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JPS6210463U - - Google Patents

Info

Publication number
JPS6210463U
JPS6210463U JP10152085U JP10152085U JPS6210463U JP S6210463 U JPS6210463 U JP S6210463U JP 10152085 U JP10152085 U JP 10152085U JP 10152085 U JP10152085 U JP 10152085U JP S6210463 U JPS6210463 U JP S6210463U
Authority
JP
Japan
Prior art keywords
wiring board
printed wiring
frame
outer periphery
copper foil
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10152085U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP10152085U priority Critical patent/JPS6210463U/ja
Publication of JPS6210463U publication Critical patent/JPS6210463U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Structure Of Printed Boards (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は外周部に長方形状の銅箔2が2列、額
縁状に設けられている本考案に係る印刷配線板の
部分平面図、第2図は外周部に円形の銅箔4が2
列、額縁状に設けられている本考案に係る印刷配
線板の部分平面図である。 1,3…印刷配線板、2,4…銅箔。
FIG. 1 is a partial plan view of a printed wiring board according to the present invention in which two rows of rectangular copper foils 2 are provided in a frame shape on the outer periphery, and FIG.
FIG. 2 is a partial plan view of the printed wiring board according to the present invention, which is arranged in rows and frame shapes; 1, 3...Printed wiring board, 2, 4...Copper foil.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 外周部に銅箔が間隔を設けて額縁状に設けられ
ていることを特徴とする印刷配線板。
A printed wiring board characterized in that copper foil is provided at intervals on the outer periphery in the shape of a frame.
JP10152085U 1985-07-02 1985-07-02 Pending JPS6210463U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10152085U JPS6210463U (en) 1985-07-02 1985-07-02

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10152085U JPS6210463U (en) 1985-07-02 1985-07-02

Publications (1)

Publication Number Publication Date
JPS6210463U true JPS6210463U (en) 1987-01-22

Family

ID=30972325

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10152085U Pending JPS6210463U (en) 1985-07-02 1985-07-02

Country Status (1)

Country Link
JP (1) JPS6210463U (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63241993A (en) * 1987-03-30 1988-10-07 株式会社日立製作所 Multilayer printed board and its manufacturing method
JPH03185793A (en) * 1989-12-14 1991-08-13 Nec Corp Manufacture of multilayer printed wiring board
JP2003021546A (en) * 2001-07-06 2003-01-24 Denso Corp Membrane type sensor and its manufacturing method
JP2007180211A (en) * 2005-12-27 2007-07-12 Ngk Spark Plug Co Ltd Core substrate for manufacturing wiring board and manufacturing method of wiring board
JP2008085340A (en) * 2006-09-27 2008-04-10 Samsung Electronics Co Ltd Circuit board for warpage prevention and manufacturing method thereof
JP2010165855A (en) * 2009-01-15 2010-07-29 Shinko Electric Ind Co Ltd Wiring board and method of manufacturing the same

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63241993A (en) * 1987-03-30 1988-10-07 株式会社日立製作所 Multilayer printed board and its manufacturing method
JPH03185793A (en) * 1989-12-14 1991-08-13 Nec Corp Manufacture of multilayer printed wiring board
JP2003021546A (en) * 2001-07-06 2003-01-24 Denso Corp Membrane type sensor and its manufacturing method
JP2007180211A (en) * 2005-12-27 2007-07-12 Ngk Spark Plug Co Ltd Core substrate for manufacturing wiring board and manufacturing method of wiring board
JP2008085340A (en) * 2006-09-27 2008-04-10 Samsung Electronics Co Ltd Circuit board for warpage prevention and manufacturing method thereof
JP2010165855A (en) * 2009-01-15 2010-07-29 Shinko Electric Ind Co Ltd Wiring board and method of manufacturing the same

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