A JPS5587517A JP S5587517 A JPS5587517 A JP S5587517A JP 15987578 A JP15987578 A JP 15987578A JP 15987578 A JP15987578 A JP 15987578A JP S5587517 A JPS5587517 A JP S5587517A
Authority
JP
Japan
Prior art keywords
mold
resin
cover
molding
cleaning
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP15987578A
Other languages
Japanese (ja)
Other versions
JPH0139887B2 (en
Inventor
Takeshi Shimizu
Tsutomu Mimata
Masakazu Ozawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP15987578A priority Critical patent/JPS5587517A/en
Publication of JPS5587517A publication Critical patent/JPS5587517A/en
Publication of JPH0139887B2 publication Critical patent/JPH0139887B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/70—Maintenance
    • B29C33/72—Cleaning

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

PURPOSE:To shorten molding cycle by mechanically cleaning the inside surface of a mold after resin molding without complete mold separation, in assembling process of a resin-sealed type semiconductor device. CONSTITUTION:After resin molding, the inside surface of a mold is cleaned as follows. With upper and lower molds 1 and 2 separated from each other, a protective cover is moved to cover a molded body 4 positioned in the opening, and cleanners 8 and 9 are moved following up to the movement of the cover to clean the inside surfaces of the molds 1 and 2. After cleaning, the cover is moved out of the mold, and the resin-molding mold is cleaned. Since the cleaning can be carried out easily, the molding cycle in a continuous assemly step can be shortened.
JP15987578A 1978-12-27 1978-12-27 Method and apparatus for cleaning resin-molding mold Granted JPS5587517A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15987578A JPS5587517A (en) 1978-12-27 1978-12-27 Method and apparatus for cleaning resin-molding mold

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15987578A JPS5587517A (en) 1978-12-27 1978-12-27 Method and apparatus for cleaning resin-molding mold

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP10457784A Division JPS6018318A (en) 1984-05-25 1984-05-25 Resin mold equipment

Publications (2)

Publication Number Publication Date
JPS5587517A true JPS5587517A (en) 1980-07-02
JPH0139887B2 JPH0139887B2 (en) 1989-08-24

Family

ID=15703105

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15987578A Granted JPS5587517A (en) 1978-12-27 1978-12-27 Method and apparatus for cleaning resin-molding mold

Country Status (1)

Country Link
JP (1) JPS5587517A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS649712A (en) * 1987-07-02 1989-01-13 Rohm Co Ltd Resin molding device
JPH0297009U (en) * 1989-01-19 1990-08-02
US5297897A (en) * 1989-11-24 1994-03-29 Asm Fico Tooling B.V. Single-strip molding apparatus
EP0655323A3 (en) * 1989-11-24 1996-06-05 Fico Bv Single strip moulding apparatus with means for exerting pressure.
US7537967B2 (en) * 2001-05-18 2009-05-26 Renesas Technology Corp. Mold cleaning sheet and manufacturing method of a semiconductor device using the same

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS649712A (en) * 1987-07-02 1989-01-13 Rohm Co Ltd Resin molding device
JPH0297009U (en) * 1989-01-19 1990-08-02
US5297897A (en) * 1989-11-24 1994-03-29 Asm Fico Tooling B.V. Single-strip molding apparatus
EP0655323A3 (en) * 1989-11-24 1996-06-05 Fico Bv Single strip moulding apparatus with means for exerting pressure.
EP0633111A3 (en) * 1989-11-24 1996-06-05 Fico Bv Single-strip moulding apparatus with movable mould halves.
US7537967B2 (en) * 2001-05-18 2009-05-26 Renesas Technology Corp. Mold cleaning sheet and manufacturing method of a semiconductor device using the same
US7943432B2 (en) 2001-05-18 2011-05-17 Renesas Electronics Corporation Mold cleaning sheet and manufacturing method of a semiconductor device using the same

Also Published As

Publication number Publication date
JPH0139887B2 (en) 1989-08-24

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