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JPS56161426A - Plasticization of polyamide resin - Google Patents

Plasticization of polyamide resin

Info

Publication number
JPS56161426A
JPS56161426A JP6528980A JP6528980A JPS56161426A JP S56161426 A JPS56161426 A JP S56161426A JP 6528980 A JP6528980 A JP 6528980A JP 6528980 A JP6528980 A JP 6528980A JP S56161426 A JPS56161426 A JP S56161426A
Authority
JP
Japan
Prior art keywords
polyamide resin
plasticizer
homopolyamide
hydroxybenzoate
pentanediol
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6528980A
Other languages
Japanese (ja)
Inventor
Mitsuaki Iyama
Toshio Muraki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toray Industries Inc
Original Assignee
Toray Industries Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toray Industries Inc filed Critical Toray Industries Inc
Priority to JP6528980A priority Critical patent/JPS56161426A/en
Publication of JPS56161426A publication Critical patent/JPS56161426A/en
Pending legal-status Critical Current

Links

Landscapes

  • Emulsifying, Dispersing, Foam-Producing Or Wetting Agents (AREA)
  • Processes Of Treating Macromolecular Substances (AREA)
  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

PURPOSE: To obtain a plasticized polyamide resin having a relatively large amount of a uniformly distributed plasticizer, by heating a homopolyamide-based polyamide resin in contact with a specified plasticizer.
CONSTITUTION: A polyamide resin selected from the group consisting of a homopolyamide containing not more than ten amido groups per 100C and a copolyamide based on the component constituting said homopolyamide, is heated to a temperature between 110°C and the m.p. of the polyamide resin, in contact with at least one plasticizer selected from the group consisting of N-butylbenzenesulfonamide, N- ethyl-o,p-toluenesulfonamide, N,N,-dibutylbenzenesulfonamide, n-octyl p-hydroxybenzoate, 2-ethylhexyl p-hydroxybenzoate, ethylene glycol, glycerin, 2-methyl-2,4- pentanediol and 2,2,4-trimethyl-1,3-pentanediol to allow the polyamide resin to absorb the plasticizer.
COPYRIGHT: (C)1981,JPO&Japio
JP6528980A 1980-05-19 1980-05-19 Plasticization of polyamide resin Pending JPS56161426A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6528980A JPS56161426A (en) 1980-05-19 1980-05-19 Plasticization of polyamide resin

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6528980A JPS56161426A (en) 1980-05-19 1980-05-19 Plasticization of polyamide resin

Publications (1)

Publication Number Publication Date
JPS56161426A true JPS56161426A (en) 1981-12-11

Family

ID=13282618

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6528980A Pending JPS56161426A (en) 1980-05-19 1980-05-19 Plasticization of polyamide resin

Country Status (1)

Country Link
JP (1) JPS56161426A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61127102A (en) * 1984-11-26 1986-06-14 Shin Kobe Electric Mach Co Ltd Preparation of material for molding resin magnet
JPS63108062A (en) * 1986-10-14 1988-05-12 ダブリユー・アール・グレイス・アンド・カンパニー−コネチカツト Thermoplastic polymer composition
JPH01225659A (en) * 1988-01-28 1989-09-08 Huels Ag Low temperature impact-resistant thermoplastic molding material and hollow profile material composed thereof
US4904718A (en) * 1987-07-01 1990-02-27 Huels Aktiengesellschaft Thermoplastic molding compounds which have impact strength when cold
WO1998036783A1 (en) * 1997-02-21 1998-08-27 Intella Interventional Systems, Inc. Plasticized nylon balloons for medical devices
EP0608509B1 (en) * 1993-01-23 1999-02-10 Hüls Aktiengesellschaft Process for incorporating plasticisers in polyamides
WO2016098812A1 (en) * 2014-12-16 2016-06-23 株式会社クラレ Polyamide resin composition and molded article thereof

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5123547A (en) * 1974-07-17 1976-02-25 Nippon Zeon Co Funmatsuseikeiyono funmatsuenkabinirujushisoseibutsu

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5123547A (en) * 1974-07-17 1976-02-25 Nippon Zeon Co Funmatsuseikeiyono funmatsuenkabinirujushisoseibutsu

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61127102A (en) * 1984-11-26 1986-06-14 Shin Kobe Electric Mach Co Ltd Preparation of material for molding resin magnet
JPS63108062A (en) * 1986-10-14 1988-05-12 ダブリユー・アール・グレイス・アンド・カンパニー−コネチカツト Thermoplastic polymer composition
US4904718A (en) * 1987-07-01 1990-02-27 Huels Aktiengesellschaft Thermoplastic molding compounds which have impact strength when cold
JPH01225659A (en) * 1988-01-28 1989-09-08 Huels Ag Low temperature impact-resistant thermoplastic molding material and hollow profile material composed thereof
EP0608509B1 (en) * 1993-01-23 1999-02-10 Hüls Aktiengesellschaft Process for incorporating plasticisers in polyamides
WO1998036783A1 (en) * 1997-02-21 1998-08-27 Intella Interventional Systems, Inc. Plasticized nylon balloons for medical devices
WO2016098812A1 (en) * 2014-12-16 2016-06-23 株式会社クラレ Polyamide resin composition and molded article thereof
CN107001791A (en) * 2014-12-16 2017-08-01 株式会社可乐丽 Amilan polyamide resin composition and its products formed
JPWO2016098812A1 (en) * 2014-12-16 2017-09-21 株式会社クラレ Polyamide resin composition and molded product thereof
CN107001791B (en) * 2014-12-16 2019-12-03 株式会社可乐丽 Polyamide resin composition and its molded article
US10995197B2 (en) 2014-12-16 2021-05-04 Kuraray Co., Ltd. Polyamide resin composition and molded article thereof

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