JPS62104399A - Manufacture of ultrasonic probe - Google Patents

Abstract

PURPOSE:To facilitate the working of a probe in a complicate shape by molding a shape memory material under envelope condition where the shape is memorized, returning it into a plane state and carrying out the sticking of a vibrator array and dicing work under normal condition, and returning the material into the molding shape under transition condition. CONSTITUTION:A rubber material 4 having shape memory characteristics is molded in a necessary shape at >=150 deg. and the shape is memorized. Then, the material is restored to a flat plate at the room temperature and the vibrator array 1 is stuck and diced. Then the rubber material 4 is heated to its secondary transition temperature and restored to its original shape. A backing material 2 is adhered thereto to and made hard to deform.

Description

Detailed Description of the Invention (Industrial Application Field) The present invention relates to an ultrasonic probe used in an ultrasonic diagnostic device, etc., and more specifically, an ultrasonic probe that can be easily processed even in complex shapes. Concerning the method of producing children.

(Prior Art) In an ultrasonic probe used in an ultrasonic diagnostic device or the like, a backing material for absorbing unnecessary ultrasonic beams is provided on one surface of a transducer array. FIG. 3 is a configuration diagram showing an example of such a conventional ultrasonic probe.
For example, is an M3 sound wave transducer array (hereinafter simply referred to as a transducer array) made of PZT (lead zirconate titanate) based material, and one surface (back surface) of this transducer array has a transducer array 1. A backing material 2 is provided to absorb unnecessary ultrasonic beams directed toward the back surface. Note that a matching layer and an acoustic lens are provided on the other surface (front surface) of the vibrator array 1, but these are not shown. Incidentally, with the recent diversification of J3 probes in the market, there has been a demand for probes with curved surfaces.

(Problems to be Solved by the Invention) As mentioned above, machining a probe with a curved surface requires a special tool, a transducer array with a curved surface, etc. An example of the working method is shown in Fig. 4.The sensor array 1 is placed in advance on the surface of the semicircular backing material 2 (A).
It is pasted as shown in the figure, then (b) a cut is made with a dicing saw 3 as shown in the figure, then it is rotated at the required angle and cut, and then it is further rotated and cut. In the case of a flat surface, it is possible to cut many things at once with multiple blades, but in this case it is difficult. In addition, there are also products that are cut on a flat surface and subjected to processing such as forced bending. In this case, the number of steps increases, man-hours and costs increase, and dimensional accuracy may not be achieved. If the shape is complex, it cannot be processed simply by rotating the material as shown in (b) of Figure 4, which further increases the number of man-hours.

The present invention has been made in view of the above points, and an object thereof is to realize a method for processing a probe that can easily process a probe having a complicated shape such as a curved surface.

(Means for Solving the Problems) The present invention solves the above problems in a method of manufacturing an ultrasound probe for an ultrasound diagnostic device in which a transducer array is pasted on a backing material and subjected to dicing processing. Shape memory material is molded under surrounding conditions that memorize its shape, returned to a planar state under normal conditions, attached with a vibrator array, subjected to dicing processing, returned to the molded shape under transition conditions, and as needed. It is characterized by pasting a backing material.

(Function) The shape memory is molded at a high temperature to memorize the shape, returned to room temperature, a transducer array is attached, dicing is performed, and the memorized shape is returned to the memorized shape at a transition temperature to perform the desired ultrasonic probe. get a child

(Example) Examples of the present invention will be described in detail below.

FIG. 1 shows an example of manufacturing a semicircular ultrasonic probe.

(A) Figure: A rubber material 4 having shape memory properties (norbornene polymer, etc.) is molded to a required curvature at 150° C. or higher to memorize the shape.

(b) Figure: Return this to a flat plate at room temperature and attach the vibrator array 1.

(c) Figure: Dicing.

(D) When heated to the secondary transition temperature of the rubber material 4 (approximately 36° C.), it returns to its original semicircular shape (after this, it maintains this shape at room temperature).

(E) Figure: Since the rubber material 4 alone is easily deformed, the backing material 2 is bonded.

Figure 2 shows an example of a complex shape.

(A) Figure, the rubber material 4 is pressure molded at 150°C or higher,
Memorize the shape you need.

(B) Figure: The rubber material 4 is made into a flat plate at room temperature, and the vibrator array is attached.

(C) Figure: When reheated (at about 36° C. or higher) after dicing, it returns to its memorized shape.

As described above, a rubber material with shape memory properties is used to mold the desired shape at high temperature, return to a flat plate at room temperature, attach an image sensor array, dice it, and heat it to a transition temperature to memorize it. By returning the probe to the desired shape, it is possible to easily obtain 1 q of ultrasonic probes that have been diced into the desired shape without performing difficult dicing.

The material listed here is just an example, and the material having shape memory characteristics is not limited to rubber, and any other material having shape memory characteristics may be used.

(Effects of the Invention) As explained above, according to the present invention, even complex-shaped ultrasonic probes can be easily processed by dicing.

[Brief explanation of drawings]

FIG. 1 is a diagram showing a processing method according to an embodiment of the present invention, and shows the processing order from (A) to (E). FIG. 2 is a diagram showing a processing method for another shape, and shows the processing order from (A) to (C). FIG. 3 is a diagram of a conventional ultrasonic probe, and FIG. 4 is a diagram of a conventional processing method for a deformed probe. 1... Vibrator array 2... Backing material 3.
... Dicing saw 4 ... Shape memory material 5 ... Adhesive patent applicant Yokogawa Medical Systems Co., Ltd. No. 1 (a) (c) (e) Country (b) (d) 1. a child array 2; Backing material Fig. 2 (A) (B) (C) 1 i 41i17J child array 41 Shape memory material (rubber material) Fig. 3] i Transducer array (PZT) 21 Backing material Fig. 4 (A) (B) )1 i
a-77 ray 2j patsukin tie 3; dicing saw

Claims (1)

[Claims] In the manufacturing method of an ultrasound probe for an ultrasound diagnostic device, in which a transducer array is attached to a backing material and diced, the shape memory material is molded under surrounding conditions that memorize the shape, and is flat under normal conditions. A method of manufacturing an ultrasonic probe, which comprises returning the probe to a molded shape, pasting a transducer array thereon, performing dicing, restoring the molded shape under transition conditions, and pasting a backing material as necessary.