KR100261542B1 - Spacer manufacturing method of field effect electron emission display device - Google Patents

Abstract

PURPOSE: A method for manufacturing a spacer of a field emission display device is provided to manufacture a spacer for separating an anode plate and a cathode plater by using a photosensitive glass. CONSTITUTION: A photosensitive glass spacer fixing mask is aligned on an anode substrate(40) including an anode electrode(42) and a color phosphors(44). A mask hole of a rectangular shape with a ratio of length and breadth ratio of 2:1 is formed on the photosensitive glass spacer fixing mask. A photosensitive glass spacer(30) with a ratio of length and breadth ratio of 1:1 is formed. The photosensitive glass spacer has a rectangular shape. The photosensitive glass spacer fixing mask is aligned on a substrate(10). A fixing agent(60) is applied on the mask hole. The photosensitive glass spacer is laminated on the mask hole. The spacer(30) is fixed by drying the fixing agent(30).

Description

Spacer manufacturing method of field effect electron emission display device

The present invention relates to a field effect electron emission display device (hereinafter, abbreviated as FED), and more particularly, by manufacturing a spacer separating the positive electrode plate and the negative electrode plate using photosensitive glass using an etching process, The present invention relates to a method for manufacturing a spacer of a field effect electron-emitting display device, in which a spacer is precisely positioned at a desired place and an aspect ratio thereof can be maintained at a predetermined ratio or more.

The field effect electron emission display device is designed to display a desired pattern, letter or symbol by electrons emitted from the cathode by colliding with phosphors and emitting light. The power consumption is low and there is an advantage that can implement a high brightness color pattern.

The FED forms a microtips-shaped cathode that emits electrons for field concentration, and forms an anode coated with a gate and phosphor for electric field induction to induce electron emission from a plurality of microtips. When the electrons collide with the phosphor, the phosphor is stimulated to realize an image using light generated in the process of exciting and transitioning the outermost electrons of the phosphor.

Figure 1 shows the basic configuration of this FED. This is formed by crossing the cathode electrode 12 of the column electrode and the gate electrode 16 of the row electrode, which are separated by the insulating layer 18, on the cathode substrate 10. The microtip-shaped emitter 14 is formed integrally with the cathode electrode 12 between each of the electrodes 18, and a gate hole 20 is formed in the upper gate electrode 16 to open.

Meanwhile, the anode electrode 42 and the phosphor 44 of the transparent conductive film ITO are formed on the bottom surface of the anode substrate 40, and the anode substrate 40 and the cathode substrate 10 are formed through a plurality of spacers 30. The microtips of the emitter 14 are formed to face each other so as to face the phosphor 44 so that electrons are emitted from the tip of the emitter 14 even when only a low voltage is applied to the micro area. The outer part is vacuum-packed by the sealing agent 60.

In the FED having such a structure, when an appropriate amount of voltage is applied to the cathode electrode 12 and the gate electrode 16, a strong electric field is formed at the microtip of the emitter 14, and electrons are emitted by the quantum mechanical tunnel effect. . When the emitted electrons are attracted to the anode electrode 42 to which a voltage of several hundred volts is applied and collide with the phosphor 44, the emitted electrons are emitted on the phosphor 44.

On the other hand, the conventional FED manufacturing method is as follows. The gate hole 20 and the cavity 22 are formed in a structure in which the cathode electrode 12, the insulating layer 18, and the gate electrode 16 are deposited on the cathode substrate 10 using a conventional semiconductor process. By rotating the cathode substrate 10 and depositing molybdenum (Mo) vapor using an electron beam evaporation apparatus having a predetermined projection angle, the microtip-shaped emitter 14 is formed inside the cavity 22.

In addition, after the anode electrode 42 formed of the ITO transparent conductive film is formed on the separate anode substrate 40 and the phosphor 44 is coated thereon, the anode substrate 40 and the cathode substrate 10 are spaced apart from each other. A plurality of spacers 30 are formed on the upper surface of the gate electrode 16 of the cathode substrate 10 so as to be opposed to each other, and then the anode substrate 40 is bonded thereon to form an FED panel. Then, the edge of the FED panel is sealed with the sealant 60 and exhausted through the exhaust port 24 so that a vacuum may be formed therein, thereby high vacuum packaging.

On the other hand, there are a number of methods for manufacturing the spacer in the FED, one representative example, the predetermined position of the cathode substrate 10 on which the anode substrate 40 or the emitter 14 to which the phosphor 44 is applied is formed. The dielectric paste is applied by several screen printing processes and then fired to form a spacer 30. FIG. 2 shows the formation of the spacer 30 in this manner, where the spacer 30 determines the spacing between the anode substrate 40 and the cathode substrate 10, thus increasing the height from several hundred microns to several thousand microns. It is formed to have.

In addition, there is a method of using a glass, a method of using a polymer, a method of using a photosensitive glass, etc., but the situation is only in the experimental stage, and the FED is not commercialized yet, it is not known which method is best. In addition, the conditions required for the spacer should be composed of an insulator, should not be affected by vacuum, should be resistant to compressive stress, easy to manufacture and low production cost.

However, the above-described methods may have disadvantages in that they are not feasible or expensive due to the verification of the specific effects yet. In addition, aspect ratio may be a problem and a problem may arise in size or strength.

The present invention is to solve the conventional problems as described above, the present invention by manufacturing a mask and spacer of the photosensitive glass material and screen printing sequentially with the fixing agent, while accurately positioned in the desired place, maintaining the aspect ratio above a certain The purpose of the present invention is to provide a spacer manufacturing method which is easy to manufacture and at the same time low in manufacturing cost and has a low impact on vacuum as well as excellent strength.

In order to achieve the above object, the present invention provides a method for manufacturing a spacer of a field effect electron emission display device, wherein photosensitive glasses having a rectangular mask hole having a minimum aspect ratio of 2: 1 or more are staggered at positions where the spacer is to be fixed. Forming a spacer for fixing the spacers of the material, manufacturing a spacer having a rectangular columnar photosensitive glass material having an aspect ratio of 1: 1, aligning the mask on the substrate, and aligning the mask on the substrate Applying a fixing agent to the hole of the mask by the screen printing method, laminating a spacer having an aspect ratio of 1: 1 in the mask hole in multiple stages to form a total aspect ratio of the spacer of 2: 1 or more, and drying the fixing agent to dry the spacer It characterized in that it comprises a step of fixing.

According to the present invention, the desired aspect ratio can be obtained by forming a spacer by repeating the screen printing process of applying a fixing agent using a spacer fixing mask and spacer of photosensitive glass material and scattering the spacer. Simultaneously, the manufacturing cost is low, the impact on vacuum is low, and the compressive stress is excellent, thereby satisfying the requirements of the spacer.

1 is a cross-sectional view showing the structure of a typical FED,

Figure 2 is a cross-sectional view showing a spacer produced by a conventional screen printing method,

3a to 3c is a process diagram showing a process preceding the spacer manufacturing process according to the present invention,

Figure 4 is a perspective view showing a glass mask according to the invention for use in the manufacture of the spacer in the FED manufacturing process,

5a to 5d is a spacer manufacturing process according to the present invention,

6 is a perspective view illustrating a distribution state of a spacer applied to a substrate through a glass mask according to the present invention;

<Description of the code | symbol about the principal part of drawing>

10: cathode substrate 12: cathode electrode (Cathode electrode)

14: emitter 16: gate electrode

18: insulating layer 20: gate hole

22: Cavity 24: Exhaust vent

30: spacer 40: anode substrate

42: anode electrode 44: phosphors (Color phosphors)

50: glass mask 52: mask hole

60: Sealant

Such a characteristic configuration and the effects thereof according to the present invention will become more apparent from the detailed description of the embodiments with reference to the accompanying drawings.

First, the process preceding the spacer manufacturing process of the field effect electron emission display device according to the present invention will be briefly described as follows.

3A is a cross-sectional view illustrating a process of manufacturing a cathode substrate, in which a cathode electrode 12 is deposited on the cathode substrate 10 and patterned in a column direction, and SiO ₂ or the like is deposited on the cathode electrode 12. The same insulating layer (not shown) is formed by a deposition method, and the gate electrode 16 is deposited on the insulating layer to pattern the gate electrode 16 in a direction orthogonal to the cathode electrode 12 to form the cathode electrode 12 and the gate. The electrodes 16 are separated by an insulating layer and arranged in a lattice shape.

3B is a cross-sectional view illustrating a process of forming a hole, a cavity, and an emitter, in which a plurality of gate holes 20 are formed at one end of the gate electrode 16, thereby removing the exposed insulating layer 18. To form the cavity 22. Subsequently, a predetermined projection angle is rotated while rotating the structure in which the cathode electrode 12, the insulating layer 18, the gate electrode 16, the gate hole 20, and the cavity 22 are formed on the cathode substrate 10 by the preceding process. A metal layer is formed by an electron beam evaporation apparatus having a to form an emitter 14 having a sharp tip inside the cavity 22.

FIG. 3C is a cross sectional view showing a process for forming an anode substrate. An anode electrode 42 formed of an ITO transparent conductive film is formed on an anode substrate 40, and a phosphor 44 is applied thereon to form a predetermined shape. Pattern.

Figure 4 shows a mask according to the invention for use in the manufacture of the spacer in the FED manufacturing process, which is manufactured using photosensitive glass with a selective etching rate of up to 20: 1 to 40: 1, the mask hole 52 The positions of are selected according to the calculated stress and staggered in the zigzag direction at each position where the spacer is to be fixed. Therefore, after exposing it, a square hole having a desired size is manufactured through an etching process using heat treatment and hydrofluoric acid. At this time, the mask hole 52 has an aspect ratio of at least 2: 1 or more and a length of several millimeters (mm) or more to produce a rectangular shape.

5a to 5d show a spacer manufacturing process according to the present invention.

First, the screen fixing spacer fixing mask 50 configured as described above is aligned on the anode substrate 40 on which the anode electrode 42 and the phosphor 44 are patterned. Here, the process of inserting the spacer 31 into the mask hole 52 is difficult. As a representative method, as shown in FIG. 5A, the spacer 31 having an aspect ratio of 1: 1 is inserted into the rectangular mask hole 52. Next, there is a method of continuously increasing the aspect ratio as shown in FIGS. 5B and 5C by screen printing the spacers 32 and 33 to which the fixing agent is applied.

The first spacer 31 is manufactured in the shape of a square pillar having an aspect ratio of 1: 1 using photosensitive glass of the same material as the mask 50, and the length of the first spacer 31 is about 2/3 of the length of the mask hole 52. . A fixing agent (not shown) is first applied before inserting the spacer 31 into the mask hole 52. At this time, if the length ratio of the spacer 31 to 2 mm or more while the length ratio of the square hole 52 and the spacer 31 of the mask 50 is about 2: 2, screen printing may be very easy. In addition, although the first spacer 31 and the second or third spacers 32 and 33 may not be vertically aligned when they are stacked, the spacers 30 may collapse or may not affect the phosphor 44. Also, as shown, glass beads 33 may be used as the last spacer.

As another spacer inserting method, there is a method of manufacturing the spacer 30 after coating one side of the spacers with a metal and adhering the magnetic (not shown) to the opposite side of the mask hole 52, in the present invention, both methods It is desirable to maintain a maximum aspect ratio of about 4: 1 as possible and in this way.

Meanwhile, in the above-described process, the process of forming the spacer 30 on the anode substrate 40 is described. However, the spacer 30 may be formed on the cathode substrate 10.

And, as shown in Figure 5d, while the spacer 30 and the spacer fixing mask 50 at the same time through the drying and pre-sintering, aligned with the lower substrate and finally sintered by the moisture and binder contained in the fixing agent After removing the spacer 30 to fix the spacer 30, it is bonded by a vacuum packaging process to form an FED panel.

This vacuum packaging process is performed while maintaining the vacuum of the panel through the exhaust process, the sealing material 60 of the frit glass material is sintered at a temperature of about 400 ℃ or more to seal the panel. At this time, the anode substrate 40 and the cathode substrate 10 are pressed at a predetermined pressure. A fixing agent made of a frit glass material also undergoes plastic deformation at a sintering temperature, so that internal gaps between the panels are formed in the same manner as the spacers 30.

6 illustrates a distribution state of spacers formed on a substrate through a glass mask according to the above-described process.

The foregoing has described the present invention with reference to the preferred embodiments, and the technical idea of the present invention is not limited thereto, and modifications and changes may be made without changing the scope within the scope of the claims.

According to the spacer manufacturing method according to the present invention as described above, by configuring the spacer fixing mask and the spacer with a photosensitive glass material, the mask hole can be obtained through the etching and heat treatment process to obtain an improved etching rate, applying a fixing agent By forming the spacer through the repeated screen printing process of scattering the spacer, the desired aspect ratio can be easily formed at low cost, excellent compressive strength can be obtained, and no problem occurs in vacuum (Out gasing).

Claims (8)

In the spacer manufacturing method of the field effect electron emission display device, Forming a mask for fixing a spacer of photosensitive glass material having a rectangular mask hole having a minimum aspect ratio of 2: 1 or more at a position where the spacer is to be fixed; Manufacturing a spacer having a rectangular columnar photosensitive glass material having an aspect ratio of 1: 1; Aligning the mask on a substrate; Applying a fixing agent to the holes of the mask aligned on the substrate by a screen printing method, and stacking the spacer having an aspect ratio of 1: 1 in the mask hole in multiple stages to form an overall aspect ratio of the spacer of 2: 1 or more; Wow, And drying the fixing agent to fix the spacers. The method of claim 1, The mask hole is a method of manufacturing a spacer of a field effect electron emission display device, characterized in that formed by etching with hydrofluoric acid. The method of claim 1, The method of manufacturing a spacer of a field effect electron emission display device, characterized in that the one side of the spacer is coated with a metal to close the magnetic contact to the opposite side of the mask hole and then the spacer is fixed. The method of claim 1, The method of manufacturing a spacer of a field effect electron emission display device, characterized in that the last spacer in the stacking of the spacer in multiple stages using a photosensitive glass ball. The method of claim 1, A method for manufacturing a spacer of a field effect electron emission display device, characterized in that the aspect ratio of the entire spacer is formed to be 4: 1 or more. The method of claim 1, And the spacer is formed on the anode substrate. The method of claim 1, And the spacer is formed on the cathode substrate. The method of claim 1, The material of the fixing agent is a spacer manufacturing method of a field effect electron emission display device, characterized in that made of the same material as the sealing sealant to be sintered at the same temperature.

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