JPS6416610A - Cleaving device - Google Patents
Cleaving deviceInfo
- Publication number
- JPS6416610A JPS6416610A JP17251087A JP17251087A JPS6416610A JP S6416610 A JPS6416610 A JP S6416610A JP 17251087 A JP17251087 A JP 17251087A JP 17251087 A JP17251087 A JP 17251087A JP S6416610 A JPS6416610 A JP S6416610A
- Authority
- JP
- Japan
- Prior art keywords
- divided
- tables
- operated
- cleavage
- wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
PURPOSE:To prevent the defect or contamination on the surface of crystal after its cleavage by a method in which the working table almost corresponding to the shape of the object to be cleft is provided with suction holes, and is divided along the desired cutting lines by providing the difference in level, and then the divided tables are independently operated by vacuum. CONSTITUTION:A working table 5 is a circular table with the size corresponding to a wafer, and is divided into five parts. Each divided table 5a-5e is capable of rising and lowering independently and is provided with a number of suction holes 15. When the wafer which has been preliminarily registered is transferred onto the table, first the vacuum of the divided tables 5a-5c are operated and the divided tables 5a ands 5e are lowered, and then the vacuum of the tables 5d and 5e are operated. Then, bending impact is applied to the wafer, whereby its cleavage is advanced along the difference in level of the table, and both ends thereof are cut. Next, the divided tables 5b, 5c are operated similarly, and by the bending in the direction crossing at right angle to above mentioned direction, the cleavage is advanced along the difference in level, whereby a rectangular crystalline base plate remains one the table 5a.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17251087A JPS6416610A (en) | 1987-07-10 | 1987-07-10 | Cleaving device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17251087A JPS6416610A (en) | 1987-07-10 | 1987-07-10 | Cleaving device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6416610A true JPS6416610A (en) | 1989-01-20 |
Family
ID=15943298
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17251087A Pending JPS6416610A (en) | 1987-07-10 | 1987-07-10 | Cleaving device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6416610A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5829658A (en) * | 1995-05-22 | 1998-11-03 | Alcatel N.V. | Method and device for carrying out the cleavage in ultra-high vacuum environment of portions of a processed semiconductor wafer |
| JP2008159959A (en) * | 2006-12-26 | 2008-07-10 | Sanyo Electric Co Ltd | Semiconductor substrate cleaving method and cleaving apparatus, solar cell cleaving method and solar cell module manufacturing method |
| JP2009166143A (en) * | 2008-01-11 | 2009-07-30 | Disco Abrasive Syst Ltd | Cutting equipment |
| JP2015191993A (en) * | 2014-03-28 | 2015-11-02 | 株式会社東京精密 | Semiconductor manufacturing device and semiconductor manufacturing method |
-
1987
- 1987-07-10 JP JP17251087A patent/JPS6416610A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5829658A (en) * | 1995-05-22 | 1998-11-03 | Alcatel N.V. | Method and device for carrying out the cleavage in ultra-high vacuum environment of portions of a processed semiconductor wafer |
| JP2008159959A (en) * | 2006-12-26 | 2008-07-10 | Sanyo Electric Co Ltd | Semiconductor substrate cleaving method and cleaving apparatus, solar cell cleaving method and solar cell module manufacturing method |
| JP2009166143A (en) * | 2008-01-11 | 2009-07-30 | Disco Abrasive Syst Ltd | Cutting equipment |
| JP2015191993A (en) * | 2014-03-28 | 2015-11-02 | 株式会社東京精密 | Semiconductor manufacturing device and semiconductor manufacturing method |
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