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JPS5749284A - Manufacture of light-emitting display device - Google Patents

Manufacture of light-emitting display device

Info

Publication number
JPS5749284A
JPS5749284A JP12485580A JP12485580A JPS5749284A JP S5749284 A JPS5749284 A JP S5749284A JP 12485580 A JP12485580 A JP 12485580A JP 12485580 A JP12485580 A JP 12485580A JP S5749284 A JPS5749284 A JP S5749284A
Authority
JP
Japan
Prior art keywords
led23
display device
emitting display
solder
gap
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12485580A
Other languages
Japanese (ja)
Inventor
Tsunenobu Horikoshi
Junichi Okamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP12485580A priority Critical patent/JPS5749284A/en
Publication of JPS5749284A publication Critical patent/JPS5749284A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/83—Electrodes
    • H10H20/831—Electrodes characterised by their shape
    • H10H20/8314—Electrodes characterised by their shape extending at least partially onto an outer side surface of the bodies
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
    • H01L2224/331—Disposition
    • H01L2224/3318—Disposition being disposed on at least two different sides of the body, e.g. dual array
    • H01L2224/33181—On opposite sides of the body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks

Landscapes

  • Led Device Packages (AREA)
  • Led Devices (AREA)

Abstract

PURPOSE:To make it possible to obtain highly reliable light-emitting display device by using LEDs having a simple construction and easy to produce and loading them securely to a substrate in a wireless manner. CONSTITUTION:A positive electrode and a negative electrode are formed on an insulating substrate 29 such that their connecting portions 25 and 26 oppose to each other with a suitable gap 27 therebetween and are connected to a conductor circuit 28. An LED23 disposed within the gap 27 has a P layer 18 and an N layer 19 which are parallel to the juncture surface 20. The LED23 further has electrodes 21 and 22 over the entire areas of the end surfaces thereof. The LED23 is fixed at its side surfaces by a resin 31 while the electrodes 21 and 22 thereof are connected to the above-mentioned connecting portions 25 and 26 by means of solder 30. A reference numeral 33 designates a solder resist film. According to this method, it is possible to preserve a comparatively large gap 27 for mounting the LED23 so that the formation of the pattern is facilitated advantageously. In addition, the resin-bonding of the LED to the insulating substrate produces an effect of temporary fixing, which is turn facilitates the control of position and amount of application. In consequence, the undesirable attaching to the electrode surface, which would cause an inferior connection, is avoided. Furthermore, the breaking of connection is avoided thanks to the wireless type connection. The strong bonding by solder promises a high heat radiation effect. In conseqiuence, it is possible to obtain a light emitting display device operative at a high reliability.
JP12485580A 1980-09-09 1980-09-09 Manufacture of light-emitting display device Pending JPS5749284A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12485580A JPS5749284A (en) 1980-09-09 1980-09-09 Manufacture of light-emitting display device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12485580A JPS5749284A (en) 1980-09-09 1980-09-09 Manufacture of light-emitting display device

Publications (1)

Publication Number Publication Date
JPS5749284A true JPS5749284A (en) 1982-03-23

Family

ID=14895757

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12485580A Pending JPS5749284A (en) 1980-09-09 1980-09-09 Manufacture of light-emitting display device

Country Status (1)

Country Link
JP (1) JPS5749284A (en)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0588040A3 (en) * 1992-08-20 1994-04-06 Hewlett-Packard Company Light source and technique for mounting light emitting diodes
EP0635893A1 (en) * 1993-07-22 1995-01-25 SHARP Corporation Semiconductor light emitter
JPH10294493A (en) * 1997-02-21 1998-11-04 Toshiba Corp Semiconductor light emitting device
US6018167A (en) * 1996-12-27 2000-01-25 Sharp Kabushiki Kaisha Light-emitting device
US6299056B1 (en) 1999-03-31 2001-10-09 Sharp Kabushiki Kaisha Light-emitting diode and manufacturing method thereof and method for mounting light-emitting diode on electric wiring board
JP2006253673A (en) * 2005-02-14 2006-09-21 Toshiba Corp Semiconductor light emitting element and light emitting device
US7795059B2 (en) 2005-02-14 2010-09-14 Kabushiki Kaisha Toshiba Method of fabricating a semiconductor light-emitting device
CN105140374A (en) * 2015-08-13 2015-12-09 山东浪潮华光光电子股份有限公司 Routing-free LED packaging structure and preparation method therefor
WO2022069731A1 (en) * 2020-10-02 2022-04-07 Osram Opto Semiconductors Gmbh Optoelectronic device and method for producing an optoelectronic device
WO2023153476A1 (en) * 2022-02-10 2023-08-17 京セラ株式会社 Light-emitting device production method and production device, and laser element substrate

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1440274A (en) * 1972-12-28 1976-06-23 Tokyo Shibaura Electric Co Display device using light-emitting semiconductor elements

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1440274A (en) * 1972-12-28 1976-06-23 Tokyo Shibaura Electric Co Display device using light-emitting semiconductor elements

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0739043A3 (en) * 1992-08-20 1997-10-29 Hewlett Packard Co Light source and technique for mounting light emitting diodes
EP0843365A3 (en) * 1992-08-20 1998-11-11 Hewlett-Packard Company Light source and technique for mounting light emitting diodes
CN1050936C (en) * 1992-08-20 2000-03-29 惠普公司 Light source and technique for mounting light emitting diodes
EP0588040A3 (en) * 1992-08-20 1994-04-06 Hewlett-Packard Company Light source and technique for mounting light emitting diodes
KR100297453B1 (en) * 1992-08-20 2001-10-24 마리 오 휴버 Light source with light emitting diode mounted vertically on the light emitting junction
EP0635893A1 (en) * 1993-07-22 1995-01-25 SHARP Corporation Semiconductor light emitter
US5537433A (en) * 1993-07-22 1996-07-16 Sharp Kabushiki Kaisha Semiconductor light emitter
KR100296202B1 (en) * 1996-12-27 2001-10-25 마찌다 가쯔히꼬 Light emitting display device
US6018167A (en) * 1996-12-27 2000-01-25 Sharp Kabushiki Kaisha Light-emitting device
JPH10294493A (en) * 1997-02-21 1998-11-04 Toshiba Corp Semiconductor light emitting device
US6299056B1 (en) 1999-03-31 2001-10-09 Sharp Kabushiki Kaisha Light-emitting diode and manufacturing method thereof and method for mounting light-emitting diode on electric wiring board
JP2006253673A (en) * 2005-02-14 2006-09-21 Toshiba Corp Semiconductor light emitting element and light emitting device
US7795059B2 (en) 2005-02-14 2010-09-14 Kabushiki Kaisha Toshiba Method of fabricating a semiconductor light-emitting device
CN105140374A (en) * 2015-08-13 2015-12-09 山东浪潮华光光电子股份有限公司 Routing-free LED packaging structure and preparation method therefor
WO2022069731A1 (en) * 2020-10-02 2022-04-07 Osram Opto Semiconductors Gmbh Optoelectronic device and method for producing an optoelectronic device
WO2023153476A1 (en) * 2022-02-10 2023-08-17 京セラ株式会社 Light-emitting device production method and production device, and laser element substrate

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