JPWO2011077477A1 - Display device and manufacturing method thereof - Google Patents

Abstract

The display device includes a plurality of pixel portions 100a to 100c,. Each organic light emitting layer of each pixel unit 100a to 100c,... Is partitioned by banks 105a to 105f,. Pixel portions 100c and 100d that are located on the panel outer peripheral portion (end of pixel array) side and are adjacent to each other in the X-axis direction are extracted. At this time, in the bank 105c that partitions the organic light emitting layer of the pixel portion 100c and the organic light emitting layer of the pixel portion 100d, the inclination angle θca of the side surface portion 105ca corresponding to the organic light emitting layer of the pixel portion 100c is more The inclination angle θcb of the side surface portion 105cb corresponding to the organic light emitting layer of 100d is larger.

Description

  The present invention relates to a display device and a manufacturing method thereof, and more particularly to a display device including an organic light emitting layer and a manufacturing method thereof.

  In recent years, research and development of display devices using the electroluminescence phenomenon of organic materials have been promoted. In this display device, each pixel portion includes an anode electrode and a cathode electrode, and an organic light emitting layer interposed therebetween. In driving the display device, holes are injected from the anode electrode, electrons are injected from the cathode electrode, and light is emitted by recombination of holes and electrons in the organic light emitting layer.

  The organic light emitting layers of adjacent pixel portions are partitioned by a bank made of an insulating material. The organic light emitting layer is formed, for example, by dropping ink containing an organic light emitting material in each region partitioned by the bank and drying the ink.

  However, there is a problem that it is difficult to make the film thickness of the organic light emitting layer formed as described above uniform.

  Here, in order to make the film thickness of the organic light emitting layer uniform, for example, an invention proposed in Patent Document 1 is described in which a convex portion is provided on the inner surface of the bank, thereby controlling the pinning position of the ink. Yes. That is, by adopting the technique proposed in Patent Document 1, it is possible to pin the convex portion where the pinning position is formed when the ink in one pixel portion is dropped. Uniformity can be ensured.

JP 2007-31235 A

  By the way, with respect to the entire area of the panel of the display device (center part, outer peripheral part), the technique proposed by the above-mentioned Patent Document 1 is adopted, and fine convex portions are formed on the inner surface of the bank with high accuracy according to the panel area. It is considered difficult to do. For this reason, it is not easy to make the thickness of the organic light emitting layer uniform in the entire panel area of the display device (central tail portion, outer peripheral portion).

  The present invention has been made to solve the above-described problems, and aims to make the film thickness of the organic light-emitting layer uniform in the pixel portion located on the outer periphery of the panel, and to provide a display device with less luminance unevenness in the panel surface. It aims at providing the manufacturing method.

  Thus, a display device according to one embodiment of the present invention employs the following structure.

  In the display device according to one embodiment of the present invention, a plurality of pixel portions are arranged. Each pixel portion is interposed between the first electrode and the second electrode, and the first electrode and the second electrode. And an organic light emitting layer. In the display device according to one embodiment of the present invention, a plurality of banks are provided above the first electrode to partition the organic light emitting layer for each pixel portion. The plurality of pixel portions include a first pixel portion and a second pixel portion that are located on the end side of the pixel array and are adjacent to each other in the direction of the pixel array. A first bank is included to partition the organic light emitting layer of the first pixel portion and the organic light emitting layer of the second pixel portion.

  In the display device according to one embodiment of the present invention, in the first bank, the first side surface portion corresponding to the first pixel portion has a larger inclination angle than the second side surface portion corresponding to the second pixel portion. Features.

  In the display device according to one embodiment of the present invention, in the first bank formed on the end portion side of the pixel array, the inclination angle of the first side surface portion corresponding to the first pixel portion corresponds to the second pixel portion. Since the inclination angle is larger than the inclination angle of the two side surface portions, the pinning position when the ink is dropped at the time of manufacture is higher in the first side surface portion than in the second side surface portion. For this reason, in the drying process, the film thickness corresponding to the first side surface portion in the organic light emitting layer of the first pixel portion is thinner than the film thickness corresponding to the second side surface portion in the organic light emitting layer of the second pixel portion. There is a tendency to try.

  On the other hand, as described above, due to the non-uniform vapor concentration distribution, the thickness of the organic light emitting layer after drying is higher in the portion corresponding to the first side surface portion in the first pixel portion than in the second pixel portion. Tend to be thicker than the portion corresponding to the second side surface portion. Therefore, in the display device according to one embodiment of the present invention, the effect of increasing the film thickness of the organic light emitting layer in the portion corresponding to the first side surface portion due to the nonuniformity of the vapor concentration distribution is Since the film thickness is reduced by increasing the inclination angle of one side surface, the film shape of the organic light emitting layer in the end side pixel portion can be made uniform.

  Accordingly, in the display device according to one embodiment of the present invention, the film shape of the organic light emitting layer in the pixel portion located on the outer periphery of the panel is made uniform, and luminance unevenness is reduced.

It is a block diagram which shows schematic structure of the display apparatus 1 which concerns on embodiment. 3 is a schematic cross-sectional view showing a pixel unit 100 in the display panel 10. FIG. 3 is a schematic plan view showing a bank 105 in the display panel 10. FIG. 3 is a schematic cross-sectional view illustrating a structure of banks 105a to 105f for each of pixel portions 100a to 100c in the display panel 10. FIG. (A) is a schematic cross-sectional view showing the pinning position when the taper angle of the bank side surface portion is small, (b) is a schematic cross-sectional view showing the pinning position when the taper angle of the bank side surface portion is large, (C) is a schematic cross-sectional view showing the state of the organic light emitting layer after drying when the taper angle of the bank side surface is small, and (d) is the organic after drying when the taper angle of the bank side surface is large. It is a schematic cross section which shows the state of a light emitting layer. It is a figure which shows collectively the relationship between the inclination-angle (taper angle) (theta) of a bank, pinning height H, and the film thickness T of an organic light emitting layer. It is a figure which shows the film thickness distribution of the organic light emitting layer in the samples 1-3. It is a figure which shows the film thickness distribution of the organic light emitting layer in the samples 4 and 5. FIG. (A)-(c) is a schematic cross section which shows the principal part process in the manufacturing method of the display panel 10 in order. (A)-(c) is a schematic cross section which shows the principal part process in the manufacturing method of the display panel 10 in order. 10 is a schematic cross-sectional view showing main processes in a manufacturing method according to Modification 1. FIG. (A)-(b) is a schematic cross section which shows the principal part process in the manufacturing method which concerns on the modification 2 in order. (A)-(b) is a schematic cross section which shows the principal part process in the manufacturing method which concerns on the modification 2 in order. (A) is a figure which shows the relationship between exposure / development processing and the taper angle of a bank, (b) is AFM which shows the shape of the formed bank. 3 is an external perspective view showing an example of an external appearance of a set including the display device 1. FIG. 14 is a schematic plan view showing a structure of a bank 305 included in a display panel 30 according to Modification 3. FIG. (A) is a schematic cross section which shows the organic light emitting layer in the display panel which concerns on a prior art, (b) is a figure which shows the film thickness uniformity distribution of the organic light emitting layer for every area | region of a display panel. . It is a schematic cross section which shows the vapor concentration distribution in the drying process at the time of formation of an organic light emitting layer. It is a schematic cross section for demonstrating the mechanism of the bias | inclination of the film | membrane shape in a drying process.

[Outline of One Embodiment of the Present Invention]
In the display device according to one embodiment of the present invention, a plurality of pixel portions are arranged. Each pixel portion is interposed between the first electrode and the second electrode, and the first electrode and the second electrode. And an organic light emitting layer. In the display device according to one embodiment of the present invention, a plurality of banks are provided above the first electrode to partition the organic light emitting layer for each pixel portion. The plurality of pixel portions include a first pixel portion and a second pixel portion that are located on the end side of the pixel array and are adjacent to each other in the direction of the pixel array. A first bank is included to partition the organic light emitting layer of the first pixel portion and the organic light emitting layer of the second pixel portion.

  In the display device according to one embodiment of the present invention, in the first bank, the first side surface portion corresponding to the first pixel portion has a larger inclination angle than the second side surface portion corresponding to the second pixel portion. Features.

  In the display device according to one embodiment of the present invention, in the first bank that partitions between adjacent pixel portions located on the end side of the pixel array, the inclination angle of the first side surface portion is relative to the inclination angle of the second side surface portion. Since it is large, when the ink is dropped in the step of forming the organic light emitting layer, the pinning position on the first side surface portion becomes higher than the pinning position on the second side surface portion. Specifically, the pinning position at the first side surface portion having a relatively large inclination angle is higher than the pinning position at the second side surface portion having a relatively small inclination angle. The thickness of the organic light emitting layer after drying is such that the film thickness of the organic light emitting layer corresponding to the first side surface portion in the first bank is greater than the film thickness of the organic light emitting layer corresponding to the second side surface portion. Try to be thin.

  From the above, the effect of increasing the film thickness at the portion due to the movement of the solvent to reduce the surface free energy during drying is due to the inclination angle of the first side surface portion being larger than that of the second side surface portion. The film thickness is reduced by the change of the pinning position, and the film shape of the organic light emitting layer is made uniform in the entire pixel portion including the pixel portion on the end side of the pixel array.

  Therefore, in the display device according to one embodiment of the present invention, the thickness of the organic light-emitting layer is uniformized in all the pixel portions, and luminance unevenness is reduced.

    In the display device according to one embodiment of the present invention, in the above structure, a third pixel portion and a fourth pixel portion that are located on the center side of the pixel array and are adjacent to each other in the direction of the pixel array are extracted. Try. At this time, the plurality of banks include a second bank that partitions the organic light emitting layer of the third pixel portion and the organic light emitting layer of the fourth pixel portion. In such a configuration, the inclination angle of the third side surface portion corresponding to the third pixel portion in the second bank and the fourth side surface portion corresponding to the fourth pixel portion in the second bank are equal to each other. It is possible to adopt a configuration that is formed as described above.

  As shown in FIGS. 17A and 17B, the film thicknesses of the organic light emitting layers 906a and 906b in the pixel portion are substantially uniform in the center portion of the panel (center side in the pixel array). Yes. For this reason, the film thickness of the organic light emitting layer of the pixel portion located on the center side of the pixel array can be kept uniform by equalizing the inclination angles of the third side surface portion and the fourth side surface portion. It becomes.

  Note that “equal” in the above does not mean that the numerical values are completely equal, but considers a dimensional error in manufacturing the display device. Specifically, the inclination angles of the third side surface portion and the fourth side surface portion are made equal to each other within a range where the difference in luminance efficiency (luminance unevenness) of the plurality of pixel portions in the entire panel is practically acceptable. means.

  Furthermore, in the display device according to one embodiment of the present invention, in the above structure, the plurality of banks includes a third bank that partitions the organic light emitting layer of the second pixel portion on the end side of the pixel array. A configuration in which the fifth side surface portion corresponding to the second pixel portion in the third bank has a larger inclination angle than the second side surface portion can be employed. In the case of adopting such a configuration, the film thickness of the organic light emitting layer of the second pixel portion is suppressed from being increased by the above relationship even in the portion corresponding to the fifth side surface portion, and the entire pixel portion is The thickness of the organic light emitting layer can be made uniform.

  In the display device according to one embodiment of the present invention, in the above structure, the inclination angle of the first side surface portion is set in a range of 35 [°] or more and 40 [°] or less, and the inclination angle of the second side surface portion is 25. As an example, it can be set within the range of [°] to 30 [°]. If the first side surface portion and the second side surface portion are formed with an inclination angle in such a range, the film thickness (film shape) of each organic light emitting layer is surely uniform over the entire single unit side pixel unit. Can be

  In the display device according to one embodiment of the present invention, in the above structure, the inclination angles of the third side surface portion and the fourth side surface portion are both in the range of 25 [°] to 30 [°]. As an example. If the third side surface portion and the fourth side surface portion are formed with an inclination angle in such a range, the thickness of the organic light emitting layer in the central pixel portion can be made uniform as a whole.

  In the above, the “inclination angle” means each side surface portion of the bank and the underlying layer on which the bank is provided (the first electrode, the hole injection layer, the hole transport layer, and the hole injection transport layer) The angle formed by the top surface of

  A method for manufacturing a display device according to one embodiment of the present invention is a method for manufacturing a display device in which a plurality of pixel portions are arranged, and includes the following steps.

  (First Step) A functional layer including the first electrode is formed on the substrate.

  (Second Step) A photosensitive resist material is laminated on the functional layer.

  (Third Step) The photosensitive resist material laminated in the execution of the second step is subjected to mask exposure and patterned to form a plurality of openings corresponding to a plurality of pixel portions, and between adjacent openings. A plurality of banks to be partitioned are formed.

  (4th process) An organic light emitting material is dripped and dried with respect to each of several opening part, and an organic light emitting layer is formed.

  (5th process) A 2nd electrode is formed above an organic light emitting layer.

  In the method for manufacturing a display device according to one embodiment of the present invention, the plurality of openings are both positioned on the end side of the pixel array and are adjacent to each other in the pixel array direction. The plurality of banks includes a first bank that partitions the organic light emitting layers of the first opening and the second opening.

  In the third step, the inclination angle of the first side surface portion corresponding to the first opening in the first bank is equal to the side surface portion corresponding to the second opening in the first bank (hereinafter, for simplicity, “ The first bank is formed so as to increase with respect to the inclination angle of “second side surface portion”.

  By adopting such a manufacturing method, it is possible to manufacture a display device in which the inclination angle of the first side surface portion in the first bank has a large relationship with the inclination angle of the second side surface portion. In the display device manufactured by using such a method, as described above, the pinning position when ink is dropped on the end side opening at the time of manufacturing is the second side surface portion at the first side surface portion. From the relationship between the pinning position and the film thickness as described above, the film thickness of the organic light emitting layer can be made uniform, and the luminance unevenness can be reduced.

  Therefore, in the method for manufacturing a display device according to one embodiment of the present invention, the thickness of the organic light-emitting layer in the pixel portion at the outer peripheral portion of the panel (at the end of the pixel array) is made uniform, and uneven luminance in the surface is reduced. Fewer display devices can be manufactured.

  In the method for manufacturing a display device according to one aspect of the present invention, in the above configuration, when the third step is performed, the exposure amount to the photosensitive resist material in the portion corresponding to the first side surface portion is set to the second side surface. As an example, a configuration in which the inclination angle of the first side surface portion is made larger than the inclination angle of the second side surface portion by increasing the exposure amount of the portion corresponding to the portion to the photosensitive resist material. Can be adopted.

  In the method for manufacturing a display device according to one embodiment of the present invention, in the above configuration, when performing the third step, the light transmittance of the portion corresponding to the first side surface portion corresponds to the second side surface portion. Adopting a configuration in which the inclination angle of the first side surface portion is made larger than the inclination angle of the second side surface portion by performing exposure using a mask having a large relationship with respect to the light transmittance of the portion. Can do. As a result, the tilt angle of the first side surface portion is larger than the tilt angle of the second side surface portion, and a display device with little luminance variation in the surface can be manufactured.

  In the method for manufacturing a display device according to one embodiment of the present invention, when performing the third step, a photosensitive resist material is used for a portion corresponding to the first side surface portion and a portion corresponding to the second side surface portion. After exposure and development, it is possible to adopt a configuration in which an exposure process is additionally performed on a portion corresponding to the first side surface portion. By such a measure, the first bank and the second bank can be formed in which the inclination angle of the first side surface portion is larger than the inclination angle of the second side surface portion.

[Embodiment]
Below, an example of the form for implementing this invention is demonstrated, referring drawings.

  The form used in the following description is an example used for easy understanding of the configuration, operation and effect of the present invention, and the present invention is not limited to the following form other than its essential features. It is not something to receive.

(Background to obtaining the embodiment of the present invention)
As a result of earnest research, the present inventor has obtained the following knowledge regarding the organic light-emitting display device described in (Background Art).

  Usually, as shown in FIG. 17A, the organic light emitting layers 906 a and 906 c are formed between banks 905 erected on a substrate 901.

In this case, as shown in FIG. 17B, the organic light emitting layer 906c in the pixel portion at the outer peripheral portion of the panel tends to be less uniform in film thickness than the organic light emitting layer 906a in the pixel portion at the central portion of the panel. (Parts indicated by two-dot chain lines D ₁ and D ₂ in FIG. 17B). Specifically, the present inventor has confirmed that the surface of the organic light emitting layer is higher in the pixel portion located on the outer periphery of the panel as it goes to the outer periphery of the panel. In FIG. 17B, the horizontal axis indicates the distance from the outer peripheral edge, and the vertical axis indicates the degree of film thickness deviation.

  As a result of repeated studies on the above phenomenon, the present inventor presumed that the decrease in the uniformity of the organic light-emitting layer thickness was caused by non-uniform vapor concentration distribution during ink drying, as will be described below. did. Specifically, as shown in FIG. 18, the vapor concentration in the vicinity of the pixel portions 900b and 900c located on the outer periphery of the panel is lower than the vapor concentration in the vicinity of the pixel portion 900a located in the center of the panel. It has become. Then, due to the uneven vapor concentration distribution, the evaporation rate of the solvent from the dropped ink in the pixel portions 900b and 900c on the outer periphery of the panel becomes non-uniform (encircled by a two-dot chain line in FIG. 18). See section).

  On the other hand, the evaporation rate from the dropped ink in the pixel portion 900a at the center of the panel is substantially uniform.

However, as shown in FIG. 19B, the solvent moves as indicated by the solid line arrow inside the ink 9061c in the middle of drying. In this case, the solvent moves so as to compensate for the evaporated amount (moves so as to minimize the surface free energy), and the solute (organic light emitting material) moves as the solvent moves. Therefore, as shown in FIG. 19 (c), in the pixel portion of the panel outer periphery, the surface profile L ₂ is the organic light emitting layer 906c which raised the more outer is formed.

  As described above, the present inventor relates to an organic light-emitting display device, and the film thickness of the organic light-emitting layer is uniform due to the non-uniformity of the vapor concentration distribution during ink drying on the outer peripheral side and the central side of the panel. I got the inference that the gender declines.

  The inventor makes the pinning position on the bank side surface of the ink different by changing the inclination angle of the bank side surface in the panel surface, and as a result, the film thickness of the organic light emitting layer is made uniform. I found a technical feature.

1. Schematic Configuration of Display Device 1 The overall configuration of the display device 1 according to the present embodiment will be described with reference to FIG.

  As shown in FIG. 1, the display device 1 includes a display panel unit 10 and a drive control unit 20 connected to the display panel unit 10. The display panel unit 10 is an organic EL panel using an electroluminescence phenomenon of an organic material, and a plurality of organic EL elements are arranged and configured.

  The drive control unit 20 is composed of four drive circuits 21 to 24 and a control circuit 25.

  In the actual display device 1, the arrangement of the drive control unit 20 with respect to the display panel unit 10 is not limited to this.

2. Configuration of Display Panel 10 The configuration of the display panel 10 will be described with reference to FIG. The display panel 10 according to the present embodiment employs a top emission type organic EL panel as an example, and emits organic light having one of red (R), green (G), and blue (B). A plurality of pixel portions 100 including layers are arranged and configured in a matrix, but in FIG. 2, one pixel portion 100 is extracted and drawn.

  As shown in FIG. 2, the display panel 10 includes an anode electrode 102 formed on a TFT substrate 101 (hereinafter simply referred to as “substrate”) 101, and an electrode coating layer on the anode electrode 102. 103 and a hole injecting and transporting layer 104 are sequentially laminated. Note that the anode electrode 102 and the electrode coating layer 103 are formed in a state of being separated for each pixel unit 100.

  A hole injecting and transporting layer 104 is formed on the electrode covering layer 103, and a bank 105 made of an insulating material and partitioning each pixel unit 100 is further provided thereon. An organic light emitting layer 106 is formed in a region partitioned by the bank 105 in each pixel unit 100, and an electron injection layer 107, a cathode electrode 108, and a sealing layer 109 are sequentially stacked thereon. .

a) Substrate 101
The substrate 101 is, for example, alkali-free glass, soda glass, non-fluorescent glass, phosphate glass, boric acid glass, quartz, acrylic resin, styrene resin, polycarbonate resin, epoxy resin, polyethylene, polyester, silicone resin. Or an insulating material such as alumina.

b) Anode electrode 102
The anode electrode 102 is composed of a single layer made of a conductive material or a laminate in which a plurality of layers are laminated. For example, Ag (silver), APC (silver, palladium, copper alloy), ARA ( Silver, rubidium, gold alloy), MoCr (molybdenum and chromium alloy), NiCr (nickel and chromium alloy), etc. are used. In the case of the top emission type as in the present embodiment, it is preferably formed of a highly reflective material.

c) Electrode coating layer 103
The electrode coating layer 103 is formed using, for example, ITO (indium tin oxide), and covers the upper surface of the anode electrode 102 in the Z-axis direction.

d) Hole injection transport layer 104
The hole injecting and transporting layer 104 is a layer made of an oxide such as silver (Ag), molybdenum (Mo), chromium (Cr), vanadium (V), tungsten (W), nickel (Ni), iridium (Ir), for example. It is. The hole injecting and transporting layer 104 made of such a metal oxide has a function of injecting and transporting holes to and from the organic light emitting layer 106 in a stable manner or assisting the generation of holes, and has a large work function. Have.

  Here, when the hole injection / transport layer 104 is made of an oxide of a transition metal, a plurality of levels can be obtained by taking a plurality of oxidation numbers. As a result, hole injection is facilitated and driven. The voltage can be reduced.

  The hole injecting and transporting layer 104 can be formed using PEDOT (mixture of polythiophene and polystyrene sulfonic acid) or the like in addition to the metal oxide as described above.

e) Bank 105
The bank 105 is made of an organic material such as resin and has an insulating property. Examples of the organic material used for forming the bank 105 include acrylic resin, polyimide resin, and novolac type phenol resin. The bank 105 preferably has organic solvent resistance.

  Furthermore, since the bank 105 is formed by an etching process, a baking process, or the like, it is preferable that the bank 105 be formed of a highly resistant material that does not excessively deform or alter the processes. In order to give water repellency, the side surface portion can be treated with fluorine.

Note that as the insulating material used for forming the bank 105, in addition to the above-described materials, a material having a resistivity of 10 ⁵ [Ω · cm] or more and having water repellency can be used. This is because when a material having a resistivity of 10 ⁵ [Ω · cm] or less is used, a leakage current between the anode electrode 102 and the cathode electrode 108 or a leakage current between adjacent pixel portions 100 is generated. This is because various problems such as an increase in power consumption are caused.

  When the bank 105 is formed using a hydrophilic material, the difference in affinity / water repellency between the side surface of the bank 105 and the surface of the hole injecting and transporting layer 104 is reduced, and the organic light emitting layer 106 is formed. For this reason, it is difficult to selectively hold ink containing an organic substance in the opening of the bank 105.

  Furthermore, as for the structure of the bank 105, not only a single layer structure as shown in FIG. 2 but also a multilayer structure of two or more layers can be adopted. In this case, the above materials can be combined for each layer, and an inorganic material and an organic material can be used for each layer.

f) Organic light emitting layer 106
The organic light emitting layer 106 has a function of emitting light by generating an excited state by recombination of holes injected from the anode electrode 102 and electrons injected from the cathode electrode 108. As a material used for forming the organic light emitting layer 106, it is necessary to use a light emitting organic material that can be formed by a wet printing method.

  Specifically, for example, an oxinoid compound, a perylene compound, a coumarin compound, an azacoumarin compound, an oxazole compound, an oxadiazole compound, a perinone compound, a pyrrolopyrrole compound, and a naphthalene described in a patent publication (JP-A-5-163488). Compound, anthracene compound, fluorene compound, fluoranthene compound, tetracene compound, pyrene compound, coronene compound, quinolone compound and azaquinolone compound, pyrazoline derivative and pyrazolone derivative, rhodamine compound, chrysene compound, phenanthrene compound, cyclopentadiene compound, stilbene compound, diphenylquinone Compound, styryl compound, butadiene compound, dicyanomethylenepyran compound, dicyanomethylenethiopyran compound, fluoresceinization Product, pyrylium compound, thiapyrylium compound, serenapyrylium compound, telluropyrylium compound, aromatic ardadiene compound, oligophenylene compound, thioxanthene compound, anthracene compound, cyanine compound, acridine compound, metal complex of 8-hydroxyquinoline compound, 2-bipyridine It is preferably formed of a fluorescent substance such as a metal complex of a compound, a Schiff salt and a group III metal complex, an oxine metal complex, or a rare earth complex.

g) Electron injection layer 107
The electron injection layer 107 has a function of transporting electrons injected from the cathode electrode 108 to the organic light emitting layer 106, and is preferably formed of, for example, barium, phthalocyanine, lithium fluoride, or a combination thereof.

h) Cathode electrode 108
The cathode electrode 108 is made of, for example, ITO or IZO (indium zinc oxide). In the case of the top emission type display panel 10, it is preferably formed of a light transmissive material. About light transmittance, it is preferable that the transmittance | permeability shall be 80 [%] or more.

  As a material used for forming the cathode electrode 108, in addition to the above, for example, a structure in which a layer containing an alkali metal, an alkaline earth metal, or a halide thereof and a layer containing silver are laminated in this order is used. You can also. In the above, the layer containing silver may be formed of silver alone, or may be formed of a silver alloy. In order to improve the light extraction efficiency, a highly transparent refractive index adjusting layer can be provided on the silver-containing layer.

i) Sealing layer 109
The sealing layer 109 has a function of suppressing exposure of the organic light emitting layer 106 or the like to moisture or air, and is made of, for example, a material such as SiN (silicon nitride) or SiON (silicon oxynitride). It is formed using. In the case of the top emission type display panel 10, it is preferably formed of a light transmissive material.

3. Configuration of Bank 105 As shown in FIG. 3, the display panel 10 according to the present embodiment employs a line bank 105 as an example. Specifically, each of the banks 105 extends in the Y-axis direction, and partitions between adjacent pixel units 100 in the X-axis direction. The pixel unit 100 is formed so that the light emission color is different for each region partitioned by the bank 105.

4). 4. Configuration of Bank 105 for Each Region As shown in FIG. 4, from the display panel 10, the pixel portions 100a and 100b located in the central portion and the pixel portions located in the outer peripheral portion (arranged among a plurality of arranged pixel portions) It is assumed that the pixel portions 100c and 100d located at the end portions are extracted, and banks 105a to 105d are arranged on both sides of the pixel portions 100a to 100d.

  In the pixel portion 100a and the pixel portion 100b, the organic light emitting layers (not shown in FIG. 4) are partitioned by the bank 105a, and the side surface portions 105aa and 105ab of the bank 105a and the hole injecting and transporting layer which is a base layer. The surface 104a of 104 forms angles θaa and θab, respectively.

  On the other hand, the pixel portion 100c and the pixel portion 100d located on the outer periphery of the panel are partitioned by a bank 105a between the organic light emitting layers (not shown in FIG. 4), and the side portions 105ca and 105cb of the bank 105c are separated from each other. The surface 104a of the hole injecting and transporting layer 104, which is the underlayer, forms angles θca and θcb, respectively. Further, in the bank 105d that further divides the organic light emitting layer (not shown in FIG. 4) of the pixel portion 100d in the X-axis direction, the side surface portion 105da and the surface 104a of the hole injecting and transporting layer 104, which is a base layer, Forms an angle θda. At this time, the angles θaa, θab, θca, θcb, θda satisfy the relationships shown by the following equations.

[Formula 1] θca> θcb
[Equation 2] θaa = θab
[Equation 3] θda> θcb
In this embodiment, the angles θaa, θab, and θcb are angles within a range of 25 [°] to 30 [°], and the angles θca and θda are within a range of 35 [°] to 40 [°]. The angle of

5). The relationship between the inclination angle θ of the side surface in the bank 105 and the film thickness of the organic light emitting layer 106 The relationship between the inclination angle θ of the side surface in the bank 105 and the film thickness of the organic light emitting layer 106 will be described with reference to FIGS. To do. In FIG. 5, the structure of the pixel portion is schematically drawn.

  As shown in FIG. 5A, the angle of inclination of the side surface of the bank 105x (the angle formed between the side surface and the surface of the hole injecting and transporting layer 104) is an angle θx, and as shown in FIG. The inclination angle of the side surface portion of the bank 105y (the angle formed between the side surface portion and the surface of the hole injection transport layer 104) is the angle θy. The angle θx and the angle θy satisfy the following relationship.

[Equation 4] θy> θx
When inks 1060x and 1060y containing an organic light emitting material are dropped onto the openings defined by the banks 105x and 105y, the heights Hx and Hy of the pinning positions Px and Py are as follows.

[Expression 5] Hy> Hx
As shown in FIG. 5C, when the ink 1060x is dried, the central portion of the pixel portion of the formed organic light emitting layer 106x is caused by the relatively low height Hx of the pinning position Px. The thickness rises and the film thickness becomes the thickness Tx.

  On the other hand, as shown in FIG. 5D, when the ink 1060y is dried, the organic light emitting layer 106y to be formed has a relatively high height Hy at the pinning position Py. The portion is recessed and the film thickness becomes the thickness Ty.

  The thickness Tx and the thickness Ty satisfy the following relationship.

[Equation 6] Tx> Ty
The above relationship is summarized in FIG. As shown in FIG. 6, if the inclination angle (taper angle) θ of the bank 105 is reduced, the pinning height H is reduced, and the resultant film thickness T of the organic light emitting layer 106 is increased. On the contrary, if the inclination angle (taper angle) θ of the bank 105 is increased, the pinning height H is increased, and the resulting film thickness T of the organic light emitting layer 106 is decreased.

  About the above matter, five samples were created and evaluated. The results are shown in FIG. 7 and FIG.

  As shown in FIGS. 7 and 8, the pinning position is higher in Sample 3 and Sample 4 in which the taper angle is larger than the film thickness distribution of Sample 2. 7 and 8, the horizontal axis indicates the horizontal direction, and the vertical axis indicates the height direction.

  However, Sample 5 in which the taper angle (tilt angle) of the bank was increased to 50 [°] had a lower film thickness uniformity than Sample 2.

6). Manufacturing Method of Display Panel 10 A characteristic part of the manufacturing method of the display panel 10 according to the present embodiment will be described with reference to FIGS. In addition, about the manufacturing process which abbreviate | omits description below, it is possible to employ | adopt the various processes proposed as a prior art.

  First, as shown in FIG. 9A, the anode electrode 102 and the electrode covering layer 103 are formed on the upper surface of the substrate 101 in the Z-axis direction so as to correspond to the planned regions where the pixel portions 100a to 100d,. Are sequentially stacked. Then, a hole injecting and transporting layer 104 is laminated and formed so as to cover the entire surface. The anode electrode 102 is formed by, for example, forming an Ag thin film using a sputtering method or a vacuum deposition method, and then patterning the Ag thin film using a photolithography method.

  The electrode coating layer 103 is formed, for example, by forming an ITO thin film on the surface of the anode electrode 102 using a sputtering method or the like and patterning the ITO thin film using a photolithography method or the like. In forming the hole injecting and transporting layer 104, first, a metal film is formed on the surface of the substrate 101 including the surface of the electrode coating layer 103 by using a sputtering method or the like. Thereafter, the formed metal film is oxidized to form the hole injecting and transporting layer 104.

  Next, as shown in FIG. 9B, a bank material layer 1050 is formed so as to cover the hole injection transport layer 104 by using, for example, a spin coating method. For the formation of the bank material layer 1050, a photosensitive resist material is used. Specifically, as described above, an insulating organic material such as an acrylic resin, a polyimide resin, or a novolac phenol resin is used. it can.

  Next, as shown in FIG. 9C, a mask 501 provided with openings 501a and 501c is provided above the bank material layer 1050 where a bank is to be formed. In this state, exposure is performed through the openings 501a and 501c of the mask 501.

  Note that, as shown in FIG. 9C, the width Wa of the opening 501a of the mask 501 between the regions corresponding to the pixel portions 100a and 100b located in the center is the banks 105a and 105b to be formed (FIG. 4). )) Is defined by points Pa1 and Pa2 at the lower end of the side surface portion. On the other hand, between the regions corresponding to the pixel portions 100c and 100d located on the outer peripheral portion, the width Wc1 of the mask opening 501a is the point at the upper end of the side portion of the banks 105c and 105d (see FIG. 4) to be formed. It is defined by Pc1 and the point Pc2 at the bottom.

  Next, as shown in FIG. 10A, openings 502c are provided above the bank material layer 1050 at locations corresponding to the side portions 105ca and 105da (see FIG. 4) of the banks 105c and 105d, respectively. The mask 502 is disposed. In this state, the second exposure is executed through the opening 502c of the mask 502.

  The width Wc2 of the opening 502c in the mask 502 is defined by the lower end point Pc3 and the upper end point Pc1 of the side surfaces of the banks 105c and 105d to be formed.

  Next, as shown in FIG. 10B, development and baking are performed to form banks 105a to 105d,. As described above, the side surface portions 105ca and 105da in the banks 105c and 100d have an inclination angle larger than that of the side surface portion 105cb in the bank 105c, and the inclination angles of the side surface portions 105aa, 105ab,. Will be equal.

  Thereafter, as shown in FIG. 10C, ink containing an organic light-emitting material is dropped into the openings partitioned by the banks 105a to 105d,. The organic light emitting layers 106a to 106d,... Are formed by drying the ink.

  Although not shown, the display panel 10 is formed by sequentially stacking the electron injection layer 107, the cathode electrode 108, the sealing layer 109, and the like.

7. Effect As shown in FIG. 4, in the display panel 10 of the display device 1 according to the present embodiment, the organic light emitting layers 106c and 106d (see FIG. 10C) of the pixel portion 100c and the pixel portion 100d located on the outer periphery of the panel. In the bank 105c that partitions each other, the inclination angles θca and θcb of the side surface portions 105ca and 105cb are set to have the relationship of [Equation 1], that is, the angle θca is larger than the angle θcb. Has been. For this reason, in the pixel portions 100c and 100d located on the outer peripheral portion of the panel, the pinning position corresponding to the side surface portions 105ca and 105da when ink is dropped at the time of manufacture is higher than the pinning position corresponding to the side surface portion 105cb. .

  Therefore, the film thicknesses of the organic light emitting layers 106c and 106d are on the outer peripheral side of the pixel portions 100c and 100d located on the outer peripheral portion of the panel (portions corresponding to the side surface portions 105ca and 105da) due to the vapor concentration distribution during ink drying. The action of increasing the thickness can be suppressed by the action by setting the respective inclination angles θca to θda of the corresponding side surface parts 105ca and 105da of the banks 105c and 105d as described above, and the pixel parts 100c and 100c positioned on the outer peripheral part of the panel The film thickness on the end side of the organic light emitting layers 106c and 106d at 100d can be made uniform as a whole.

  Further, the inclination angles θaa and θab of the side surface portions 105aa and 105ab in the bank 105a are equal to each other as shown in the above [Equation 2]. For this reason, the film thickness of the organic light emitting layer 106d corresponding to each part is equalized (uniformed) as a whole.

  Therefore, the display panel 10 has an effect that the thickness of the organic light emitting layer 106 after drying is uniform in the pixel portions 100a to 100d,.

  In addition, if the manufacturing method of the display apparatus 1 which concerns on this Embodiment demonstrated using FIG. 9 and FIG. 10 is used, manufacture of the display apparatus 1 which has the said effect is possible.

  Further, as described above, “equal” does not mean that the numerical values are completely equal, but considers a dimensional error in manufacturing the display device. Specifically, the inclination angles are made equal in a range where the difference in luminance (brightness unevenness) between the pixel portions 100a to 100d,. Means.

[Modification 1]
Next, Modification 1 of the method for manufacturing the display device 1 will be described with reference to FIG. FIG. 11 shows steps corresponding to the steps shown in FIGS. 9C to 10A.

  As shown in FIG. 11, after a bank material layer 1050 is formed on the hole injecting and transporting layer 104, a mask 503 is disposed thereon. The mask 503 is provided with light transmitting portions 503a, 503c1, 503c2,. The light transmitting portions 503a, 503c1, 503c2,... Correspond to the locations where the banks 105a to 105d,... (See FIG. 4) partitioning the pixel portions 100a to 100d,. Is provided.

  In the method for manufacturing the display device 1 according to the first modification, the width Wa of the light transmitting portion 503a in the region corresponding to the pixel portion 100a is the point at the lower end of the banks 105a and 105b (see FIG. 4) to be formed. It is defined by Pa1 and Pa2.

  On the other hand, the width Wc2 of the light transmitting portion 503c1 in the region corresponding to the pixel portion 100c is defined by the lower end point Pc2 and the upper end point Pc1 of the banks 105c and 105d (see FIG. 4) to be formed. The light transmitting portion 503c2 is defined by points Pc3 and Pc1 at the lower ends of the banks 105e and 105f (see FIG. 4) to be formed.

  Here, the mask 503 is configured by using a mask such as a halftone, and the light transmittances of the light transmission portions 503a and 503c1 and the light transmission portion 503c2 are different. Specifically, the light transmittance of the light transmitting portion 503c2 is larger than the light transmittance of the light transmitting portions 503a and 503c1.

  Banks 105a to 105d as shown in FIG. 10B can be formed by performing exposure / development in a state where the mask 503 having the above-described configuration is arranged and then baking. it can. That is, in the portion exposed through the light transmitting portion 503c2 where the light transmittance is set to be large, as compared with the portion exposed through the other light transmitting portions 503a and 503c1, The inclination angle of the side wall surface is increased.

  The subsequent steps are the same as those in the above embodiment.

  Note that the magnitude relationship may be reversed with respect to the above-described relationship regarding the exposure amount depending on various conditions such as the type of photosensitive resist material that is a constituent material of the bank 105.

  The display device 1 can also be manufactured by the manufacturing method as described above.

[Modification 2]
Next, a second modification of the method for manufacturing the display device 1 will be described with reference to FIGS. 12 and 13 show processes corresponding to the processes shown in FIGS. 9C to 10B.

  As shown in FIG. 12A, a bank material layer 1050 is formed on the hole injecting and transporting layer 104, and then a mask 504 is disposed thereon. The mask 504 is provided with openings 504a, 504c,... Corresponding to the locations where the banks 105a to 105d,.

  Openings 504a provided at locations where banks 105a and 105b (see FIG. 4) corresponding to the pixel portions 100a and 100b are to be formed are the same as the openings 501a of the mask 501 used in the manufacturing method of the above embodiment. It is formed with a width. On the other hand, the width Wc3 of the opening 504c provided at a location where the banks 105c and 105d (see FIG. 4) corresponding to the pixel portions 100c and 100d are to be formed is surrounded by a two-dot chain line in FIG. As shown in the portion, the width is set to be larger than the width defined by the points Pc2 and Pc3 at the lower ends of the banks 105c and 105d. Specifically, the width is increased at a location where the inclination angle is to be increased.

  First exposure / development is performed in a state where the mask 504 having the form shown in FIG. As a result, as shown in FIG. 12B, bank material layers 1051a to 1051d,... Remain at locations corresponding to the openings 504a and 504c of the mask 504.

  As shown in FIG. 12B, in the state where the first exposure / development is performed, the inclination angles of the side surfaces of the bank material layers 1051a to 1051d,... Are uniform. In the second modification, baking is not performed at this time.

  As shown in FIG. 13A, in a state where the bank material layers 1051a to 1051d,... Are formed, a mask 505 is disposed thereon. In the mask 505, openings are made only at locations where the inclination angle is to be increased (side portions 105ca, 105da,... In FIG. 4) among locations corresponding to the side portions of the banks 105a to 105d to be formed. 505c and 505d are provided.

  Banks 105a to 105d as shown in FIG. 13 (b) can be formed by performing the second exposure / development with the mask 505 and then baking. In the banks 105c, 105d, the side surface portions 105ca, 105da on the left side in the X-axis direction (panel center side) have a larger inclination angle than the other side surface portions 105aa, 105ab, 105cb,.

  Thereafter, the display device 1 can be manufactured by performing the same steps as in the above-described embodiment and the like.

[Verification of manufacturing method]
About each manufacturing method which concerns on the said embodiment and the modification 1, 2, the bank shape after formation was verified by the specific example. The result will be described with reference to FIG.

  As shown in FIG. 14A, the inclination angle of the bank side surface portion to be formed increases as the exposure amount increases. Specifically, when the exposure amount is 200 [mJ] and the exposure / development is performed, the inclination angle of the bank side surface portion is 23 [°], whereas the exposure amount is 300 [mJ]. The inclination angle of the bank side surface formed when developed is 38 [°]. This result is also shown in AFM (Atomic Force Microscope) shown in FIG.

  Further, as shown in FIGS. 14A and 14B, after the first exposure / development with an exposure amount of 200 [mJ], the second exposure / development with an exposure amount of 100 [mJ]. When development is performed, the inclination angle of the bank side surface portion to be formed is 50 [°]. This corresponds to the manufacturing method according to the second modification and is considered to be effective for increasing the inclination angle of the bank side surface.

  In FIG. 14B, the horizontal axis indicates the horizontal direction, and the vertical axis indicates the height direction.

[Other matters]
In the above embodiment and the first and second modifications, each configuration as an example is adopted in order to easily understand the configuration and the operation / effect of the present invention. The present invention, except for essential parts, It is not limited to the said form. For example, in the above embodiment, as shown in FIG. 2, the configuration in which the anode electrode 102 is disposed on the lower side in the Z-axis direction with respect to the organic light emitting layer 106 is adopted as an example. In addition to the organic light-emitting layer 106, a configuration in which the cathode electrode 108 is disposed on the lower side in the Z-axis direction may be employed.

  When the cathode electrode 108 is arranged on the lower side in the Z-axis direction with respect to the organic light emitting layer 106, a top emission structure is formed. Therefore, the cathode electrode 108 is used as a reflective electrode layer, and the electrode coating layer 103 is formed thereon. The structure which forms is adopted.

  In the above-described embodiment and the like, the specific external shape of the display device 1 is not shown. However, for example, it can be a part of the system as shown in FIG. The organic EL display device does not require a backlight like a liquid crystal display device, and is therefore suitable for thinning, and exhibits excellent characteristics from the viewpoint of system design.

  Further, in the above embodiment and the first and second modifications, the so-called line bank structure as shown in FIG. 3 is adopted as the form of the bank 105, but the bank 105 extends in the Y-axis direction as shown in FIG. The display panel 30 can also be configured by using a pixel bank 305 including a bank element 305a and a bank element 305b extending in the X-axis direction.

As shown in FIG. 16, when the pixel bank 305 is employed, the inclination angle of the side wall portion on the outer side in the X-axis direction and the Y-axis direction with respect to the pixel portion 300 on the outer peripheral portion of the panel is increased. The effect similar to the above can be obtained. Specifically, in the configuration in which the pixel portion having the side wall portion indicated by the arrows B ₁ , B ₂ , B ₃ , and B ₄ corresponds to the corner portion of the outer peripheral portion of the panel, the inclination of the side wall portion indicated by the arrows B ₁ and B ₃ The angle is made larger than the inclination angle of the side wall portion indicated by the arrow B ₂ , and the inclination angle of the side wall portion indicated by the arrows B ₄ and B ₆ is larger than the inclination angle of the side wall portion indicated by the arrow B _5. To be.

  Moreover, in the said embodiment and the modification 1, 2, the inclination angle of the side wall part outside the bank formed in a panel outer peripheral part was made larger than the inclination angle of the bank side part corresponding to a panel center part. However, this relationship can be appropriately changed according to the flow of vapor (vapor concentration) in the drying process related to the formation of the organic light emitting layer during production. For example, due to the structure of the drying device, etc., when the flow of vapor during ink drying is in the direction from the outer periphery of the panel toward the center of the panel, this corresponds to the location where the thickness of the organic light emitting layer increases. Then, the inclination angle of the bank side surface portion may be increased. Thereby, the film thickness of an organic light emitting layer can be made uniform, and the brightness nonuniformity in the whole panel can be reduced.

  In the embodiment and the first and second modifications, the light emission colors (red, green, and blue) in the pixel portion are not distinguished, but the characteristics of the ink containing the organic light emitting material change according to the light emission color. In this case, the inclination angle of the corresponding bank side surface portion can be defined according to the ink characteristics of each emission color.

  In addition, the area to be increased in the inclination angle of the bank side surface portion can be appropriately defined according to the manufacturing process, the panel size, etc., for example, 0.5 [%] to the number of the outer peripheral portion of the panel It is considered desirable to target a pixel portion of about [%] (for example, 1 [%]). This is because the variation in the thickness of the organic light emitting layer in the display device according to the prior art shown in FIG.

  The present invention is useful for realizing a display device with little luminance unevenness and high image quality performance.

1. Display device 10,30. Display panel 20. Drive control part 21-24. Drive circuit 25. Control circuit 100, 100a to 100c, 300. Pixel unit 101. Substrate 102. Anode electrode 103. Electrode coating layer 104. Hole injection layer 105,105a-105f, 105x, 105y, 305. Banks 106, 106a, 106c, 106x, 106y. Organic light emitting layer 107. Electron injection layer 108. Cathode electrode 109. Sealing layer 501-505. Exposure masks 1050, 1051a, 1051b, 1051e, 1051f. Bank material layers 1060x, 1060y. ink

  The present invention relates to a display device and a manufacturing method thereof, and more particularly to a display device including an organic light emitting layer and a manufacturing method thereof.

  In recent years, research and development of display devices using the electroluminescence phenomenon of organic materials have been promoted. In this display device, each pixel portion includes an anode electrode and a cathode electrode, and an organic light emitting layer interposed therebetween. In driving the display device, holes are injected from the anode electrode, electrons are injected from the cathode electrode, and light is emitted by recombination of holes and electrons in the organic light emitting layer.

  The organic light emitting layers of adjacent pixel portions are partitioned by a bank made of an insulating material. The organic light emitting layer is formed, for example, by dropping ink containing an organic light emitting material in each region partitioned by the bank and drying the ink.

However, there is a problem that it is difficult to make the film thickness of the organic light emitting layer formed as described above uniform.
Here, in order to make the film thickness of the organic light emitting layer uniform, for example, an invention proposed in Patent Document 1 is described in which a convex portion is provided on the inner surface of the bank, thereby controlling the pinning position of the ink. Yes. That is, by adopting the technique proposed in Patent Document 1, it is possible to pin the convex portion where the pinning position is formed when the ink in one pixel portion is dropped. Uniformity can be ensured.

JP 2007-31235 A

  By the way, with respect to the entire area of the panel of the display device (center part, outer peripheral part), the technique proposed by the above-mentioned Patent Document 1 is adopted, and fine convex portions are formed on the inner surface of the bank with high accuracy according to the panel area. It is considered difficult to do. For this reason, it is not easy to make the thickness of the organic light emitting layer uniform in the entire panel area of the display device (central tail portion, outer peripheral portion).

  The present invention has been made to solve the above-described problems, and aims to make the film thickness of the organic light-emitting layer uniform in the pixel portion located on the outer periphery of the panel, and to provide a display device with less luminance unevenness in the panel surface. It aims at providing the manufacturing method.

Thus, a display device according to one embodiment of the present invention employs the following structure.
In the display device according to one embodiment of the present invention, a plurality of pixel portions are arranged. Each pixel portion is interposed between the first electrode and the second electrode, and the first electrode and the second electrode. And an organic light emitting layer. In the display device according to one embodiment of the present invention, a plurality of banks are provided above the first electrode to partition the organic light emitting layer for each pixel portion. The plurality of pixel portions include a first pixel portion and a second pixel portion that are located on the end side of the pixel array and are adjacent to each other in the direction of the pixel array. A first bank is included to partition the organic light emitting layer of the first pixel portion and the organic light emitting layer of the second pixel portion.

  In the display device according to one embodiment of the present invention, in the first bank, the first side surface portion corresponding to the first pixel portion has a larger inclination angle than the second side surface portion corresponding to the second pixel portion. Features.

  In the display device according to one embodiment of the present invention, in the first bank formed on the end portion side of the pixel array, the inclination angle of the first side surface portion corresponding to the first pixel portion corresponds to the second pixel portion. Since the inclination angle is larger than the inclination angle of the two side surface portions, the pinning position when the ink is dropped at the time of manufacture is higher in the first side surface portion than in the second side surface portion. For this reason, in the drying process, the film thickness corresponding to the first side surface portion in the organic light emitting layer of the first pixel portion is thinner than the film thickness corresponding to the second side surface portion in the organic light emitting layer of the second pixel portion. There is a tendency to try.

  On the other hand, as described above, due to the non-uniform vapor concentration distribution, the thickness of the organic light emitting layer after drying is higher in the portion corresponding to the first side surface portion in the first pixel portion than in the second pixel portion. Tend to be thicker than the portion corresponding to the second side surface portion. Therefore, in the display device according to one embodiment of the present invention, the effect of increasing the film thickness of the organic light emitting layer in the portion corresponding to the first side surface portion due to the nonuniformity of the vapor concentration distribution is Since the film thickness is reduced by increasing the inclination angle of one side surface, the film shape of the organic light emitting layer in the end side pixel portion can be made uniform.

  Accordingly, in the display device according to one embodiment of the present invention, the film shape of the organic light emitting layer in the pixel portion located on the outer periphery of the panel is made uniform, and luminance unevenness is reduced.

It is a block diagram which shows schematic structure of the display apparatus 1 which concerns on embodiment. 3 is a schematic cross-sectional view showing a pixel unit 100 in the display panel 10. FIG. 3 is a schematic plan view showing a bank 105 in the display panel 10. FIG. 3 is a schematic cross-sectional view illustrating a structure of banks 105a to 105f for each of pixel portions 100a to 100c in the display panel 10. FIG. (A) is a schematic cross-sectional view showing the pinning position when the taper angle of the bank side surface portion is small, (b) is a schematic cross-sectional view showing the pinning position when the taper angle of the bank side surface portion is large, (C) is a schematic cross-sectional view showing the state of the organic light emitting layer after drying when the taper angle of the bank side surface is small, and (d) is the organic after drying when the taper angle of the bank side surface is large. It is a schematic cross section which shows the state of a light emitting layer. It is a figure which shows collectively the relationship between the inclination-angle (taper angle) (theta) of a bank, pinning height H, and the film thickness T of an organic light emitting layer. It is a figure which shows the film thickness distribution of the organic light emitting layer in the samples 1-3. It is a figure which shows the film thickness distribution of the organic light emitting layer in the samples 4 and 5. FIG. (A)-(c) is a schematic cross section which shows the principal part process in the manufacturing method of the display panel 10 in order. (A)-(c) is a schematic cross section which shows the principal part process in the manufacturing method of the display panel 10 in order. 10 is a schematic cross-sectional view showing main processes in a manufacturing method according to Modification 1. FIG. (A)-(b) is a schematic cross section which shows the principal part process in the manufacturing method which concerns on the modification 2 in order. (A)-(b) is a schematic cross section which shows the principal part process in the manufacturing method which concerns on the modification 2 in order. (A) is a figure which shows the relationship between exposure / development processing and the taper angle of a bank, (b) is AFM which shows the shape of the formed bank. 3 is an external perspective view showing an example of an external appearance of a set including the display device 1. FIG. 14 is a schematic plan view showing a structure of a bank 305 included in a display panel 30 according to Modification 3. FIG. (A) is a schematic cross section which shows the organic light emitting layer in the display panel which concerns on a prior art, (b) is a figure which shows the film thickness uniformity distribution of the organic light emitting layer for every area | region of a display panel. . It is a schematic cross section which shows the vapor concentration distribution in the drying process at the time of formation of an organic light emitting layer. It is a schematic cross section for demonstrating the mechanism of the bias | inclination of the film | membrane shape in a drying process.

[Outline of One Embodiment of the Present Invention]
In the display device according to one embodiment of the present invention, a plurality of pixel portions are arranged. Each pixel portion is interposed between the first electrode and the second electrode, and the first electrode and the second electrode. And an organic light emitting layer. In the display device according to one embodiment of the present invention, a plurality of banks are provided above the first electrode to partition the organic light emitting layer for each pixel portion. The plurality of pixel portions include a first pixel portion and a second pixel portion that are located on the end side of the pixel array and are adjacent to each other in the direction of the pixel array. A first bank is included to partition the organic light emitting layer of the first pixel portion and the organic light emitting layer of the second pixel portion.

  In the display device according to one embodiment of the present invention, in the first bank, the first side surface portion corresponding to the first pixel portion has a larger inclination angle than the second side surface portion corresponding to the second pixel portion. Features.

  In the display device according to one embodiment of the present invention, in the first bank that partitions between adjacent pixel portions located on the end side of the pixel array, the inclination angle of the first side surface portion is relative to the inclination angle of the second side surface portion. Since it is large, when the ink is dropped in the step of forming the organic light emitting layer, the pinning position on the first side surface portion becomes higher than the pinning position on the second side surface portion. Specifically, the pinning position at the first side surface portion having a relatively large inclination angle is higher than the pinning position at the second side surface portion having a relatively small inclination angle. The thickness of the organic light emitting layer after drying is such that the film thickness of the organic light emitting layer corresponding to the first side surface portion in the first bank is greater than the film thickness of the organic light emitting layer corresponding to the second side surface portion. Try to be thin.

  From the above, the effect of increasing the film thickness at the portion due to the movement of the solvent to reduce the surface free energy during drying is due to the inclination angle of the first side surface portion being larger than that of the second side surface portion. The film thickness is reduced by the change of the pinning position, and the film shape of the organic light emitting layer is made uniform in the entire pixel portion including the pixel portion on the end side of the pixel array.

Therefore, in the display device according to one embodiment of the present invention, the thickness of the organic light-emitting layer is uniformized in all the pixel portions, and luminance unevenness is reduced.
In the display device according to one embodiment of the present invention, in the above structure, a third pixel portion and a fourth pixel portion that are located on the center side of the pixel array and are adjacent to each other in the direction of the pixel array are extracted. Try. At this time, the plurality of banks include a second bank that partitions the organic light emitting layer of the third pixel portion and the organic light emitting layer of the fourth pixel portion. In such a configuration, the inclination angle of the third side surface portion corresponding to the third pixel portion in the second bank and the fourth side surface portion corresponding to the fourth pixel portion in the second bank are equal to each other. It is possible to adopt a configuration that is formed as described above.

  As shown in FIGS. 17A and 17B, the film thicknesses of the organic light emitting layers 906a and 906b in the pixel portion are substantially uniform in the center portion of the panel (center side in the pixel array). Yes. For this reason, the film thickness of the organic light emitting layer of the pixel portion located on the center side of the pixel array can be kept uniform by equalizing the inclination angles of the third side surface portion and the fourth side surface portion. It becomes.

  Note that “equal” in the above does not mean that the numerical values are completely equal, but considers a dimensional error in manufacturing the display device. Specifically, the inclination angles of the third side surface portion and the fourth side surface portion are made equal to each other within a range where the difference in luminance efficiency (luminance unevenness) of the plurality of pixel portions in the entire panel is practically acceptable. means.

  Furthermore, in the display device according to one embodiment of the present invention, in the above structure, the plurality of banks includes a third bank that partitions the organic light emitting layer of the second pixel portion on the end side of the pixel array. A configuration in which the fifth side surface portion corresponding to the second pixel portion in the third bank has a larger inclination angle than the second side surface portion can be employed. In the case of adopting such a configuration, the film thickness of the organic light emitting layer of the second pixel portion is suppressed from being increased by the above relationship even in the portion corresponding to the fifth side surface portion, and the entire pixel portion is The thickness of the organic light emitting layer can be made uniform.

  In the display device according to one embodiment of the present invention, in the above structure, the inclination angle of the first side surface portion is set in a range of 35 [°] or more and 40 [°] or less, and the inclination angle of the second side surface portion is 25. As an example, it can be set within the range of [°] to 30 [°]. If the first side surface portion and the second side surface portion are formed with an inclination angle in such a range, the film thickness (film shape) of each organic light emitting layer is surely uniform over the entire single unit side pixel unit. Can be

  In the display device according to one embodiment of the present invention, in the above structure, the inclination angles of the third side surface portion and the fourth side surface portion are both in the range of 25 [°] to 30 [°]. As an example. If the third side surface portion and the fourth side surface portion are formed with an inclination angle in such a range, the thickness of the organic light emitting layer in the central pixel portion can be made uniform as a whole.

  In the above, the “inclination angle” means each side surface portion of the bank and the underlying layer on which the bank is provided (the first electrode, the hole injection layer, the hole transport layer, and the hole injection transport layer) The angle formed by the top surface of

A method for manufacturing a display device according to one embodiment of the present invention is a method for manufacturing a display device in which a plurality of pixel portions are arranged, and includes the following steps.
(First Step) A functional layer including the first electrode is formed on the substrate.

(Second Step) A photosensitive resist material is laminated on the functional layer.
(Third Step) The photosensitive resist material laminated in the execution of the second step is subjected to mask exposure and patterned to form a plurality of openings corresponding to a plurality of pixel portions, and between adjacent openings. A plurality of banks to be partitioned are formed.

(4th process) An organic light emitting material is dripped and dried with respect to each of several opening part, and an organic light emitting layer is formed.
(5th process) A 2nd electrode is formed above an organic light emitting layer.

  In the method for manufacturing a display device according to one embodiment of the present invention, the plurality of openings are both positioned on the end side of the pixel array and are adjacent to each other in the pixel array direction. The plurality of banks includes a first bank that partitions the organic light emitting layers of the first opening and the second opening.

  In the third step, the inclination angle of the first side surface portion corresponding to the first opening in the first bank is equal to the side surface portion corresponding to the second opening in the first bank (hereinafter, for simplicity, “ The first bank is formed so as to increase with respect to the inclination angle of “second side surface portion”.

  By adopting such a manufacturing method, it is possible to manufacture a display device in which the inclination angle of the first side surface portion in the first bank has a large relationship with the inclination angle of the second side surface portion. In the display device manufactured by using such a method, as described above, the pinning position when ink is dropped on the end side opening at the time of manufacturing is the second side surface portion at the first side surface portion. From the relationship between the pinning position and the film thickness as described above, the film thickness of the organic light emitting layer can be made uniform, and the luminance unevenness can be reduced.

  Therefore, in the method for manufacturing a display device according to one embodiment of the present invention, the thickness of the organic light-emitting layer in the pixel portion at the outer peripheral portion of the panel (at the end of the pixel array) is made uniform, and uneven luminance in the surface is reduced. Fewer display devices can be manufactured.

  In the method for manufacturing a display device according to one aspect of the present invention, in the above configuration, when the third step is performed, the exposure amount to the photosensitive resist material in the portion corresponding to the first side surface portion is set to the second side surface. As an example, a configuration in which the inclination angle of the first side surface portion is made larger than the inclination angle of the second side surface portion by increasing the exposure amount of the portion corresponding to the portion to the photosensitive resist material. Can be adopted.

  In the method for manufacturing a display device according to one embodiment of the present invention, in the above configuration, when performing the third step, the light transmittance of the portion corresponding to the first side surface portion corresponds to the second side surface portion. Adopting a configuration in which the inclination angle of the first side surface portion is made larger than the inclination angle of the second side surface portion by performing exposure using a mask having a large relationship with respect to the light transmittance of the portion. Can do. As a result, the tilt angle of the first side surface portion is larger than the tilt angle of the second side surface portion, and a display device with little luminance variation in the surface can be manufactured.

  In the method for manufacturing a display device according to one embodiment of the present invention, when performing the third step, a photosensitive resist material is used for a portion corresponding to the first side surface portion and a portion corresponding to the second side surface portion. After exposure and development, it is possible to adopt a configuration in which an exposure process is additionally performed on a portion corresponding to the first side surface portion. By such a measure, the first bank and the second bank can be formed in which the inclination angle of the first side surface portion is larger than the inclination angle of the second side surface portion.

[Embodiment]
Below, an example of the form for implementing this invention is demonstrated, referring drawings.

  The form used in the following description is an example used for easy understanding of the configuration, operation and effect of the present invention, and the present invention is not limited to the following form other than its essential features. It is not something to receive.

(Background to obtaining the embodiment of the present invention)
As a result of earnest research, the present inventor has obtained the following knowledge regarding the organic light-emitting display device described in (Background Art).

Usually, as shown in FIG. 17A, the organic light emitting layers 906 a and 906 c are formed between banks 905 erected on a substrate 901.
In this case, as shown in FIG. 17B, the organic light emitting layer 906c in the pixel portion at the outer peripheral portion of the panel tends to be less uniform in film thickness than the organic light emitting layer 906a in the pixel portion at the central portion of the panel. (Parts indicated by two-dot chain lines D ₁ and D ₂ in FIG. 17B). Specifically, the present inventor has confirmed that the surface of the organic light emitting layer is higher in the pixel portion located on the outer periphery of the panel as it goes to the outer periphery of the panel. In FIG. 17B, the horizontal axis indicates the distance from the outer peripheral edge, and the vertical axis indicates the degree of film thickness deviation.

  As a result of repeated studies on the above phenomenon, the present inventor presumed that the decrease in the uniformity of the organic light-emitting layer thickness was caused by non-uniform vapor concentration distribution during ink drying, as will be described below. did. Specifically, as shown in FIG. 18, the vapor concentration in the vicinity of the pixel portions 900b and 900c located on the outer periphery of the panel is lower than the vapor concentration in the vicinity of the pixel portion 900a located in the center of the panel. It has become. Then, due to the uneven vapor concentration distribution, the evaporation rate of the solvent from the dropped ink in the pixel portions 900b and 900c on the outer periphery of the panel becomes non-uniform (encircled by a two-dot chain line in FIG. 18). See section).

On the other hand, the evaporation rate from the dropped ink in the pixel portion 900a at the center of the panel is substantially uniform.
However, as shown in FIG. 19B, the solvent moves as indicated by the solid line arrow inside the ink 9061c in the middle of drying. In this case, the solvent moves so as to compensate for the evaporated amount (moves so as to minimize the surface free energy), and the solute (organic light emitting material) moves as the solvent moves. Therefore, as shown in FIG. 19 (c), in the pixel portion of the panel outer periphery, the surface profile L ₂ is the organic light emitting layer 906c which raised the more outer is formed.

  As described above, the present inventor relates to an organic light-emitting display device, and the film thickness of the organic light-emitting layer is uniform due to the non-uniformity of the vapor concentration distribution during ink drying on the outer peripheral side and the central side of the panel. I got the inference that the gender declines.

  The inventor makes the pinning position on the bank side surface of the ink different by changing the inclination angle of the bank side surface in the panel surface, and as a result, the film thickness of the organic light emitting layer is made uniform. I found a technical feature.

1. Schematic Configuration of Display Device 1 The overall configuration of the display device 1 according to the present embodiment will be described with reference to FIG.
As shown in FIG. 1, the display device 1 includes a display panel unit 10 and a drive control unit 20 connected to the display panel unit 10. The display panel unit 10 is an organic EL panel using an electroluminescence phenomenon of an organic material, and a plurality of organic EL elements are arranged and configured.

The drive control unit 20 is composed of four drive circuits 21 to 24 and a control circuit 25.
In the actual display device 1, the arrangement of the drive control unit 20 with respect to the display panel unit 10 is not limited to this.

2. Configuration of Display Panel 10 The configuration of the display panel 10 will be described with reference to FIG. The display panel 10 according to the present embodiment employs a top emission type organic EL panel as an example, and emits organic light having one of red (R), green (G), and blue (B). A plurality of pixel portions 100 including layers are arranged and configured in a matrix, but in FIG. 2, one pixel portion 100 is extracted and drawn.

  As shown in FIG. 2, the display panel 10 includes an anode electrode 102 formed on a TFT substrate 101 (hereinafter simply referred to as “substrate”) 101, and an electrode coating layer on the anode electrode 102. 103 and a hole injecting and transporting layer 104 are sequentially laminated. Note that the anode electrode 102 and the electrode coating layer 103 are formed in a state of being separated for each pixel unit 100.

  A hole injecting and transporting layer 104 is formed on the electrode covering layer 103, and a bank 105 made of an insulating material and partitioning each pixel unit 100 is further provided thereon. An organic light emitting layer 106 is formed in a region partitioned by the bank 105 in each pixel unit 100, and an electron injection layer 107, a cathode electrode 108, and a sealing layer 109 are sequentially stacked thereon. .

a) Substrate 101
The substrate 101 is, for example, alkali-free glass, soda glass, non-fluorescent glass, phosphate glass, boric acid glass, quartz, acrylic resin, styrene resin, polycarbonate resin, epoxy resin, polyethylene, polyester, silicone resin. Or an insulating material such as alumina.

b) Anode electrode 102
The anode electrode 102 is composed of a single layer made of a conductive material or a laminate in which a plurality of layers are laminated. For example, Ag (silver), APC (silver, palladium, copper alloy), ARA ( Silver, rubidium, gold alloy), MoCr (molybdenum and chromium alloy), NiCr (nickel and chromium alloy), etc. are used. In the case of the top emission type as in the present embodiment, it is preferably formed of a highly reflective material.

c) Electrode coating layer 103
The electrode coating layer 103 is formed using, for example, ITO (indium tin oxide), and covers the upper surface of the anode electrode 102 in the Z-axis direction.

d) Hole injection transport layer 104
The hole injecting and transporting layer 104 is a layer made of an oxide such as silver (Ag), molybdenum (Mo), chromium (Cr), vanadium (V), tungsten (W), nickel (Ni), iridium (Ir), for example. It is. The hole injecting and transporting layer 104 made of such a metal oxide has a function of injecting and transporting holes to and from the organic light emitting layer 106 in a stable manner or assisting the generation of holes, and has a large work function. Have.

  Here, when the hole injection / transport layer 104 is made of an oxide of a transition metal, a plurality of levels can be obtained by taking a plurality of oxidation numbers. As a result, hole injection is facilitated and driven. The voltage can be reduced.

  The hole injecting and transporting layer 104 can be formed using PEDOT (mixture of polythiophene and polystyrene sulfonic acid) or the like in addition to the metal oxide as described above.

e) Bank 105
The bank 105 is made of an organic material such as resin and has an insulating property. Examples of the organic material used for forming the bank 105 include acrylic resin, polyimide resin, and novolac type phenol resin. The bank 105 preferably has organic solvent resistance.

  Furthermore, since the bank 105 is formed by an etching process, a baking process, or the like, it is preferable that the bank 105 be formed of a highly resistant material that does not excessively deform or alter the processes. In order to give water repellency, the side surface portion can be treated with fluorine.

Note that as the insulating material used for forming the bank 105, in addition to the above-described materials, a material having a resistivity of 10 ⁵ [Ω · cm] or more and having water repellency can be used. This is because when a material having a resistivity of 10 ⁵ [Ω · cm] or less is used, a leakage current between the anode electrode 102 and the cathode electrode 108 or a leakage current between adjacent pixel portions 100 is generated. This is because various problems such as an increase in power consumption are caused.

  When the bank 105 is formed using a hydrophilic material, the difference in affinity / water repellency between the side surface of the bank 105 and the surface of the hole injecting and transporting layer 104 is reduced, and the organic light emitting layer 106 is formed. For this reason, it is difficult to selectively hold ink containing an organic substance in the opening of the bank 105.

  Furthermore, as for the structure of the bank 105, not only a single layer structure as shown in FIG. 2 but also a multilayer structure of two or more layers can be adopted. In this case, the above materials can be combined for each layer, and an inorganic material and an organic material can be used for each layer.

f) Organic light emitting layer 106
The organic light emitting layer 106 has a function of emitting light by generating an excited state by recombination of holes injected from the anode electrode 102 and electrons injected from the cathode electrode 108. As a material used for forming the organic light emitting layer 106, it is necessary to use a light emitting organic material that can be formed by a wet printing method.

  Specifically, for example, an oxinoid compound, a perylene compound, a coumarin compound, an azacoumarin compound, an oxazole compound, an oxadiazole compound, a perinone compound, a pyrrolopyrrole compound, and a naphthalene described in a patent publication (JP-A-5-163488). Compound, anthracene compound, fluorene compound, fluoranthene compound, tetracene compound, pyrene compound, coronene compound, quinolone compound and azaquinolone compound, pyrazoline derivative and pyrazolone derivative, rhodamine compound, chrysene compound, phenanthrene compound, cyclopentadiene compound, stilbene compound, diphenylquinone Compound, styryl compound, butadiene compound, dicyanomethylenepyran compound, dicyanomethylenethiopyran compound, fluoresceinization Product, pyrylium compound, thiapyrylium compound, serenapyrylium compound, telluropyrylium compound, aromatic ardadiene compound, oligophenylene compound, thioxanthene compound, anthracene compound, cyanine compound, acridine compound, metal complex of 8-hydroxyquinoline compound, 2-bipyridine It is preferably formed of a fluorescent substance such as a metal complex of a compound, a Schiff salt and a group III metal complex, an oxine metal complex, or a rare earth complex.

g) Electron injection layer 107
The electron injection layer 107 has a function of transporting electrons injected from the cathode electrode 108 to the organic light emitting layer 106, and is preferably formed of, for example, barium, phthalocyanine, lithium fluoride, or a combination thereof.

h) Cathode electrode 108
The cathode electrode 108 is made of, for example, ITO or IZO (indium zinc oxide). In the case of the top emission type display panel 10, it is preferably formed of a light transmissive material. About light transmittance, it is preferable that the transmittance | permeability shall be 80 [%] or more.

  As a material used for forming the cathode electrode 108, in addition to the above, for example, a structure in which a layer containing an alkali metal, an alkaline earth metal, or a halide thereof and a layer containing silver are laminated in this order is used. You can also. In the above, the layer containing silver may be formed of silver alone, or may be formed of a silver alloy. In order to improve the light extraction efficiency, a highly transparent refractive index adjusting layer can be provided on the silver-containing layer.

i) Sealing layer 109
The sealing layer 109 has a function of suppressing exposure of the organic light emitting layer 106 or the like to moisture or air, and is made of, for example, a material such as SiN (silicon nitride) or SiON (silicon oxynitride). It is formed using. In the case of the top emission type display panel 10, it is preferably formed of a light transmissive material.

3. Configuration of Bank 105 As shown in FIG. 3, the display panel 10 according to the present embodiment employs a line bank 105 as an example. Specifically, each of the banks 105 extends in the Y-axis direction, and partitions between adjacent pixel units 100 in the X-axis direction. The pixel unit 100 is formed so that the light emission color is different for each region partitioned by the bank 105.

4). 4. Configuration of Bank 105 for Each Region As shown in FIG. 4, from the display panel 10, the pixel portions 100a and 100b located in the central portion and the pixel portions located in the outer peripheral portion (arranged among a plurality of arranged pixel portions) It is assumed that the pixel portions 100c and 100d located at the end portions are extracted, and banks 105a to 105d are arranged on both sides of the pixel portions 100a to 100d.

  In the pixel portion 100a and the pixel portion 100b, the organic light emitting layers (not shown in FIG. 4) are partitioned by the bank 105a, and the side surface portions 105aa and 105ab of the bank 105a and the hole injecting and transporting layer which is a base layer. The surface 104a of 104 forms angles θaa and θab, respectively.

  On the other hand, the pixel portion 100c and the pixel portion 100d located on the outer periphery of the panel are partitioned by a bank 105a between the organic light emitting layers (not shown in FIG. 4), and the side portions 105ca and 105cb of the bank 105c are separated from each other. The surface 104a of the hole injecting and transporting layer 104, which is the underlayer, forms angles θca and θcb, respectively. Further, in the bank 105d that further divides the organic light emitting layer (not shown in FIG. 4) of the pixel portion 100d in the X-axis direction, the side surface portion 105da and the surface 104a of the hole injecting and transporting layer 104, which is a base layer, Forms an angle θda. At this time, the angles θaa, θab, θca, θcb, θda satisfy the relationships shown by the following equations.

[Formula 1] θca> θcb
[Equation 2] θaa = θab
[Equation 3] θda> θcb
In this embodiment, the angles θaa, θab, and θcb are angles within a range of 25 [°] to 30 [°], and the angles θca and θda are within a range of 35 [°] to 40 [°]. The angle of

5). The relationship between the inclination angle θ of the side surface in the bank 105 and the film thickness of the organic light emitting layer 106 The relationship between the inclination angle θ of the side surface in the bank 105 and the film thickness of the organic light emitting layer 106 will be described with reference to FIGS. To do. In FIG. 5, the structure of the pixel portion is schematically drawn.

  As shown in FIG. 5A, the angle of inclination of the side surface of the bank 105x (the angle formed between the side surface and the surface of the hole injecting and transporting layer 104) is an angle θx, and as shown in FIG. The inclination angle of the side surface portion of the bank 105y (the angle formed between the side surface portion and the surface of the hole injection transport layer 104) is the angle θy. The angle θx and the angle θy satisfy the following relationship.

[Equation 4] θy> θx
When inks 1060x and 1060y containing an organic light emitting material are dropped onto the openings defined by the banks 105x and 105y, the heights Hx and Hy of the pinning positions Px and Py are as follows.

[Expression 5] Hy> Hx
As shown in FIG. 5C, when the ink 1060x is dried, the central portion of the pixel portion of the formed organic light emitting layer 106x is caused by the relatively low height Hx of the pinning position Px. The thickness rises and the film thickness becomes the thickness Tx.

  On the other hand, as shown in FIG. 5D, when the ink 1060y is dried, the organic light emitting layer 106y to be formed has a relatively high height Hy at the pinning position Py. The portion is recessed and the film thickness becomes the thickness Ty.

The thickness Tx and the thickness Ty satisfy the following relationship.
[Equation 6] Tx> Ty
The above relationship is summarized in FIG. As shown in FIG. 6, if the inclination angle (taper angle) θ of the bank 105 is reduced, the pinning height H is reduced, and the resultant film thickness T of the organic light emitting layer 106 is increased. On the contrary, if the inclination angle (taper angle) θ of the bank 105 is increased, the pinning height H is increased, and the resulting film thickness T of the organic light emitting layer 106 is decreased.

About the above matter, five samples were created and evaluated. The results are shown in FIG. 7 and FIG.
As shown in FIGS. 7 and 8, the pinning position is higher in Sample 3 and Sample 4 in which the taper angle is larger than the film thickness distribution of Sample 2. 7 and 8, the horizontal axis indicates the horizontal direction, and the vertical axis indicates the height direction.

However, Sample 5 in which the taper angle (tilt angle) of the bank was increased to 50 [°] had a lower film thickness uniformity than Sample 2.
6). Manufacturing Method of Display Panel 10 A characteristic part of the manufacturing method of the display panel 10 according to the present embodiment will be described with reference to FIGS. In addition, about the manufacturing process which abbreviate | omits description below, it is possible to employ | adopt the various processes proposed as a prior art.

  First, as shown in FIG. 9A, the anode electrode 102 and the electrode covering layer 103 are formed on the upper surface of the substrate 101 in the Z-axis direction so as to correspond to the planned regions where the pixel portions 100a to 100d,. Are sequentially stacked. Then, a hole injecting and transporting layer 104 is laminated and formed so as to cover the entire surface. The anode electrode 102 is formed by, for example, forming an Ag thin film using a sputtering method or a vacuum deposition method, and then patterning the Ag thin film using a photolithography method.

  The electrode coating layer 103 is formed, for example, by forming an ITO thin film on the surface of the anode electrode 102 using a sputtering method or the like and patterning the ITO thin film using a photolithography method or the like. In forming the hole injecting and transporting layer 104, first, a metal film is formed on the surface of the substrate 101 including the surface of the electrode coating layer 103 by using a sputtering method or the like. Thereafter, the formed metal film is oxidized to form the hole injecting and transporting layer 104.

  Next, as shown in FIG. 9B, a bank material layer 1050 is formed so as to cover the hole injection transport layer 104 by using, for example, a spin coating method. For the formation of the bank material layer 1050, a photosensitive resist material is used. Specifically, as described above, an insulating organic material such as an acrylic resin, a polyimide resin, or a novolac phenol resin is used. it can.

  Next, as shown in FIG. 9C, a mask 501 provided with openings 501a and 501c is provided above the bank material layer 1050 where a bank is to be formed. In this state, exposure is performed through the openings 501a and 501c of the mask 501.

  Note that, as shown in FIG. 9C, the width Wa of the opening 501a of the mask 501 between the regions corresponding to the pixel portions 100a and 100b located in the center is the banks 105a and 105b to be formed (FIG. 4). )) Is defined by points Pa1 and Pa2 at the lower end of the side surface portion. On the other hand, between the regions corresponding to the pixel portions 100c and 100d located on the outer peripheral portion, the width Wc1 of the mask opening 501a is the point at the upper end of the side portion of the banks 105c and 105d (see FIG. 4) to be formed. It is defined by Pc1 and the point Pc2 at the bottom.

  Next, as shown in FIG. 10A, openings 502c are provided above the bank material layer 1050 at locations corresponding to the side portions 105ca and 105da (see FIG. 4) of the banks 105c and 105d, respectively. The mask 502 is disposed. In this state, the second exposure is executed through the opening 502c of the mask 502.

  The width Wc2 of the opening 502c in the mask 502 is defined by the lower end point Pc3 and the upper end point Pc1 of the side surfaces of the banks 105c and 105d to be formed.

  Next, as shown in FIG. 10B, development and baking are performed to form banks 105a to 105d,. As described above, the side surface portions 105ca and 105da in the banks 105c and 100d have an inclination angle larger than that of the side surface portion 105cb in the bank 105c, and the inclination angles of the side surface portions 105aa, 105ab,. Will be equal.

  Thereafter, as shown in FIG. 10C, ink containing an organic light-emitting material is dropped into the openings partitioned by the banks 105a to 105d,. The organic light emitting layers 106a to 106d,... Are formed by drying the ink.

Although not shown, the display panel 10 is formed by sequentially stacking the electron injection layer 107, the cathode electrode 108, the sealing layer 109, and the like.
7. Effect As shown in FIG. 4, in the display panel 10 of the display device 1 according to the present embodiment, the organic light emitting layers 106c and 106d (see FIG. 10C) of the pixel portion 100c and the pixel portion 100d located on the outer periphery of the panel. In the bank 105c that partitions each other, the inclination angles θca and θcb of the side surface portions 105ca and 105cb are set to have the relationship of [Equation 1], that is, the angle θca is larger than the angle θcb. Has been. For this reason, in the pixel portions 100c and 100d located on the outer peripheral portion of the panel, the pinning position corresponding to the side surface portions 105ca and 105da when ink is dropped at the time of manufacture is higher than the pinning position corresponding to the side surface portion 105cb. .

  Therefore, the film thicknesses of the organic light emitting layers 106c and 106d are on the outer peripheral side of the pixel portions 100c and 100d located on the outer peripheral portion of the panel (portions corresponding to the side surface portions 105ca and 105da) due to the vapor concentration distribution during ink drying. The action of increasing the thickness can be suppressed by the action by setting the respective inclination angles θca to θda of the corresponding side surface parts 105ca and 105da of the banks 105c and 105d as described above, and the pixel parts 100c and 100c positioned on the outer peripheral part of the panel The film thickness on the end side of the organic light emitting layers 106c and 106d at 100d can be made uniform as a whole.

  Further, the inclination angles θaa and θab of the side surface portions 105aa and 105ab in the bank 105a are equal to each other as shown in the above [Equation 2]. For this reason, the film thickness of the organic light emitting layer 106d corresponding to each part is equalized (uniformed) as a whole.

Therefore, the display panel 10 has an effect that the thickness of the organic light emitting layer 106 after drying is uniform in the pixel portions 100a to 100d,.
In addition, if the manufacturing method of the display apparatus 1 which concerns on this Embodiment demonstrated using FIG. 9 and FIG. 10 is used, manufacture of the display apparatus 1 which has the said effect is possible.

  Further, as described above, “equal” does not mean that the numerical values are completely equal, but considers a dimensional error in manufacturing the display device. Specifically, the inclination angles are made equal in a range where the difference in luminance (brightness unevenness) between the pixel portions 100a to 100d,. Means.

[Modification 1]
Next, Modification 1 of the method for manufacturing the display device 1 will be described with reference to FIG. FIG. 11 shows steps corresponding to the steps shown in FIGS. 9C to 10A.

  As shown in FIG. 11, after a bank material layer 1050 is formed on the hole injecting and transporting layer 104, a mask 503 is disposed thereon. The mask 503 is provided with light transmitting portions 503a, 503c1, 503c2,. The light transmitting portions 503a, 503c1, 503c2,... Correspond to the locations where the banks 105a to 105d,... (See FIG. 4) partitioning the pixel portions 100a to 100d,. Is provided.

  In the method for manufacturing the display device 1 according to the first modification, the width Wa of the light transmitting portion 503a in the region corresponding to the pixel portion 100a is the point at the lower end of the banks 105a and 105b (see FIG. 4) to be formed. It is defined by Pa1 and Pa2.

  On the other hand, the width Wc2 of the light transmitting portion 503c1 in the region corresponding to the pixel portion 100c is defined by the lower end point Pc2 and the upper end point Pc1 of the banks 105c and 105d (see FIG. 4) to be formed. The light transmitting portion 503c2 is defined by points Pc3 and Pc1 at the lower ends of the banks 105e and 105f (see FIG. 4) to be formed.

  Here, the mask 503 is configured by using a mask such as a halftone, and the light transmittances of the light transmission portions 503a and 503c1 and the light transmission portion 503c2 are different. Specifically, the light transmittance of the light transmitting portion 503c2 is larger than the light transmittance of the light transmitting portions 503a and 503c1.

  Banks 105a to 105d as shown in FIG. 10B can be formed by performing exposure / development in a state where the mask 503 having the above-described configuration is arranged and then baking. it can. That is, in the portion exposed through the light transmitting portion 503c2 where the light transmittance is set to be large, as compared with the portion exposed through the other light transmitting portions 503a and 503c1, The inclination angle of the side wall surface is increased.

The subsequent steps are the same as those in the above embodiment.
Note that the magnitude relationship may be reversed with respect to the above-described relationship regarding the exposure amount depending on various conditions such as the type of photosensitive resist material that is a constituent material of the bank 105.

The display device 1 can also be manufactured by the manufacturing method as described above.
[Modification 2]
Next, a second modification of the method for manufacturing the display device 1 will be described with reference to FIGS. 12 and 13 show processes corresponding to the processes shown in FIGS. 9C to 10B.

  As shown in FIG. 12A, a bank material layer 1050 is formed on the hole injecting and transporting layer 104, and then a mask 504 is disposed thereon. The mask 504 is provided with openings 504a, 504c,... Corresponding to the locations where the banks 105a to 105d,.

  Openings 504a provided at locations where banks 105a and 105b (see FIG. 4) corresponding to the pixel portions 100a and 100b are to be formed are the same as the openings 501a of the mask 501 used in the manufacturing method of the above embodiment. It is formed with a width. On the other hand, the width Wc3 of the opening 504c provided at a location where the banks 105c and 105d (see FIG. 4) corresponding to the pixel portions 100c and 100d are to be formed is surrounded by a two-dot chain line in FIG. As shown in the portion, the width is set to be larger than the width defined by the points Pc2 and Pc3 at the lower ends of the banks 105c and 105d. Specifically, the width is increased at a location where the inclination angle is to be increased.

  First exposure / development is performed in a state where the mask 504 having the form shown in FIG. As a result, as shown in FIG. 12B, bank material layers 1051a to 1051d,... Remain at locations corresponding to the openings 504a and 504c of the mask 504.

  As shown in FIG. 12B, in the state where the first exposure / development is performed, the inclination angles of the side surfaces of the bank material layers 1051a to 1051d,... Are uniform. In the second modification, baking is not performed at this time.

  As shown in FIG. 13A, in a state where the bank material layers 1051a to 1051d,... Are formed, a mask 505 is disposed thereon. In the mask 505, openings are made only at locations where the inclination angle is to be increased (side portions 105ca, 105da,... In FIG. 4) among locations corresponding to the side portions of the banks 105a to 105d to be formed. 505c and 505d are provided.

  Banks 105a to 105d as shown in FIG. 13 (b) can be formed by performing the second exposure / development with the mask 505 and then baking. In the banks 105c, 105d, the side surface portions 105ca, 105da on the left side in the X-axis direction (panel center side) have a larger inclination angle than the other side surface portions 105aa, 105ab, 105cb,.

Thereafter, the display device 1 can be manufactured by performing the same steps as in the above-described embodiment and the like.
[Verification of manufacturing method]
About each manufacturing method which concerns on the said embodiment and the modification 1, 2, the bank shape after formation was verified by the specific example. The result will be described with reference to FIG.

  As shown in FIG. 14A, the inclination angle of the bank side surface portion to be formed increases as the exposure amount increases. Specifically, when the exposure amount is 200 [mJ] and the exposure / development is performed, the inclination angle of the bank side surface portion is 23 [°], whereas the exposure amount is 300 [mJ]. The inclination angle of the bank side surface formed when developed is 38 [°]. This result is also shown in AFM (Atomic Force Microscope) shown in FIG.

  Further, as shown in FIGS. 14A and 14B, after the first exposure / development with an exposure amount of 200 [mJ], the second exposure / development with an exposure amount of 100 [mJ]. When development is performed, the inclination angle of the bank side surface portion to be formed is 50 [°]. This corresponds to the manufacturing method according to the second modification and is considered to be effective for increasing the inclination angle of the bank side surface.

In FIG. 14B, the horizontal axis indicates the horizontal direction, and the vertical axis indicates the height direction.
[Other matters]
In the above embodiment and the first and second modifications, each configuration as an example is adopted in order to easily understand the configuration and the operation / effect of the present invention. The present invention, except for essential parts, It is not limited to the said form. For example, in the above embodiment, as shown in FIG. 2, the configuration in which the anode electrode 102 is disposed on the lower side in the Z-axis direction with respect to the organic light emitting layer 106 is adopted as an example. In addition to the organic light-emitting layer 106, a configuration in which the cathode electrode 108 is disposed on the lower side in the Z-axis direction may be employed.

  When the cathode electrode 108 is arranged on the lower side in the Z-axis direction with respect to the organic light emitting layer 106, a top emission structure is formed. Therefore, the cathode electrode 108 is used as a reflective electrode layer, and the electrode coating layer 103 is formed thereon. The structure which forms is adopted.

  In the above-described embodiment and the like, the specific external shape of the display device 1 is not shown. However, for example, it can be a part of the system as shown in FIG. The organic EL display device does not require a backlight like a liquid crystal display device, and is therefore suitable for thinning, and exhibits excellent characteristics from the viewpoint of system design.

  Further, in the above embodiment and the first and second modifications, the so-called line bank structure as shown in FIG. 3 is adopted as the form of the bank 105, but the bank 105 extends in the Y-axis direction as shown in FIG. The display panel 30 can also be configured by using a pixel bank 305 including a bank element 305a and a bank element 305b extending in the X-axis direction.

As shown in FIG. 16, when the pixel bank 305 is employed, the inclination angle of the side wall portion on the outer side in the X-axis direction and the Y-axis direction with respect to the pixel portion 300 on the outer periphery of the panel is increased. The effect similar to the above can be obtained. Specifically, in the configuration in which the pixel portion having the side wall portion indicated by the arrows B ₁ , B ₂ , B ₃ , and B ₄ corresponds to the corner portion of the outer peripheral portion of the panel, the inclination of the side wall portion indicated by the arrows B ₁ and B ₃ The angle is made larger than the inclination angle of the side wall portion indicated by the arrow B ₂ , and the inclination angle of the side wall portion indicated by the arrows B ₄ and B ₆ is larger than the inclination angle of the side wall portion indicated by the arrow B _5. To be.

  Moreover, in the said embodiment and the modification 1, 2, the inclination angle of the side wall part outside the bank formed in a panel outer peripheral part was made larger than the inclination angle of the bank side part corresponding to a panel center part. However, this relationship can be appropriately changed according to the flow of vapor (vapor concentration) in the drying process related to the formation of the organic light emitting layer during production. For example, due to the structure of the drying device, etc., when the flow of vapor during ink drying is in the direction from the outer periphery of the panel toward the center of the panel, this corresponds to the location where the thickness of the organic light emitting layer increases. Then, the inclination angle of the bank side surface portion may be increased. Thereby, the film thickness of an organic light emitting layer can be made uniform, and the brightness nonuniformity in the whole panel can be reduced.

  In the embodiment and the first and second modifications, the light emission colors (red, green, and blue) in the pixel portion are not distinguished, but the characteristics of the ink containing the organic light emitting material change according to the light emission color. In this case, the inclination angle of the corresponding bank side surface portion can be defined according to the ink characteristics of each emission color.

  In addition, the area to be increased in the inclination angle of the bank side surface portion can be appropriately defined according to the manufacturing process, the panel size, etc., for example, 0.5 [%] to the number of the outer peripheral portion of the panel It is considered desirable to target a pixel portion of about [%] (for example, 1 [%]). This is because the variation in the thickness of the organic light emitting layer in the display device according to the prior art shown in FIG.

  The present invention is useful for realizing a display device with little luminance unevenness and high image quality performance.

1. Display device 10,30. Display panel 20. Drive control part 21-24. Drive circuit 25. Control circuit 100, 100a to 100c, 300. Pixel unit 101. Substrate 102. Anode electrode 103. Electrode coating layer 104. Hole injection layer 105,105a-105f, 105x, 105y, 305. Banks 106, 106a, 106c, 106x, 106y. Organic light emitting layer 107. Electron injection layer 108. Cathode electrode 109. Sealing layer 501-505. Exposure masks 1050, 1051a, 1051b, 1051e, 1051f. Bank material layers 1060x, 1060y. ink

Claims (10)

A display device in which a plurality of pixel portions are arranged,
Each pixel portion includes a first electrode and a second electrode, and an organic light emitting layer interposed between the first electrode and the second electrode.
Above the first electrode, a plurality of banks are provided to partition the organic light emitting layer for each pixel unit,
Each of the plurality of pixel portions includes a first pixel portion and a second pixel portion that are located on the end side of the array and are adjacent to each other in the direction of the array,
The first pixel portion is located on the center side of the array with respect to the second pixel portion,
The plurality of banks includes a first bank that partitions the organic light emitting layer of the first pixel unit and the organic light emitting layer of the second pixel unit,
In the first bank, the first side surface portion corresponding to the first pixel portion has a larger inclination angle than the second side surface portion corresponding to the second pixel portion. The plurality of pixel portions include a third pixel portion and a fourth pixel portion that are located on the center side of the array and are adjacent to each other in the direction of the array,
The plurality of banks include a second bank that partitions the organic light emitting layer of the third pixel portion and the organic light emitting layer of the fourth pixel portion,
2. The tilt angle of the third side surface portion corresponding to the third pixel portion and the fourth side surface portion corresponding to the fourth pixel portion in the second bank are equal to each other. Display device. The plurality of banks includes a third bank that divides the organic light emitting layer of the second pixel portion on an end side of the array,
The display device according to claim 1, wherein the fifth side surface portion corresponding to the second pixel portion in the third bank has a larger inclination angle than the second side surface portion. The inclination angle of the first side surface portion is in the range of not less than 35 ° and not more than 40 °,
The display device according to claim 1, wherein an inclination angle of the second side surface portion is in a range of 25 ° to 30 °. The display device according to claim 2, wherein an inclination angle of each of the third side surface portion and the fourth side surface portion is in a range of 25 ° to 30 °. The display device according to claim 1, wherein the inclination angle is an angle formed between each side surface portion of the bank and an upper surface of a base layer on which the bank is provided. A method of manufacturing a display device in which a plurality of pixel portions are arranged,
A first step of forming a functional layer including a first electrode on a substrate;
A second step of laminating a photosensitive resist material on the functional layer;
The laminated photosensitive resist material is subjected to mask exposure and patterned to form a plurality of openings corresponding to a plurality of pixel portions and to form a plurality of banks partitioning the adjacent openings. 3 steps,
A fourth step of forming an organic light emitting layer by dropping an ink containing an organic light emitting material into each of the plurality of openings and drying the ink;
A fifth step of forming a second electrode above the organic light emitting layer;
Have
Each of the plurality of openings includes a first opening and a second opening that are located on the end side of the array and are adjacent to each other in the direction of the array,
The first opening is located on the center side of the array with respect to the second opening,
The plurality of banks include a first bank that partitions the organic light emitting layer of the first opening and the organic light emitting layer of the second opening,
In the third step, in the first bank, the first side surface portion corresponding to the first opening portion has an inclination angle larger than the second side surface portion corresponding to the second opening portion. Forming the first bank. A method for manufacturing a display device. In the third step, with respect to exposure of the photosensitive resist material, an exposure amount to a portion corresponding to the first side surface portion is increased with respect to an exposure amount to a portion corresponding to the second side surface portion. The manufacturing method of the display device according to claim 7, wherein an inclination angle of the first side surface portion is larger than an inclination angle of the second side surface portion. In the third step, with respect to the exposure of the photosensitive resist material, the light transmittance to the portion corresponding to the first side surface portion is set to the light transmittance to the portion corresponding to the second side surface portion. The method for manufacturing a display device according to claim 7, wherein a large mask is used so that an inclination angle of the first side surface portion is larger than an inclination angle of the second side surface portion. In the third step, the portion corresponding to the first side surface portion and the portion corresponding to the second side surface portion are exposed and developed with the photosensitive resist material, and then correspond to the first side surface portion. 8. The method according to claim 7, wherein an exposure process is additionally performed on the portion to be processed so that the inclination angle of the first side surface portion is larger than the inclination angle of the second side surface portion. The manufacturing method of the display apparatus of description.

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