KR100332086B1 - A separating plate with directly heating medium and the process of fabricating the laminates using the separating plate - Google Patents

Abstract

The present invention relates to the field of laminate manufacturing for printed circuit boards and the like, and in particular, to minimize the thermal characteristic variation applied between laminates, which has been a problem in the prior art in forming laminates. And a challenge. To this end, the present invention provides a technical configuration that is provided with an electrical connection means on the metal carrier itself in the separator plate used for separation between the laminates. When the laminates are directly heated by using a new separator with electrical heating means, the variation of the thermal characteristics applied to each laminate is minimized, so that the rheological characteristics of the prepreg, which is one of the main components of the laminate, are different. Is minimized. As a result, there is an effect of providing a laminate of uniform quality suitable for use in a printed circuit board or the like which requires high precision due to less variation in physical properties of the molded product regardless of the position in the press.

Description

Separating plate equipped with direct heating means and a method of manufacturing a laminate using the same {A SEPARATING PLATE WITH DIRECTLY HEATING MEDIUM AND THE PROCESS OF FABRICATING THE LAMINATES USING THE SEPARATING PLATE}

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a separator having a new function used in a process of manufacturing a metal clad laminate, a multilayer printed circuit board, and an unclad laminate, and specifically, a thermosetting resin. The present invention relates to a carrier separation plate of a direct heating type, in which a prepreg is laminated and then subjected to a press process, and heat applied to the laminate is not a hot plate present in the press. By using the separator of the present invention, it is possible to produce a laminate of good quality with uniform physical properties.

Separator plates used in the press process are typically materials used between the laminate and the laminate to allow the laminates to be formed into laminates to be easily separated from each other while at the same time smoothing the surface of the molded article. The present invention adds a new electrical heating function to the separator having this common function so that the same amount of energy is applied directly to the individual stacks, thereby increasing the rate of rise of the temperature between the stacks and in the stack. (Iii) Provides a method of laminating by minimizing temperature variations. Herein, the laminate refers to a laminate of prepregs, metal thin films, inner layer printed circuit boards, and the like in a desired order.

Recently, the electronics industry requires the processing of printed circuit boards having a circuit width of 100 μm or less in manufacturing printed circuit boards, and more recently, the processing of circuits having a circuit width of 50 μm has been developed. For processing such a microcircuit conventional substrate per perforation of 0.2mm and out for an interlayer connection are sometimes dozens per month to 1cm ^2. Therefore, in order to maximize the area accommodating the conductor circuits, the size of the interlayer connecting land accommodating the perforated holes is gradually decreasing. As a result, the demand for numerical stability on substrates (laminates) to be processed is also becoming more precise. If the numerical stability of the substrate is unstable and uneven, there is a high risk that the interlayer connecting lands will be out of position. If only one land is not in place, the interlayer connection hole will not be properly drilled in the correct place. As a result, the interlayer connection circuits are not electrically connected or connected in an unstable state, so that they cannot function properly as circuit boards. Therefore, in order to process a high quality printed circuit board with a high yield, it is very important to minimize the numerical stability deviation between the substrate and the substrate with stable numerical stability of the substrate. In addition, the number of boards inserted into slots and electrically connected to other circuit boards and systems increases the tolerance of the thickness tolerance. Therefore, it is impossible to produce a competitive product without minimizing the variation of physical properties such as the numerical stability and thickness of the circuit board. The variation in the physical properties of such substrates is strongly related to the temperature variations between the stacks and the temperature variations within the stacks, more specifically the chemical-rheological properties of the prepregs, which are considered in making the laminates.

In order to uniformize the physical properties of laminate products made from prepregs impregnated with thermosetting resins, the chemo-rheology properties of these resins may be applied between the hot plate and hot plate of the laminate. It is essential to mold so as to remain uniform regardless of the position within the stage). This requires minimizing variations in the chemical and rheological properties of the prepreg. The chemical-rheological properties of these thermosetting resins are determined by temperature, time, and the curing reaction properties of the resin. The thermosetting prepregs laminated at each stage during the press process exhibit a constant curing reaction characteristic regardless of the position of the laminate. However, the nature of the temperature over time of each laminate depends on its position within the stage of the laminate. Thus, minimizing temperature variations between and within a stack means minimizing the chemical-rheological variation of the prepregs being stacked.

In this regard, first of all, a conventional laminate manufacturing method commonly used in the art, the thermal curing laminate is impregnated with the raw material resin with a suitable amount of the catalyst in a reinforcing material such as glass fiber and paper and then evaporated the solvent in the hot air A semi-cured product (ie, prepreg) made to be cured to a suitable degree and easily operated is formed by laminating an appropriate amount together with a metal thin film and an inner layer printed circuit board. In this process, except for very short cycles (lamination, molding, cooling), as in plywood manufacturing, etc., several stacks (e.g., about 10 sheets) are generally used in one step to improve productivity. After loading, the laminate is heated and pressurized between the hot plate and the hot plate to form a laminate by co-heating the laminate.

The method is a press method in which all the laminates between stages are uniformly heated at once by heat and pressure transferred directly from a press hot plate existing above and below a plurality of laminates. However, in this method, because a plurality of all stacks are disposed between one end at a time, the heating properties of the stacks individually vary depending on their position within the stacks. In other words, a stack located close to the hot plate will quickly rise in temperature, while a stack far away from the hot plate will rise at a low rate. The maximum temperature deviation which arises in this case between the laminated body and laminated body which generate | occur | produces is 15 degreeC or more, and the deviation for each site | part in one laminated body also becomes 3-10 degreeC. As a result, the stacked prepregs exhibit different chemical-rheological properties depending on the location of the stack in the stack and undergo curing under such properties. As a result, the above-described conventional method inevitably causes variations in the properties of the final molded laminates.

Here, the meaning that the difference in chemical-rheological properties of the prepreg inevitably leads to the characteristic deviation of the molded laminate means specifically: When the heat of the hot plate is transmitted to the stack, the temperature of the prepreg initially increases as the temperature of the prepreg rises. As the solid phase melts and turns into a liquid phase, the resin impregnated in the prepreg flows out. Then, the viscosity changes depending on the temperature of the resin, and at the same time, the curing chemical reaction of the resin proceeds. In this case, the path of the curing chemical reaction of the resin, the flow time of the resin, the flow temperature, and the flow amount vary depending on the position in the stage. As a result, the prepregs in the stack that exist at different locations have different chemical-rheological properties depending on the location. This phenomenon not only causes the circuit width and the characteristic deviation between the fully cured final laminate products, but also makes the numerical stability of the product uneven due to the stress in the laminate generated during curing and cooling.

This non-uniformity has a number of detrimental effects on the printed circuit board processing process, making it very difficult to substantially meet the thin and short and high functionality demands of electronic products, which are continuing trends now and in the future. Anyone skilled in the art that performs the physical properties and lamination of thermosetting resins is well aware of this problem.

Improved methods and apparatus to address the above-mentioned problems were developed in the 1990s by PCT / IT92 / 00101, US Pat. Nos. 5,615,470 and 5,647,940. This method is a method that can be used only in the case of manufacturing metal thin film laminates such as copper foil laminates and multilayer printed circuit boards, which are essentially used in the electronics industry. It is a method using the intrinsic property that must be laminated with. These patents, in the manufacture of a metal thin film laminated substrate, in which the insulator and the metal foil to be formed are continuously laminated together with the prepreg, and then the metal thin film is electrically connected to the metal thin film to be integrally formed together with the metal foil by heating the prepreg with electrical energy. The present invention relates to a method for allowing prepregs in a stage to have the same heat rising characteristics. According to this method, since the temperature deviation between the stacks in the stage is usually 5 ° C. or less, the art recognizes that the variation in the rheological properties of the prepregs between the stacks is uniform. This improves the productivity compared to the conventional method described above, and since the heat amount applied to the plurality of stacks is essentially the same, the temperature variation between the stacks is small so that a uniform laminate product can be produced regardless of the position in the stage. There is an advantage that it can.

However, metal thin films used in the art are generally copper plating foils and have a thickness deviation of ± 10%. Therefore, even if the temperature deviation between the stacks is considerably improved, the site-specific temperature variations in one stack are often inferior to the conventional methods described above, up to 10 ° C. As a result, warpage occurs in the molded substrate, and it is generally recognized in the art that the effect of visual improvement of the numerical stability characteristics is uncertain.

In addition, due to the structural problem of having to stack metal thin films in situ with prepreg continuously in one place, dust and other flying resin powder and reinforcement powder are deposited on the surface of the laminate and eventually laminated. There is also a high probability of producing surface defects of the finished product. In addition, the loss of the metal thin film is more than that of the conventional method due to the process requirements in which the metal thin film must be continuously stacked, including the prepreg and the separator plate. It is also pointed out that in order to minimize the loss of the metal thin film that must be continuously connected and stacked, the manufacturing of printed circuit boards must have as many sets of separator plates as the size of the actual circuit board.

The problems with this method are summarized below.

1. It can be used only for the production of products with metal surface such as copper foil, aluminum foil, etc. Therefore, it cannot be used for manufacture of a metal-free thin film laminated substrate.

2. In most industrial printed circuit board fabrication, prepreg containing glass fiber has to be worked in series on a table with metal thin film and other laminates and separators, due to the scattering of glass powder and resin. The likelihood of defective products due to the surface condition of the product is higher than that of the conventional method.

3. If you do not have the same type of separator according to the working size of the board, the loss of metal thin film is bigger.

4. Since the metal foil provided in the roll state must be continuously stacked, the interlayer position fixing method by riveting is mainly used for manufacturing a multi-layer printed circuit board having four or more layers. It is difficult to manufacture products with more than 10 layers in high yield.

5. Although there is a difference in degree due to the thickness variation of the metal thin film as a heat supply source, the temperature variation in a laminate is inevitably caused by more than a conventional method.

6. If no additional cooling press is installed after hot press molding, natural cooling should be used because cooling by the cooling water in the molding press is not easy as in the conventional method. In this case, the cooling time is excessively excessive, which is unproductive, and the temperature variation of each part in the molded substrate during the cooling is large. This is a negative effect on the properties of the molding because the stress due to the temperature difference is excessive compared to the conventional method described above to cool through the hot plate.

As a result of intensive research to solve the problems of the above-described prior arts, the present inventors provide a heating means that can be directly connected to a metal carrier in a separator plate used for stacking the stacks, and directly heating the stack in one step. It is noted that the temperature deviation of each stack present in the stack and the temperature variations within one stack are minimized, thereby minimizing the chemical-rheological properties of the prepreg, resulting in a laminate with uniform properties. Came to discover. That is, the present invention is to solve the problem that the laminates in the stage can be molded with almost the same temperature rise characteristics, and as a technical means for this is a conventional separation plate with electrical heating means on the carrier metal plate itself By carrying out the method, the advantages of the conventional press method while maintaining the advantages are characterized in that to complement the disadvantages of the prior invention.

Since the direct heating type separator provided in the present invention adds an electric heating function to the existing separating plate function, the existing laminate stacking process can be used as it is, and the cooling process can also be performed using the upper and lower hot plates provided in the stage. It has the advantage that it can be cooled in the same manner as used in the conventional method. In addition to the high convenience and economical efficiency of the process, in addition to the advantages of the direct heating of the laminate while using the advantages of the existing lamination process as it is, the incidence of surface defects and loss of the metal film due to flying dust and other material powder The effect of minimizing this can also be obtained.

1 is a view schematically showing a cross-sectional view of a separator plate when the electric heating means is mounted on the metal plate itself as a carrier.

2 is a plan view of a separator in which an insulating band is formed to form a planar electrical flow on a conductive metal carrier.

FIG. 3 is a schematic cross-sectional view of a separator in the case of using a connection contact which is detachable by contacting a carrier and an electric heating means as a conductive material having a loop-type electric flow.

4 is a view showing an embodiment of a contact device for the electrical connection between the separator in the case of the contact shown in FIGS. 1 and 3.

The terminology used herein is defined as follows.

In general, the "separation plate" means a plate placed between the stacks and used for separating and forming the stack and the stack, and is mainly composed of a carrier and an insulating layer. At this time, a metal separator is usually placed between the stacks to facilitate separation of the molded laminate and to obtain a good quality surface. As the separator, generally, a stainless steel plate and an aluminum plate having a thickness of 1.2 mm to 2.5 mm are mainly used in the art. In the present invention, the "separation plate" includes a carrier and / or heating means, an insulating layer, and the carrier may be a metal plate, a conductive or non-conductive polymer composite material, or the like. In the present invention, by using a direct connection to the metal carrier itself as one embodiment, it is used directly as a heating means.

By "prepreg" is meant a resin in a semi-cured state containing a reinforcing material which is made to be easy to operate by impregnating the thermosetting resin with the reinforcing material and drying it and then proceeding the curing reaction to an appropriate level.

By "laminate" is meant a material before molding in which the materials to be shaped are bonded and laminated with an adhesive prepreg.

"Contact" is a device used as a means for enabling the electrical connection between the separator, in the present invention includes a fixed contact and the detachable contact that can be used as a detachable plate and the separator. Can be.

The "lamination process" means a process of molding a laminate into one by adding a laminate to a stage and then heating and pressing the laminate to heat-combine the laminate.

Usually, a metal plate is used as a carrier separation plate. In one embodiment of the present invention, an aluminum plate was used as a carrier and an electric heating means.

The lamination method of the present invention using the direct heating type carrier separation plate equipped with the electric heating means, in addition to the advantage that the temperature variation between and within the stack can be significantly minimized while using a conventional press unit. After the water is completely cured, there is an advantage that it can be produced by cooling the molded product according to the desired cooling curve by flowing the cooling water in the hot plate by using a hot plate even without an additional cooling press as in conventional conventional methods.

BRIEF DESCRIPTION OF THE DRAWINGS Preferred embodiments of the present invention will be described with reference to the drawings in order to more easily describe the present invention. The above drawings are schematic diagrams shown for the purpose of illustrating the preferred scope of the invention and should not be limited to the scope of the invention.

1 shows the structure of a separator plate. Here, (1) is a metal plate having a high hardness, and serves as a carrier and electric heating means, (2) is an insulating layer, and (a) is a contact for mutual electrical connection of each separator. Electricity is connected to the electrical heating means 1 between the separators in a series and parallel manner, and the stacked prepregs are heat-molded.

FIG. 2 is a view showing a structure showing how electricity flows inside a metal plate when the metal plate itself is used as a heating means as shown in FIG. 1. That is, it is a schematic diagram of the electrical energy connected in the engagement (a) of the left part is electrically connected to the engagement (a) located in the right part by turning the insulator (3). The insulator 3 is formed by drilling holes on the metal plate or cutting the metal plate by mechanical cutting. In the case where the insulating band is formed by punching holes in the aluminum carrier, holes 0.2-1.0 mm in diameter are drilled at intervals of 0.05-0.3 mm to form aluminum oxide having a circuit width of 25-150 µm. When cutting by the mechanical method, the metal plate is cut in the manner shown in FIG. At this time, the gap (or gap) between the inside of the hole and the cut portion is filled with a high heat resistant insulating paste.

3 illustrates a case where the carrier is used as the conductive material and the electric heating means, and an insulating material 1b is inserted between the conductive carriers 1a to induce an electrical loop. (a) shows the detachable connection engagement. When the carrier metal plate is used as the conductive material, the carrier metal plate is similar to that of Figs. 1 and 2, but as shown in Fig. 2, it is possible to flow the electricity from the lower layer (or upper layer) to the upper layer (or lower layer) in a loop form in the carrier. have. This part will be described later in detail in Example 2. In addition, as the conductive material used in the present invention, any material may be used as long as it is conductive, and is not limited to any particular one. Specific examples thereof will be appreciated by those skilled in the art. In the case of using a polymer composite material as the conductive material, a material containing copper, silver, and carbon powder may be mentioned as the metal filler. The insulating material may be a polymer laminate or an inorganic material thin plate (for example, ceramic).

In FIGS. 1 and 3, the engagement (a) shows an example of using a detachable detachable engagement with the separator, but it is also possible to make an electrical connection between the other separators using an engagement permanently fixed to the separator. Do.

Figure 4 shows a contact device for electrically connecting the separator plates for separating the laminate in the laminate, the device is detachably installed between each separator plate, a plurality of cutouts on one side thereof in a V-shape With a plurality of engaging pieces bent alternately with each other, the engaging pieces allow each separator plate to be electrically interconnected. However, in the present invention, those skilled in the art will fully appreciate that any type of contacting device for electrically connecting the upper and lower layers in a detachable manner can be used. Therefore, the above-mentioned contact device is only one embodiment of the present invention, and the present invention is not limited thereto. Referring to the drawings in detail, the contact device connects each separator plate. For example, the contact piece A electrically connects the bottom surface of the second separator plate, and the contact portion A ′ is the top surface of the first separator plate. It is a device that makes a plurality of separation plates are mutually connected to each other in a V shape when viewed from the outside through a method of electrically connecting the two. Connection of this contact device is carried out using a separate contact holder mechanism supplied from the outside. This contact device is a device that can be easily removed from the separating plate, and is also a means that can be repeatedly used. More specifically, the laminate and the separator are pressurized in a press and then pressurized by electrical connection to form a laminate. After cooling, continue to depressurize and disconnect the electrical connections, and then separate all the formed articles in the press. The separator, molded laminate, and detachable engagement are then separated separately. Separator and removable engagement are reusable in laminate manufacturing.

By using the separator of the structure shown in FIGS. 1-4 described above, even when the carrier is used as an electric heating means, it is possible to collect contact with one side of the separator, so that the work in the field is compared with the case where the contact is collected on both sides of the separator. Not only is this easy, it is easy to clean the separator plate using automated rollers, and there is no need to limit the size of the prepreg and metal thin film used as raw materials for lamination, which is more convenient for supplying raw materials.

As another aspect, the present invention includes a method for manufacturing a laminate used in the manufacture of a metal thin film laminate, a metal-free thin film laminate, or a multilayer printed circuit board using such a direct heating separator. This method includes the following steps:

a) providing a metal separator plate having an electric heating means or an electric heating layer therein;

b) placing a stack comprising one or more prepregs on the separator as described above

c) placing an electrical heating means or a metal separator plate with an electrical heating layer on said laminate.

d) directly heating the laminate by supplying power so that the separator of (a) and the separator of (c) are electrically connected to each other through the engagement.

When the electrical contact is not fixedly attached to the separator, step (b) 'of the detachable contact device may be performed at both ends of the separator between the steps (b) and (c). If a detachable contact is not used, a fixed contact may be used in which electrical contact is fixed on one side of the separator plate.

Steps (b)-(c) (when detachable engagement is used, steps (b)-(b ')-(c) may be repeated one or more times as many times as desired, and also stacking of step (b)) The water is placed on the separator in a size smaller than the width of the separator so that engagement is placed at both ends of the separator, and the separators and laminates of steps (a)-(c) are typically pressurized within the stage of the press. It is molded into a laminate by the step of (d).

The laminate manufactured as described above is used for metal thin film laminates, metal-free thin film laminates, or multilayer printed circuit boards.

The invention is illustrated as more specific embodiments in the following non-limiting examples. The embodiments described below are merely used for the purpose of illustrating the present invention and are not intended to limit the scope of the present invention. In addition, the process figures described in these examples are for the purpose of process description only, and the scope of the process of the present invention is not limited thereto.

EXAMPLES

Example 1 Fabrication and Testing of Directly Heated Separator with Electric Heating Means in the Metal Plate Carrier

This embodiment is to explain in detail with respect to Figure 1, using a 1.2 mm thick aluminum sheet as a carrier metal plate (1) to prepare a separation plate in a manner to be treated in the following steps.

Step 1: Drilling and Washing Process

Holes with a diameter of 0.4 mm were drilled at intervals of 0.15 mm on the metal plate 1 at the positions of the insulator 3. The material of the perforated metal plate 1 was immersed in a weak alkaline solution at 60 ° C. for 3 minutes and washed with water.

Step 2: forming the insulating layer 2

After attaching the polyimide adhesive tape to the contact point (a) on the metal plate (1) material, the current density was 1 to 3 amps / dm2 at 20 ° C. in a solution containing 20 to 30 g / liter of oxalic acid. Was applied to form an aluminum oxide insulating film 2 having a 100 탆 circuit width in the surface of the carrier 1 and in the perforated holes.

The inside of the drilled hole was filled with EL-18B from Alpha Metal, California, USA, and then cured for 30 minutes in an oven at 160 ° C.

Step 3: Engaging Connection

The tape adhered to the contact (a) was peeled off, washed with hexane, and dried. Copper having a thickness of 15 to 30 µm was electroplated to the contact (a) in a normal acidic electroplating solution. The copper surface was corroded with 3-10 μm of copper with 10% sulfuric acid and 10% hydrogen peroxide solution, and then nickel was plated to the contact portion with a thickness of 3-10 μm by a conventional method using nickel sulfamate. Using a plating solution containing 800 to 1200 ppm of cobalt and 5 to 25 g / liter of gold, gold was plated on a nickel plating to a thickness of 0.05 to 0.2 mu m to form a contact (a).

Temperature deviation test of the laminate using the separator of the present invention:

Five sheets of epoxy prepreg impregnated with 7628 glass present fiber fabrics were laminated for each laminate by using the separator plate prepared in the method of Example 1 for this test, and the laminates were stacked 11 layers high in one stage. . Electrically connecting all the separators in series by using a connection contact made of a beryllium copper alloy thin film, and flowing the current from 0 to 500 amperes, and stacking the laminate at an average speed of 3 ° C. per minute from 170 ° C. to 170 ° C. per minute. The temperature variation between the laminates and in one laminate was considered by heating.

The results are shown in Table 1 below.

Conventional hotplate Conventional metal thin film Separator of the Invention (Example 1) Temperature difference between stacks 15 ℃ or more 5 ℃ or less 4 ~ 6 ℃ Temperature difference in the stack 5 ℃ or less 8 ~ 10 ℃ 3 ~ 5 ℃

From the above Table 1, in the present invention, the temperature deviation in one laminate is the same level as that of the conventional method by the conventional hot plate, and the temperature deviation between the laminates is applied to the conventional metal thin film. Since the present invention is equivalent to the pressing method, it can be seen that the present invention overcomes the disadvantages of both methods of the prior art and takes only advantages.

Example 2 Preparation and Testing of Separator Plate When Using Metal Plate Carrier with Loop Type Electric Flow as Heating Means

In this example, two aluminum metal sheets were used. Except for about 5 to 15 cm from one side portion on one side of the first sheet of aluminum metal sheet, Step 2 in Example 1 was performed to form an aluminum oxide layer having a thickness of 25 to 100 µm. Then, in order to make the thickness of the oxide layer and the non-oxidized aluminum plate the same, the sand belt was treated with sand belt, washed with water, and brazed the second aluminum metal plate to integrate the first metal plate and the second metal plate into one. After removing the tape attached to the contact (a) and washed with hexane (hexane) solvent and dried. Using a nickel sulfamate, a plating solution containing 3 to 1200 ppm and 5 to 25 g / liter of gold was plated on the nickel plating to a thickness of 0.05 to 0.2 mu m in a conventional manner to form a contact (a).

Temperature deviation test of the laminate using the separator of the present invention:

As a result of measuring the temperature deviation in the same manner as in the test in Example 1, the average temperature deviation between the laminates was 2 to 4 ° C, and the deviation in one laminate was 3 to 6 ° C.

Example 3: Preparation and test of a heating carrier separator plate made of a conductive polymer composite material which forms an electrical loop to flow electricity

This embodiment is a variation of Example 1 to illustrate the separation plate of the direct heating means using a conductive composite material instead of a metal plate carrier, using LER-850 of Lucky Chemical Co., Ltd. as a main component, additives YDCN-703 of Kukdo Chemical, a domestic material; 120 phr (phr: mixed amount per 100 grams of LER-850S), silver flakes having a particle size of 1 to 10 mu m (Silver Flake); 120-180 phr, maleic anhydride; 35 to 55 phr, 2 pyromellitic anhydride; 20 to 50 phr and dimethyl formaldehyde were added to make varnishes of 60 to 150 phr. This varnish was impregnated and dried in a glass fiber nonwoven fabric having a density of 210 g / m 2 to obtain a prepreg. Thereafter, four prepregs were used, and a prepreg containing no silver plaque was inserted in the middle. Here, the filling-free prepreg is identical in all other compositions except that it contains the filled prepreg and silver flakes. The filling-free prepreg has the same width as the filling prepreg but is shortened by about 5 cm in length so that after lamination, electricity flows in a loop around the unfilled laminate layer. A 0.5 oz rolled aluminum was laminated on both sides of the prepreg and cured for 40 to 120 minutes at 3 to 100 atm on a 180 ° C. hot plate as a normal lamination method to prepare an aluminum foil separator plate coated with aluminum foil on both sides. The polyimide adhesive tape was stuck to the site where the engagements (a) and (b) were to be formed.

Thereafter, the insulating layer of the aluminum oxide film was formed by the method of Step 2 of Example 1, and the contact (a) was formed by performing the process of Step 3.

Temperature deviation test of the laminate using the separator of the present invention:

As a result of measuring the temperature deviation in the same manner as in the test in Example 1, the average temperature deviation between the laminates was 2 to 4 ° C, and the deviation in one laminate was 3 to 6 ° C.

According to the present invention, since all the laminates are directly heated since a metal thin film form that can be electrically connected, a conductive polymer composite or a direct heating type separator having a pluralized heating means, or a separating plate whose metal carrier is a heating means is provided. This minimizes the temperature variation according to the position of the laminate present in one stage and the temperature variation within the interior of the laminate, thereby minimizing the difference in chemical-rheological properties between the prepregs and the thickness of the shaped laminate. And it is possible to produce a laminate having uniform physical properties in the numerical stability and the like.

In addition, since the direct heating type separator of the present invention is used by mounting an electric heating means on a conventional separator plate, the metal foil which minimizes the temperature variation between laminates by heating the metal thin film used as a material of the laminate in the manufacture of the metal laminate substrate. The heating process can be performed by using the upper and lower hot plates without additional cooling press while maintaining the advantages of the conventional method of heating type, and also separating the prepreg and copper foil lamination process to remove dust and other material powders. As a result, the incidence of surface defects may be reduced, and thus, the advantages of the conventional press method may be retained.

Moreover, when using the detachable detachable detachable type of the present invention, supply of the raw material is more convenient because the separation plate is easy to clean and the size of the prepreg and the metal thin film used as the raw material is not limited.

The above description of the present invention has been described only for the purpose of illustrating the present invention, and the scope of the present invention is not limited thereto, and any modifications or changes may be made without departing from the scope and spirit of the following claims. Make it possible.

Claims (8)

A separator used to separate laminates in a laminate press process for forming and manufacturing laminates, wherein the laminate is directly heated to electrically heat the separator itself so as to minimize variations in temperature between and within the laminate. And providing a means, the separator comprising an insulator for forming an electrical loop with said electrical heating means. The separator as set forth in claim 1, further comprising a detachable engagement for detachable electrical connection between the separator plates. The separator as set forth in claim 1, wherein an electrical contact is fixedly arranged on one side of the separator for electrical connection between the separators. In the contact device for electrically connecting the separator plates for separating the laminates in the laminate, the separators are detachably installed between each separator plate, and each separator plate is electrically connected by the contact pieces by being composed of a plurality of contact pieces. Detachable engagement device, characterized in that. A method of making a laminate comprising the following steps: a) providing a separator plate with an electric heating means or an electric heating layer therein; b) placing a stack comprising one or more prepregs on the separator plate c) disposing the detachable contactor of claim 4 at both ends of the separator if the electrical contact is not fixed to the separator; d) placing a separator plate with an electrical heating layer on the stack. e) supplying power so that the separator of (a) and the separator of (c) are electrically connected to each other through the engagement so that the laminate is directly heat-molded to produce a laminate. The method of claim 5, wherein the step (b)-(d) is repeated one or more times. The method according to claim 5, wherein an electric contact fixed to one side of the separator is used instead of the detachable contact apparatus for electrical connection between the separators. The method according to any one of claims 5 to 7, wherein the laminate prepared in step e) is used for a metal thin film laminate, a metal free thin film laminate, or a multilayer printed circuit board.