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JPS51137378A - Semi conductor wafer - Google Patents

Semi conductor wafer

Info

Publication number
JPS51137378A
JPS51137378A JP6166275A JP6166275A JPS51137378A JP S51137378 A JPS51137378 A JP S51137378A JP 6166275 A JP6166275 A JP 6166275A JP 6166275 A JP6166275 A JP 6166275A JP S51137378 A JPS51137378 A JP S51137378A
Authority
JP
Japan
Prior art keywords
semi conductor
conductor wafer
aprt
electrical connection
contact
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6166275A
Other languages
Japanese (ja)
Inventor
Yoshifumi Takeuchi
Katsuki Iwasaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP6166275A priority Critical patent/JPS51137378A/en
Publication of JPS51137378A publication Critical patent/JPS51137378A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4899—Auxiliary members for wire connectors, e.g. flow-barriers, reinforcing structures, spacers, alignment aids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015—Shape
    • H01L2924/10155—Shape being other than a cuboid
    • H01L2924/10157—Shape being other than a cuboid at the active surface

Landscapes

  • Dicing (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

PURPOSE: To improve manufacturing yield rate by avoiding inferior goods in the case of the work miss that a aprt of the fine wire used for electrical connection is in contact with the surface of semi conductor chip.
COPYRIGHT: (C)1976,JPO&Japio
JP6166275A 1975-05-22 1975-05-22 Semi conductor wafer Pending JPS51137378A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6166275A JPS51137378A (en) 1975-05-22 1975-05-22 Semi conductor wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6166275A JPS51137378A (en) 1975-05-22 1975-05-22 Semi conductor wafer

Publications (1)

Publication Number Publication Date
JPS51137378A true JPS51137378A (en) 1976-11-27

Family

ID=13177648

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6166275A Pending JPS51137378A (en) 1975-05-22 1975-05-22 Semi conductor wafer

Country Status (1)

Country Link
JP (1) JPS51137378A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6281591B1 (en) 1999-03-11 2001-08-28 Oki Electric Industry Co., Ltd. Semiconductor apparatus and semiconductor apparatus manufacturing method
US6344696B2 (en) 1997-10-03 2002-02-05 Nec Corporation Chip size package semiconductor device and method of forming the same

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49105466A (en) * 1973-02-07 1974-10-05

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49105466A (en) * 1973-02-07 1974-10-05

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6344696B2 (en) 1997-10-03 2002-02-05 Nec Corporation Chip size package semiconductor device and method of forming the same
US6555416B2 (en) 1997-10-03 2003-04-29 Nec Corporation Chip size package semiconductor device and method of forming the same
US6281591B1 (en) 1999-03-11 2001-08-28 Oki Electric Industry Co., Ltd. Semiconductor apparatus and semiconductor apparatus manufacturing method
US6770543B2 (en) 1999-03-11 2004-08-03 Oki Electric Industry Co., Ltd. Semiconductor apparatus and semiconductor apparatus manufacturing method

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