KR100294791B1 - Etching machine - Google Patents
Etching machine Download PDFInfo
- Publication number
- KR100294791B1 KR100294791B1 KR1019980012697A KR19980012697A KR100294791B1 KR 100294791 B1 KR100294791 B1 KR 100294791B1 KR 1019980012697 A KR1019980012697 A KR 1019980012697A KR 19980012697 A KR19980012697 A KR 19980012697A KR 100294791 B1 KR100294791 B1 KR 100294791B1
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- South Korea
- Prior art keywords
- etching solution
- etching
- plate
- electrode plate
- metal plate
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- 238000005530 etching Methods 0.000 title claims abstract description 92
- 229910052751 metal Inorganic materials 0.000 claims abstract description 40
- 239000002184 metal Substances 0.000 claims abstract description 40
- 238000007654 immersion Methods 0.000 claims description 15
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 abstract description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 2
- 229910052802 copper Inorganic materials 0.000 abstract description 2
- 239000010949 copper Substances 0.000 abstract description 2
- 238000005034 decoration Methods 0.000 abstract description 2
- 229910001220 stainless steel Inorganic materials 0.000 abstract description 2
- 239000010935 stainless steel Substances 0.000 abstract description 2
- 239000012212 insulator Substances 0.000 abstract 1
- 238000000034 method Methods 0.000 description 8
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 238000005520 cutting process Methods 0.000 description 3
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
- C25F7/00—Constructional parts, or assemblies thereof, of cells for electrolytic removal of material from objects; Servicing or operating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
- C25F3/00—Electrolytic etching or polishing
- C25F3/02—Etching
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- ing And Chemical Polishing (AREA)
Abstract
본 발명은 엘리베이터의 케이지와 도어 그리고, 건축물의 장식용등으로 널리 사용되는 스텐레스판이나 동판 등의 금속판(이하, 금속판이라 통칭함)의 표면에 에칭(etching)가공을 하여 금속판의 표면에 아름다운 무늬를 형성할 수 있도록 하는 에칭머신에 관한 것으로서, 더욱 상세하게는 에칭용액탱크의 내측 바닥면에 에칭가공을 할 금속판을 눕혀 놓은 상태로 에칭가공을 할 수 있도록 함으로서, 가공하는 금속판의 손실을 방지함과 동시에 에칭용액의 사용량을 절감시킬 수 있도록 하기 위한 것이다.The present invention provides a beautiful pattern on the surface of the metal plate by etching the surface of the metal plate (hereinafter referred to as metal plate) such as stainless steel plate or copper plate which is widely used for decoration of elevator cages and doors and buildings. The present invention relates to an etching machine that can be formed, and more particularly, by etching the metal plate to be etched on the inner bottom surface of the etching solution tank, thereby preventing the loss of the metal plate to be processed. At the same time to reduce the amount of use of the etching solution.
상기 본 발명에 의한 에칭장치는, 후방 양측에 지지포스트(4)가 수직설치된 받침대(1)의 상측에는 상부 양측에 걸림턱(3)을 구비하고 후방측 상부테두리에 "-"전극판(6)이 설치된 절연체의 에칭용액탱크(2)가 설치되며, 상기 에칭용액탱크(2)의 내측바닥에는 소정길이의 "+"전극봉(5)이 상향 설치되고, 상기 에칭용액탱크(2)의 상부에는 전방 양측에 상기 걸림턱(3)에 걸리는 걸림돌기(10)가 설치되고 금속판재로 제작되어 전기가 통하는 덮개형전극판(8)이 힌지식으로 개폐토록 설치되며, 상기 "-"전극판(6)과 덮개형전극판(8)이 다수개의 전극연결단자(7)에 의해 연결되고, 상기 양측 지지포스트(4)와 덮개형전극판(8)의 사이에는 실린더(11)가 설치된 것을 특징으로 한다.The etching apparatus according to the present invention has a latching jaw (3) on the upper both sides on the upper side of the pedestal (1) where the support post (4) is installed vertically on both rear sides, and the "-" electrode plate (6) on the rear upper edge. ), An etching solution tank 2 of an insulator is installed, and a "+" electrode bar 5 of a predetermined length is installed upward on an inner bottom of the etching solution tank 2, and an upper portion of the etching solution tank 2 is provided. In the front both sides is provided with a locking projection (10) to be caught on the locking step (3) and the cover-shaped electrode plate 8, which is made of a metal plate and is electrically connected to be opened and closed in a hinged manner, the "-" electrode plate 6 and the cover electrode plate 8 are connected by a plurality of electrode connection terminals 7, and the cylinder 11 is installed between the support posts 4 and the cover electrode plate 8 on both sides. It features.
Description
본 발명은 엘리베이터의 케이지와 도어 그리고, 건축물의 장식용등으로 널리 사용되는 스텐레스판이나 동판 등의 금속판(이하, 금속판이라 통칭함)의 표면에 에칭(etching)가공을 하여 금속판의 표면에 아름다운 무늬를 형성할 수 있도록 하는 에칭장치에 관한 것이다.The present invention provides a beautiful pattern on the surface of the metal plate by etching the surface of the metal plate (hereinafter referred to as metal plate) such as stainless steel plate or copper plate which is widely used for decoration of elevator cages and doors and buildings. It relates to an etching apparatus that can be formed.
종래의 에칭방법은 콘크리트로 깊게 구축한 에칭용액탱크의 내측에 에칭용액을 채운뒤에 가공할 금속판을 "+"전극에 걸은 상태에서 에칭용액의 내측에 침지(沈漬)하고, "-"전극도 에칭용액의 내측에 침지시킨 상태에서 전류를 통과시키면 금속판의 표면이 부식되면서 에칭면을 형성하게 된다.In the conventional etching method, the etching solution is filled in the inside of the etching solution tank deeply constructed of concrete, and the metal plate to be processed is immersed inside the etching solution while the metal plate to be processed is hooked on the "+" electrode. When a current is passed while being immersed inside the etching solution, the surface of the metal plate is corroded to form an etching surface.
이와 같은 종래의 에칭방법은, "+"전극에 가공할 금속판을 걸기 위하여 금속판에 구멍을 뚫어야만 했고, 상기와 같이 금속판에 "+"전극에 걸기위한 구멍이 뚫려 있어서 에칭가공이 완료한 뒤에 상기 구멍을 뚫었던 부분을 잘라내야 했다.In the conventional etching method, a hole must be drilled in the metal plate to hang the metal plate to be machined on the "+" electrode, and as described above, the hole for hanging the "+" electrode is drilled in the metal plate. I had to cut out the hole that I drilled.
상기와 같이 금속판에 구멍을 뚫는 공정과, 구멍을 뚫었던 부분을 잘라내는 절단공정이 추가되는 문제와, 구멍을 뚫었던 부분을 잘라내므로 재료의 손실이 많게 되는 등의 문제점을 지니고 있었다.As described above, there was a problem in that a process of punching a metal plate, a cutting process of cutting out a punched part, and a loss of material due to cutting of the punched part were made.
또한, 상기와 같이 에칭을 위하여 "+"전극에 가공할 금속판을 걸기 때문에 에칭용액탱크가 깊고 커야 했으며, 그에 따라 에칭용액의 사용량이 많이 소요되므로 제조원가를 상승시키게 되는 등의 문제점을 아울러 안고 있었다.In addition, since the metal plate to be processed on the "+" electrode for etching as described above, the etching solution tank had to be deep and large.
본 발명은 상기와 같은 문제점을 해결 하기위한 것으로서, 본 발명의 목적은 에칭가공할 금속판을 에칭용액탱크에 눕혀 놓은 상태로 에칭할 수 있도록 함으로서, 금속판에 구멍을 뚫지 않으므로 금속판의 손실을 예방하고, 에칭용액의 사용량을 대폭 절감하여 생산원가를 절감시킬 수 있도록 하는 에칭장치를 제공하기 위한 것이다.The present invention is to solve the above problems, an object of the present invention is to etch the metal plate to be etched in a state lying in the etching solution tank, to prevent the loss of the metal plate because it does not drill a hole in the metal plate, It is to provide an etching apparatus that can significantly reduce the amount of etching solution used to reduce the production cost.
도 1은 본 발명에 따른 에칭장치의 사시도.1 is a perspective view of an etching apparatus according to the present invention.
도 2는 본 발명의 평면도.2 is a plan view of the present invention.
도 3은 본 발명의 정단면도.Figure 3 is a front sectional view of the present invention.
도 4의 (가),(나)는 본 발명의 작용상태의 측단면도이다.4A and 4B are side cross-sectional views of the working state of the present invention.
* 도면의 주요부분에 대한 부호의 설명 *Explanation of symbols on the main parts of the drawings
1. 받침대 2. 에칭용액탱크1. Base 2. Etching solution tank
3. 걸림턱 4. 지지포스트3. Jam Jaw 4. Support Post
5. "+"전극봉 6. "-"전극판5. "+" electrode 6. "-" electrode plate
7. 전극연결단자 8. 덮개형전극판7. Electrode connector terminal 8. Cover type electrode plate
9. 힌지부 10. 걸림돌기9. Hinge 10. Hanging protrusion
11. 실린더 12. 에칭용액11.Cylinder 12. Etching Solution
13. 금속판 14. 침지전극판13. Metal plate 14. Immersion electrode plate
15. 통공15. Through
상기한 바와 같은 목적을 달성하기 위한 본 발명의특지에 따르면, 본 발명은 후방양측에 지지포스트가 수직설치된 받침대와, 상기 받침대 상에 설치되고 내상부 양측에 걸림턱을 구비하며 에칭용액이 채워지는 바닥면에 에칭되는 금속판이 놓여지는 에칭용액탱크와, 상기 지지포스트에 설치된 실린더의 로드에 의해 상기 에칭용액탱크의 상단에 힌지식으로 개폐되게 설치되고, 그 선단부에는 상기 걸림턱에 걸려지는 걸림돌기가 구비되며, 그 저면에는 침지전극이 설치된 금속판재의 덮개형전극판과, 상기 에칭용액탱크의 외측에 구비되고 상기 덮개형전극판과 전기적으로 연결되어 에칭작업시 상기 침지전극으로 전원을 공급하는 -전극을 포함하여 구성된다.According to a special feature of the present invention for achieving the above object, the present invention is provided with a support post is vertically installed on both sides of the rear, and provided on the pedestal and having a locking jaw on both sides of the inner upper portion is filled with the etching solution An etching solution tank on which a metal plate to be etched is placed and a rod of a cylinder installed on the support post is hingedly installed on the upper end of the etching solution tank. The bottom surface is provided with a cover-type electrode plate of the metal plate material and the immersion electrode is installed on the outer side of the etching solution tank and electrically connected to the cover-type electrode plate to supply power to the immersion electrode during the etching operation- It is configured to include an electrode.
상기 침지전극은 상기 덮개형전극판의 저면에 일정 간격을 두고 설치되는 것으로, 다수개의 통공이 형성되며 상기 덮개형전극판이 폐쇄시 에칭용액에 잠기게 된다.The immersion electrode is provided at a predetermined interval on the bottom surface of the cover electrode plate, a plurality of holes are formed and the cover electrode plate is immersed in the etching solution when closed.
이와 같은 구성을 가지는 본발명에서는 에칭을 위한 금속판을 에칭용액탱크내에 눕힌 상태로 작업을 수행하므로 상대적으로 적은양의에칭용액을 사용할 수 있고, 최종제품 크기의 금속판으로 에칭작업을 진행할 수 있게 되어 에칭작업 전후의 작업이 최소화되는 이점이 있다.In the present invention having such a configuration, since the metal plate for etching is performed in a state lying down in the etching solution tank, a relatively small amount of etching solution can be used, and the etching operation can be performed with a metal plate of a final product size. There is an advantage that the work before and after work is minimized.
이하 상기한 바와 같은 본 발명에 의한 에칭장치의 바람직한 실시예를 첨부된 도면을 참고하여 상세하게 설명한다.Hereinafter, a preferred embodiment of the etching apparatus according to the present invention as described above will be described in detail with reference to the accompanying drawings.
도 1내지 도4에 도시된 바와 같이, 받침대(1)의 후방 양측에는 지지포스트(4)가 수직설치되고, 상기 지지포스트(4)를 연결포스트(4`)가 연결한다. 상기 받침대(1) 상에는 에칭용액탱크(2)가 설치된다.1 to 4, support posts 4 are vertically installed on both rear sides of the pedestal 1, and the support posts 4 'connect the support posts 4'. The etching solution tank 2 is installed on the pedestal 1.
상기 에칭용액탱크(2)는 그 내부에서 에칭작업이 이루어지는 부분으로 그 크기는 대체로 에칭작업을 위한 금속판(13)을 바닥에 놓을 수 있을 정도의 크기를 가진다. 이와 같은 에칭용액탱크(2)의내상부 양측에는 걸림턱(3)이 형성되어 있다. 여기서 상기 에칭용액탱크(2)는 내측에 황산, 크롬용액 등이 에칭용액(12)이 담겨지므로 황산, 크롬용액이 충분히 견딜수 있는 재질로 형성되는 것이 바람직하다.The etching solution tank 2 is a portion where the etching work is performed in the inside thereof, and the size of the etching solution tank 2 is large enough to place a metal plate 13 for etching. The locking jaw 3 is formed at both sides of the inner upper portion of the etching solution tank 2. Here, the etching solution tank 2 is preferably formed of a material that can sufficiently withstand sulfuric acid and chromium solution because sulfuric acid, chromium solution, and the like are contained in the etching solution 12.
그리고 상기 에칭용액탱크(2)의 바닥면 일측에는 다수개의 +전극봉(5)이 소정 간격으로 일렬로 수직 상방으로 돌출되게 설치된다. 다음으로 상기 에칭용액탱크(2)의 상단 일측 가장자리에는 -전극판(6)이 설치되어 있다. 상기 -전극판(6)과 전기적으로 연결되게 다수개의 전극연결단자(7)가 설치된다. 상기 전극연결단자(7)는 아래에서 설명될 덮개형전극판(8) 측과 상기 -전극판(6)을 전기적으로 연결하게 된다.In addition, a plurality of + electrode rods 5 are installed on one side of the bottom surface of the etching solution tank 2 so as to protrude vertically upward in a row at predetermined intervals. Next, the -electrode plate 6 is provided at one edge of the upper end of the etching solution tank 2. A plurality of electrode connection terminals 7 are provided to be electrically connected to the -electrode plate 6. The electrode connecting terminal 7 electrically connects the cover electrode plate 8 side and the -electrode plate 6 to be described below.
한편, 상기 에칭용액탱크(2)의 상단에는 개폐가능하게 덮개형전극판(8)이 설치된다. 상기 덮개형전극판(8)은 상기 에칭용액탱크(2)의 일측에 힌지부(9)를 중심으로 개폐되도록 설치된다. 상기 덮개형전극판(8)의 선단 양측에는 상기 걸림턱(3)에 걸려져 덮개형전극판(8)의 폐쇄위치를 규제하는 걸림돌기(10)가 구비된다.On the other hand, the top of the etching solution tank (2) is provided with a lid-type electrode plate 8 to be opened and closed. The cover electrode plate 8 is installed to open and close about the hinge portion 9 on one side of the etching solution tank 2. On both sides of the front end of the cover electrode plate 8 is provided with a locking projection 10 is caught by the locking step (3) to regulate the closed position of the cover electrode plate (8).
그리고 상기 덮개형전극판(8)은 상기 지지포스트(4)와 실린더(11)에 의해 연결된다. 즉 상기 실린더(11)가 상기 지지포스트(4)에 각각 설치되고, 상기 실린더(11)의 로드(11`)가 상기 덮개형전극판(8)에 연결되어 있어, 상기 로드(11`)가 상기 실린더(11) 내외부로 입출됨에 의해 상기 덮개형전극판(8)이 힌지부(9)를 중심으로 동작되는 것이다.The cover electrode plate 8 is connected by the support post 4 and the cylinder 11. That is, the cylinders 11 are respectively installed in the support posts 4, and the rods 11 ′ of the cylinders 11 are connected to the lid-shaped electrode plate 8, so that the rods 11 ′ are provided. The lid-type electrode plate 8 is operated around the hinge portion 9 by entering and exiting the cylinder 11.
상기 덮개형전극판(8)의 저면에는 다수의 통공(15)이 형성된 다수개의 침지전극판(14)이 일정간격을 두고 하향설치되어 있다. 이때, 상기 침지전극판(14)은 덮개형전극판(8)이 에칭용액탱크(2)의 상부에서 덮어 폐쇄할 때 상기 에칭용액탱크(2)에 채워진 에칭용액(12)에 잠길 수 있도록 되어 있다.A plurality of immersion electrode plates 14 in which a plurality of through holes 15 are formed on the bottom of the cover electrode plate 8 are provided downward at a predetermined interval. In this case, the immersion electrode plate 14 may be immersed in the etching solution 12 filled in the etching solution tank 2 when the lid-shaped electrode plate 8 is covered and closed at the top of the etching solution tank 2. have.
여기서, 상기 -전극판(6)과 덮개형전극판(8)이 다수개의 전극연결단자(7)에 의해 연결되어 -전원이 -전극판(6)에서 덮개형전극판(8)으로 전달 될 수 있다.Here, the electrode plate 6 and the cover electrode plate 8 are connected by a plurality of electrode connection terminals 7 so that power is transferred from the electrode plate 6 to the cover electrode plate 8. Can be.
이하 상기한 바와 같은 본 발명 실시예의 작용효과를 살펴보면 다음과 같다.Looking at the effect of the embodiment of the present invention as described above as follows.
먼저, 금속판(13)에 임의의 문양을 에칭을 하고자 할 결우에는 에칭할 부분을 제외한 나머지 부분에 약품을 도포한다. 이와같이 하면 상기 약품이 도포된 부분에서는 에칭이 발생하지 않고, 약품이 도포되지 않은 부분만 에칭이 되는 것이다. 상기와 같이 한후, 상기 금속판(13)을 에칭용액(12)이 담겨져 있는 에칭용액탱크(2)의 내측바닥면에 눕혀 놓은다. 이때, 상기 +전극봉(5)과 금속판(13)을 전기적으로 연결되게 한다.First, in the case where a desired pattern is to be etched on the metal plate 13, a chemical is applied to the remaining portions except for the portion to be etched. In this way, etching does not occur in the portion where the chemical is applied, and only the portion where the chemical is not applied is etched. After the above, the metal plate 13 is laid on the inner bottom surface of the etching solution tank 2 in which the etching solution 12 is contained. At this time, the + electrode 5 and the metal plate 13 to be electrically connected.
그 뒤, 실린더(11)의 로드(11`)가 돌출되도록 실린더(11)를 작동시키게 되면, 덮개형전극판(8)은 힌지부(9)를 중심으로 회동하면서 에칭용액탱크(2)의 상측에 닫혀 지게 된다.Then, when the cylinder 11 is operated so that the rod 11 ′ of the cylinder 11 protrudes, the lid-shaped electrode plate 8 rotates about the hinge portion 9, so that the etching solution tank 2 is closed. It is closed on the upper side.
이 때, 상기 덮개형전극판(8)의 양측에 외향돌출된 걸림돌기(10)가 에칭용액탱크(2)의 상부양측에 단턱지게 형성된 걸림턱(3)에 걸려서 더 이상 하강하지 않고 정확한 위치에 놓이게 된다.At this time, the locking projections 10 protruding outwardly on both sides of the lid-shaped electrode plate 8 are caught by the locking projections 3 formed on both sides of the upper portion of the etching solution tank 2 so that they are not lowered anymore. Will be placed in.
상기와 같이 덮개형전극판(8)이 에칭용액탱크(2)의 상측에 닫혀지게 되면, 덮개형전극판(8)의 저면에 하향 돌출된 침지전극판(14)이 에칭용액(12)에 침지되게 되면서 침지전극판(14)에 흐르고 있는 -전극과, +전극봉(5)의 +전극이 에칭용액(12)에 의해 통전되게 되어 상기 금속판(13) 중 약품이 묻지 않은 부분만 부식되면서 에칭면을 형성하게 된다.When the lid-type electrode plate 8 is closed on the upper side of the etching solution tank 2 as described above, the immersion electrode plate 14 protruding downward on the bottom surface of the lid-type electrode plate 8 is applied to the etching solution 12. While being immersed, the -electrode flowing in the immersion electrode plate 14 and the + electrode of the + electrode electrode 5 are energized by the etching solution 12, so that only the portion of the metal plate 13 which is not chemically etched is corroded and etched. It will form a face.
상기와 같이 덮개형전극판(8)을 닫음에 따라 전류가 통전되어 에칭가공이 완료된 뒤에는 실린더(11)를 작동시켜 덮개형전극판(8)이 에칭용액탱크(2)의 상측에서 상측으로 힌지식으로 개방되면, 상기에칭용액(12)에 침지되었던 침지전극판(14)이 에칭용액(12)에서 나와 에칭용액탱크(2)의 내측에는 더이상 전류가 흐를수 없게 된다.As the cover electrode plate 8 is closed as described above, after the current is energized and the etching process is completed, the cylinder 11 is operated to cover the cover electrode plate 8 from the upper side of the etching solution tank 2 to the upper side. When open to the knowledge, the immersion electrode plate 14 that has been immersed in the etching solution 12 exits the etching solution 12 and no more current can flow inside the etching solution tank 2.
상기 덮개형전극판(8)의 저면에 설치되어 있는 침지전극판(14)에는 다수의 통공(15)이 형성되어 있고, 상기 침지전극판(14)이 다수개가 일정간격으로 배열설치되어서 덮개형전극판(8)을 상측으로 개방시 침지전극판(14)에 묻어있던 에칭용액(13)이 상기 다수의통공(15)과 인접한 침지전극판(14)사이의 틈새를 통해 하측으로 흘러 내리게 된다.A plurality of through holes 15 are formed in the immersion electrode plate 14 provided on the bottom of the cover electrode plate 8, and the plurality of immersion electrode plates 14 are arranged at regular intervals to cover the cover type. When the electrode plate 8 is opened upward, the etching solution 13 buried in the immersion electrode plate 14 flows downward through a gap between the plurality of through holes 15 and the adjacent immersion electrode plate 14. .
상기와 같이 덮개형전극판(8)이 상측으로 개방된 뒤에는 에칭용액탱크(2)의 바닥면에 눕혀져 있는 금속판(13)을 꺼내어 금속판(13)에 묻어 있는 에칭용액(12)을 세척을 하고, 이렇게 에칭용액(12)을 세척한 금속(13)판의 에칭면에 금박이나 은박, 에폭시 등을 코딩시켜서 장식판재를 제조하게 되는 것이다.After the cover electrode plate 8 is opened as described above, the metal plate 13 lying on the bottom surface of the etching solution tank 2 is taken out, and the etching solution 12 buried in the metal plate 13 is washed. In this way, a gold plate, silver foil, epoxy or the like is coded on the etching surface of the metal 13 plate from which the etching solution 12 is washed, thereby producing a decorative plate material.
그리고, 본 발명의 에칭장치를 사용하지 않을 경우에는 메인전원을 차단시킨 상태에서 덮개형전극판(8)을 닫아두면 에칭용액(12)의 냄새가 작업장으로 새어나가는 것을 방지하고, 이물질이 에칭용앵탱크(2)의 내측으로 들어가는 것을 차단하며, 에칭용액에 사람이 빠질 염려가 없게 되는 등의 효과가 있는 것이다.In the case where the etching apparatus of the present invention is not used, closing the lid-type electrode plate 8 while the main power is cut off prevents the smell of the etching solution 12 from leaking into the work place, and prevents foreign substances from being etched. It blocks the entry into the tank 2, and there is an effect that the etching solution is not likely to fall out.
이상에서 살펴본 바와 같은 본 발명에 따른 에칭장치는, 에칭용액탱크의 내측에 에칭가공할 금속판을 눕혀 놓은 상태에서 에칭가공이 이루어 질수 있도록 되어서, 종래와는 달리 금속판에 구멍을 뚫지 않아도 되므로 불필요한 작업공정을 삭제시키는 효과와, 금속판의 손실이 발생하지 않는 효과와, 소량의 에칭용액으로 에칭가공을 있는 등의 장점을 지니고 있는 것이다.As described above, the etching apparatus according to the present invention can be etched in a state in which a metal plate to be etched is placed inside an etching solution tank, so unlike the conventional art, it is not necessary to drill a hole in the metal plate, thereby unnecessary work process. And the effect of eliminating the loss of the metal plate, the effect of eliminating the loss of the metal plate, and the etching process with a small amount of the etching solution.
상기와 같이 불필요한 작업공정이 삭제되고, 금속판의 손실을 방지하며, 소량의 에칭용액으로 에칭가공을 할 수 있는 등의 장점으로 인하여 제품 생산원가가 대폭절감되는 효과를 지니고 있으며, 인체에 유해한 에칭용액이 담겨져 있는 에칭용액탱크를 덮개형전극판으로서 덮어 둘 수 있슴으로해서 작업자가 에칭용액탱크에 빠지는 등의 안전사고를 완벽하게 예방할 수 있는 효과를 지니고 있는 것이다.This eliminates unnecessary work processes as described above, prevents the loss of metal plates, and enables the etching process with a small amount of etching solution, which greatly reduces the production cost of the product. Since the contained etching solution tank can be covered with a cover electrode plate, the operator can completely prevent safety accidents such as falling into the etching solution tank.
Claims (2)
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019980012697A KR100294791B1 (en) | 1998-04-03 | 1998-04-03 | Etching machine |
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| KR1019980012697A KR100294791B1 (en) | 1998-04-03 | 1998-04-03 | Etching machine |
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