JPS5085541A - - Google Patents
Info
- Publication number
- JPS5085541A JPS5085541A JP13536873A JP13536873A JPS5085541A JP S5085541 A JPS5085541 A JP S5085541A JP 13536873 A JP13536873 A JP 13536873A JP 13536873 A JP13536873 A JP 13536873A JP S5085541 A JPS5085541 A JP S5085541A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13536873A JPS5085541A (en) | 1973-12-05 | 1973-12-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13536873A JPS5085541A (en) | 1973-12-05 | 1973-12-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5085541A true JPS5085541A (en) | 1975-07-10 |
Family
ID=15150081
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13536873A Pending JPS5085541A (en) | 1973-12-05 | 1973-12-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5085541A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6824039B2 (en) * | 2002-03-26 | 2004-11-30 | Institute Of High Performance Computing | Lead free tin based solder composition |
| JP2006255784A (en) * | 2004-11-24 | 2006-09-28 | Nittetsu Micro Metal:Kk | Unleaded solder alloy |
| WO2013038621A1 (en) * | 2011-09-12 | 2013-03-21 | パナソニック株式会社 | Electrical connection structure, electrical equipment provided therewith, and method of manufacturing electrical connection structure |
-
1973
- 1973-12-05 JP JP13536873A patent/JPS5085541A/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6824039B2 (en) * | 2002-03-26 | 2004-11-30 | Institute Of High Performance Computing | Lead free tin based solder composition |
| JP2006255784A (en) * | 2004-11-24 | 2006-09-28 | Nittetsu Micro Metal:Kk | Unleaded solder alloy |
| WO2013038621A1 (en) * | 2011-09-12 | 2013-03-21 | パナソニック株式会社 | Electrical connection structure, electrical equipment provided therewith, and method of manufacturing electrical connection structure |