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JPS5750454A - Etching for soldered electrode - Google Patents

Etching for soldered electrode

Info

Publication number
JPS5750454A
JPS5750454A JP55125327A JP12532780A JPS5750454A JP S5750454 A JPS5750454 A JP S5750454A JP 55125327 A JP55125327 A JP 55125327A JP 12532780 A JP12532780 A JP 12532780A JP S5750454 A JPS5750454 A JP S5750454A
Authority
JP
Japan
Prior art keywords
soldered electrode
acetic acid
solder
etching
electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP55125327A
Other languages
Japanese (ja)
Inventor
Shinichi Muramatsu
Yuzuru Oji
Kiichiro Mukai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP55125327A priority Critical patent/JPS5750454A/en
Publication of JPS5750454A publication Critical patent/JPS5750454A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/11—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H01L2224/13001—Core members of the bump connector
    • H01L2224/13099—Material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Weting (AREA)

Abstract

PURPOSE:To eliminate a defective soldered electrode without corroding an underlying metal, by a method wherein vapor including oxygen is guided in a glacial acetic acid or acetic acid solution and a soldered electrode including lead and tin to be removed is left in the solution. CONSTITUTION:An Si substrate 1 having solder is left in glacial acetic acid foamed oxygen to perform etching and a defective soldered electrode 9 is removed. After removing the solder, a soldered electrode is newly formed again. This method completely eliminates lead and tin layers only forming solder without damaging an underlying metal.
JP55125327A 1980-09-11 1980-09-11 Etching for soldered electrode Pending JPS5750454A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55125327A JPS5750454A (en) 1980-09-11 1980-09-11 Etching for soldered electrode

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55125327A JPS5750454A (en) 1980-09-11 1980-09-11 Etching for soldered electrode

Publications (1)

Publication Number Publication Date
JPS5750454A true JPS5750454A (en) 1982-03-24

Family

ID=14907364

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55125327A Pending JPS5750454A (en) 1980-09-11 1980-09-11 Etching for soldered electrode

Country Status (1)

Country Link
JP (1) JPS5750454A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6348100B1 (en) 1999-07-01 2002-02-19 International Business Machines Corporation Resist bowl cleaning

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6348100B1 (en) 1999-07-01 2002-02-19 International Business Machines Corporation Resist bowl cleaning

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