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JPS6299481A - Microwave plasma generator - Google Patents

Microwave plasma generator

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Publication number
JPS6299481A
JPS6299481A JP60240070A JP24007085A JPS6299481A JP S6299481 A JPS6299481 A JP S6299481A JP 60240070 A JP60240070 A JP 60240070A JP 24007085 A JP24007085 A JP 24007085A JP S6299481 A JPS6299481 A JP S6299481A
Authority
JP
Japan
Prior art keywords
microwave
plasma
dielectric
waveguide
line
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60240070A
Other languages
Japanese (ja)
Other versions
JPH0695479B2 (en
Inventor
Kyoichi Komachi
小町 恭一
Sumio Kobayashi
純夫 小林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Steel Corp
Original Assignee
Sumitomo Metal Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Metal Industries Ltd filed Critical Sumitomo Metal Industries Ltd
Priority to JP60240070A priority Critical patent/JPH0695479B2/en
Publication of JPS6299481A publication Critical patent/JPS6299481A/en
Publication of JPH0695479B2 publication Critical patent/JPH0695479B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【発明の詳細な説明】 (産業上の利用分野) 本発明は、マイクロ波プラズマ発生装置の改良に関する
ものである。
DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to improvements in microwave plasma generators.

(従来の技術) 低圧ガスの放電によって生成した低温プラズマは、系全
体が低温でありながら様々な化学反応を促進するため、
無機材料と有機材料のいずれ番こも適用でき、極めて応
用範囲が広く、半導体の製造プロセス、高分子材料、金
属の表面改質等しこ用し)られている。
(Prior art) Low-temperature plasma generated by low-pressure gas discharge promotes various chemical reactions even though the entire system is at a low temperature.
It can be applied to both inorganic and organic materials, and has an extremely wide range of applications, including semiconductor manufacturing processes, polymer materials, and surface modification of metals.

しかして、この低温プラズマを発生させるために、従来
の研究開発・実用機では主にラジオ波(13,56MH
z)により励起させる方法が用6sられていたが、マイ
クロ波を用いる方が効率・装置の点で有利であることが
知られている(広瀬二マイクロ波放電プラズマとその装
置、塗装技術、19、(1’l、(1980)、100
〜105頁)。有利な点を以下に示す。
However, in order to generate this low-temperature plasma, conventional research and development/practical equipment mainly uses radio waves (13,56 MHz).
However, it is known that using microwaves is more advantageous in terms of efficiency and equipment (Hirose 2 Microwave discharge plasma and its equipment, coating technology, 19 , (1'l, (1980), 100
~105 pages). The advantages are shown below.

■電子温度Teとガス温度Tgの比Te/TgA<大き
く、より低温のプラズマが得られる。
(2) The ratio of electron temperature Te to gas temperature Tg is larger than Te/TgA, and a lower temperature plasma can be obtained.

■電極を必要としないので、電極からの汚染を防ぐこと
ができる。
■Since no electrodes are required, contamination from the electrodes can be prevented.

■マイクロ波の電力を局所的に注入でき、外部空間への
不用な放射損失がなく、高密度のプラズマが生成できる
■Microwave power can be locally injected, there is no unnecessary radiation loss to the outside space, and high-density plasma can be generated.

■発振器が簡単である。■The oscillator is simple.

■導波管でマイクロ波を伝送するため放射損失がなく、
整合が簡単な構造でできる。
■There is no radiation loss because microwaves are transmitted through a waveguide.
Integration is possible with a simple structure.

ところで、従来のマイクロ波を利用したプラズマ発生装
置としては、以下の構造のものが知られている。
By the way, as a conventional plasma generation device using microwaves, one having the following structure is known.

■生成部・処理室分離型(前記文献) 従来よりよく知られている構造で、導波管中に石英管を
貫通させ、石英管中でプラズマを発生させるもの。なお
、処理容器は別途設け、被処理物はプラズマから離れた
下流に設置する。
■ Separate generation section/processing chamber type (see above) This is a well-known structure in which a quartz tube is passed through a waveguide and plasma is generated inside the quartz tube. Note that the processing container is provided separately, and the object to be processed is placed downstream away from the plasma.

■金属アンテナ型(特公昭57−53858、特開昭5
7−9868、特開昭56−41382)金属アンテナ
を用いて導波管からマイクロ波を別の大容量の処理容器
内に導入し、該処理容器内でプラズマを発生させるもの
■Metal antenna type (Japanese Patent Publication No. 57-53858, Japanese Patent Publication No. 57-53858,
7-9868, JP-A-56-41382) Microwaves are introduced from a waveguide into another large-capacity processing container using a metal antenna, and plasma is generated within the processing container.

■周期構造型(R,G、Bosisio、 C,F、W
eissf 1och、 M、R、Wertheime
r:The Large Volume Microw
ave Plasma Generator、J、Mi
crowave T’ower、7(4)、1972)
導波管より周期構造を利用した開放線路にマイクロ波を
導入し、前記開放線路下に設けた石英管内にプラズマを
発生させるもの。
■Periodic structure type (R, G, Bosisio, C, F, W
eissf 1och, M, R, Wertheime
r:The Large Volume Micro
ave Plasma Generator, J, Mi
Crowave T'ower, 7(4), 1972)
Microwaves are introduced into an open line using a periodic structure through a waveguide, and plasma is generated in a quartz tube placed under the open line.

(発明が解決しようとする問題点) しかしながら、前記■の構造のものは、プラズマ生成部
が導波管の大きさで限定される為、多量の試料や大型の
試料の処理が行なえない。また、この構造のものは、プ
ラズマによるマイクロ波の反射が大きく効率が悪い。
(Problems to be Solved by the Invention) However, in the structure (2) described above, since the plasma generation section is limited by the size of the waveguide, it is not possible to process a large number of samples or large samples. Furthermore, in this structure, the microwaves are reflected by the plasma and the efficiency is low.

また、■の構造のものは、比較的径の大きな石英管にプ
ラズマを発生させることができるために多数処理が可能
であるが、アンテナと導波管との整合がむずかしく、プ
ラズマが不均一になりやすい為、その改善のための装置
が複雑になる。
In addition, the structure (■) can generate plasma in a relatively large-diameter quartz tube, so it is possible to process a large number of processes, but it is difficult to match the antenna and waveguide, resulting in non-uniform plasma. Because it is easy to cause this, the equipment to improve it becomes complicated.

更に、■の構造のものは、周期構造型線路と導波管の整
合をとるために幅広いものができず、細長いプラズマし
か発生できない(前記文献によれば外径19mmの石英
ガラス管内でプラズマを発生させている。)また、前記
線路の構造も複雑であるという問題がある。
Furthermore, in the case of the structure (■), due to the matching between the periodic structure type line and the waveguide, it is not possible to create a wide one, and only elongated plasma can be generated (according to the above-mentioned document, plasma is generated in a quartz glass tube with an outer diameter of 19 mm). Furthermore, there is a problem that the structure of the line is complicated.

そこで、本出願人は上記問題点に鑑みて、マイクロ波を
用いて大面積かつ均一なプラズマを比較的簡単な構造で
安定して発生できるマイクロ波プラズマ発生装置を備え
たマイクロ波プラズマ処理装置を特願昭60−1113
036号で提案した。
Therefore, in view of the above-mentioned problems, the present applicant has developed a microwave plasma processing apparatus equipped with a microwave plasma generator that can stably generate large-area, uniform plasma using microwaves with a relatively simple structure. Patent application 1986-1113
It was proposed in issue 036.

本発明は、本出願人が先に提案した特願昭60−143
036号の発明の構成要素であるマイクロ波プラズマ発
生装置を更に改良したものである。
The present invention is based on the patent application No. 60-143 previously proposed by the applicant.
This is a further improvement of the microwave plasma generator which is a component of the invention of No. 036.

(問題を解決するための手段) 本発明は、マイクロ波発振器および該マイクロ波発振器
からのマイクロ波を伝送する導波管と、該導波管に連通
される誘電体被覆線路と、該誘電体被覆線路の下方に配
置される反応器を具備して成り、前記誘電体被覆線路に
は前記マイクロ波をその共振周波数で反射せしめるため
の反射板を移動可能に付設すると共に、前記誘電体被覆
線路あるいは反応器のすくなくともどちらか一方をこれ
ら両者間の反発振器側の間隔が狭くなるような傾斜可能
に構成することを要旨とするマイクロ波プラズマ発生装
置である。
(Means for Solving the Problems) The present invention provides a microwave oscillator, a waveguide for transmitting microwaves from the microwave oscillator, a dielectric-covered line connected to the waveguide, and a dielectric-coated line connected to the waveguide. A reactor is provided below the covered line, and the dielectric covered line is movably attached with a reflector for reflecting the microwave at its resonant frequency, and the dielectric covered line is movably attached Alternatively, it is a microwave plasma generation device in which at least one of the reactors is configured to be tiltable so that the distance between the two on the repulsion oscillator side becomes narrow.

ここで、本発明装置の構成要素である誘電体被覆線路に
反射板を移動可能に付設するのは次の理由による。
Here, the reason why the reflector is movably attached to the dielectric coated line, which is a component of the device of the present invention, is as follows.

すなわち、プラズマが発生すると誘電体被覆線路の共振
周波数が変化して前記誘電体被覆線路からマイクロ波発
振器の方に戻ってくるマイクロ波が大きくなる。この時
、反射板を前後に移動させることによって共振周波数を
変化させ、もってマイクロ波の周波数である2、45G
Hzに合致させ、反射波を小さくできるからである。
That is, when plasma is generated, the resonant frequency of the dielectric covered line changes, and the microwaves returning from the dielectric covered line to the microwave oscillator become larger. At this time, by moving the reflector back and forth, the resonant frequency is changed, which is 2.45G, which is the frequency of microwaves.
This is because the reflected waves can be made smaller by matching the frequency to Hz.

また、誘電体被覆線路あるいは反応器のすくなくともど
ちらか一方をこれら両者間の反発振器側の間隔が狭くな
るような傾斜可能に構成するのは次の理由による。
The reason why at least one of the dielectric covered line or the reactor is configured to be tiltable so that the distance between them on the repulsion oscillator side becomes narrow is as follows.

すなわち、前記したように構成しない場合には、プラズ
マは発振器側に偏って発生し、プラズマの発生量はマイ
クロ波の進行方向に向かって少なくなる傾向にあった。
That is, in the case of not having the configuration as described above, plasma was generated biased toward the oscillator side, and the amount of plasma generated tended to decrease in the direction of propagation of the microwave.

しかし、本発明のような構成とすることによってプラズ
マを全域に均一となるように発生させることができる。
However, with the configuration of the present invention, plasma can be generated uniformly over the entire area.

(作   用) 本発明は、誘電体被覆線路に反射板を移動可能に付設す
ると共に、前記誘電体被覆線路あるいは反応器のすくな
くともどちらが一方をこれら両者間の反発振器側の間隔
が狭くなるような傾斜可能に構成した為、マイクロ波の
反射を小さくできると共に、プラズマを全域に均一とな
るように発生させることができる。
(Function) The present invention movably attaches a reflecting plate to a dielectric covered line, and at least one of the dielectric coated line or a reactor is arranged so that the distance between the two on the repulsive oscillator side becomes narrower. Since it is configured to be tiltable, reflection of microwaves can be reduced and plasma can be generated uniformly over the entire area.

(実 施 例) 以下本発明を添付図面に基づいて説明する。(Example) The present invention will be explained below based on the accompanying drawings.

図面において、lはマイクロ波発振器であり、ここから
例えば2.45GHzのマイクロ波が発生され、導波管
2 (WRI−22,109,22酊X54.61龍)
より伝送される。
In the drawing, l is a microwave oscillator from which, for example, a 2.45 GHz microwave is generated, and a waveguide 2 (WRI-22, 109, 22 x 54.61 dragon)
Transmitted by

3は前記導波管2に連通された誘電体被覆線路であり、
該誘電体被覆線路3を構成する誘電体層4には例えばテ
フロン、ポリスチレン、ポリエチレン等の誘電損失の小
さい物質が採用されている。
3 is a dielectric covered line connected to the waveguide 2;
The dielectric layer 4 constituting the dielectric covered line 3 is made of a material with low dielectric loss, such as Teflon, polystyrene, or polyethylene.

すなわち、この誘電体層4は表面波導波路として電磁界
の集中をもたらし、また、当該表面波は光の速度より遅
い遅波となる為、マイクロ波のエネルギーをを効にガス
に伝達し、プラズマを発生させることができるのである
In other words, this dielectric layer 4 serves as a surface wave waveguide to concentrate the electromagnetic field, and since the surface wave is a slow wave slower than the speed of light, it effectively transmits microwave energy to the gas and generates plasma. can be generated.

また、本例のように導波管2と誘電体被覆線路3を別体
構成すれば誘電体層4の幅を導波管2の幅に比較して広
くできる為、大面積のプラズマを発生させることができ
る。
Furthermore, if the waveguide 2 and the dielectric covered line 3 are configured separately as in this example, the width of the dielectric layer 4 can be made wider compared to the width of the waveguide 2, so a large area of plasma can be generated. can be done.

5は前記誘電体被覆線路3の終端に付設された反射板で
あり、導波管2方向への接離移動が可能なように成され
ている。すなわち、この反射板5を移動させることによ
ってプラズマ発生後の共振点の移動に追従し、マイクロ
波の反射を最小にし電界強度を大きくして効率を高める
のである。
Reference numeral 5 denotes a reflecting plate attached to the terminal end of the dielectric covered line 3, and is configured to be able to move toward and away from the waveguide 2. That is, by moving this reflector plate 5, it follows the movement of the resonance point after plasma generation, minimizing the reflection of microwaves, increasing the electric field strength, and increasing efficiency.

6は前記誘電体被覆線路3の下方に配設された反応器で
あり、この上面には誘電損失の小さな耐熱性物質、例え
ば石英ガラス板7が載置されており、これを通してマイ
クロ波を反応器6内に導入するようになされている。
Reference numeral 6 denotes a reactor disposed below the dielectric covered line 3, and a heat-resistant material with small dielectric loss, such as a quartz glass plate 7, is placed on the upper surface of the reactor, through which microwaves are reacted. It is designed to be introduced into the container 6.

8は前記反応器6と誘電体被覆線路3間の反マイクロ波
発振器1例の間隔を狭くするように反応器6の下方に配
設された傾斜角度調整部材であり、マイクロ波が放射や
プラズマによる損失のために減衰するのを補ってプラズ
マを均一に発生させるためのものである。
Reference numeral 8 designates an inclination angle adjustment member disposed below the reactor 6 so as to narrow the distance between the reactor 6 and the dielectric covered line 3, which is an example of an anti-microwave oscillator. This is to compensate for the attenuation caused by the loss caused by the plasma and generate plasma uniformly.

なお、反応器6を傾斜させる代わりに、誘電体被覆線路
3を傾斜させてもよいことは勿論であり、また、両者を
傾斜させてもよい。
Note that, of course, instead of tilting the reactor 6, the dielectric covered line 3 may be tilted, or both may be tilted.

また、これらを傾斜させる代わりに、誘電体層4の厚さ
をマイクロ波の進行方向に向がって薄くし、誘電体層4
とマイクロ波の結合度を小さくしてゆくことによって均
一なプラズマを発生させてもよい。
Moreover, instead of slanting these, the thickness of the dielectric layer 4 is made thinner in the direction of propagation of the microwave, and the dielectric layer 4 is made thinner in the direction of propagation of the microwave.
A uniform plasma may be generated by decreasing the degree of coupling between the microwave and the microwave.

9はガスボンベや流量計を備えたガス導入装置、10は
排気装置である。
9 is a gas introduction device equipped with a gas cylinder and a flow meter, and 10 is an exhaust device.

次に、本発明装置を用いてプラズマを発生させる手順を
以下に説明する。
Next, the procedure for generating plasma using the apparatus of the present invention will be explained below.

先ず、反応器6内を低真空又は高真空になるまで排気し
、この状態の反応器6内にガスを導入する。
First, the inside of the reactor 6 is evacuated to low vacuum or high vacuum, and gas is introduced into the reactor 6 in this state.

次に、マイクロ波発振器1を作動させてマイク0波を発
振させ、プラズマを発生させる。しかる後、反射板5を
移動させてマイクロ波の反射を最小にする。
Next, the microwave oscillator 1 is activated to oscillate a zero microwave wave to generate plasma. Thereafter, the reflection plate 5 is moved to minimize reflection of the microwave.

(実 験 結 果) 第1図に示す本発明装置を用いてプラズマを発生させた
(Experimental Results) Plasma was generated using the apparatus of the present invention shown in FIG.

本実験では、2.45GHzマイクロ波発振器を用い、
また、誘電体層には幅200 ***、長さ484wm
、厚さ200のテフロンを使用した。
In this experiment, a 2.45GHz microwave oscillator was used,
In addition, the dielectric layer has a width of 200 *** and a length of 484 wm.
, Teflon with a thickness of 200 was used.

但し、導波管と誘電体被覆線路の結合部における反射を
小さくして電界分布を乱さないように、第2図に示すよ
うな形状のテフロンを導波管内に挿入し、また、誘電体
被覆線路内のテフロンも第3図に示すように12Onの
長さに亘ってテーパをつけた。なお、第2図中λgは管
内波長、λは誘電体の表面波の波長を表わしている。
However, in order to reduce the reflection at the coupling part between the waveguide and the dielectric-coated line and not disturb the electric field distribution, Teflon with a shape as shown in Figure 2 is inserted into the waveguide, and the dielectric-coated line is The Teflon in the track was also tapered over a length of 12 On as shown in FIG. In FIG. 2, λg represents the tube wavelength, and λ represents the wavelength of the surface wave of the dielectric.

また、反射板は幅200龍、高さ40酊のものを使用し
、石英ガラス板は幅200龍、長さ3001のものを使
用した。
Further, the reflector used was 200 mm wide and 40 mm high, and the quartz glass plate was 200 mm wide and 300 mm long.

このような形状、寸法のプラズマ発生装置の反応器に、
プラズマ発生ガスとして空気を導入し、ガス圧10Pa
、マイクロ波電力IKw=33電体被覆線路のマイクロ
波導入口部分(第1図における左端)でのテフロンとプ
ラズマ発生部の距離を60mとし、反応器を5°傾けて
プラズマを発生させたところプラズマは200m■X 
300 **全域に均一に発生した。
In the reactor of the plasma generator with such shape and dimensions,
Air was introduced as plasma generating gas, and the gas pressure was 10 Pa.
, microwave power IKw = 33 The distance between Teflon and the plasma generation part at the microwave inlet part of the electrically coated line (left end in Figure 1) was set to 60 m, and the reactor was tilted 5 degrees to generate plasma. is 200m
300 ** Occurred uniformly over the entire area.

(発明の効果) 以上説明したように本発明は、誘電体被覆線路に反射板
を移動可能に付設すると共に、前記誘電体被覆線路ある
いは反応器のすくなくともどちらか一方をこれら両者間
の反発振器側の間隔が狭くなるような傾斜可能に構成し
た為、マイクロ波の反射を小さくできて、プラズマを広
い範囲に亘り全域に均一となるように発生させることが
でき、多量の処理材を均質に一度に処理したり、また、
大型の処理材を均質に処理できる。更に本発明装置は整
合も簡単にとれる為、装置の構造や調整を簡単にできる
等益するところ大なる効果を有する。
(Effects of the Invention) As explained above, the present invention movably attaches a reflector to a dielectric covered line, and also connects at least one of the dielectric covered line or the reactor to the repulsive oscillator between them. Because it is configured so that it can be tilted so that the interval between the two is narrower, the reflection of microwaves can be reduced, and plasma can be generated uniformly over a wide range, allowing a large amount of processing material to be uniformly processed at once. or process it into
Large-sized processing materials can be processed uniformly. Furthermore, since the device of the present invention can be easily matched, it has great effects such as simplifying the structure and adjustment of the device.

【図面の簡単な説明】[Brief explanation of drawings]

図面は本発明に係るマイクロ波プラズマ発生装置の一実
施例を示すもので、第1図(イ)は正面図中央縦断面図
、(ロ)は側面図、第2図は導波管と誘電体被覆線路の
接合部を示す図面、第3図は誘電体層の平面図である。 1はマイクロ波発振器、2は導波管、3は誘電体被覆線
路、5は反射板、6は反応器、8は傾斜角度調整部材。
The drawings show an embodiment of the microwave plasma generator according to the present invention, in which Fig. 1 (a) is a front view and central vertical sectional view, (b) is a side view, and Fig. 2 is a waveguide and dielectric. FIG. 3 is a plan view of the dielectric layer. 1 is a microwave oscillator, 2 is a waveguide, 3 is a dielectric covered line, 5 is a reflection plate, 6 is a reactor, and 8 is an inclination angle adjusting member.

Claims (1)

【特許請求の範囲】[Claims] (1)マイクロ波発振器および該マイクロ波発振器から
のマイクロ波を伝送する導波管と、該導波管に連通され
る誘電体被覆線路と、該誘電体被覆線路の下方に配置さ
れる反応器を具備して成り、前記誘電体被覆線路には前
記マイクロ波をその共振周波数で反射せしめるための反
射板を移動可能に付設すると共に、前記誘電体被覆線路
あるいは反応器のすくなくともどちらか一方をこれら両
者間の反発振器側の間隔が狭くなるような傾斜可能に構
成することを特徴とするマイクロ波プラズマ発生装置。
(1) A microwave oscillator, a waveguide that transmits the microwave from the microwave oscillator, a dielectric covered line connected to the waveguide, and a reactor placed below the dielectric covered line A reflector plate for reflecting the microwave at its resonant frequency is movably attached to the dielectric coated line, and at least one of the dielectric coated line or the reactor is attached to the reflector plate for reflecting the microwave at its resonant frequency. A microwave plasma generation device characterized in that it is configured to be tiltable so that the distance between the two on the repulsion oscillator side becomes narrow.
JP60240070A 1985-10-25 1985-10-25 Microwave plasma generator Expired - Fee Related JPH0695479B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60240070A JPH0695479B2 (en) 1985-10-25 1985-10-25 Microwave plasma generator

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60240070A JPH0695479B2 (en) 1985-10-25 1985-10-25 Microwave plasma generator

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP6103798A Division JP2570170B2 (en) 1994-05-18 1994-05-18 Microwave plasma generator

Publications (2)

Publication Number Publication Date
JPS6299481A true JPS6299481A (en) 1987-05-08
JPH0695479B2 JPH0695479B2 (en) 1994-11-24

Family

ID=17054041

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60240070A Expired - Fee Related JPH0695479B2 (en) 1985-10-25 1985-10-25 Microwave plasma generator

Country Status (1)

Country Link
JP (1) JPH0695479B2 (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5645644A (en) * 1995-10-20 1997-07-08 Sumitomo Metal Industries, Ltd. Plasma processing apparatus
US5788798A (en) * 1994-07-14 1998-08-04 Sumitomo Metal Industries, Ltd. Plasma processing apparatus
JP2000514595A (en) * 1996-07-08 2000-10-31 アプライド、マイクロウェーブ、プラズマ、コンセプツ、インコーポレーテッド Coaxial microwave applicator for electron cyclotron resonant plasma source
US6246175B1 (en) 1999-10-25 2001-06-12 National Science Council Large area microwave plasma generator
US6290807B1 (en) 1998-04-10 2001-09-18 Tokyo Electron Limited Apparatus and method for microwave plasma process
US6358361B1 (en) 1998-06-19 2002-03-19 Sumitomo Metal Industries Limited Plasma processor

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5788798A (en) * 1994-07-14 1998-08-04 Sumitomo Metal Industries, Ltd. Plasma processing apparatus
US5645644A (en) * 1995-10-20 1997-07-08 Sumitomo Metal Industries, Ltd. Plasma processing apparatus
JP2000514595A (en) * 1996-07-08 2000-10-31 アプライド、マイクロウェーブ、プラズマ、コンセプツ、インコーポレーテッド Coaxial microwave applicator for electron cyclotron resonant plasma source
US6290807B1 (en) 1998-04-10 2001-09-18 Tokyo Electron Limited Apparatus and method for microwave plasma process
US6358361B1 (en) 1998-06-19 2002-03-19 Sumitomo Metal Industries Limited Plasma processor
US6246175B1 (en) 1999-10-25 2001-06-12 National Science Council Large area microwave plasma generator

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