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JPS5796766A - Semiconductor wafer edge polishing device - Google Patents

Semiconductor wafer edge polishing device

Info

Publication number
JPS5796766A
JPS5796766A JP55168887A JP16888780A JPS5796766A JP S5796766 A JPS5796766 A JP S5796766A JP 55168887 A JP55168887 A JP 55168887A JP 16888780 A JP16888780 A JP 16888780A JP S5796766 A JPS5796766 A JP S5796766A
Authority
JP
Japan
Prior art keywords
semiconductor wafer
dish
lapping
polishing device
wafer edge
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP55168887A
Other languages
Japanese (ja)
Inventor
Fumihiro Honda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP55168887A priority Critical patent/JPS5796766A/en
Publication of JPS5796766A publication Critical patent/JPS5796766A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • B24B9/065—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

PURPOSE:To polish an edge of a semiconductor wafer uniformly and with accuracy by combining the rotary motion of a lapping dish and the reciprocating motion of the semiconductor wafer. CONSTITUTION:A palling dish 2 is rotated by a motor, and the semiconductor wafter 1 held by a holder 3 which moves up and down by means of a cylinder is pressed against the lapping dish 2. By this lapping dish 2 and lapping powder supplied from a nozzle 6, the semiconductor wafer 1 is polished. At the same time, a reciprocating motion is provided to the holder 3 by a sliding mechanism 5 through an arm 4, bringing the semiconductor wafer 1 in uniform contact with the lapping dish 2. As a result, uniform polishing of the periphery of the semiconductor wafer and uniform wear of the lapping dish are attained.
JP55168887A 1980-11-27 1980-11-27 Semiconductor wafer edge polishing device Pending JPS5796766A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55168887A JPS5796766A (en) 1980-11-27 1980-11-27 Semiconductor wafer edge polishing device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55168887A JPS5796766A (en) 1980-11-27 1980-11-27 Semiconductor wafer edge polishing device

Publications (1)

Publication Number Publication Date
JPS5796766A true JPS5796766A (en) 1982-06-16

Family

ID=15876401

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55168887A Pending JPS5796766A (en) 1980-11-27 1980-11-27 Semiconductor wafer edge polishing device

Country Status (1)

Country Link
JP (1) JPS5796766A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6722964B2 (en) 2000-04-04 2004-04-20 Ebara Corporation Polishing apparatus and method
KR100825562B1 (en) * 2006-12-19 2008-04-25 주식회사 포스코 Specimen processing equipment
US7559825B2 (en) 2006-12-21 2009-07-14 Memc Electronic Materials, Inc. Method of polishing a semiconductor wafer
CN102229078A (en) * 2011-05-23 2011-11-02 锦州市锦利电器有限公司 Multistation automatic angle grinder
KR101140930B1 (en) 2010-03-29 2012-05-15 현대제철 주식회사 Horizontal position grinding device for removing welding defects on welded plate
CN109702637A (en) * 2019-02-28 2019-05-03 郑州工程技术学院 Optimization and manufacturing method of superhard bonded abrasive grinding parameters based on Adams simulation

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6722964B2 (en) 2000-04-04 2004-04-20 Ebara Corporation Polishing apparatus and method
US6935932B2 (en) 2000-04-04 2005-08-30 Ebara Corporation Polishing apparatus and method
US7108589B2 (en) 2000-04-04 2006-09-19 Ebara Corporation Polishing apparatus and method
KR100825562B1 (en) * 2006-12-19 2008-04-25 주식회사 포스코 Specimen processing equipment
US7559825B2 (en) 2006-12-21 2009-07-14 Memc Electronic Materials, Inc. Method of polishing a semiconductor wafer
KR101140930B1 (en) 2010-03-29 2012-05-15 현대제철 주식회사 Horizontal position grinding device for removing welding defects on welded plate
CN102229078A (en) * 2011-05-23 2011-11-02 锦州市锦利电器有限公司 Multistation automatic angle grinder
CN102229078B (en) 2011-05-23 2013-01-16 锦州市锦利电器有限公司 Multi-station automatic angle grinding machine
CN109702637A (en) * 2019-02-28 2019-05-03 郑州工程技术学院 Optimization and manufacturing method of superhard bonded abrasive grinding parameters based on Adams simulation
CN109702637B (en) * 2019-02-28 2020-10-02 郑州工程技术学院 Adams simulation based superhard consolidation abrasive grinding parameter optimization and manufacturing method

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