JPS57186367A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPS57186367A JPS57186367A JP56071015A JP7101581A JPS57186367A JP S57186367 A JPS57186367 A JP S57186367A JP 56071015 A JP56071015 A JP 56071015A JP 7101581 A JP7101581 A JP 7101581A JP S57186367 A JPS57186367 A JP S57186367A
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- mask
- gate
- substrate
- high accuracy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
Landscapes
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
Abstract
PURPOSE:To set the channel length of a gate to predetermined value easily and with high accuracy, and to improve the characteristic of power consumption and response by directly connecting a gate electrode by wiring, one end thereof is connected to the surface of the gate electrode and the other end thereof to a source. CONSTITUTION:SiO2 33a And poly Si 34a are stacked onto an Si substrate 30, and the gate electrode 34 is formed using a resist 40 as a mask. The surface of the electrode 34 is oxidized while SiO2 33b is stacked, the surface is coated with a resist mask 42 with a window hole while adjoining to the electrode 34, and a connecting hole 43 communicating with the substrate 30 and the electrode 34 is shaped to the films 33b, 33a. The resist 42 is removed, poly Si 44 connected to the substrate 30 and the electrode 34 is deposited through the hole 43, and a mask 45 according to a prescribed pattern is executed. The wiring layer 35 is formed, the mask 45 is removed, windows 46 are bored, an impurity is diffused, and the source 31 are a drain 32 are shaped. Since masks for forming the electrode 34 and the connecting hole 43 can be conformed with high accuracy, the wiring layer 35 can be disposed with high accuracy, the channel length of the gate is set to predetermined value, and the characteristic of power consumption and response and improved remarkably.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56071015A JPS57186367A (en) | 1981-05-12 | 1981-05-12 | Semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56071015A JPS57186367A (en) | 1981-05-12 | 1981-05-12 | Semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57186367A true JPS57186367A (en) | 1982-11-16 |
| JPH0582066B2 JPH0582066B2 (en) | 1993-11-17 |
Family
ID=13448253
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP56071015A Granted JPS57186367A (en) | 1981-05-12 | 1981-05-12 | Semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57186367A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6279773B1 (en) | 1999-05-26 | 2001-08-28 | Kiyota Engineering Co., Ltd. | Lid body of beverage container |
| JP2020038981A (en) * | 2014-05-29 | 2020-03-12 | 株式会社半導体エネルギー研究所 | Semiconductor device |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55132057A (en) * | 1979-03-30 | 1980-10-14 | Nec Corp | Mos integrated circuit and its manufacture |
-
1981
- 1981-05-12 JP JP56071015A patent/JPS57186367A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55132057A (en) * | 1979-03-30 | 1980-10-14 | Nec Corp | Mos integrated circuit and its manufacture |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6279773B1 (en) | 1999-05-26 | 2001-08-28 | Kiyota Engineering Co., Ltd. | Lid body of beverage container |
| JP2020038981A (en) * | 2014-05-29 | 2020-03-12 | 株式会社半導体エネルギー研究所 | Semiconductor device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0582066B2 (en) | 1993-11-17 |
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