JPS6115315A - Method of producing laminated ceramic capacitor - Google Patents
Method of producing laminated ceramic capacitorInfo
- Publication number
- JPS6115315A JPS6115315A JP13675484A JP13675484A JPS6115315A JP S6115315 A JPS6115315 A JP S6115315A JP 13675484 A JP13675484 A JP 13675484A JP 13675484 A JP13675484 A JP 13675484A JP S6115315 A JPS6115315 A JP S6115315A
- Authority
- JP
- Japan
- Prior art keywords
- forming
- internal electrodes
- green sheet
- ceramic capacitor
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003985 ceramic capacitor Substances 0.000 title claims description 28
- 238000000034 method Methods 0.000 title claims description 8
- 239000003990 capacitor Substances 0.000 claims description 21
- 238000005520 cutting process Methods 0.000 claims description 16
- 239000000919 ceramic Substances 0.000 claims description 15
- 238000004519 manufacturing process Methods 0.000 claims description 13
- 239000011241 protective layer Substances 0.000 claims description 10
- 239000000843 powder Substances 0.000 claims description 6
- 239000002002 slurry Substances 0.000 claims description 6
- 239000011230 binding agent Substances 0.000 claims description 4
- 238000010030 laminating Methods 0.000 claims description 4
- 239000003960 organic solvent Substances 0.000 claims description 4
- 239000004014 plasticizer Substances 0.000 claims description 4
- 238000010304 firing Methods 0.000 claims description 3
- 230000001681 protective effect Effects 0.000 claims description 3
- 238000004898 kneading Methods 0.000 claims description 2
- 238000001035 drying Methods 0.000 claims 1
- 238000003475 lamination Methods 0.000 description 3
- 239000010410 layer Substances 0.000 description 3
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 2
- MQIUGAXCHLFZKX-UHFFFAOYSA-N Di-n-octyl phthalate Natural products CCCCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCCC MQIUGAXCHLFZKX-UHFFFAOYSA-N 0.000 description 2
- BJQHLKABXJIVAM-UHFFFAOYSA-N bis(2-ethylhexyl) phthalate Chemical compound CCCCC(CC)COC(=O)C1=CC=CC=C1C(=O)OCC(CC)CCCC BJQHLKABXJIVAM-UHFFFAOYSA-N 0.000 description 2
- 238000007606 doctor blade method Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 102220513348 NADH-ubiquinone oxidoreductase chain 2_Q70T_mutation Human genes 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 229910052788 barium Inorganic materials 0.000 description 1
- DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium atom Chemical compound [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 description 1
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 1
- 229910002113 barium titanate Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000002003 electrode paste Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
Landscapes
- Ceramic Capacitors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
(技術分野)
本発明は積層セラミックコンデンサの製造方法に関し、
特にセラミックグリーンシートに内部電極を形成し、積
層一体化し、切断し、セラミックコンデンサを製造する
方法の保護セラミック層の形成方法の改良に関する。[Detailed Description of the Invention] (Technical Field) The present invention relates to a method for manufacturing a multilayer ceramic capacitor,
In particular, the present invention relates to an improvement in a method for forming a protective ceramic layer in a method of manufacturing a ceramic capacitor by forming internal electrodes on ceramic green sheets, laminating them into one piece, and cutting them.
(従来技術)
一般に積層セラミックコンチンサラ製造するには、チタ
ン酸バリウム系等のセラミ、り粉末にメチルセロソルブ
等の有機溶剤、フタル酸ジオクチル等の可塑剤、ポリビ
ニルブチラール等ツバインダーを入れて混練し、泥しよ
う化した後、ドクターブレード法等金用いて長尺のセラ
ミ、フグリーンシート(以後グリーンシートと略称)を
製造する。つぎにグリーンシートヲ所望の大きさに切取
シ、グリーンシート膜1を得る(第1図(a))。次に
このグリーン7−ト膜1上の所望の位置にスクリーン印
刷法等で内部電極2を被着形成して、内部電極印刷膜3
を得る(第2図(b))。しかる後、この内部電極印刷
膜3を交互に180度回転させて積層し、その上下に保
護層としてグリーンシート膜1を数枚ずつ積層し、加圧
一体化して積属体4を得る(第1図(C))。次にこの
積層体4を所定の寸法に切断分離し、積層セラミックコ
ンデンサ生チップ5を得る(第1図(d)、 (e))
。次にセラミ、り粉末の焼成に適した温度で上述の積層
セラミックコンデンサ生チップ5全焼成し、外部電極7
を形成して積層セラミックコンデンサ8を製造している
(第1図げ))。しかし、このような従来のs層セラミ
ックコンデンサの製造方法は次のような欠点を有してい
た。(Prior art) Generally, in order to manufacture a multilayer ceramic ceramic, an organic solvent such as methyl cellosolve, a plasticizer such as dioctyl phthalate, and a binder such as polyvinyl butyral are added to ceramic powder such as barium titanate and kneaded. After turning into slurry, a long ceramic green sheet (hereinafter abbreviated as green sheet) is manufactured using a doctor blade method or the like. Next, the green sheet is cut to a desired size to obtain a green sheet film 1 (FIG. 1(a)). Next, internal electrodes 2 are formed at desired positions on this green 7-t film 1 by screen printing or the like, and internal electrode printed films 3 are formed.
(Figure 2(b)). Thereafter, the internal electrode printed films 3 are alternately rotated 180 degrees and stacked, and several green sheet films 1 are stacked on top and bottom of the film as protective layers, and the stacked body 4 is obtained by pressurizing and integrating them. Figure 1 (C)). Next, this laminate 4 is cut and separated into predetermined dimensions to obtain a raw multilayer ceramic capacitor chip 5 (FIGS. 1(d) and 1(e)).
. Next, the above-mentioned multilayer ceramic capacitor green chip 5 is completely fired at a temperature suitable for firing the ceramic powder, and the external electrode 7 is heated.
(Fig. 1)). However, such a conventional method for manufacturing an S-layer ceramic capacitor has the following drawbacks.
(イ) 積層体から個々の積層セラミックコンデンサに
切断する際のマージン寸法の位置出しが困難である。(a) It is difficult to determine the margin dimensions when cutting the laminated body into individual laminated ceramic capacitors.
(ロ)前述の切断位置のバラツキがあるため第1図fb
)で示した切断余裕幅eおよびmi所定の畏さに設ける
必要がある。(b) Due to the above-mentioned variation in cutting position, Fig. 1 fb
) It is necessary to provide the cutting margin e and mi with a predetermined width.
(ハ)切断後の積層セラミックコンテンサの内部電極の
ズレ状態の確認手段として第1図tb)の切断余裕幅m
fチェックするためには、第1図fd)で示したA−A
’・線で切断し、第1図(e)の如く内部電極2の重な
シ面を露出させ、マージン幅を測定しなければならない
。(c) As a means of checking the misalignment state of the internal electrodes of the laminated ceramic capacitor after cutting, the cutting margin width m shown in Figure 1 tb)
To check f, A-A shown in Fig. 1fd)
The margin width must be measured by cutting along the line ``* to expose the overlapping surface of the internal electrode 2 as shown in FIG. 1(e).
に)積層セラミ、クコンデンサの側面の保護層(第1図
(d)の−lの部分)の長さが切断精度のバラツキを考
慮すると最小200μm以上必要である。(ii) The length of the protective layer on the side surface of the multilayer ceramic capacitor (the part -l in FIG. 1(d)) must be at least 200 μm or more, taking into account variations in cutting accuracy.
(発明の目的)
本発明の目的は、かかる従来欠点を解決した積層セラミ
、クコンデンサの製造方法を提供することにある。(Objective of the Invention) An object of the present invention is to provide a method for manufacturing a laminated ceramic capacitor, which solves the conventional drawbacks.
(発明の構成)
本発明によればセラミ、り粉末に有機溶剤、可塑剤、バ
インダーを混線し、泥・しよう化する工程と、この泥し
ようを′成膜した後、乾燥させてグリーンシートi形成
する工程と、このグリーンシートの所望の位置に4電ペ
ーストヲ印刷し、内部電極形成のグリーンシートを所望
する静電容量に応じて必要枚数を交互に積層し、さらに
その上下にグリーンシートのみの保護膜を保護層として
数枚ずつ積層・加圧してコンデンサ集合体を形成する工
程と、このコンデンサ集合体を切断して内部電極が両側
面に露出した第1の板状コンデンサ集合体を形成する工
程と、上記第1の板状コンデンサ集合体の内部電極の露
出面にグリーンシートのみの保護層を積層・加圧して内
部電極を埜覆した第2の板状コンデンサ集合体を形成す
る工程と、第2の板状コンデンサ集合体を個片状のコン
デンサに切断分離して内部電極の端面を露出させる工程
と、上記個片状のコンデンサを焼成した後、P3部電極
の端面に外部電極を被着形成する工程とからなる積層セ
ラミ、クコンデンサの製造方法が得られ仝・
(実施例)
以下1本発明の一実施例について第2図(al〜(g)
を参照して説明する。(Structure of the Invention) According to the present invention, the process of mixing ceramic, glue powder with an organic solvent, plasticizer, and binder to form a slurry and sulfur, and after forming this slurry into a film, it is dried to form a green sheet. 4-electrode paste is printed on the desired position of this green sheet, the required number of green sheets for forming internal electrodes are stacked alternately according to the desired capacitance, and then only green sheets are placed above and below the green sheets. A process of laminating and pressurizing several layers using a protective film to form a capacitor assembly, and cutting this capacitor assembly to form a first plate-shaped capacitor assembly with internal electrodes exposed on both sides. and a step of laminating and pressurizing a protective layer consisting of only a green sheet on the exposed surface of the internal electrodes of the first plate-shaped capacitor assembly to form a second plate-shaped capacitor assembly with the internal electrodes covered. , cutting and separating the second plate-shaped capacitor assembly into individual capacitor pieces to expose the end faces of the internal electrodes; and after firing the individual capacitor pieces, external electrodes are attached to the end faces of the P3 part electrodes. A method for producing a laminated ceramic capacitor, which comprises a step of adhering and forming, is obtained.
Explain with reference to.
チタンはバリウム系等のセラミック粉末にメチルセロソ
ルブ等の有機溶剤、フタル酸ジオクチル等の可塑剤、ポ
リビニルブチラール等のバインダーを入れて混練し泥し
よう化した後、ドクターブレード法等により長尺のグリ
ーンシート全製造し所望の大きさに切取ったグリーンシ
ートIdlK−得る(第2図)。Titanium is made by adding an organic solvent such as methyl cellosolve, a plasticizer such as dioctyl phthalate, and a binder such as polyvinyl butyral to a barium-based ceramic powder, kneading it into slurry, and then forming it into a long green sheet using a doctor blade method etc. A green sheet IdlK is obtained which is completely manufactured and cut to the desired size (FIG. 2).
次にグリーンシートpAl上の所望の位置にスクリーン
印刷法等で内部電極2を短冊状に被着形成し、内部電極
印刷膜(以後、印刷膜と略称)、13を得る(第2図(
b))。次にこの印刷膜13を所望す不静電容量が得ら
れるように必要枚数を交互に180°同転させて積層し
、さらにその上下に保護層として前述のグリーンシート
膜1を数枚ずつ積/liして熱プレスなどで加圧一体化
し積層体14を得る(第2図(C))。次にこの積層体
14をB−B’ 、C−C’線に沿って切断し、内部電
極2が両側面に露出した第1の板状の積層セラミックコ
ンデンサ集合体(以後、コンデンサ集合体と略称)9′
t−得る(第2図(d))。次にこのコンデンサ集合体
9の内部電極2の露出した両側面に第2図fe)に示す
如く保護層として数枚のグリーンシート膜1を積層した
後これを金型6.6’ 、6”内に入れ加圧一体化して
内部電極2の露出しない第2の板状のコンデンサ集合体
9A、f得る(第2図(e))。Next, internal electrodes 2 are formed in strips at desired positions on the green sheet pAl by screen printing or the like to obtain an internal electrode printed film (hereinafter abbreviated as printed film) 13 (see Fig. 2).
b)). Next, the required number of printed films 13 are stacked alternately by rotating 180° so as to obtain the desired capacitance, and several green sheet films 1 described above are stacked on top and bottom of the printed films 13 as protective layers. /li and pressurized and integrated using a hot press or the like to obtain a laminate 14 (FIG. 2(C)). Next, this laminate 14 is cut along lines B-B' and C-C' to obtain a first plate-shaped multilayer ceramic capacitor assembly (hereinafter referred to as a capacitor assembly) in which the internal electrodes 2 are exposed on both sides. Abbreviation) 9'
t-obtained (Fig. 2(d)). Next, several green sheet films 1 are laminated as a protective layer on both exposed sides of the internal electrodes 2 of the capacitor assembly 9 as shown in FIG. A second plate-shaped capacitor assembly 9A, f in which the internal electrodes 2 are not exposed is obtained by putting the capacitors into a single plate and integrating them under pressure (FIG. 2(e)).
次にこのコンデンサ集合体9A=に所定の寸法に切断し
て両端部に内部電極2を露出させた積層セラミックコン
デンサ生チップ15を得る(第2図(f))。Next, this capacitor assembly 9A= is cut into a predetermined size to obtain a raw multilayer ceramic capacitor chip 15 with internal electrodes 2 exposed at both ends (FIG. 2(f)).
次にこの積層セラミックコンデンサ生チップ15を焼成
し、外部電極7を前述の内部電極2露出の両端部に被着
形成して積層セラミ、クコンデンサ18を製造する(第
2図1g))。Next, this laminated ceramic capacitor green chip 15 is fired, and external electrodes 7 are formed on both exposed ends of the internal electrodes 2 to produce a laminated ceramic capacitor 18 (FIG. 2, 1g)).
(発明の効果) 以上1本発明の製造方法により、次の効果がある。(Effect of the invention) The manufacturing method of the present invention has the following effects.
(1)積層セラミックコンデンサの側面の保護層を後で
形成するので、積層セラミックコンデンサの側面まで、
内部電極を設けられる。従って。(1) Since the protective layer on the side surface of the multilayer ceramic capacitor is formed later, the side surface of the multilayer ceramic capacitor is
An internal electrode is provided. Therefore.
従来の製造方法における第1図(b)の切断余裕幅lを
設ける必要が無い。There is no need to provide the cutting margin l shown in FIG. 1(b) in the conventional manufacturing method.
(11)積層セラミ、クコンテンサの側面寸で、内部電
極が露出しているので、積層ズレの状態が容易に確認で
きる。(11) Since the internal electrodes are exposed in the side dimensions of the laminated ceramic and capacitor, the state of lamination misalignment can be easily confirmed.
fiii) 幅方向の積層ズレ(第2図げl +、y
寸法)が発生しないため静電容量精度を向上することが
できる。fiii) Lamination misalignment in the width direction (Fig. 2 +, y
Since the capacitance accuracy does not occur, the capacitance accuracy can be improved.
qVl 従来の製造方法は切断時の精度の点から、積
層セラミックコンデンサの側面の保護層全せまくするこ
とは困難であったが1本製造方法ではセラミック粉末の
耐圧および製品の定格電圧1問題の無い範囲まで狭くす
ることができる。qVl With the conventional manufacturing method, it was difficult to make the protective layer on the side of the multilayer ceramic capacitor as narrow as possible due to cutting precision, but with the one-piece manufacturing method, there was no problem with the withstand voltage of the ceramic powder and the rated voltage of the product. The range can be narrowed down.
閏 従って同一形状での積層セラミックコンデンサで従
来製造方法に較べて内部電極面積を広く取ることができ
るので静電容量範囲を拡大できる。Therefore, in a multilayer ceramic capacitor having the same shape, the internal electrode area can be increased compared to the conventional manufacturing method, and the capacitance range can be expanded.
第1図(a)はセラミックグリーンシートの上面図。
第1図jb)は内部電極印刷膜の上面図、第1図fc)
は印刷膜およびグリーンシート膜を積層し、加圧一体化
した積層体の上面図、第1図(d)は積層セラミックコ
ンデンサ生チップの斜視図、第1図felは第1図(d
)のA −A’線での断面図、第1図+f)は(外部電
極形成後の)積層セラミ、クコンデンサの斜視図、第2
図(a)はセラミックグリーンシートの上面図、第2図
fblは本発明製造方法の内部電極印刷膜の上面図、第
2図(C)は印刷膜を必要枚数交互に積層し、その上下
に(保護層としての)グリーン7−Ii積層して加圧一
体化した積層体の上面図。
第2図fdlは第2図(C)の積層体を1=l−B’
、C−C’線で切断して得られる第1の板状の積層セラ
ミックコンデンサ集合体の斜視図、第2図(e)は第1
の板状の積層セラミックコンデンサ集合体の内部電極露
出面にグリーンシート全積層し、加圧一体化する金型の
断面図、第2図(f)は本発明の製造方法により製造し
た積層セラミ、クコンデンサ生チップの斜視図、第2図
(g)は外部電極形成後の積層セラミ、クコンデンサの
斜視図。
図中の符号
1・・・・・グリーンシート膜、2・・・・・・内部電
極、3゜13・・・−・内部電極印刷膜、4.14・・
・・・積層体、5.15・・・・積層セラミックコンデ
ンサ生チップ。
6.6’ 、6“・・・・金型、7・・・・外部電極、
8゜18・・・・積層セラミックコンデンサ、9・・・
(第1の)板状の積層セラミックコンデンサ集合体、1
、 m、 −j!’ 、−m・・ 切断余裕幅、W
内部′電極の積層ズレ。
4 ′
1″t!A +“−I F: IN”、 ′、、
。
(θ) (b) (
C)(f) fし
/Q七〇A
(e)FIG. 1(a) is a top view of the ceramic green sheet. Figure 1 jb) is a top view of the internal electrode printed film, Figure 1 fc)
is a top view of a laminate in which a printed film and a green sheet film are laminated and integrated under pressure, FIG. 1(d) is a perspective view of a raw multilayer ceramic capacitor chip, and FIG.
) is a cross-sectional view taken along the line A-A', Figure 1+f) is a perspective view of the laminated ceramic capacitor (after external electrode formation), and Figure 2
Figure (a) is a top view of a ceramic green sheet, Figure 2 fbl is a top view of an internal electrode printed film according to the manufacturing method of the present invention, and Figure 2 (C) is a top view of a ceramic green sheet in which the required number of printed films are alternately laminated and placed above and below. FIG. 3 is a top view of a laminate in which Green 7-Ii (as a protective layer) is laminated and integrated under pressure. Fig. 2 fdl is the laminated body of Fig. 2 (C) as 1=l-B'
FIG. 2(e) is a perspective view of the first plate-shaped multilayer ceramic capacitor assembly obtained by cutting along line C-C'.
FIG. 2(f) is a cross-sectional view of a mold in which green sheets are fully laminated on the internal electrode exposed surface of a plate-shaped multilayer ceramic capacitor assembly and integrated under pressure. FIG. 2(g) is a perspective view of a laminated ceramic capacitor after forming external electrodes. Reference numeral 1 in the figure: Green sheet film, 2: Internal electrode, 3゜13: - Internal electrode printed film, 4.14...
...Laminated body, 5.15...Multilayer ceramic capacitor raw chip. 6.6', 6"...Mold, 7...External electrode,
8゜18... Multilayer ceramic capacitor, 9...
(First) plate-shaped multilayer ceramic capacitor assembly, 1
, m, −j! ' , -m... Cutting margin width, W
Lamination misalignment of internal electrode. 4 ′ 1″t!A + “-IF: IN”, ′,,
. (θ) (b) (
C) (f) fshi /Q70A (e)
Claims (1)
デンサの製造方法。 (イ)セラミック粉末に有機溶剤、可塑剤、バインダー
を混練し、泥しょう化する工程、 (ロ)前記泥しょうを成膜した後、乾燥させてグリーン
シートを形成する工程、 (ハ)前記グリーンシートの所望の位置に、導電ペース
ト印刷し、内部電極形成のグリーンシートを所望する静
電容量に応じて必要枚数を交互に積層し、さらにその上
下にグリーンシートのみの保護膜を保護層として数枚ず
つ積層・加圧して、コンデンサ集合体を形成する工程、 (ニ)前記コンデンサ集合体を切断して内部電極が両側
面に露出した第1の板状コンデンサ集合体を形成する工
程、 (ホ)前記第1の板状コンデンサ集合体の内部電極の露
出面にグリーンシートのみの保護層を積層・加圧して内
部電極を被覆した第2の板状コンデンサ集合体を形成す
る工程、 (ヘ)前記第2の板状コンデンサ集合体を個片状のコン
デンサに切断分離して内部電極の端面を露出させる工程
、 (ト)前記個片状のコンデンサを焼成した後、内部電極
の端面に外部電極を被着形成する工程。[Claims] A method for manufacturing a multilayer ceramic capacitor, characterized by comprising the following steps. (B) A step of kneading an organic solvent, a plasticizer, and a binder to ceramic powder to form a slurry; (B) A step of forming a film of the slurry and then drying it to form a green sheet; (C) A step of forming the green sheet. A conductive paste is printed on the desired position of the sheet, and the required number of green sheets for forming internal electrodes are laminated alternately according to the desired capacitance, and then a number of protective films made of green sheets are added above and below as a protective layer. (d) cutting the capacitor assembly to form a first plate-shaped capacitor assembly with internal electrodes exposed on both sides; ) a step of laminating and pressurizing a protective layer of only a green sheet on the exposed surface of the internal electrode of the first plate-shaped capacitor assembly to form a second plate-shaped capacitor assembly covering the internal electrode; cutting and separating the second plate-shaped capacitor assembly into individual capacitor pieces to expose the end faces of internal electrodes; (g) after firing the individual capacitor pieces, forming external electrodes on the end faces of the internal electrodes; The process of adhering and forming.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13675484A JPS6115315A (en) | 1984-07-02 | 1984-07-02 | Method of producing laminated ceramic capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13675484A JPS6115315A (en) | 1984-07-02 | 1984-07-02 | Method of producing laminated ceramic capacitor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6115315A true JPS6115315A (en) | 1986-01-23 |
Family
ID=15182715
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13675484A Pending JPS6115315A (en) | 1984-07-02 | 1984-07-02 | Method of producing laminated ceramic capacitor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6115315A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63119182A (en) * | 1986-10-01 | 1988-05-23 | コ−ア株式会社 | Manufacture of crossed conductor |
| JPH03108306A (en) * | 1989-09-21 | 1991-05-08 | Murata Mfg Co Ltd | Manufacture of multilayer capacitor |
| JP2013219153A (en) * | 2012-04-06 | 2013-10-24 | Murata Mfg Co Ltd | Method for manufacturing electronic component |
| US8773839B2 (en) | 2009-12-11 | 2014-07-08 | Murata Manufacturing Co., Ltd. | Multilayer ceramic electronic component |
| US8773840B2 (en) | 2009-12-11 | 2014-07-08 | Murata Manufacturing Co., Ltd. | Monolithic ceramic electronic component |
| US9082556B2 (en) | 2009-12-11 | 2015-07-14 | Murata Manufacturing Co., Ltd. | Monolithic ceramic capacitor |
| US9245688B2 (en) | 2009-12-11 | 2016-01-26 | Murata Manufacturing Co., Ltd. | Monolithic ceramic capacitor |
-
1984
- 1984-07-02 JP JP13675484A patent/JPS6115315A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63119182A (en) * | 1986-10-01 | 1988-05-23 | コ−ア株式会社 | Manufacture of crossed conductor |
| JPH03108306A (en) * | 1989-09-21 | 1991-05-08 | Murata Mfg Co Ltd | Manufacture of multilayer capacitor |
| US8773839B2 (en) | 2009-12-11 | 2014-07-08 | Murata Manufacturing Co., Ltd. | Multilayer ceramic electronic component |
| US8773840B2 (en) | 2009-12-11 | 2014-07-08 | Murata Manufacturing Co., Ltd. | Monolithic ceramic electronic component |
| US9082556B2 (en) | 2009-12-11 | 2015-07-14 | Murata Manufacturing Co., Ltd. | Monolithic ceramic capacitor |
| US9245688B2 (en) | 2009-12-11 | 2016-01-26 | Murata Manufacturing Co., Ltd. | Monolithic ceramic capacitor |
| JP2013219153A (en) * | 2012-04-06 | 2013-10-24 | Murata Mfg Co Ltd | Method for manufacturing electronic component |
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