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JPS59227133A - Wire bonding device - Google Patents

Wire bonding device

Info

Publication number
JPS59227133A
JPS59227133A JP58101434A JP10143483A JPS59227133A JP S59227133 A JPS59227133 A JP S59227133A JP 58101434 A JP58101434 A JP 58101434A JP 10143483 A JP10143483 A JP 10143483A JP S59227133 A JPS59227133 A JP S59227133A
Authority
JP
Japan
Prior art keywords
bonding
arm
wire
tool
pellet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP58101434A
Other languages
Japanese (ja)
Inventor
Takao Watanabe
隆夫 渡辺
Masayoshi Yamaguchi
政義 山口
Nobushi Suzuki
鈴木　悦四
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP58101434A priority Critical patent/JPS59227133A/en
Publication of JPS59227133A publication Critical patent/JPS59227133A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/786—Means for supplying the connector to be connected in the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/8512—Aligning
    • H01L2224/85148—Aligning involving movement of a part of the bonding apparatus
    • H01L2224/85169—Aligning involving movement of a part of the bonding apparatus being the upper part of the bonding apparatus, i.e. bonding head, e.g. capillary or wedge
    • H01L2224/8518—Translational movements
    • H01L2224/85181—Translational movements connecting first on the semiconductor or solid-state body, i.e. on-chip, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/852—Applying energy for connecting
    • H01L2224/85201—Compression bonding
    • H01L2224/85205—Ultrasonic bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE:To prevent damage to the pellets by providing a damper member which supports a bonding arm from the lower side with contact to damp a vibration thereby forming an uniform contact bonding ball. CONSTITUTION:The damper member 37 is in contact with the lower side of a bonding arm 9 till a bonding tool 10 comes in pressure contact with a pellet 33 and a lead frame 34, after which the member separates from the arm 9. Accordingly, the damage to the pellet 33 due to the tool 10 is prevented. Also, a vibration of the tool 10 is substantially reduced and a stable shape of the ball 36 can be obtained.

Description

【発明の詳細な説明】 〔発明の技術分野〕 この発明は半導体装置の組立工程において用いられるワ
イヤボンディング装置忙関する。DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a wire bonding apparatus used in the assembly process of semiconductor devices.

〔発明の技術的背景とその問題点〕[Technical background of the invention and its problems]

半導体装置の組立工程において用いられる従来のワイヤ
ボンディング装置は第１図に示す特開昭５５−７４１５
２号公報のように構成されている。すなわち、本体ｌに
設けられたワイヤ繰出し部２からワイヤガイド３を介し
て上クランプ４にワイヤ５を導入するようになっている
。A conventional wire bonding device used in the assembly process of semiconductor devices is shown in FIG.
It is structured as in Publication No. 2. That is, the wire 5 is introduced into the upper clamp 4 from the wire feeding part 2 provided on the main body l via the wire guide 3.

上記上クランプ４の下方には揺動アーム６にホルダ７を
介して下クランプ８とボンディングアーム９に支持され
たボンディングツール１０とが設られている。上記揺動
アーム５とボンディングアーム９とは基端部において一
体と々っており、本体ｘＫ設けられた回動軸１１に回動
自在に支持されている。すなわち、本体ＩＫは上記回動
軸１１に回動自在に支持されたスイングアーム１２が設
けられている。このスイングアーム１２の上部には上記
揺動アーム６が一体に設けられるとともに下部にはブラ
ヶッ）ＪＪが板ばね１４を介し、押え板１５．１５によ
り取着されている。上記ブラケット１１には上記ボンデ
ィングアーム９の基端部９ａが固定されている。上記ブ
ラケット５ｇは揺動アーム６に設けられた透孔を貫通し
て上方に延長されその上端にはばね支柱１６が設けられ
ている。また、揺動アーム６の先端側には上記ばね支柱
１６と対向するように調節ねじ１７がブラツケット１８
に螺入されている。上記ばね支柱１６と調節ねじ１７と
の間にはばね１９が取着けられていて、調節ねじ１７１
Ｃ螺合するナツト２０を左右に回転することにより上記
調節ねじ１７が進退し、ばね１９の張力を調節できるよ
うになっている。Below the upper clamp 4, a lower clamp 8 and a bonding tool 10 supported by a bonding arm 9 are provided on a swing arm 6 via a holder 7. The swing arm 5 and the bonding arm 9 are integrally formed at their base end portions, and are rotatably supported by a pivot shaft 11 provided on the main body xK. That is, the main body IK is provided with a swing arm 12 rotatably supported on the rotation shaft 11. The swing arm 6 is integrally provided on the upper part of the swing arm 12, and a bracket (JJ) is attached to the lower part of the swing arm 12 via a leaf spring 14 by a presser plate 15.15. A base end 9a of the bonding arm 9 is fixed to the bracket 11. The bracket 5g passes through a through hole provided in the swing arm 6 and extends upward, and a spring support 16 is provided at the upper end of the bracket 5g. Further, an adjustment screw 17 is attached to a bracket 18 on the tip side of the swing arm 6 so as to face the spring support 16.
is screwed into. A spring 19 is installed between the spring support 16 and the adjusting screw 17, and the adjusting screw 171
By rotating the nut 20 to which C is screwed together left and right, the adjusting screw 17 moves forward and backward, and the tension of the spring 19 can be adjusted.

また、ブラケット１３の上部にはアーマチュア２１がね
じ止めされ、このアーマチュア２・ｌと対向するように
電磁石２２が支持部材２３に支持されて揺動アーム６上
に設けられている。これらアーマチュア２１と電磁石２
２とでダンパソレノイド２４を構成している。他方、ス
イングアーム１２に、はりニアモータコイル２５が取付
けられ、本体ｌに設けられたフレーム２６にはマグネッ
ト２１が固定されている。また、スイングアーム１２の
後端には位置検出器２Ｂがセンサブラケット２９により
上記フレーム２６に固定され、この位置検出器２８は上
記センサブラケット２９とスイングアーム１２の端部の
検出ブラケット３０との間に設けられたばね３１によＩ
】一定圧で上記検出ブラケットｓｏｉ対して接触するよ
う釦なっている。また、揺動アーム６の先端側圧はボン
ディングアーム９と対向して非接触変位形３２が設けら
れている。Further, an armature 21 is screwed to the upper part of the bracket 13, and an electromagnet 22 is supported by a support member 23 and provided on the swing arm 6 so as to face the armature 2.l. These armature 21 and electromagnet 2
2 constitutes a damper solenoid 24. On the other hand, a beam near motor coil 25 is attached to the swing arm 12, and a magnet 21 is fixed to a frame 26 provided on the main body l. Further, at the rear end of the swing arm 12, a position detector 2B is fixed to the frame 26 by a sensor bracket 29, and this position detector 28 is located between the sensor bracket 29 and the detection bracket 30 at the end of the swing arm 12. I by the spring 31 provided in
] The button is designed to come into contact with the detection bracket soi at a constant pressure. Further, a non-contact displacement type 32 is provided for the tip end side pressure of the swing arm 6, facing the bonding arm 9.

上記スイングアーム１２がリニアモータコイル２５およ
びマグネット２７からなるリニアモータに、駆動されて
上下動すること和よってボンディングツール１０が上下
動し、ペレット３３とリードフレーム３４とをトーチ３
５によって形成されたボール３６を介して接続するよう
にｋっている。The swing arm 12 is driven by a linear motor consisting of a linear motor coil 25 and a magnet 27 to move up and down, and as a result, the bonding tool 10 moves up and down, and the pellet 33 and lead frame 34 are attached to the torch 3.
5 to be connected via a ball 36 formed by a ball 36.

上記のように従来のワイヤボンディング装置においては
、ボンディングアーム９を固定するブラケットＩＩＩと
揺動アーム６に設けたダンパソレノイド２４によってボ
ンディング中以外は付勢し係合する方法がとられている
がボンディングツール１０の上下動運時に第２図のＰｌ
。As mentioned above, in the conventional wire bonding apparatus, a method is used in which the bracket III that fixes the bonding arm 9 and the damper solenoid 24 provided on the swing arm 6 are biased and engaged except during bonding. When the tool 10 moves up and down, Pl in Fig. 2
.

ＬＪのように大きく振動する。このようにボンディング
ツールＩＯが振動する状態でペレット３３にボンディン
グするとボール３６は第３図に示すように変形するだけ
でなく、ペレット３３を損傷したり、接合強度も弱くな
るという欠点があった。It vibrates loudly like LJ. If the ball 36 is bonded to the pellet 33 while the bonding tool IO is vibrating in this way, the ball 36 will not only be deformed as shown in FIG. 3, but also have the drawbacks of damaging the pellet 33 and weakening the bonding strength.

〔発明の目的〕[Purpose of the invention]

この発明は上記の事情を考慮して力されたもので、その
目的とするところは、ポンディング時ボンディングツー
ルの振動を減少させることにより均一な圧着ボールを形
成し、ペレットを損傷することを防止するワイヤボンデ
ィング装置を提供するものである。This invention was developed in consideration of the above circumstances, and its purpose is to form a uniform crimped ball by reducing the vibration of the bonding tool during bonding, and to prevent damage to the pellet. The present invention provides a wire bonding device that performs the following steps.

〔発明の概要〕[Summary of the invention]

この発明においては、ボンディングツールを上下方向に
揺動させるボンディングアームの先端部にこれを下方か
ら接触支持する減衰部材を設はボンディングアームの下
降時にボンディングアームの下面を上記減衰部材に接触
支持することによりボンディング時の振動を減少させる
ようＫしたものである。In the present invention, a damping member that contacts and supports the bonding arm from below is provided at the tip of the bonding arm that swings the bonding tool in the vertical direction, and the lower surface of the bonding arm contacts and supports the damping member when the bonding arm is lowered. K is used to reduce vibration during bonding.

〔発明の実施例〕[Embodiments of the invention]

以下、この発明の一実施例を第１図の同一構成部分に同
一符号を付けた第４図〜第６図を参照して説明する。図
中３７はアルミニウムなどからなるＬ字形の減衰部材で
ある。この減衰部材３７はペレット３３およびリードフ
レーム３４にボンディングツールＩＯが圧接するまでボ
ンディングアーム９に接触し、こののち、このポンディ
ソゲアーム９から離れるように々つている。Hereinafter, one embodiment of the present invention will be described with reference to FIGS. 4 to 6, in which the same components in FIG. 1 are given the same reference numerals. In the figure, 37 is an L-shaped damping member made of aluminum or the like. The damping member 37 contacts the bonding arm 9 until the bonding tool IO comes into pressure contact with the pellet 33 and the lead frame 34, and then moves away from the bonding arm 9.

上記のように構成されたワイヤボンディング装置により
ボンディングを行なうと、ボンディングアーム９はスイ
ングアーム１２とともに上下動し、ボンディングツール
ＩＯは第７図に示す曲線Ａのように上下動する。この間
ダンパソレノイド２４はオン、オフを繰返えし、ボンデ
ィングツール１０が下降しペレット３３あるいはリード
フレーム３４と当接し上昇に至るまでオフとなりそれ以
外ではオンとカリボンデイングアームタとスイングアー
ム１２とを係合状態にし、これらは一体となって移動し
周期Ｔの間。When bonding is performed using the wire bonding apparatus configured as described above, the bonding arm 9 moves up and down together with the swing arm 12, and the bonding tool IO moves up and down as shown by the curve A shown in FIG. During this time, the damper solenoid 24 is repeatedly turned on and off, and is turned off until the bonding tool 10 descends and comes into contact with the pellet 33 or lead frame 34 and rises. in the engaged state, and they move together for a period T.

にポンディングが完了する。他方、減衰部材３７はボン
ディングツールＩＯがペレット３３またはリードフレー
ム３４に圧接するまでポンディングアーム９の下面に当
接しそれ以後ポンディングアーム９から離れるのでポン
ディングに際しポンディングツールＩＯがペレット３３
に対して損傷を与えることが防止されるとともにボンデ
ィングツールＩＯの振動は第８図のＰ２．Ｌ２のように
大幅に減少し、ボール３６の形状も第９図に示すように
安定する。Pounding is completed. On the other hand, the damping member 37 contacts the lower surface of the bonding arm 9 until the bonding tool IO comes into pressure contact with the pellet 33 or the lead frame 34, and then separates from the bonding arm 9.
The vibration of the bonding tool IO is prevented from causing damage to the bonding tool IO at P2. in FIG. L2 is significantly reduced, and the shape of the ball 36 is also stabilized as shown in FIG.

ナオ、上記実施例においては、ボンディングアーム９に
超音波ホーンを使用して減衰部材３７を付加したが、こ
れに限定するものではなく熱圧着方式のボンディングア
ームに付加しても同じ効果がある。In the above embodiment, the damping member 37 is added to the bonding arm 9 using an ultrasonic horn, but the damping member 37 is not limited to this, and the same effect can be obtained even if it is added to a thermocompression type bonding arm.

〔発明の効果〕〔Effect of the invention〕

以上、説明したようＫこの発明においては、ボンディン
グアームの光端部をこの下方から接触支持する減衰部材
を設け、ボンディングツールが下降しペレットにポンデ
ィングするとき上記減衰部材がこのボンディングアーム
と接触し振動を減衰させるので、ペレットの損傷を防止
するだけでなくボール形状も安定しワイヤポンディング
の歩留まりを向上し半導体装置の信頼性を向上させると
いう効果がある。As explained above, in this invention, a damping member is provided that contacts and supports the optical end of the bonding arm from below, so that when the bonding tool descends and bonds to the pellet, the damping member contacts this bonding arm. Since the vibration is attenuated, it not only prevents damage to the pellet, but also stabilizes the ball shape, improving the yield of wire bonding and improving the reliability of semiconductor devices.

【図面の簡単な説明】[Brief explanation of drawings]

第１図は従来のワイヤポンディング装置を示す側面図、
第２図はボンディングツールの振動状態を示すグラフ図
、第３図はペレットにボールを介してワイヤを接続した
状態を示す斜視図、第４図はこの発明の一実旅例を示す
側面図、第５図は同じくこの要部を示す正面図、第６図
は第５図に対する側面図、第７図および第８図はこの発
明の詳細な説明するグラフ図、第９図は同じくボールの
形状を示す斜視図である。 ２・・・ワイヤ繰出し装置、３・・・ワイヤガイド、４
．８・・・クランプ装置、５・・・ワイヤ、９・・・ボ
ンディングアーム、１０・・・ボンディングツール、＼ ３７・・・減衰部材。Fig. 1 is a side view showing a conventional wire bonding device;
FIG. 2 is a graph showing the vibration state of the bonding tool, FIG. 3 is a perspective view showing a state in which a wire is connected to a pellet via a ball, and FIG. 4 is a side view showing an example of the present invention. FIG. 5 is a front view showing the main parts, FIG. 6 is a side view of FIG. 5, FIGS. 7 and 8 are graphs explaining the invention in detail, and FIG. 9 is the shape of the ball. FIG. 2... Wire feeding device, 3... Wire guide, 4
．． 8... Clamp device, 5... Wire, 9... Bonding arm, 10... Bonding tool, \37... Damping member.

Claims (1)

【特許請求の範囲】[Claims] ワイヤ繰出し部から導出されたワイヤをワイヤガイドを
介してクランプ装置ｉ！に導入し、このタラップ装置か
ら導出されたワイヤをボンディングツールへ導入するよ
うにしたワイヤボンディング装置において、上記ボンデ
ィングツールを上下方向に揺動させるボンディングアー
ムの先端部をその下方から接触支持して振動を減衰する
減衰部材を設けたことを特徴とするワイヤボンディング
装置。The wire led out from the wire feeding section is passed through the wire guide to the clamp device i! In this wire bonding device, the wire led out from the ramp device is introduced into the bonding tool, and the tip of the bonding arm that swings the bonding tool in the vertical direction is supported in contact with it from below to generate vibration. A wire bonding device characterized in that it is provided with a damping member that damps the.
JP58101434A 1983-06-07 1983-06-07 Wire bonding device Pending JPS59227133A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58101434A JPS59227133A (en) 1983-06-07 1983-06-07 Wire bonding device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58101434A JPS59227133A (en) 1983-06-07 1983-06-07 Wire bonding device

Publications (1)

Publication Number Publication Date
JPS59227133A true JPS59227133A (en) 1984-12-20

Family

ID=14300585

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58101434A Pending JPS59227133A (en) 1983-06-07 1983-06-07 Wire bonding device

Country Status (1)

Country Link
JP (1) JPS59227133A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7353976B2 (en) 2004-09-30 2008-04-08 Unaxis International Trading Ltd. Wire bonder

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7353976B2 (en) 2004-09-30 2008-04-08 Unaxis International Trading Ltd. Wire bonder

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