JPS6381838A - Cooling element and manufacture thereof - Google Patents

Abstract

(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed description of the invention] [Industrial application field] The present invention has excellent heat dissipation characteristics, high mechanical strength, and
The present invention relates to a cooling body with high productivity, and also relates to a method for manufacturing a cooling body that allows the cooling body to be manufactured in a simple process.

[Conventional technology]

As a conventional cooling body, for example, there is one shown in FIGS. 1 is provided. Figure 4 (a
In Fig. 1, the radiation fin 1 is planar, but in Fig. 4 (bl
In addition to the planar heat dissipation fins 1, there are branch fins 1a branched to the sides.

In the above configuration, this is
By attaching it to a circuit element such as the above and placing it under forced air cooling, the heat generated in the circuit element is dissipated, and the circuit element can be made smaller and have a higher power consumption. Naturally, Fig. 4 fb)
As shown in Fig. 4, the heat dissipation surface area is larger than that of the AlO material, so superior heat dissipation characteristics can be obtained.

FIG. 5 shows another conventional cooling body, in which, for example, a copper base material 2 is fixed with a copper heat dissipating fin 1 by solder 3 to be integrated.

According to this cooling body, the heat dissipation fins 1 can be made larger and higher, and the intervals between them can be narrowed, so that better heat dissipation characteristics can be obtained.

[Problem that the invention seeks to solve]

However, according to the cooling body shown in Fig. 4 fal, (b), it is difficult to reduce the thickness of the heat dissipation fins 1 and the interval between them, and to increase their length in terms of extrusion processing, so the heat dissipation There is a limit to the improvement of the characteristics (cooling capacity), and although it is possible to eliminate these five points using the cooling body shown in Fig. 5, the mechanical strength of the radiation fins 1 is weak, so The radiation fins 1 may be bent during attachment to circuit elements or device assembly, and since the radiation fins 1 are fixed one by one with solder, productivity is low.

Means for Solving Problem C] The present invention has been made in view of the above, and in order to improve heat dissipation characteristics, increase mechanical strength, and increase productivity, a corrugated thin heat dissipation fin is provided. In order to manufacture the cooling body in a simple process, thin fin material is formed into a corrugated shape and then fixed to the base material by brazing or adhesive. The present invention provides a method for manufacturing a cooling body.

Hereinafter, the cooling body of the present invention and its manufacturing method will be explained in detail.

〔Example〕

FIG. 1 shows an embodiment of the cooling body of the present invention, in which solder 3 is attached to a base material 2 made of copper, for example, and having side walls 2a on both sides.
A corrugated thin heat dissipating fin 4 made of, for example, copper is fixed via the (corrugated folded part 4a on one side is fixed). The side wall 2a of the base material 2 is approximately equal in height to the radiation fin 4, and protects the radiation fin 4 from the side surface in addition to the manufacturing reason described later.

FIG. 2 (aj, mountain) shows the method for manufacturing a cooling body of the present invention. Fig. 2(a) shows a half-EB3 plate material placed on a base material 2 having side walls 2a on both sides, and Fig. 2(b) shows a corrugated material with frits 5 provided as needed. Therefore, a heat dissipating fin 4 (4a is a folded portion) is formed. When the radiation fins 4 are inserted into the base material 2 in an elastically narrowed form, the radiation fins 4 spring back and both ends thereof are locked and positioned at the base of the side wall 2a. Place this in a heating furnace (not shown) and solder 3.
By melting the heat dissipating fins 4 and soldering them to the base material 2, and then taking them out of the heating furnace and cooling them, a cooling body having a predetermined configuration is obtained.

In this embodiment, the solder 3 is placed on the base material 2, but the base material 2 may be plated with solder in advance. Further, if the heat dissipation fins 4 are provided with frits 5, the heat dissipation characteristics are further improved, but they may be omitted depending on the case.

FIG. 3 shows a second embodiment of the method for manufacturing a cooling body of the present invention. The parts common to the first embodiment are indicated by the same reference numerals, so redundant explanation will be omitted. A cooling body of a predetermined size is obtained by manufacturing a long body as described above and cutting it into a predetermined length along cutting lines X+ and Xz.

In each of the above embodiments, the base material 2 and the radiation fins 4 are integrated with the solder 3, but an epoxy resin adhesive may also be used. In addition, the base agent 2 and the heat radiation fin 4
is not limited to copper. Further, the height of the side wall 23 does not need to be approximately equal to the height of the radiation fin 4, and may be lowered to half or less depending on the application.

[Effects of the Invention] As explained above, according to the cooling body of the present invention, since the corrugated thin heat dissipation fins are fixed to the base material, the heat dissipation characteristics are improved, mechanical strength is increased, and productivity is increased. In addition, according to the method for manufacturing a cooling body of the present invention, the thin fin material is formed into a corrugated shape and then fixed to the base material by brazing or adhesive, so it is a simple process. The cooling body can be manufactured.

[Brief explanation of the drawing]

FIG. 1 is a sectional view showing one embodiment of the cooling body of the present invention, and FIG.
Figures (a) and (b) are explanatory diagrams showing a first embodiment of the method for manufacturing a cooling body of the present invention, and Fig. 3 is an explanatory diagram showing a second embodiment of the method for manufacturing a cooling body of the present invention. , Fig. 4 (al, (bl
and FIG. 5 is an explanatory diagram showing a conventional cooling body. Explanation of symbols 2-1---Base material 2a---Side wall 3-
・---One solder 4---Corrugated heat dissipating fin 4a---Folded part Patent applicant Hitachi Cable Co., Ltd. Agent
Patent Attorney Taira 1) Tadashio 2---Base material 2-1---Side wall 3---Solder 4---Corrugated radiation fin 4a---・・・
...-folded part 2a = 1st)! I a Fig. 3 2 ------- Base material 2 a - Side wall 3 - Solder Fig. 4 Fig. 5

Claims (3)

[Claims] (1) A cooling body comprising a corrugated thin radiation fin and a base material that integrates the radiation fin by fixing a corrugated folded portion on one side of the radiation fin. (2) The cooling body according to claim 1, wherein the base material has side walls of a predetermined height on both sides. (3) A step of forming a thin radiation fin material into a corrugated shape, a step of manufacturing a base material having side walls of a predetermined height on both sides, and a step of narrowing the corrugated radiation fin material to form the base material. A method for manufacturing a cooling body, comprising the steps of: sandwiching the radiation fin material between the side walls of the cooling body; and fixing a corrugated folded portion of one side of the radiation fin material to the base material.