JPS59215725A - Semiconductor manufacturing device - Google Patents

Abstract

PURPOSE:To prevent a substrate from adhesion of the degenerated solutions of developers by a method wherein the plane positions of nozzles are arranged at the side of the development objective substrate up to directly after starting of spraying of the developer fed from the nozzle and after directly before finishing of spraying, and the nozzles are made to perform reciprocating transference on the substrate performing spraying. CONSTITUTION:A first developer is sprayed from nozzle 25 stopping at the position A through a solution line 27 at the same time with starting of the rotation of a head 12 holding a substrate 11, an arm 31 is swinged between the positions A, A', and the nozzle 25 passes the upper part of the center of the substrate 11. After the prescribed hours of starting of motion of a sprayer 23, a sprayer 24 is fed with a second developer from a solution line 28 during stopping at the position B, and sprays from a nozzle 26. When the sprayer 26 stops at the position A, the sprayer 24 reciprocates between the positions B, B' spraying as it is, and after the prescribed hours, stops at the position B, and spraying of the nozzle 26 is also stopped. The head 12 continues the rotation to dry the substrate 11. According to this construction, a degenerated solution is not adhered to the substrate at spraying time from the nozzle, and moreover spraying condition can be stabilized.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to semiconductor manufacturing equipment, and more particularly, to a wafer developing device that develops a wafer that has been exposed to light after a mask is placed on a bamboo.

[Technical background of the invention and points in between]

As shown in FIG. 1, this birch semiconductor manufacturing apparatus includes a wafer holding table (hereinafter referred to as a spin head) 12 that holds a phenol 1, that is, a wafer 11 to be developed, on which Kf)3 light has been applied after mask alignment. ．． An example of spraying a developing solution is 2.
The atomizer 13114 on the stand and the solution receiver that collects the hot liquid sprayed from the nozzle 15.16 of the atomizer 13.14 are located in the section (
17 (hereinafter referred to as cups) are mainly provided. Nozzle 15.
The planar positional relationship of 16 is as shown in FIG. That is, the atomizer 13 generally includes at least one nozzle 15.1.
6 is fixedly arranged at a position above the side 11. Note that 18 indicates the opening edge of the cup f17.

In the above-described semiconductor manufacturing apparatus, the workpiece 11 to be developed is held by the spin head 12, and when the spin head 12 starts rotating in the direction of arrow a in the figure by a drive mechanism (not shown) such as a motor.

For example, the first developing solution is sprayed onto the wafer 11 from the nozzle 15 of the sprayer 13 . When the spraying from the nozzle 15 is completed, the second developing solution is sprayed from the nozzle 16 of the sprayer 14 onto the square. Then, when the spraying from the nozzle 16 is finished and a predetermined time has elapsed, the rotation of the spin head 12 is stopped, and the development cycle is completed.

Such semiconductor manufacturing equipment has the following three drawbacks.

■ When the nozzle finishes spraying, if the liquid does not drain easily, spray the liquid from the nozzle onto the developed Pheno 1.

There is a risk that the resin may drip and deform the Resost pattern.

■ Dust in the air may be adsorbed to the liquid collected at the tip of the nozzle, and this string may be sprayed onto the wafer when the solution is sprayed from the nozzle, resulting in a four-main failure. this is.

This is particularly noticeable when the spray interval becomes long.

(2) In the spray state from the nozzle, the spray intensity within the spray area is not uniform, which causes variations in resist pattern dimensions within the wafer.

[Purpose of the invention]

The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a semiconductor manufacturing apparatus in which there is no fear that even if liquid drips from a nozzle, it will affect the wafer.

Other objects of this invention are 1. It is an object of the present invention to provide a semiconductor manufacturing apparatus that can prevent a degraded solution from adhering to a square during spraying from a nozzle, and can stabilize the spray state.

Still another object of the present invention is to provide a semiconductor manufacturing apparatus that can make the spray intensity uniform over the wafer, thereby reducing variations in resist pattern dimensions within the wafer.

[A essential point of the invention]

This invention applies immediately after the start of spraying of the developing solution from the nozzle and immediately after the end of spraying.

The planar position of the nozzle is located outside the wafer to be developed, and the nozzle is repeatedly moved back and forth across the wafer to be developed while remaining in a spraying state.

[Embodiments of the invention]

FIG. 3 is a partially sectional side view of a two-way developing device according to an embodiment of the present invention, and the same parts as in FIG. 1 are given the same reference numerals.

The atomizer, designated 23.24 in the figure, has a nozzle 25.26 for spraying the solution. Sprayer;!
J, 24 are supplied with first and second developing solutions of different types of organic solvents via solution lines 27 and 28, and are supplied with, for example, Nt(
Nitrogen) gas is supplied. Sprayer 23
24 is attached to one end of the arm 31,32.

The other end of the arm 31.32 is connected to a drive mechanism such as a motor (second
drive mechanism),? J, 34 rotation axis (not shown)
is connected to. However, arm 31 , , V 2
The spin head 1 is driven by the drive mechanism 33 and J4.
The developer sealing plate 9 held by 2 rotates in a horizontal direction to 11. In the initial state, the sprayers 23 and 24 have their planar positions aligned with the area 11 of the object to be developed and the opening edge 18 of the cup 17.
It is located between. The spray timing of the sprayers 23, 24 is controlled by a control mechanism (not shown). This control mechanism includes drive mechanisms 33, 34° and a spin head 1.
It also controls a drive mechanism (not shown) that rotates 2.

Next, the operation of one embodiment of the present invention will be described with reference to the plan view of FIG. 4 and the flowcharts 'ff-' of FIGS. FIG. 4 is a plan view of essential parts of the wafer developing device fi, j shown in FIG. 3, mainly showing the planar positional relationship of the sprayers z J, 24 with respect to the wafer 1 to be developed. Also, the flowchart in FIG. 5 is for control not shown! 3 shows the sequence of development cycles under the control of the flI mechanism. In the initial state, the sprayers 23 and 24 have their planar positions aligned with the wafer 1 to be developed, as shown in FIG.
It is stopped at a predetermined position %A, B between the opening edge 18 of the opening 17 and the opening edge 18 of the opening 17.

At the start of the development cycle, as shown in the flowchart of FIG. 5, the wafer 11 to be developed is first held on the pedestal of the spin head 12 by vacuum suction or the like (step 100). Next, the cup 17 rises in the direction indicated by the arrow in FIG. 3 (step 10). Note that FIG. 3 shows a state in which the cup 17 has already been raised. Next, the spin head 12 starts rotating, and with the atomizer 23 stopped at the position shown by the symbol q-A in FIG. 4, the 1Itt name from the nozzle 26 starts υIJ (step θ2). Spraying from the nozzle 25 is made possible by supplying N2 gas through the pressure line 29, so that the first developing solution supplied through the solution line 27 is sprayed from the nozzle 26. Sprayed.

Next, the drive mechanism 33 is activated, and the spray device 23 moves repeatedly in the direction of arrow C between the position indicated by the symbol A and the position indicated by the symbol A' in FIG. The arm 3211i reciprocates as if swinging (SWING) (step 103). At this time, the sprayer 23 passes through the upper part near the center of the cube 11 to be developed. After the sprayer 23 starts swinging, when it is detected that a preset time has elapsed (step 1θ4, 1os), the sprayer 24 moves to position fiiB (fourth
(See figure) Spraying from the nozzle 26 is started with Ic stopped (step 106). Spraying from the nozzle 26 is made possible by supplying N2 gas through the pressure line 30, which causes the second developing solution supplied through the bath tank 28 to It is sprayed from the nozzle 26.

Next, the swinging motion of the sprayer 23 is stopped.

The drive mechanism 33 stops the sprayer 23 at the original position A. At the same time, the drive mechanism 34 is operated, and the sprayer 24 repeatedly swings in the direction of arrow d between the position indicated by the symbol B and the position indicated by the symbol B' in FIG. 4 while maintaining the spraying state (Stella f107).

Subsequently, the spray from the nozzle 25 is stopped (step 1
08). Then, when it is detected that the preset time has elapsed (step fl J
J).

Subsequently, spraying from the nozzle 26 is stopped (step 1
12). Then, only the rotation of the spin head 12 is continued, and the drying of the wafer 11 is performed. The rotation of the spin head 12 is then stopped (step 113), and then the cup 17 is lowered in the direction indicated by arrow e in FIG. 3 (step 114). Next, the wafer 11 is released from the holding state and taken out from the spin head 12 (step 11
5). - In the above embodiment, the sprayer was explained as having a planar position outside the wafer to be developed 1 in the initial state, but this is not limited to this. It is sufficient that the target position is outside the sea urchin to be developed.

〔Effect of the invention〕

As described in detail above, the present invention can achieve the following effects.

■ Immediately before the nozzle finishes spraying, the sprayer is moved so that at least the nozzle tip is positioned outside the wafer, so even if the developing solution drips from the nozzle at the end of spraying, the solution will not leak. It will not fall on the developed surface. Therefore, the resist pattern is not deformed.

■ When spraying from the nozzle starts, at least the tip of the nozzle is located outside the sea urchin, so if the spray time interval becomes long, dust in the air will adsorb to the solution accumulated at the tip of the nozzle, causing the problem Solution containing dust (altered solution)
Even if it is sprayed, the current target Waeha is
It has no effect. Therefore, pattern defects will not occur.

■ Unstable spray state At least the nozzle tip is located outside the wafer at the start and end of spraying, so there is no risk of the corrosion treatment solution being sprayed onto the wafer in an unstable spray state.

■ Since the solution is sprayed while the sprayer repeatedly moves back and forth across the wafer, the spray intensity on the +7 wafer can be made uniform.

Variations in resist pattern dimensions within the wafer can be reduced.

[Brief explanation of the drawing]

FIG. 1 is a side view showing a part of a conventional wafer developing apparatus in cross section, and FIG. 2 is a diagram showing the planar positional relationship of the nozzle shown in FIG. 1 with respect to the wafer. Mud 3 figure is part of this invention 211! ! Fig. 4 is a side view showing a part of the current Ueno 1 specialized equipment related to B'u from the UT side; FIG. 5 is a flowchart of one cycle of development. DESCRIPTION OF SYMBOLS 11...Wafer to be developed, 12...Feno 1 holding stand (spin head), 73.24...Spray W% device, 25
．． 26... Nozzle, 31, 32... Arm, 33
゜34... Drive mechanism. Applicant's agent Patent attorney Takehiko Suzue Figure 1 Figure 3 Figure 4

Claims (1)

[Scope of Claims] A wafer holding stand that holds a wafer to be developed. a first driving mechanism for rotating the wafer holding table; What kind of nozzle is used to spray the developing processing solution? In the initial state, at least the tip of the nozzle extends in the vertical direction a circular area having approximately the same radius as the above-mentioned square with the rotation center of the above-mentioned wafer holding table as the center of the circle. a sprayer located outside the spatial region formed by the sprayer, an arm that supports the sprayer, a second ffi movement mechanism that rotates the arm, and a spray aiming mechanism that controls the first and second drive mechanisms and controls the sprayer. and a control mechanism that performs control, and after the start of spraying from the nozzle, the control mechanism repeatedly moves back and forth across the sprayer or the sea urchin to be developed held on the 9M holding table for a predetermined period of time. and means for controlling the second drive mechanism so as to stop at the original position after the elapse of time. and means for controlling the sprayer so that the sprayer stops at the original position and then the spraying from the nozzle ends.