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JPS5356983A - Multilayer wiring substrate - Google Patents

Multilayer wiring substrate

Info

Publication number
JPS5356983A
JPS5356983A JP13212176A JP13212176A JPS5356983A JP S5356983 A JPS5356983 A JP S5356983A JP 13212176 A JP13212176 A JP 13212176A JP 13212176 A JP13212176 A JP 13212176A JP S5356983 A JPS5356983 A JP S5356983A
Authority
JP
Japan
Prior art keywords
sheet
wiring substrate
multilayer wiring
bonding
wirings
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13212176A
Other languages
Japanese (ja)
Inventor
Takashi Nukui
Shigeo Nakatake
Masaru Iwasaki
Katsuteru Awane
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Priority to JP13212176A priority Critical patent/JPS5356983A/en
Publication of JPS5356983A publication Critical patent/JPS5356983A/en
Priority to US06/379,722 priority patent/US4420364A/en
Pending legal-status Critical Current

Links

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)

Abstract

PURPOSE:To obtain fine wirings by forming lower wirings to a bonding sheet in a semi-hardened state, placing a bondable organic insulator layer over this, heating under pressure and bonding the sheet, thereafter hardening the sheet.
JP13212176A 1976-11-02 1976-11-02 Multilayer wiring substrate Pending JPS5356983A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP13212176A JPS5356983A (en) 1976-11-02 1976-11-02 Multilayer wiring substrate
US06/379,722 US4420364A (en) 1976-11-02 1982-05-19 High-insulation multi-layer device formed on a metal substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13212176A JPS5356983A (en) 1976-11-02 1976-11-02 Multilayer wiring substrate

Publications (1)

Publication Number Publication Date
JPS5356983A true JPS5356983A (en) 1978-05-23

Family

ID=15073891

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13212176A Pending JPS5356983A (en) 1976-11-02 1976-11-02 Multilayer wiring substrate

Country Status (1)

Country Link
JP (1) JPS5356983A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61188996A (en) * 1985-02-18 1986-08-22 オ−ケ−プリント配線株式会社 Printed wiring board
JPS62239597A (en) * 1986-04-11 1987-10-20 オ−ケ−プリント配線株式会社 Electronic parts attaching plate

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4867764A (en) * 1971-12-21 1973-09-17

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4867764A (en) * 1971-12-21 1973-09-17

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61188996A (en) * 1985-02-18 1986-08-22 オ−ケ−プリント配線株式会社 Printed wiring board
JPS62239597A (en) * 1986-04-11 1987-10-20 オ−ケ−プリント配線株式会社 Electronic parts attaching plate

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