JPS564241B2 - - Google Patents
Info
- Publication number
- JPS564241B2 JPS564241B2 JP8689873A JP8689873A JPS564241B2 JP S564241 B2 JPS564241 B2 JP S564241B2 JP 8689873 A JP8689873 A JP 8689873A JP 8689873 A JP8689873 A JP 8689873A JP S564241 B2 JPS564241 B2 JP S564241B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Chairs Characterized By Structure (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8689873A JPS564241B2 (en) | 1973-08-03 | 1973-08-03 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8689873A JPS564241B2 (en) | 1973-08-03 | 1973-08-03 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5037566A JPS5037566A (en) | 1975-04-08 |
| JPS564241B2 true JPS564241B2 (en) | 1981-01-29 |
Family
ID=13899641
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8689873A Expired JPS564241B2 (en) | 1973-08-03 | 1973-08-03 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS564241B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7061082B2 (en) | 1997-02-25 | 2006-06-13 | Micron Technology, Inc. | Semiconductor die with attached heat sink and transfer mold |
| US7220615B2 (en) | 2001-06-11 | 2007-05-22 | Micron Technology, Inc. | Alternative method used to package multimedia card by transfer molding |
| US7244637B2 (en) | 1998-09-03 | 2007-07-17 | Micron Technology, Inc. | Chip on board and heat sink attachment methods |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5534846Y2 (en) * | 1977-07-08 | 1980-08-18 | ||
| JPH01310962A (en) * | 1988-06-10 | 1989-12-15 | Eisai Co Ltd | Apparatus for arranging and supplying tablet |
-
1973
- 1973-08-03 JP JP8689873A patent/JPS564241B2/ja not_active Expired
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7061082B2 (en) | 1997-02-25 | 2006-06-13 | Micron Technology, Inc. | Semiconductor die with attached heat sink and transfer mold |
| US7244637B2 (en) | 1998-09-03 | 2007-07-17 | Micron Technology, Inc. | Chip on board and heat sink attachment methods |
| US7220615B2 (en) | 2001-06-11 | 2007-05-22 | Micron Technology, Inc. | Alternative method used to package multimedia card by transfer molding |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5037566A (en) | 1975-04-08 |