JPS58161334A - wire bonding equipment - Google Patents
wire bonding equipmentInfo
- Publication number
- JPS58161334A JPS58161334A JP57042598A JP4259882A JPS58161334A JP S58161334 A JPS58161334 A JP S58161334A JP 57042598 A JP57042598 A JP 57042598A JP 4259882 A JP4259882 A JP 4259882A JP S58161334 A JPS58161334 A JP S58161334A
- Authority
- JP
- Japan
- Prior art keywords
- bonding
- vibration
- wire
- wire bonding
- tool
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/852—Applying energy for connecting
- H01L2224/85201—Compression bonding
- H01L2224/85205—Ultrasonic bonding
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
本発明は、半導体装置の製造工程において内部素子と外
部リード間をワイヤで接続するボンディング工程で使用
されるボンディング装置に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a bonding apparatus used in a bonding process for connecting internal elements and external leads with wires in the manufacturing process of semiconductor devices.
半導体装置の内部素子と外部リード間をワイヤで接続す
るに際し、ワイヤの先端に金属ボールを作りこのボール
をボンディングツールにより加圧し、接続する方法が一
般に用いられているが、この時、低温下でボンディング
を行なう目的がら、加圧時に超音波振動等の振動を与え
る場合がある。When connecting the internal elements of a semiconductor device and the external leads with a wire, a method is generally used in which a metal ball is formed at the tip of the wire and the ball is pressurized with a bonding tool to make the connection. For the purpose of bonding, vibrations such as ultrasonic vibrations may be applied during pressurization.
この種のボンディングに使用されるボンディング装置を
第１図に平面図で示す。同図に示す様に軸１を中心にホ
ーン４が上下方向に揺動しホーン先端に取付けたボンデ
ィングツール５によりボンディングが行なわれる。この
ときホーン４は超音波発振子３により図示矢印方向忙加
振されている。A bonding apparatus used for this type of bonding is shown in plan view in FIG. As shown in the figure, a horn 4 swings vertically about a shaft 1, and bonding is performed by a bonding tool 5 attached to the tip of the horn. At this time, the horn 4 is vigorously vibrated by the ultrasonic oscillator 3 in the direction of the arrow shown in the figure.
この様な従来の装置であると、第２図に矢印Ａ方向から
見たワイヤ７のボンディング部位の形状は第３図に示す
様に圧着直後のボール形状８は加振後にボール形状９の
様に変わりボンディングの強度、信頼性等がボンディン
グ位置により変わってしまうという問題がある。With such a conventional device, the shape of the bonding part of the wire 7 when viewed from the direction of arrow A in FIG. 2 is as shown in FIG. 3, from a ball shape 8 immediately after crimping to a ball shape 9 after vibration. However, there is a problem in that bonding strength, reliability, etc. change depending on the bonding position.
したがって、本発明の目的は、ボンディングツールに加
えられる振動が平面２方向に作用するように加振用超音
波発振子を複数個付設しかつこの発振子の発振を制御し
得るよう構成することにより、ボンディングの強度、信
頼性の向上を図ることができるワイヤボンディング装置
を提供することにある。Therefore, an object of the present invention is to provide a plurality of excitation ultrasonic oscillators so that the vibrations applied to the bonding tool act in two plane directions, and to control the oscillation of the oscillators. Another object of the present invention is to provide a wire bonding device that can improve bonding strength and reliability.
以下、本発明の実施例を図面に基づいて説明する。Embodiments of the present invention will be described below based on the drawings.
第４図は、本発明の実施例を示しており、ホーン４に取
着した超音波発振子３に加えて超音波発振子３′をボン
ディング軸の一延長上に取付は超音波発振子３と３をそ
れぞれ先端のボンディングツール５が同図矢印に示す平
面２方向の振動軌跡１０を描く様に同期制御させる様に
する。つまり、両振動をＸ、 Ｙ方向に直交させると
共に両振幅を等しくすることにより、合成振動を円形と
する。FIG. 4 shows an embodiment of the present invention, in which in addition to the ultrasonic oscillator 3 attached to the horn 4, an ultrasonic oscillator 3' is attached on one extension of the bonding shaft. and 3 are synchronously controlled so that the bonding tool 5 at the tip draws a vibration locus 10 in two plane directions indicated by arrows in the figure. That is, by making both vibrations orthogonal to the X and Y directions and making both amplitudes equal, the combined vibration is made circular.
したかつ又本実施例によれば、ボンディングツール５は
ボンディングに最適な振動軌跡１０を描くのでボンディ
ング後のボール形状は円形となり各ボンディングの強度
、信頼性は常に一定のものとなる。また各ボンディング
毎にその振動量を変えることにより被ボンデイング材に
よる特異性をもカバーすることが出来るなど多くの効果
な有し、従来の問題を解消するものである。Moreover, according to the present embodiment, the bonding tool 5 draws the optimum vibration locus 10 for bonding, so that the ball shape after bonding is circular, and the strength and reliability of each bonding are always constant. Furthermore, by changing the amount of vibration for each bonding, it is possible to cover the peculiarities of the materials to be bonded, etc., and has many effects, thus solving the problems of the conventional method.
なお、本発明は前記実施例に限定されるものではなく追
加した加振振動源はボンディング軸でなくボンディング
ホーンに取付けてもよく、この場合第５図に示す様に発
振子３．３′を直角配置するようにしてもよい。Note that the present invention is not limited to the above-mentioned embodiment, and the additional vibration source may be attached to the bonding horn instead of the bonding shaft. In this case, the oscillator 3.3' is attached as shown in FIG. They may be arranged at right angles.
また、加振振動方向及び大きさを、各ボンディング毎に
制御することを特徴とするもの、あるいはまた、加振振
動方向及び大きさを、各ボンディング中にボンディング
状態を検出し、その結果をフィードバックすることによ
り、各ボンディング毎に制御するものが本発明の好適な
他の各実施例である。In addition, the direction and magnitude of excitation vibration are controlled for each bonding, or the direction and magnitude of excitation vibration are detected during each bonding, and the results are fed back. In other preferred embodiments of the present invention, control is performed for each bonding.
以上説明したように本発明によれば各ボンディング毎に
最適な加振が得られるのでボンディングの強度、信頼性
の向上を得ることが可能である。As explained above, according to the present invention, optimum vibration can be obtained for each bonding, so it is possible to improve the strength and reliability of the bonding.
第１図は従来用いられている加振付ボンディング装置を
示す平面図、第２図は、ボンディング後のワイヤ側面図
、第３図は第２図の入方向より見たボンディング形状を
示す平面図、第４図は本発明の実施例の平面図、第５図
は本発明の変形例の平面図である。
１・・・ボンディング軸、２・・・ベアリング、３・・
・発振子、４・・・ボンディングアーム（ホーン）、５
・・・ボンディングツール、６・・・振動方向、７・・
・ボンディングワイヤ形状、８・・・圧着直後ボール形
状、９・・加振後ボール形状、１０・・・振動方向。
’ｉ”、：晶！
第 １ 図
／
第 ２ 図FIG. 1 is a plan view showing a conventionally used excitation bonding device, FIG. 2 is a side view of the wire after bonding, and FIG. 3 is a plan view showing the bonding shape as seen from the entrance direction of FIG. FIG. 4 is a plan view of an embodiment of the invention, and FIG. 5 is a plan view of a modified example of the invention. 1... Bonding shaft, 2... Bearing, 3...
・Resonator, 4...Bonding arm (horn), 5
... Bonding tool, 6... Vibration direction, 7...
- Bonding wire shape, 8... Ball shape immediately after crimping, 9... Ball shape after vibration, 10... Vibration direction. 'i', : Akira! Figure 1/Figure 2
Claims (1)
おいて、ボンディング時に前記ボンディングツールを平
面２方向に夫々振動させる複数個の超音波発振子を付設
したことを特徴とするワイヤボンディング装置。 ２、加振振動方向を平面上で夫々直交させかつ両振幅を
等しくしてなる特許請求の範囲第１項記載のワイヤボン
ディング装置。 ３、加振振動方向及び大きさを、各ボンディング毎に制
御することを特徴とする特許請求の範囲第１項記載のワ
イヤボンディング装置。 ４、加振振動方向及び大きさを、各ボンディング中にボ
ンディング状態を検出し、その結果をフィードバックす
ることにより、各ボンディング毎に制御することを特徴
とする特許請求の範囲第１項記載のワイヤボンディング
装置。Claims: 1. A wire bonding apparatus characterized in that a bonding arm having a bonding tool is provided with a plurality of ultrasonic oscillators that respectively vibrate the bonding tool in two plane directions during bonding. 2. The wire bonding apparatus according to claim 1, wherein the excitation vibration directions are perpendicular to each other on a plane and both amplitudes are equal. 3. The wire bonding apparatus according to claim 1, wherein the direction and magnitude of vibration are controlled for each bonding. 4. The wire according to claim 1, wherein the direction and magnitude of the excitation vibration are controlled for each bonding by detecting the bonding state during each bonding and feeding back the results. bonding equipment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57042598A JPS58161334A (en) | 1982-03-19 | 1982-03-19 | wire bonding equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57042598A JPS58161334A (en) | 1982-03-19 | 1982-03-19 | wire bonding equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58161334A true JPS58161334A (en) | 1983-09-24 |
| JPH0153508B2 JPH0153508B2 (en) | 1989-11-14 |
Family
ID=12640487
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57042598A Granted JPS58161334A (en) | 1982-03-19 | 1982-03-19 | wire bonding equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58161334A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02302055A (en) * | 1989-05-16 | 1990-12-14 | Nec Kyushu Ltd | Semiconductor device |
| JP2000208560A (en) * | 1999-01-12 | 2000-07-28 | Asahi Rubber Kk | Method of mounting semiconductor chip on substrate using ultrasonic composite vibration |
| US6116490A (en) * | 1997-07-29 | 2000-09-12 | Kabushiki Kaisha Shinkawa | Bonding apparatus |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS51126063A (en) * | 1975-04-25 | 1976-11-02 | Hitachi Ltd | Wire bonding method |
| JPS534185U (en) * | 1976-06-28 | 1978-01-14 | ||
| JPS55128841A (en) * | 1979-03-27 | 1980-10-06 | Marine Instr Co Ltd | Ultrasonic drive device |
| JPS57157534A (en) * | 1981-03-23 | 1982-09-29 | Nec Corp | Assembling device for semiconductor device |
-
1982
- 1982-03-19 JP JP57042598A patent/JPS58161334A/en active Granted
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS51126063A (en) * | 1975-04-25 | 1976-11-02 | Hitachi Ltd | Wire bonding method |
| JPS534185U (en) * | 1976-06-28 | 1978-01-14 | ||
| JPS55128841A (en) * | 1979-03-27 | 1980-10-06 | Marine Instr Co Ltd | Ultrasonic drive device |
| JPS57157534A (en) * | 1981-03-23 | 1982-09-29 | Nec Corp | Assembling device for semiconductor device |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02302055A (en) * | 1989-05-16 | 1990-12-14 | Nec Kyushu Ltd | Semiconductor device |
| US6116490A (en) * | 1997-07-29 | 2000-09-12 | Kabushiki Kaisha Shinkawa | Bonding apparatus |
| JP2000208560A (en) * | 1999-01-12 | 2000-07-28 | Asahi Rubber Kk | Method of mounting semiconductor chip on substrate using ultrasonic composite vibration |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0153508B2 (en) | 1989-11-14 |
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