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JPS57190767A - Soldering method for chip parts - Google Patents

Soldering method for chip parts

Info

Publication number
JPS57190767A
JPS57190767A JP7484981A JP7484981A JPS57190767A JP S57190767 A JPS57190767 A JP S57190767A JP 7484981 A JP7484981 A JP 7484981A JP 7484981 A JP7484981 A JP 7484981A JP S57190767 A JPS57190767 A JP S57190767A
Authority
JP
Japan
Prior art keywords
parts
holes
negative pressure
substrate
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7484981A
Other languages
Japanese (ja)
Inventor
Masakazu Nakazono
Yoichiro Maehara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP7484981A priority Critical patent/JPS57190767A/en
Publication of JPS57190767A publication Critical patent/JPS57190767A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/08—Soldering by means of dipping in molten solder
    • B23K1/085—Wave soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3415—Surface mounted components on both sides of the substrate or combined with lead-in-hole components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Molten Solder (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

PURPOSE:To connect chip parts surely and electrically to the wirings on a wiring substrate by developing a negative pressure around the through-holes on the chip part mounting side of the wiring substrate, and allowing the molten solder supplied from the opposite side to arrive at the chip parts through the thrugh- holes with the aid of this negative pressure. CONSTITUTION:For example, adhesives 13 are coated on the chip part mounting parts of a wiring substrate 1, and chip parts 4 are placed thereon and are tentatively fixed. The substrate 1 in this state is mounted to a conveyor by facing the side mounted with the parts 4 upward. During transfer thereof, the substrate is subjected to preheating, flux coating, etc. and is sent over a jet solder tank 14. At this time, a negative pressure is developed in the atmosphere on the side of the substrate 1 mounted with the parts 4 by suction through a suction nozzle 16. The molten solder 15 ejecting from the tank 14 is passed through through-holes 2 by the affinity to said holes 2 and the aid of the above-mentioned negative pressure, whereby the parts 4 and wirings 11 are soldered.
JP7484981A 1981-05-20 1981-05-20 Soldering method for chip parts Pending JPS57190767A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7484981A JPS57190767A (en) 1981-05-20 1981-05-20 Soldering method for chip parts

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7484981A JPS57190767A (en) 1981-05-20 1981-05-20 Soldering method for chip parts

Publications (1)

Publication Number Publication Date
JPS57190767A true JPS57190767A (en) 1982-11-24

Family

ID=13559169

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7484981A Pending JPS57190767A (en) 1981-05-20 1981-05-20 Soldering method for chip parts

Country Status (1)

Country Link
JP (1) JPS57190767A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4646057A (en) * 1984-02-15 1987-02-24 W. C. Heraeus Gmbh Method of making chip resistors and in the chip resistors resulting from the method
US11948807B2 (en) 2021-03-30 2024-04-02 International Business Machines Corporation Feature selection through solder-ball population
US11963307B2 (en) * 2021-03-30 2024-04-16 International Business Machines Corporation Vacuum-assisted BGA joint formation

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4646057A (en) * 1984-02-15 1987-02-24 W. C. Heraeus Gmbh Method of making chip resistors and in the chip resistors resulting from the method
US11948807B2 (en) 2021-03-30 2024-04-02 International Business Machines Corporation Feature selection through solder-ball population
US11963307B2 (en) * 2021-03-30 2024-04-16 International Business Machines Corporation Vacuum-assisted BGA joint formation

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