JPS5861293A - Method for plating of stainless steel strip for electronic parts with gold - Google Patents
Method for plating of stainless steel strip for electronic parts with goldInfo
- Publication number
- JPS5861293A JPS5861293A JP14607782A JP14607782A JPS5861293A JP S5861293 A JPS5861293 A JP S5861293A JP 14607782 A JP14607782 A JP 14607782A JP 14607782 A JP14607782 A JP 14607782A JP S5861293 A JPS5861293 A JP S5861293A
- Authority
- JP
- Japan
- Prior art keywords
- stainless steel
- gold
- steel strip
- strip
- bath
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000010935 stainless steel Substances 0.000 title claims abstract description 48
- 229910001220 stainless steel Inorganic materials 0.000 title claims abstract description 48
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 title claims abstract description 44
- 229910052737 gold Inorganic materials 0.000 title claims abstract description 44
- 239000010931 gold Substances 0.000 title claims abstract description 44
- 238000007747 plating Methods 0.000 title claims abstract description 37
- 238000000034 method Methods 0.000 title claims description 19
- 238000005260 corrosion Methods 0.000 claims abstract description 7
- 230000007797 corrosion Effects 0.000 claims abstract description 7
- 239000003112 inhibitor Substances 0.000 claims abstract description 6
- 150000001412 amines Chemical class 0.000 claims abstract description 4
- 230000003213 activating effect Effects 0.000 claims abstract 6
- 230000002378 acidificating effect Effects 0.000 claims abstract 4
- 239000004094 surface-active agent Substances 0.000 claims abstract 2
- 239000000126 substance Substances 0.000 claims description 5
- 238000007517 polishing process Methods 0.000 claims description 4
- 230000004913 activation Effects 0.000 claims 2
- 239000003795 chemical substances by application Substances 0.000 claims 1
- 150000007522 mineralic acids Chemical class 0.000 claims 1
- 150000007524 organic acids Chemical class 0.000 claims 1
- 235000005985 organic acids Nutrition 0.000 claims 1
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 abstract description 15
- 229910000881 Cu alloy Inorganic materials 0.000 abstract description 7
- 239000002253 acid Substances 0.000 abstract description 6
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 abstract description 4
- 239000002202 Polyethylene glycol Substances 0.000 abstract description 3
- -1 hydrochloric acid Chemical class 0.000 abstract description 3
- 229920001223 polyethylene glycol Polymers 0.000 abstract description 3
- 229910000831 Steel Inorganic materials 0.000 abstract description 2
- 150000005215 alkyl ethers Chemical class 0.000 abstract description 2
- 239000000463 material Substances 0.000 abstract description 2
- 239000010959 steel Substances 0.000 abstract description 2
- 150000007513 acids Chemical class 0.000 abstract 4
- 238000009713 electroplating Methods 0.000 abstract 1
- 238000007654 immersion Methods 0.000 abstract 1
- 238000002156 mixing Methods 0.000 abstract 1
- 239000000203 mixture Substances 0.000 abstract 1
- 238000005498 polishing Methods 0.000 abstract 1
- 238000005238 degreasing Methods 0.000 description 8
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- 239000002585 base Substances 0.000 description 5
- 238000012360 testing method Methods 0.000 description 5
- 229910000906 Bronze Inorganic materials 0.000 description 4
- 229910000990 Ni alloy Inorganic materials 0.000 description 4
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 4
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 4
- 239000010974 bronze Substances 0.000 description 4
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 4
- 230000000873 masking effect Effects 0.000 description 4
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 238000005299 abrasion Methods 0.000 description 3
- 238000001994 activation Methods 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 239000002280 amphoteric surfactant Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 239000001509 sodium citrate Substances 0.000 description 2
- NLJMYIDDQXHKNR-UHFFFAOYSA-K sodium citrate Chemical compound O.O.[Na+].[Na+].[Na+].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O NLJMYIDDQXHKNR-UHFFFAOYSA-K 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 150000001413 amino acids Chemical class 0.000 description 1
- 239000010953 base metal Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- DMFGNRRURHSENX-UHFFFAOYSA-N beryllium copper Chemical compound [Be].[Cu] DMFGNRRURHSENX-UHFFFAOYSA-N 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 230000005389 magnetism Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- MOFOBJHOKRNACT-UHFFFAOYSA-N nickel silver Chemical compound [Ni].[Ag] MOFOBJHOKRNACT-UHFFFAOYSA-N 0.000 description 1
- 239000010956 nickel silver Substances 0.000 description 1
- KERTUBUCQCSNJU-UHFFFAOYSA-L nickel(2+);disulfamate Chemical compound [Ni+2].NS([O-])(=O)=O.NS([O-])(=O)=O KERTUBUCQCSNJU-UHFFFAOYSA-L 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 230000009972 noncorrosive effect Effects 0.000 description 1
- 239000002736 nonionic surfactant Substances 0.000 description 1
- 238000002161 passivation Methods 0.000 description 1
- UUWCBFKLGFQDME-UHFFFAOYSA-N platinum titanium Chemical compound [Ti].[Pt] UUWCBFKLGFQDME-UHFFFAOYSA-N 0.000 description 1
- XTFKWYDMKGAZKK-UHFFFAOYSA-N potassium;gold(1+);dicyanide Chemical compound [K+].[Au+].N#[C-].N#[C-] XTFKWYDMKGAZKK-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Electroplating And Plating Baths Therefor (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
Description
【発明の詳細な説明】
本発明は、新規な電子部品用ステンレス鋼帯の金メツキ
方法に関するもので、従来の銅合金またはニッケル合金
の電子部品用帯材（フープ）に比し、廉価でしかも剛性
、゛ばね性、耐熱性に優れ、また耐蝕性に関しても不銹
鋼と称せられるように腐蝕しにくく、また電気特性及び
半田性に優れた新規な電子部品用ステンレス鋼帯の金メ
ツキ方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a novel gold plating method for stainless steel strips for electronic components, which is less expensive than conventional copper alloy or nickel alloy strips (hoops) for electronic components. This relates to a new gold plating method for stainless steel strips for electronic components, which have excellent rigidity, springiness, and heat resistance, and are hard to corrode as they are referred to as non-corrosive steel.They also have excellent electrical properties and solderability. be.
従来の電子部品用帯材（フープ）としては主として燐青
銅、洋白、ベリリューム銅及びニッケル合金が用いられ
ていたが、剛性に欠け、耐蝕性が悪く、またばね性に劣
る等の欠点があった。Traditionally, phosphor bronze, nickel silver, beryllium copper, and nickel alloys have been mainly used as hoops for electronic components, but these have drawbacks such as lack of rigidity, poor corrosion resistance, and poor spring properties. Ta.
このために銅及びニッケル合金による電子部品は、軽量
、小型化を追及する現在の電子機器の部品として最少限
の厚み迄到達しているが、これ以上の小型軽量化は機械
的に要求される性能上困難な状態にある。For this reason, electronic parts made of copper and nickel alloys have reached the minimum thickness for the parts of current electronic devices that pursue lighter weight and smaller size, but further reduction in size and weight is mechanically required. Performance is in a difficult condition.
また、銅合金にも金メッキをすることが知られているが
、銅合金上に金メッキをする場合は金が素地の銅合金に
拡散するので、拡散外を見越して金メッキ層を厚くする
か、またはこれを防ぐために予めニッケルの下地メッキ
をする等の対策が施される。しかし、ニッケルを下地メ
ツキする対策では、工程が増えてコスト高となるばかシ
でなく、特に性能上音響機器及び高周波機器の部品の場
合、ニノーケルの磁性のために好ましくない。It is also known that gold plating is applied to copper alloys, but when gold plating is performed on copper alloys, the gold will diffuse into the base copper alloy, so the gold plating layer must be made thicker to prevent diffusion, or To prevent this, countermeasures are taken such as applying a nickel base plating in advance. However, the countermeasure of base plating with nickel is unwise as it increases the number of steps and increases the cost, and is not preferable due to the magnetism of nickel, especially in the case of parts for audio equipment and high frequency equipment in terms of performance.
本発明者は、安価にして且つ剛性、ばね性及び耐熱性が
高く、また電子部品として要求される電気特性、半田性
に優れたステンレス鋼帯を提供すべく長期間に亘シ研究
の結果、直接金メッキしたステンレス鋼帯が従来の銅合
金及びニッケル合金と比べ極めて優れた電子部品を製作
できる銅帯であることを見出し、この知見に基づいて本
発明を完成した。As a result of long-term research, the inventor of the present invention aimed to provide a stainless steel strip that is inexpensive, has high rigidity, springiness, and heat resistance, and has excellent electrical properties and solderability required for electronic components. We have discovered that a directly gold-plated stainless steel strip is a copper strip that can be used to manufacture extremely superior electronic parts compared to conventional copper alloys and nickel alloys, and based on this knowledge, we have completed the present invention.
すなわち本発明は、薄いステンレス鋼帯に直接金メッキ
するための電子部品用ステンレス鋼帯の金メツキ方法に
関するものである。That is, the present invention relates to a method for gold plating a stainless steel strip for electronic components, which involves directly gold plating a thin stainless steel strip.
本発明で金メッキする薄いステンレス鋼帯は、その厚さ
は０．０６〜０．２ ｍで、巾は５〜８０ｍＩのものが
好ましく、金メッキの厚さは０．３〜２゜０μ、好まし
くは０．５〜１．０μである。The thin stainless steel strip to be gold plated in the present invention preferably has a thickness of 0.06 to 0.2 m and a width of 5 to 80 mI, and the thickness of the gold plating is 0.3 to 2°0μ, preferably It is 0.5 to 1.0μ.
一般にステンレス鋼はその表面に不動態化皮しい。従っ
て、所期の金メッキを施すには、予め、この不動態化皮
膜は完全に除去するが、ステンレス鋼帯自体の素地を侵
蝕しないように注意してステンレス鋼帯の表面清浄化を
行なわなければならない。Stainless steel generally tends to be passivated on its surface. Therefore, in order to apply the desired gold plating, this passivation film must be completely removed in advance, but the surface of the stainless steel strip must be cleaned carefully to avoid corroding the base material of the stainless steel strip itself. No.
以下、実施例をあげて本発明を具体的に説明するが、本
発明はこれらの実施例に限定されるものではない。EXAMPLES The present invention will be specifically described below with reference to Examples, but the present invention is not limited to these Examples.
実施例１
■マスキング工程
厚さ０．１２〜、巾２１％のステンレス鋼帯の片側のみ
を金メッキするために、脱脂工程に入る前に耐酸、耐ア
ルカリ性に富んだ樹脂テープをステンレス鋼帯の送シ出
しに合せて片側にローラーで圧着し、メッキの際に片側
のみ金メッキを可能とするテープによるマスキング工程
を行なった。Example 1 ■ Masking process In order to gold plate only one side of a stainless steel strip with a thickness of 0.12% to 21% in width, a resin tape with high acid and alkali resistance was applied to the stainless steel strip before entering the degreasing process. One side was crimped with a roller according to the extrusion, and a masking process using tape was performed to enable gold plating on only one side during plating.
■脱脂工程
市販されているアルカリ脱脂液をステンレス槽中で７０
〜８０℃に加温し、上記ステンレス鋼帯を逐次この槽中
を通過させて一次脱脂を行ない、次に４０〜６０℃のア
ルカリ浴中でステンレス鋼板を陽極とし該ステンレス鋼
帯を陰極として６ボルトの電圧を印加して直流電解脱脂
を行なった。■Degreasing process A commercially available alkaline degreasing solution was heated to 70% in a stainless steel tank.
The stainless steel strip was heated to ~80°C and passed through this tank sequentially to perform primary degreasing, and then heated in an alkaline bath at 40 to 60°C with the stainless steel plate as an anode and the stainless steel strip as a cathode. DC electrolytic degreasing was performed by applying a voltage of volts.
■化学研摩工程
続いて該ステンレス鋼帯を、塩酸（５！５％溶液）２０
容量チ、硫酸（８５％溶液）１０容量チ、クエン酸（粉
末）１０重量％、酢酸（９０チ溶液）１容量チ及び硝酸
（６８チ溶液）５容量チよシなる混酸に、ポリエチレン
クリコールアルキルエーテル、ポリエチレングリコール
脂肪酸エステルなどの非イオンまたはアミノ酸類の両性
界面活性剤０．２重量％及びアミン系腐蝕抑制剤（例え
ばライオンアーマ社製アーモヒブー２８ ） ０．１重
量％を加えた浴に６００ワツトの超音波を照射しながら
通過させ、該ステンレス鋼帯表面の酸化物及び不純物を
除去した。■Chemical polishing process The stainless steel strip is then polished with 20% hydrochloric acid (5!5% solution).
Add polyethylene glycol to a mixed acid consisting of 1 volume of sulfuric acid (85% solution), 10 volumes of citric acid (powder), 1 volume of acetic acid (90% solution), and 5 volumes of nitric acid (68% solution). A bath containing 0.2% by weight of a nonionic or amino acid amphoteric surfactant such as an alkyl ether or polyethylene glycol fatty acid ester, and 0.1% by weight of an amine corrosion inhibitor (for example, Armohib 28 manufactured by Lion Armor) was added to the bath. Watt's ultrasonic waves were passed through the stainless steel strip while irradiating it to remove oxides and impurities on the surface of the stainless steel strip.
■電解活性化工程
燐酸（８５％溶液）１０容量チ、硫酸
（８５％溶液）１０重量％、クエン酸（粉末）５重量％
、酢酸（９０％溶液）１重量％に、上記と同様の非イオ
ンまたは両性界面活性剤０．２重量％及び腐蝕抑制剤０
．１重量％を加えた浴を６０℃に加温し、ステンレス鋼
帯にＣ）電流を、チタン白金メツキ板に０）電流を通じ
４ボルトにセットして浴中を通過させてステンレス鋼帯
の表面の活性化を行なった。■Electrolytic activation process Phosphoric acid (85% solution) 10% by volume, sulfuric acid (85% solution) 10% by weight, citric acid (powder) 5% by weight
, 1% by weight of acetic acid (90% solution), 0.2% by weight of nonionic or amphoteric surfactant as above and 0 corrosion inhibitor.
．． A bath to which 1% by weight has been added is heated to 60°C, and a current is applied to the stainless steel strip, and a current is passed through the titanium/platinum plated plate at 4 volts. was activated.
■金メッキ工程
クエン酸１２０ ｆ／ｌ、クエン酸ソーダ１２０ ｔ／
ｌ、スルファミン酸ニッケル３０ｔ７ｔ、シアン化金カ
リ８ｔ／ｌのメッキ浴中で電流密度５ Ａ／ 射〜Ｉ
Ａ／ Ｄｍ”の範囲でメッキ液温２７℃で、ステンレス
鋼帯に（−）電流を、チタン白金メツキ板に（＋）電流
を通じ５分間金メツキを行なった。■Gold plating process Citric acid 120 f/l, Sodium citrate 120 t/
Current density: 5 A / I
Gold plating was carried out for 5 minutes by applying a (-) current to the stainless steel strip and a (+) current to the titanium/platinum plated plate at a plating solution temperature of 27° C. within the range of “A/Dm”.
その結果、ステンレス鋼帯の片側に１μの厚さの金メッ
キ層が形成され、本発明のステンレス鋼帯が得られた。As a result, a gold plating layer with a thickness of 1 μm was formed on one side of the stainless steel strip, and the stainless steel strip of the present invention was obtained.
実施例２
■マスキング工程
厚さ０．１％、巾３６ｙ５のステンレス鋼帯の片側に巾
３％と４％の金の縞状部分メッキを施すために、ステン
レそ銅帯の金メッキを施さない面側には予め耐薬品性に
優れた塗料を塗布し、乾燥後巻き状としてメッキ装置に
セットした。Example 2 ■Masking process In order to apply gold stripe plating with widths of 3% and 4% to one side of a stainless steel strip with a thickness of 0.1% and a width of 36x5, the side of the stainless steel strip that is not plated with gold has a width of 3% and 4%. A coating with excellent chemical resistance was applied to the sides in advance, and after drying, it was rolled into a roll and set in a plating machine.
次に脱脂工程に入る前に実施例１と同種の樹脂テープを
ローラーで圧着すると同時に４枚のカッターを所定の寸
法位置にセットし、巾′５％と４％の金メッキができる
ようにテープを切り込んでこの分のテープを捨て、ステ
ンレスの素地を露出させた。。Next, before starting the degreasing process, a resin tape of the same type as in Example 1 is crimped with a roller, and at the same time four cutters are set at the predetermined dimensional positions, and the tape is applied so that gold plating of 5% and 4% width can be applied. I made a cut and threw away this amount of tape to expose the stainless steel base. .
■脱脂工程 実施例１と同様にして行なった。■Degreasing process It was carried out in the same manner as in Example 1.
■化学研摩工程 実施例１と同様にして行なった。■Chemical polishing process It was carried out in the same manner as in Example 1.
■電解活性化工程 実施例１と同様にして行なった。■Electrolytic activation process It was carried out in the same manner as in Example 1.
■金メッキ工程
クエン酸１２０ｔ／ｌ、クエン酸ソーダ３．１２０ｆ／
ｌ、スルファミン酸ニッケル５０ｆ ／ｌ、シアン化金
カリ８１／ｌのメッキ浴中で電流密度５Ａ／Ｄｒｒ？〜
１Ａ／Ｄｒｒ？の範囲でメッキ液温２７℃で、ステンレ
ス鋼帯に（−）電流をチタン白金メツキ板に（＋）電流
を通じ３分間金メツキを行なった。■Gold plating process Citric acid 120t/l, Sodium citrate 3.120f/
1, nickel sulfamate 50 f/l, and potassium gold cyanide 81/l in a plating bath with a current density of 5 A/Drr? ~
1A/Drr? Gold plating was performed for 3 minutes at a plating solution temperature of 27 DEG C. by passing a (-) current to the stainless steel strip and a (+) current to the titanium-platinum plated plate.
その結果、ステンレス鋼帯の片側に巾３％と４％の縞状
の０．５μの厚さの金メッキが施された本発明のステン
レス鋼帯が得られた。As a result, a stainless steel strip of the present invention was obtained, in which one side of the stainless steel strip was plated with gold in the form of stripes with a width of 3% and 4% and a thickness of 0.5 μm.
実施例３
■マスキング工程
実施例２と同じ厚さ、巾のステンレス鋼帯の片側に金を
直径５簡の円形に、かっこの円形が千鳥状に配置するよ
うに部分メッキするために、実施例１と同種の樹脂テー
プを用いて上記円形部具外の部分をマスキングした。Example 3 ■Masking process In order to partially plate gold on one side of a stainless steel strip with the same thickness and width as Example 2 in a circle with a diameter of 5 strips, and the circles in the parentheses are arranged in a staggered manner, Example The outside of the circular part was masked using a resin tape of the same type as No. 1.
■脱脂工程 実施例１と同様にして行なった。■Degreasing process It was carried out in the same manner as in Example 1.
■化学研摩工程 実施例１と同様にして行なった。■Chemical polishing process It was carried out in the same manner as in Example 1.
■電解活性化工程 実施例１と同様にして行なった。■Electrolytic activation process It was carried out in the same manner as in Example 1.
■金メッキ工程 実施例１と同様にして行なった。■Gold plating process It was carried out in the same manner as in Example 1.
その結果、ステンレス鋼帯の片側に直径５鯛の円形が千
鳥状に配置した０、５μの厚さの部分金メッキが形成さ
れ、本発明のステンレス鋼帯が得られた。なお、本発明
でこの実施例のような部分金メッキを施す場合、部分メ
ッキ部は直径で１〜７簡程度の大きさに施されることが
多い。As a result, partial gold plating with a thickness of 0.5 μm was formed on one side of the stainless steel strip in which circles with a diameter of 5 mm were arranged in a staggered manner, and the stainless steel strip of the present invention was obtained. Incidentally, when performing partial gold plating as in this embodiment in the present invention, the partial plating portion is often applied to a size of about 1 to 7 pieces in diameter.
次に、本発明ステンレス鋼帯の優れた性質について具体
的に示す。Next, the excellent properties of the stainless steel strip of the present invention will be specifically described.
（１）接点部摩耗性
燐青銅上に０，５μ金メツキしたものと、ステンレス鋼
帯（８Ｕ８−５０４）に同じく０．５μ金メツキしたも
のを摩耗テスト機で、１．２助の加圧の下に摩耗テスト
を行なった結果、ステンレス鋼帯に金メッキしたものの
方が約５０％耐岸耗率が高い事が判明した。これは素地
金属の軟、硬による結果であシ、硬いステンレス鋼帯止
の金メッキは摩耗が少なく、軟かい燐青銅上の金メッキ
は早く摩耗することがわかった。(1) Abrasion resistance of contacts A phosphor bronze plated with 0.5μ gold and a stainless steel strip (8U8-504) plated with 0.5μ gold were subjected to a pressure of 1.2 μm using an abrasion tester. As a result of abrasion tests conducted under the belt, it was found that gold-plated stainless steel strips had approximately 50% higher shore wear resistance. This is a result of the softness and hardness of the base metal; it was found that gold plating on hard stainless steel straps wears less, while gold plating on soft phosphor bronze wears out faster.
（Ｊｉ）剥離性
（イ）１８０° 曲げテスト、（ロ）テープ剥離テスト
、（ハ）４００℃、１０分間加熱後急冷テストを行々っ
た０その結果、３方法ともステンレス鋼帯よシ金メッキ
層の剥離は認められなかった。(Ji) Peelability (A) 180° bending test, (B) Tape peeling test, (C) Rapid cooling test after heating at 400℃ for 10 minutes.As a result, all three methods showed that the stainless steel strip was gold plated. No layer peeling was observed.
■半田性
ンルダーテスト機でテストの結果、半田の濡れ性が極め
て良く、半田初期の半田表面張力による押し上げが殆ん
どみられなかった。■Solderability As a result of testing with a soldering tester, the wettability of the solder was extremely good, and there was almost no upward movement due to the solder surface tension in the early stages of soldering.
α）電気電導性
燐青銅上の金メッキと比較して何んらの遜色もみられな
かった。α) No inferiority was observed compared to gold plating on electrically conductive phosphor bronze.
以上説明した本発明の方法で得た金メッキしたステンレ
ス鋼帯は、スイッチ、接点、端子、センサー、コネクタ
ー、バネ、ＬＳＩ用ケーシング等に使用できる。The gold-plated stainless steel strip obtained by the method of the present invention described above can be used for switches, contacts, terminals, sensors, connectors, springs, LSI casings, etc.
また、本発明ステンレス鋼帯から上記のような部品を作
成するには、本発明の金メッキしたステンレス鋼帯を金
型により打抜いて部品を作成すればよい。ところで、金
メッキを施す前に部品を作ってしまうと全面金メッキを
せざるを得ぬが、本発明の例えば実施例２．３のように
銅帯に部分メッキしたようなものであれば、必要部分の
みに金メッキしたものとすることができるので、コスト
が低減できる。Further, in order to create the above-mentioned parts from the stainless steel strip of the present invention, the gold-plated stainless steel strip of the present invention may be punched out using a die. By the way, if a part is made before gold plating, the entire surface must be plated with gold, but if the part is partially plated on a copper strip as in Example 2.3 of the present invention, the necessary parts can be plated with gold. Since only the metal plate can be plated with gold, the cost can be reduced.
Claims (1)
剤を配合した酸性活性化浴を用いてステンレス鋼帯を浸
漬処理する化学研摩工程と無機酸類、有機酸類、界面活
・性剤及びアミン系腐蝕抑制剤を配合した陰極電解浴を
用いて、上記ステンレス鋼帯を活性化する電解活性化工
程と 酸性金メッキ浴により、上記ステンレス鋼帯に直接電気
金メッキを施す工程と よりなることを特徴とする電子部品用ステンレス鋼帯の
金メツキ方法[Claims] A chemical polishing process in which a stainless steel strip is immersed in an acidic activation bath containing inorganic acids, organic acids, a surfactant, and an amine corrosion inhibitor;・An electrolytic activation step of activating the stainless steel strip using a cathodic electrolytic bath containing a sexing agent and an amine corrosion inhibitor, and a step of directly applying electrolytic gold plating to the stainless steel strip using an acidic gold plating bath. A method for gold plating stainless steel strips for electronic components, characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14607782A JPS5857520B2 (en) | 1982-08-25 | 1982-08-25 | Gold plating method for stainless steel strips for electronic components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14607782A JPS5857520B2 (en) | 1982-08-25 | 1982-08-25 | Gold plating method for stainless steel strips for electronic components |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2811580A Division JPS56126206A (en) | 1980-03-07 | 1980-03-07 | Steel band for electronic component |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5861293A true JPS5861293A (en) | 1983-04-12 |
| JPS5857520B2 JPS5857520B2 (en) | 1983-12-20 |
Family
ID=15399583
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14607782A Expired JPS5857520B2 (en) | 1982-08-25 | 1982-08-25 | Gold plating method for stainless steel strips for electronic components |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5857520B2 (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63195291A (en) * | 1987-02-06 | 1988-08-12 | Kansai Plant Kogyo:Kk | Method and device for producing gold-plated vessels |
| JPH03193895A (en) * | 1987-02-06 | 1991-08-23 | Kansai Plant Kogyo:Kk | Gold plated sheet and production thereof |
| WO2001059185A3 (en) * | 2000-02-08 | 2002-03-07 | Duratech Ind Inc | Pre-plate treating system |
| US6555170B2 (en) | 1998-01-30 | 2003-04-29 | Duratech Industries, Inc. | Pre-plate treating system |
| CN109666957A (en) * | 2019-01-26 | 2019-04-23 | 无锡华友微电子有限公司 | A kind of configuration method of organic acid pretreating reagent |
-
1982
- 1982-08-25 JP JP14607782A patent/JPS5857520B2/en not_active Expired
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63195291A (en) * | 1987-02-06 | 1988-08-12 | Kansai Plant Kogyo:Kk | Method and device for producing gold-plated vessels |
| JPH03193895A (en) * | 1987-02-06 | 1991-08-23 | Kansai Plant Kogyo:Kk | Gold plated sheet and production thereof |
| US6555170B2 (en) | 1998-01-30 | 2003-04-29 | Duratech Industries, Inc. | Pre-plate treating system |
| WO2001059185A3 (en) * | 2000-02-08 | 2002-03-07 | Duratech Ind Inc | Pre-plate treating system |
| CN109666957A (en) * | 2019-01-26 | 2019-04-23 | 无锡华友微电子有限公司 | A kind of configuration method of organic acid pretreating reagent |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5857520B2 (en) | 1983-12-20 |
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