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JPS6333487A - Expansion type adhesive sheet - Google Patents

Expansion type adhesive sheet

Info

Publication number
JPS6333487A
JPS6333487A JP9490887A JP9490887A JPS6333487A JP S6333487 A JPS6333487 A JP S6333487A JP 9490887 A JP9490887 A JP 9490887A JP 9490887 A JP9490887 A JP 9490887A JP S6333487 A JPS6333487 A JP S6333487A
Authority
JP
Japan
Prior art keywords
sensitive adhesive
pressure
adhesive layer
adhesive sheet
sheet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9490887A
Other languages
Japanese (ja)
Other versions
JP2613389B2 (en
Inventor
Tatsuo Kurono
黒野 龍夫
Nozomi Ohashi
大橋 望
Naomitsu Tanaka
田中 直満
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Electric Industrial Co Ltd filed Critical Nitto Electric Industrial Co Ltd
Priority to JP62094908A priority Critical patent/JP2613389B2/en
Publication of JPS6333487A publication Critical patent/JPS6333487A/en
Application granted granted Critical
Publication of JP2613389B2 publication Critical patent/JP2613389B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836Wafer tapes, e.g. grinding or dicing support tapes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901Structure
    • H01L2924/1904Component type
    • H01L2924/19041Component type being a capacitor

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Adhesive Tapes (AREA)
  • Ceramic Capacitors (AREA)

Abstract

PURPOSE:A double-sided adhesive sheet, obtained by peeling cut pieces of a molded powder article applied and fixed to a pressure-sensitive adhesive containing a foaming agent on one surface of a support sheet while subjecting the cut pieces to expansion treatment and capable of firmly and readily holding the molded powder article with a good position accuracy without giving deformation and damage. CONSTITUTION:An adhesive sheet obtained by forming a pressure-sensitive adhesive layer 3 containing a foaming agent, preferably microencapsulated agent one surface of a support sheet, e.g. PE, PP film, etc., forming a pressure- sensitive adhesive layer 3' for adhering to a support table 5 on the other surface, applying and fixing a molded powder article 1, e.g. unsintered ceramic plate, etc., on the above-mentioned adhesive layer 3, cutting the resultant material and peeling the above-mentioned cut pieces 1' while subjecting the pieces 1' to expansion treatment.

Description

【発明の詳細な説明】 産業上の利用分野 本発明は、発泡剤含有感圧性接着剤層を有する両面粘着
シートからなり、粉末成形体の切断片の製造に用いる発
泡型粘着シートに関する。
DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a foam-type adhesive sheet comprising a double-sided adhesive sheet having a pressure-sensitive adhesive layer containing a foaming agent and used for producing cut pieces of powder compacts.

従来の技術及び問題点 従来、セラミックの粉末とバインダと溶剤の混合物を成
形して得たセラミックシートに所定の内部電極を印刷し
つつ、これをアルミニウム板等からなる支持台の上に粘
着テープを介して固定された枠の中に重ね置いて圧着し
、ついでその圧着体を小片に打抜いてセラミックコンデ
ンサチップを形成するための切断片を製造するシート法
(積層法)が知られていた。
Conventional techniques and problems Conventionally, predetermined internal electrodes are printed on a ceramic sheet obtained by molding a mixture of ceramic powder, a binder, and a solvent, and then adhesive tape is placed on a support made of an aluminum plate or the like. A sheet method (laminating method) is known in which ceramic capacitors are stacked one on top of the other in a frame fixed through a frame and then crimped, and then the crimped body is punched out into small pieces to produce cut pieces for forming ceramic capacitor chips.

しかしながら、前記のセラミックシートのように粉末成
形体は変形ないし破損しやすくて、枠内等の所定位置に
変形や破損を与えないで配置することが困難であり、製
造効率や正常な切断片の歩留まりに劣る問題点があった
。殊に、上記したセラミックコンデンサチップ形成用の
切断片を得るときのように、寸法精度に優れる切断片を
得る必要がある場合には高精度の位置決めとその維持が
不可欠なため、位置決め性に劣る従来の枠方式ではより
歩留まりが低下する実状であった。
However, powder compacts like the ceramic sheets described above are easily deformed or damaged, and it is difficult to place them in a predetermined position within a frame without causing deformation or damage, which reduces manufacturing efficiency and the ability to properly cut pieces. There was a problem with poor yield. In particular, when it is necessary to obtain cut pieces with excellent dimensional accuracy, such as when obtaining cut pieces for forming ceramic capacitor chips mentioned above, it is essential to position and maintain high precision, so positioning performance is poor. In the conventional frame method, the yield was actually lower.

かかる問題点を解決するため鋭意研究した結果、本発明
者らは枠方式に代わる、粘着シートによる固定方式を想
到するに至った。この粘着シートで未焼結のセラミック
板等の粉末成形体を固定する方式によれば、粉末成形体
を安定な状態に保持しておいてその上から粘着シートを
被せるようにして貼着する方式や、平坦な状態にある感
圧性接着剤層の上に粉末成形体を載せ置く方式などをと
ることができる結果、所定位置に配置する作業で粉末成
形体を変形させたり、破損させたりすることを回避する
ことができる。また、粉末成形体の良接着性が活かされ
て高精度の位置決めが容易であることから寸法精度の高
い切断片を得ることができ、従来方式の問題点は解消さ
れる。さらに、セラミックコンデンサチップ形成用の切
断片の場合には、積層物の上下における内部電極の整合
性に優れるものが得られる利点などもある。
As a result of intensive research to solve these problems, the present inventors came up with a fixing method using an adhesive sheet instead of the frame method. According to this method of fixing a powder compact such as an unsintered ceramic plate with an adhesive sheet, the powder compact is held in a stable state and then the adhesive sheet is placed over it. As a result, there is no risk of deforming or damaging the powder compact during the process of placing it in a predetermined position. can be avoided. In addition, since the powder compact takes advantage of its good adhesive properties and facilitates highly accurate positioning, cut pieces with high dimensional accuracy can be obtained, and the problems of the conventional method are solved. Furthermore, in the case of cut pieces for forming ceramic capacitor chips, there is an advantage that excellent alignment of internal electrodes on the upper and lower sides of the laminate can be obtained.

しかし、従来の枠方式で用いられていた粘着テープくシ
ート)、すなわち単なる感圧性接着剤層を支持シートに
設けてなる粘着シートを用いた固定方式では、得られた
切断片をこれに変形や破損を与えないで粘着シートより
剥離することが困難で、そのままでは実用技術たり得な
いという新たな問題点のあることが判明した。
However, with the fixing method using an adhesive sheet (adhesive tape or sheet) used in the conventional frame method, that is, an adhesive sheet with a simple pressure-sensitive adhesive layer provided on the support sheet, the obtained cut pieces cannot be deformed. It has been found that there is a new problem in that it is difficult to peel off from the adhesive sheet without causing damage, and it cannot be used as a practical technology as it is.

問題点を解決するための手段 本発明者らは、上記の粘着シートによる固定方式゛の利
点を活かしつつ、その問題点を克服するためにさらに研
究を重ねた結果、発泡処理しうる粘着シートを用いるこ
とによりその目的を達成しうることを見出し、本発明を
完成するに至った。
Means for Solving the Problems The present inventors have conducted further research in order to overcome the problems while taking advantage of the above-mentioned fixing method using adhesive sheets. As a result, they have developed an adhesive sheet that can be foamed. The present inventors have discovered that the object can be achieved by using the present invention, and have completed the present invention.

すなわち、本発明は、支持シートの片面に粉末成形体を
貼着固定するための発泡剤含有感圧性接着剤層を有し、
他面に支持台に固着するための感圧性接着剤層を有する
両面粘着シートからなり、前記の発泡剤含有感圧性接着
剤層に貼着固定された粉末成形体を切断して得た切断片
を、発泡処理下に剥離しうるようにした発泡型粘着シー
トを提供するものである。
That is, the present invention has a foaming agent-containing pressure-sensitive adhesive layer for adhering and fixing a powder compact on one side of a support sheet,
A cut piece obtained by cutting a powder compact made of a double-sided adhesive sheet having a pressure-sensitive adhesive layer on the other side for adhering to a support base, and fixed to the foaming agent-containing pressure-sensitive adhesive layer. The present invention provides a foamed pressure-sensitive adhesive sheet which can be peeled off during foaming treatment.

作用 両面粘着シートとすることにより、片面に粉末成形体を
貼着固定し、しかもその他面を介して粘着シートを支持
台に固着した状態で前記粉末成形体を切断することが可
能となり、これにより高精度な切断処理が達成される。
By using a double-sided adhesive sheet, it is possible to cut the powder compact with the powder compact adhered and fixed to one side and the adhesive sheet fixed to the support via the other surface. A highly accurate cutting process is achieved.

一方、切断処理後、発泡剤含有感圧性接着剤層を発泡処
理することにより、有効接着面積が減少して切断片に対
する接着力を低下させることができると共に、切断片の
再接着を抑制することができて、切断片を粘着シートよ
り容易に剥離することが可能になる。さらに、発泡処理
を発泡ガスが感圧性接着剤層より噴出する程度に強く行
った場合には、その発泡時における発泡ガスの噴射によ
る剥がし作用が加わることとなって、切断片の剥離はよ
り容易となる。
On the other hand, by foaming the foaming agent-containing pressure-sensitive adhesive layer after the cutting process, the effective adhesive area can be reduced and the adhesive force to the cut pieces can be reduced, and re-adhesion of the cut pieces can be suppressed. This allows the cut pieces to be peeled off more easily than from the adhesive sheet. Furthermore, if the foaming treatment is performed so strongly that the foaming gas is ejected from the pressure-sensitive adhesive layer, the jet of foaming gas at the time of foaming will add a peeling action, making it easier to peel off the cut pieces. becomes.

実施例 第1図に示したように、本発明の発泡型粘着シート2は
、支持シート40両面に感圧性接着剤層3.3°を設け
たものであり、かつ少な(ともその一方を発泡剤含有感
圧性接着剤層3としたものである。発泡剤含有感圧性接
着剤層3は粉末成形体、例えば未焼結のセラミック板1
を貼着固定するためのものである。他面の感圧性接着剤
層3゜は粘着シート2を台座5等の支持台に固着するた
めのものである。粘着シート2を支持台に固着すること
により、発泡剤含有感圧性接着剤層3に貼着固定した未
焼結のセラミック板1を切断する際に、粘着シート2ひ
いては未焼結のセラミック板lの位置ズレが防止されて
、寸法精度に優れる切断片l゛の形成が可能になる。な
お、自動化された製造ラインなどでは発泡剤含有感圧性
接着剤層3の発泡処理は、支持台より粘着シート2を剥
がした状態で行うのが一般であるので、粘着シート2を
固着する側の感圧性接着剤層3゛は低接着力タイプ、例
えば発泡タイプ、硬化タイプ、低粘着力タイプのもの等
として剥離容易に構成することが望ましい。感圧性接着
剤層3,3°の双方に発泡剤を含有させる場合には、そ
れらの発泡温度を相違させ、感圧性接着剤層3°側の発
泡処理をより低温で行えるように構成することが好まし
い。
Embodiment As shown in FIG. 1, the foamed pressure-sensitive adhesive sheet 2 of the present invention has a pressure-sensitive adhesive layer of 3.3 degrees on both sides of a support sheet 40, and has a small pressure-sensitive adhesive layer (one of which is foamed). The foaming agent-containing pressure-sensitive adhesive layer 3 is a powder compact, for example, an unsintered ceramic plate 1.
It is for pasting and fixing. The pressure sensitive adhesive layer 3° on the other side is for fixing the adhesive sheet 2 to a support such as a pedestal 5. By fixing the adhesive sheet 2 to the support base, when cutting the unsintered ceramic plate 1 adhered and fixed to the foaming agent-containing pressure-sensitive adhesive layer 3, the adhesive sheet 2 and the unsintered ceramic plate l This prevents the positional deviation of the cut piece l' from occurring, making it possible to form a cut piece l' with excellent dimensional accuracy. In addition, in automated manufacturing lines, etc., the foaming treatment of the foaming agent-containing pressure-sensitive adhesive layer 3 is generally performed with the adhesive sheet 2 peeled off from the support base. The pressure-sensitive adhesive layer 3' is preferably of a low adhesive strength type, such as a foaming type, a hardening type, or a low adhesive strength type, so that it can be easily peeled off. When a foaming agent is contained in both pressure-sensitive adhesive layers 3 and 3°, the foaming temperatures thereof should be different so that the foaming treatment on the pressure-sensitive adhesive layer 3° side can be performed at a lower temperature. is preferred.

感圧性接着剤としては例えば、ゴム系ないしアクリル系
等の公知のものを用いることができる。
As the pressure-sensitive adhesive, for example, known rubber-based or acrylic-based adhesives can be used.

より具体的には、例えば天然ゴム、各種の合成ゴム等か
らなるゴム系ポリマ、あるいはアクリル酸ないしメタク
リル酸等のアルキルエステル系ポリマ又はアクリル酸な
いしメタクリル酸等のアルキルエステル約50〜99.
5重量%とこれと共重合可能な他の不飽和単量体約50
〜0.5重量%との共重合体等からなるアクリル系ポリ
マなど、その重量平均分子量が5000〜300000
0のものをベースポリマとし、これに必要に応じてポリ
イソシアネート化合物、アルキルエーテル化メラミン化
合物等の架橋剤を配合したものなどをあげることができ
る。
More specifically, rubber polymers made of natural rubber, various synthetic rubbers, etc., alkyl ester polymers such as acrylic acid or methacrylic acid, or alkyl esters such as acrylic acid or methacrylic acid, for example, about 50 to 99.
5% by weight and about 50% of other unsaturated monomers copolymerizable therewith.
Acrylic polymers made of copolymers with ~0.5% by weight, etc., whose weight average molecular weight is 5,000 to 300,000
Examples include those in which 0 is used as a base polymer, and a crosslinking agent such as a polyisocyanate compound or an alkyl etherified melamine compound is blended therein as necessary.

なお、架橋剤を併用する場合、その配合量はベースポリ
マ100重量部あたり約0.1−10重量部が一般であ
る。
In addition, when a crosslinking agent is used in combination, the amount thereof is generally about 0.1 to 10 parts by weight per 100 parts by weight of the base polymer.

感圧性接着剤層3に配合する、場合によっては感圧性接
着剤層3゛にも配合する発泡剤としては、例えば炭酸ア
ンモニウム、炭酸水素アンモニウム、炭酸水素ナトリウ
ム、亜硝酸アンモニウム、水素化ホウ素ナトリウム、ア
ジド類などで代表される無機系のもの、アゾビスイソブ
チロニトリル、アゾジカルボンアミド、バリウムアゾジ
カルボキシレート等のアゾ系化合物、トルエンスルホニ
ルヒドラジド、ジフェニルスルホン−3,3′−ジスル
ホヒドラジン、4.4’−オキシビス(ヘンゼンスルホ
ヒドラジド)、アリルビス(スルホヒドラジド)等のヒ
ドラジン系化合物、ρ−トルイレンスルホニルセミカル
バジド、4,4″−オキシビス(ベンゼンスルホニルセ
ミカルバジド)等のセミカルバジド系化合物、5−モル
ホリル−1゜2.3.4−チアトリアゾール等のトリア
ゾール系化合物、N、N’−ジニトロソペンタメチレン
テトラミン、N、N’−ジメチル−N、N’−ジニトロ
ソテレフタルアミド等のN−ニトロソ系化合物などで代
表される有機系のもの等、公知のものをあげることがで
きる。なお、発泡剤はマイクロカプセルに封入されたも
のが感圧性接着剤中への分散性などの点で好ましく用い
られる。マイクロカプセル化された発泡剤としては、マ
イクロスフェア−(F −30,F −50,F −7
0;商品名、松本油脂社製)などの市販品をあげること
ができる。
Examples of the foaming agent to be added to the pressure-sensitive adhesive layer 3, or in some cases also to the pressure-sensitive adhesive layer 3', include ammonium carbonate, ammonium hydrogen carbonate, sodium hydrogen carbonate, ammonium nitrite, sodium borohydride, and azide. Inorganic compounds such as azobisisobutyronitrile, azodicarbonamide, barium azodicarboxylate, toluenesulfonylhydrazide, diphenylsulfone-3,3'-disulfohydrazine, 4 .Hydrazine compounds such as 4'-oxybis(henzenesulfohydrazide) and allylbis(sulfohydrazide), semicarbazide compounds such as ρ-toluylenesulfonyl semicarbazide, 4,4''-oxybis(benzenesulfonyl semicarbazide), 5-morpholyl -1゜2.3.4-Triazole compounds such as thiatriazole, N-nitroso compounds such as N,N'-dinitrosopentamethylenetetramine, N,N'-dimethyl-N,N'-dinitrosoterephthalamide, etc. Examples include known foaming agents, such as organic compounds represented by compounds.In addition, foaming agents encapsulated in microcapsules are preferably used from the viewpoint of dispersibility in the pressure-sensitive adhesive. As the microencapsulated foaming agent, microspheres (F-30, F-50, F-7
Commercially available products such as 0; trade name, manufactured by Matsumoto Yushi Co., Ltd.) can be mentioned.

発泡剤の配合量は、上記したベースポリマ100重量部
あたり5〜300重量部が一般であるが、第5図のよう
に使用発泡剤の種類、あるいは加熱条件等により発泡特
性が比較的太き(異なるので適宜に決定され、これに限
定されない。一般に、感圧性接着剤層3の嵩が発泡で2
倍以上になる量を配合することが粉末成形体を貼着する
側としては適当である。また、100〜15o℃の約1
分間程度の加熱で粉末成形体貼着側の発泡処理が完了す
るように系を設定することが好ましい。
The amount of foaming agent blended is generally 5 to 300 parts by weight per 100 parts by weight of the above-mentioned base polymer, but as shown in Figure 5, foaming properties may vary depending on the type of foaming agent used, heating conditions, etc. (The volume of the pressure-sensitive adhesive layer 3 is approximately 20% due to foaming, and is not limited to this.)
It is appropriate to mix in an amount that is more than double the amount for the side to which the powder molded body is attached. Also, about 1 at 100-15oC
It is preferable to set the system so that the foaming treatment on the side to which the powder molded body is attached is completed by heating for about a minute.

支持シート4としては、強度等の点よりポリエステルフ
ィルムやポリプロピレンフィルムなどの比較的硬くて自
己支持性を有するフィルムが好ましく、その厚さはlO
〜50hiが適当である。
As the support sheet 4, a relatively hard self-supporting film such as a polyester film or a polypropylene film is preferable from the viewpoint of strength, and the thickness thereof is 1O2.
~50hi is appropriate.

本発明の発泡型粘着シートは、粉末成形体の切断片の製
造に用いられる。適用対象とされる粉末成形体について
は特に限定はない。本発明では平坦な状態とした粘着シ
ートの上に粉末成形体を載置固定する方式がとれるので
、上記したシート法で形成された未焼結のセラミックシ
ートに内部電極を印刷しながら、これを発泡剤含有感圧
性接着剤層の上に位置精度よ(順次積層し、得られた積
層物を圧着して例えばセラミックコンデンサ形成用等の
積層板としたセラミック板などに対しても好ましく適用
することができる。
The foamed pressure-sensitive adhesive sheet of the present invention is used for producing cut pieces of powder compacts. There are no particular limitations on the powder compact to which the present invention can be applied. In the present invention, the powder compact is placed and fixed on a flat adhesive sheet, so internal electrodes are printed on the unsintered ceramic sheet formed by the sheet method described above. It is also preferably applied to ceramic plates, etc., which are laminated in sequence on a foaming agent-containing pressure-sensitive adhesive layer and pressed together to form a laminated plate for forming a ceramic capacitor. Can be done.

本発明の発泡型粘着シートを用いて粉末成形体の切断片
を得る方法の代表例としては、未焼結のセラミック板の
場合を例に次の方法があげられる。
A representative example of a method for obtaining cut pieces of a powder compact using the foamed pressure-sensitive adhesive sheet of the present invention is the following method using an unsintered ceramic plate as an example.

すなわち、粘着シート2をその所定側の感圧性接着剤層
3゛を介して台座5に固着したのち、未焼結のセラミッ
ク板1を粘着シート2の発泡剤含有感圧性接着剤層3に
貼着固定しく第1図)、所定の大きさに切断する(第2
図)。切断手段については特に限定はなく、例えば回転
刃方式、ナイフによる切り込み方式など公知の手段が用
いられる。切断に際しては得られた切断片l°を剥離し
ゃす(するため、発泡剤含有感圧性接着剤層3も含めて
切断することが好ましい。ただし、後続の発泡処理を円
滑に行うため、粘着シートにおける支持シート4は分断
しないで少な(とも一体化の状態に残しておくことが好
ましいく第2図参照)。
That is, after the adhesive sheet 2 is fixed to the pedestal 5 via the pressure-sensitive adhesive layer 3' on a predetermined side thereof, the unsintered ceramic plate 1 is attached to the foaming agent-containing pressure-sensitive adhesive layer 3 of the adhesive sheet 2. (Fig. 1) and cut it to the specified size (Fig. 2).
figure). There are no particular limitations on the cutting means, and known means such as a rotary blade method or a cutting method using a knife may be used. When cutting, it is preferable to peel off the obtained cut piece l° (in order to do so, the foaming agent-containing pressure-sensitive adhesive layer 3 is also cut). However, in order to perform the subsequent foaming process smoothly, The support sheet 4 is not divided into parts (it is preferable to leave it in an integrated state, see FIG. 2).

ついで、台座5より粘着シート2を剥がしたのち、切断
片l゛を貼着した状態の発泡剤含有感圧性接着剤層3を
発泡処理する(第3図)。これにより、その表面が凹凸
化されて有効接着面積が減少し、切断片1°に対する接
着力が低下する。また、切断片l゛の再接着が抑制され
る。なお、発泡処理に際しては、発泡時の発泡ガスを切
断片l°に噴射させて粘着シートよりの剥離をより容易
とすべく、発泡ガスが感圧性接着剤層より噴出す゛る程
度に強(発泡処理してもよい。
Then, after peeling off the adhesive sheet 2 from the base 5, the foaming agent-containing pressure-sensitive adhesive layer 3 to which the cut piece l' is attached is subjected to foaming treatment (FIG. 3). As a result, the surface becomes uneven, the effective bonding area decreases, and the bonding force for a cut piece of 1° decreases. Furthermore, readhesion of the cut pieces l' is suppressed. In addition, during the foaming process, in order to inject the foaming gas onto the cut piece 1° during foaming and make it easier to peel off from the adhesive sheet, the foaming process should be done so strongly that the foaming gas is ejected from the pressure-sensitive adhesive layer (foaming process). You may.

ついで、粘着シート2を反転させて発泡処理を終えた感
圧性接着剤層3上の切断片l°を強制自動的に剥離する
(第4図)。本発明においては、粘着シート2を反転さ
せる際に切断片l°に作用する程度の剥離力で充分に剥
離することができる。なお、切断片に接触して強制剥離
する方式は切断片に変形や破損を与えやすいので好まし
くない。
Then, the adhesive sheet 2 is turned over and the cut pieces 1° on the pressure-sensitive adhesive layer 3 that have undergone the foaming process are forcibly and automatically peeled off (FIG. 4). In the present invention, sufficient peeling can be achieved with a peeling force that acts on the cut piece l° when the adhesive sheet 2 is reversed. Note that the method of forcibly peeling off the cut piece by contacting it is not preferable because it tends to deform or damage the cut piece.

以上のようにして、未焼結のセラミック板の切断片が得
られる。
In the manner described above, a cut piece of an unsintered ceramic plate is obtained.

ちなみに、次の実施例の粘着シートを上記した方式に適
用した場合の結果は、下記のものであった。
Incidentally, when the pressure-sensitive adhesive sheet of the following example was applied to the above method, the results were as follows.

すなわち、アクリル酸ブチル100部(重量部、以下同
様)、アクリル酸2部からなる共重合体く重量平均分子
量約80万)100部、ポリイソシアネート系架橋剤2
部、マイクロスフェア−(F −30) 30部、アン
モニア水(濃度25%)5部及び水10部を溶剤を用い
て混合調製した発泡剤含有感圧性接着剤を、厚さ100
μmのポリエステルフィルムの易接着処理した片面に乾
燥後の厚さが30μIとなるように塗布すると共に、該
フィルムの他面に、アクリル酸ブチル100部、アクリ
ロニトリル15部、アクリル酸2部からなる共重合体く
重量平均分子量約80万)100部、ジオクチルフタレ
ート10部、リン酸エステル系界面活性剤0.5部を溶
剤を用いて混合調製した感圧性接着剤を乾燥後の厚さが
l Oumとなるように塗布し、70℃で5分間乾燥処
理して粘着シートを作製し、得られた粘着シートをその
感圧性接着剤側を介してアルミニウム製台座に貼着して
固定したのち発泡剤含有感圧性接着剤層の上に、合計6
5部のBaTiO3とCaTiO3,15部のメチルメ
タクリレート系共重合体及び合計20部のドルオールと
ブタノールの組成からなり、厚さ0.05m、大きさ1
00聰X100mのセラミックコンデンサ形成用のシー
トの定位置に内部電極を印刷しながら、その20枚を順
次重ね置いたのち100 kl/ cjの力で押圧し未
焼結のセラミック板とした。ついで、そのセラミック板
をカッターでポリエステルフィルム部分まで切り込みな
がら大きさ1.5+mX2.5m+角のチップに切断し
、切断後、台座より粘着シートを剥がして切断片を貼着
したままの状態で130℃で1分間加熱発泡処理した。
That is, 100 parts of butyl acrylate (parts by weight, the same applies hereinafter), 100 parts of a copolymer (weight average molecular weight approximately 800,000) consisting of 2 parts of acrylic acid, 2 parts of a polyisocyanate crosslinking agent.
A foaming agent-containing pressure-sensitive adhesive prepared by mixing 30 parts of microspheres (F-30), 5 parts of ammonia water (concentration 25%), and 10 parts of water using a solvent was prepared to a thickness of 100 parts.
Coating was applied to one side of a μm polyester film treated for easy adhesion to a dry thickness of 30μI, and the other side of the film was coated with a coating consisting of 100 parts of butyl acrylate, 15 parts of acrylonitrile, and 2 parts of acrylic acid. A pressure-sensitive adhesive prepared by mixing 100 parts of a polymer (with a weight average molecular weight of approximately 800,000), 10 parts of dioctyl phthalate, and 0.5 parts of a phosphoric acid ester surfactant using a solvent has a dry thickness of 1 Oum. A pressure-sensitive adhesive sheet was prepared by drying at 70°C for 5 minutes, and the resulting adhesive sheet was fixed on an aluminum base via the pressure-sensitive adhesive side, and then a foaming agent was applied. On top of the included pressure sensitive adhesive layer, a total of 6
It consists of 5 parts of BaTiO3 and CaTiO3, 15 parts of methyl methacrylate copolymer, and a total of 20 parts of doluol and butanol, and has a thickness of 0.05 m and a size of 1.
While printing internal electrodes at fixed positions on sheets for forming ceramic capacitors measuring 100 m x 100 m, 20 sheets were stacked one on top of the other and pressed with a force of 100 kl/cj to form an unsintered ceramic plate. Next, the ceramic plate was cut into chips with a size of 1.5 m x 2.5 m + square using a cutter, cutting down to the polyester film part. After cutting, the adhesive sheet was peeled off from the base and the cut pieces were kept attached at 130°C. The foam was heated and foamed for 1 minute.

ついで、発泡処理した粘着シートを第4図に示した反転
方式の剥離装置に供給し切断片を粘着シートより剥離さ
せた。
Then, the foamed adhesive sheet was fed to an inversion type peeling device shown in FIG. 4, and the cut pieces were peeled off from the adhesive sheet.

得られた切断片は、寸法精度に優れるものであり、また
変形や破損は認められず、歩留まりに優れるものであっ
た。
The obtained cut pieces had excellent dimensional accuracy, no deformation or damage was observed, and the yield was excellent.

発明の効果 本発明の発泡型粘着シートによれば、未焼結のセラミッ
ク板等の粉末成形体の切断片に変形や破損を与えるよう
な剥がし手段を用いないで感圧性接着剤層より切断片を
剥離することができるので、粉末成形体を粘着シートで
固定して切断する方式をとることが可能となる。
Effects of the Invention According to the foamed pressure-sensitive adhesive sheet of the present invention, cut pieces of a powder compact such as an unsintered ceramic plate can be removed from a pressure-sensitive adhesive layer without using a peeling means that would deform or damage the cut pieces. Since the powder can be peeled off, it is possible to fix the powder compact with an adhesive sheet and cut it.

その結果、前記方式に基づいて粉末成形体を、これに変
形や破損を与えずに強固に、かつ位置精度よ<、シかも
容易に保持できて、切断時における粉末成形体の位置ず
れを有効に防止することができ、さらに発泡処理に要す
る時間が短いことも加わって、粉末成形体の切断片を寸
法精度よく、しかも歩留まりよく、効率的に製造するこ
とができ、本発明の実用的意義は大きい。
As a result, based on the above-mentioned method, it is possible to easily hold the powder compact without deforming or damaging it, and with good positional accuracy. Furthermore, in addition to the fact that the time required for the foaming process is short, it is possible to efficiently produce cut pieces of powder compacts with high dimensional accuracy and high yield, which is the practical significance of the present invention. is big.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は片面にセラミック板を貼着固定すると共に、他
面が台座に固着された状態の発泡型粘着シートの断面図
、第2図はセラミック板を切断した状態の説明断面図、
第3図は感圧性接着剤層を発泡処理した状態の説明断面
図、第4図は粘着シートを反転させて切断片を剥離する
状態の説明断面図、第5図はマイクロスフェアの発泡特
性を示したグラフである。 1:未焼結のセラミック板 1°:切断片 2:発泡型粘着シート 3:発泡剤含有感圧性接着剤層 3゛:感圧性接着剤層 4:支持シート 5:台座
Fig. 1 is a cross-sectional view of a foam adhesive sheet with a ceramic plate adhered and fixed on one side and the other side fixed to a pedestal, Fig. 2 is an explanatory cross-sectional view of the ceramic plate cut away,
Fig. 3 is an explanatory cross-sectional view of the pressure-sensitive adhesive layer after foaming treatment, Fig. 4 is an explanatory cross-sectional view of the state in which the adhesive sheet is reversed and the cut pieces are peeled off, and Fig. 5 shows the foaming characteristics of the microspheres. This is the graph shown. 1: Unsintered ceramic plate 1°: Cut piece 2: Foamed adhesive sheet 3: Foaming agent-containing pressure-sensitive adhesive layer 3: Pressure-sensitive adhesive layer 4: Support sheet 5: Pedestal

Claims (1)

【特許請求の範囲】 1、支持シートの片面に粉末成形体を貼着固定するため
の発泡剤含有感圧性接着剤層を有し、他面に支持台に固
着するための感圧性接着剤層を有する両面粘着シートか
らなり、前記の発泡剤含有感圧性接着剤層に貼着固定さ
れた粉末成形体を切断して得た切断片を、発泡処理下に
剥離しうるようにした発泡型粘着シート。 2、マイクロカプセル化された発泡剤を含有する特許請
求の範囲第1項記載の粘着シート。
[Claims] 1. A pressure-sensitive adhesive layer containing a foaming agent for adhering and fixing the powder compact on one side of the support sheet, and a pressure-sensitive adhesive layer on the other side for adhering to the support base. A foamed adhesive which is made of a double-sided adhesive sheet having a double-sided adhesive sheet and is capable of peeling off cut pieces obtained by cutting a powder compact adhered and fixed to the above-mentioned foaming agent-containing pressure-sensitive adhesive layer under foaming treatment. sheet. 2. The pressure-sensitive adhesive sheet according to claim 1, which contains a microencapsulated foaming agent.
JP62094908A 1987-04-17 1987-04-17 Foam adhesive sheet Expired - Lifetime JP2613389B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62094908A JP2613389B2 (en) 1987-04-17 1987-04-17 Foam adhesive sheet

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62094908A JP2613389B2 (en) 1987-04-17 1987-04-17 Foam adhesive sheet

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP17485786A Division JPS6330205A (en) 1986-07-25 1986-07-25 Method for manufacturing ceramic board cut pieces

Publications (2)

Publication Number Publication Date
JPS6333487A true JPS6333487A (en) 1988-02-13
JP2613389B2 JP2613389B2 (en) 1997-05-28

Family

ID=14123112

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62094908A Expired - Lifetime JP2613389B2 (en) 1987-04-17 1987-04-17 Foam adhesive sheet

Country Status (1)

Country Link
JP (1) JP2613389B2 (en)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5609954A (en) * 1991-08-14 1997-03-11 Nitto Denko Corporation Strippable pressure-sensitive adhesive and adhesive material using the same
US6200537B1 (en) * 1997-07-10 2001-03-13 Takashi Watanabe Fuel-reforming sheet and method of manufacture thereof
EP1201724A4 (en) * 1999-06-10 2002-09-25 Nitta Corp Pressure-sensitive adhesive tape for provisionally fixing green sheet for ceramic electronic part and process for producing ceramic electronic part
US6864295B2 (en) 2002-07-23 2005-03-08 Asahi Kasei Chemicals Corporation Gas-generating, pressure-sensitive adhesive composition
US7067030B2 (en) * 1998-09-30 2006-06-27 Nitto Denko Corporation Heat-peelable adhesive sheet
JP2006241387A (en) * 2005-03-07 2006-09-14 Nitta Ind Corp Adhesive sheet and method for producing multilayer ceramic electronic component
US7163597B2 (en) 1999-11-08 2007-01-16 Nitto Denko Corporation Heat-peelable pressure-sensitive adhesive sheet
US7718257B2 (en) 2000-11-08 2010-05-18 Nitto Denko Corporation Heat-peelable pressure-sensitive adhesive sheet
JP2010214947A (en) * 2009-02-23 2010-09-30 Nitto Denko Corp Heat-peelable pressure-sensitive adhesive sheet for cutting laminated ceramic sheet and method for cut-processing laminated ceramic sheet
EP2680323A1 (en) 2012-06-28 2014-01-01 Nitto Denko Corporation Method for manufacturing a light-emitting diode (LED)
EP2680324A1 (en) 2012-06-28 2014-01-01 Nitto Denko Corporation Method of manufacturing a LED
EP2680325A2 (en) 2012-06-28 2014-01-01 Nitto Denko Corporation Method of manufacturing a light emitting diode

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5661468A (en) * 1979-10-23 1981-05-26 Matsumoto Yushi Seiyaku Kk Releasable adhesive
JPS5988816A (en) * 1982-11-12 1984-05-22 日本電気ホームエレクトロニクス株式会社 Method of producing laminated ceramic part

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5661468A (en) * 1979-10-23 1981-05-26 Matsumoto Yushi Seiyaku Kk Releasable adhesive
JPS5988816A (en) * 1982-11-12 1984-05-22 日本電気ホームエレクトロニクス株式会社 Method of producing laminated ceramic part

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5609954A (en) * 1991-08-14 1997-03-11 Nitto Denko Corporation Strippable pressure-sensitive adhesive and adhesive material using the same
US6200537B1 (en) * 1997-07-10 2001-03-13 Takashi Watanabe Fuel-reforming sheet and method of manufacture thereof
US7175728B2 (en) 1998-09-30 2007-02-13 Nitto Denko Corporation Heat-peelable adhesive sheet
US7067030B2 (en) * 1998-09-30 2006-06-27 Nitto Denko Corporation Heat-peelable adhesive sheet
EP1201724A4 (en) * 1999-06-10 2002-09-25 Nitta Corp Pressure-sensitive adhesive tape for provisionally fixing green sheet for ceramic electronic part and process for producing ceramic electronic part
US7163597B2 (en) 1999-11-08 2007-01-16 Nitto Denko Corporation Heat-peelable pressure-sensitive adhesive sheet
US7718257B2 (en) 2000-11-08 2010-05-18 Nitto Denko Corporation Heat-peelable pressure-sensitive adhesive sheet
US6864295B2 (en) 2002-07-23 2005-03-08 Asahi Kasei Chemicals Corporation Gas-generating, pressure-sensitive adhesive composition
JP2006241387A (en) * 2005-03-07 2006-09-14 Nitta Ind Corp Adhesive sheet and method for producing multilayer ceramic electronic component
JP2010214947A (en) * 2009-02-23 2010-09-30 Nitto Denko Corp Heat-peelable pressure-sensitive adhesive sheet for cutting laminated ceramic sheet and method for cut-processing laminated ceramic sheet
EP2680323A1 (en) 2012-06-28 2014-01-01 Nitto Denko Corporation Method for manufacturing a light-emitting diode (LED)
EP2680324A1 (en) 2012-06-28 2014-01-01 Nitto Denko Corporation Method of manufacturing a LED
EP2680325A2 (en) 2012-06-28 2014-01-01 Nitto Denko Corporation Method of manufacturing a light emitting diode

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