KR100367021B1 - 처리 장치 - Google Patents
처리 장치 Download PDFInfo
- Publication number
- KR100367021B1 KR100367021B1 KR1019950047685A KR19950047685A KR100367021B1 KR 100367021 B1 KR100367021 B1 KR 100367021B1 KR 1019950047685 A KR1019950047685 A KR 1019950047685A KR 19950047685 A KR19950047685 A KR 19950047685A KR 100367021 B1 KR100367021 B1 KR 100367021B1
- Authority
- KR
- South Korea
- Prior art keywords
- carrier
- chamber
- wafer
- opening
- substitution
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67757—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber vertical transfer of a batch of workpieces
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67769—Storage means
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/137—Associated with semiconductor wafer handling including means for charging or discharging wafer cassette
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/139—Associated with semiconductor wafer handling including wafer charging or discharging means for vacuum chamber
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/14—Wafer cassette transporting
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Warehouses Or Storage Devices (AREA)
Abstract
Description
Claims (6)
- 피처리체를 소정의 처리로 처리하기 위한 처리수단과,상기 처리되는 복수의 피처리체를 수용하는 피처리체 캐리어를 수납하기 위한 수납부,상기 피처리체를 소정의 처리로 처리하기 위한 처리수단 및 상기 수납부에 대해 피처리체 캐리어를 반입 ·반출하기 위한 반송수단,상기 수납부와 상기 피처리체 캐리어를 반송하기 위한 적어도 일부의 반송수단이 내부에 위치되고, 그 내부를 외부대기와 차단시키기 위한 밀폐실,상기 밀폐실과 연통되면서 상기 외부대기와 그 내부가 차단되어, 상기 수납부로 반입 ·반출하기 위해 그 내부에 가수납되는 피처리체 캐리어를 상기 외부대기와 차단시킬 수 있는 치환실,상기 밀폐실의 내부에 불활성가스를 공급하기 위한 장치 및,상기 치환실의 내부에 불활성가스를 공급하기 위한 장치를 구비하여 구성된 것을 특징으로 하는 처리장치.
- 제1항에 있어서,상기 피처리체 캐리어를 반송하기 위한 반송수단은,상기 처리장치의 반입 ·반출부와 상기 치환실 및 상기 치환실과 피처리체를 소정의 처리로 처리하기 위한 처리수단의 사이에서 상기 피처리체 캐리어를 반송하기 위한 제1반송기구와,상기 수납부에 대해 상기 피처리체 캐리어를 반입 ·반출하기 위한 제2반송기구 및,상기 제1반송기구 또는 상기 제2반송기구의 사이에서 상기 피처리체 캐리어를 인수인도 하고, 상기 밀폐실 내부에 배열설치되며, 상기 밀폐실의 내부와 상기 치환실의 내부 사이를 이동할 수 있는 피처리체 캐리어 보호유지부와 상기 치환실 내부에 상기 피처리체 캐리어 보호유지부가 위치한 경우에 상기 밀폐실과 상기 치환실간의 연통구를 닫아 막는 제1문짝체를 구비하여 구성된 것을 특징으로 하는 처리장치.
- 제1항에 있어서,상기 밀폐실의 내부에 불활성가스를 공급하기 위한 장치는 상기 밀폐실의 내부에 제1관로의 개폐수단을 매개로 접속된 불활성가스 공급원을 포함하고,상기 치환실의 내부에 불활성가스를 공급하기 위한 장치는 상기 치환실의 내부에 제2관로의 개폐수단을 매개로 접속된 불활성가스 공급원을 포함하고,적어도 상기 밀폐실은 제3관로의 개폐수단을 매개로 배기관에 접속되며;상기 밀폐실 내부의 소정 가스분위기 농도를 검출하기 위해 상기 밀폐실 내부에 제공된 농도검출수단과,상기 농도검출수단으로부터의 신호에 기초하여 상기 제1 내지 제3관로의 개폐수단의 열림르도를 제어하기 위한 수단을 더 포함한 것을 특징으로 하는 처리장치.
- 제2항에 있어서,상기 피처리체 캐리어를 상기 치환실에 대해 반입 ·반출하기 위한 개구부에는 이 개구부를 개폐하기 위한 제2문짝체가 제공되고,상기 문짝체의 주변 또는 상기 치환실의 상기 연통구와 상기 개구부 주변의 어느 한쪽에 밀봉부재가 제공되며,상기 각 문짝체에는 개폐구동기구와, 상기 문짝체가 닫히는 경우에 상기 문짝체를 상기 치환실측으로 끌어당기기 위한 끌어당김기구가 제공된 것을 특징으로 하는 처리장치.
- 제3항에 있어서,상기 치환실 내부의 소정 가스분위기 농도를 검출하기 위해 상기 치환실 내부에 제공된 제2농도검출수단과,상기 농도검출수단으로부터의 신호에 기초하여 적어도 상기 제2관로의 개폐수단의 열림정도를 제어하기 위한 수단을 더 포함한 것을 특징으로 하는 처리장치.
- 제2항에 있어서,상기 제1반송기구와 상기 피처리체를 소정의 처리로 처리하기 위한 처리수단 사이에 위치된 캐리어 스테이지와,상기 캐리어 스테이지와 상기 피처리체를 소정의 처리로 처리하기 위한 처리수단간 피처리체를 반송하기 위한 반송수단을 더 포함하고,상기 제1반송기구는 상기 치환실에서 상기 캐리어 스테이지로 피처리체 캐리어를 반송하는 것을 특징으로 하는 처리장치.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP94-331038 | 1994-12-08 | ||
| JP33103894 | 1994-12-08 | ||
| JP7120857A JPH08213446A (ja) | 1994-12-08 | 1995-04-21 | 処理装置 |
| JP95-120857 | 1995-04-21 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR960026535A KR960026535A (ko) | 1996-07-22 |
| KR100367021B1 true KR100367021B1 (ko) | 2003-03-15 |
Family
ID=26458362
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019950047685A Expired - Fee Related KR100367021B1 (ko) | 1994-12-08 | 1995-12-08 | 처리 장치 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US5788448A (ko) |
| JP (1) | JPH08213446A (ko) |
| KR (1) | KR100367021B1 (ko) |
| TW (1) | TW354405B (ko) |
Families Citing this family (40)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6833035B1 (en) | 1994-04-28 | 2004-12-21 | Semitool, Inc. | Semiconductor processing system with wafer container docking and loading station |
| US6799932B2 (en) | 1994-04-28 | 2004-10-05 | Semitool, Inc. | Semiconductor wafer processing apparatus |
| US6447232B1 (en) * | 1994-04-28 | 2002-09-10 | Semitool, Inc. | Semiconductor wafer processing apparatus having improved wafer input/output handling system |
| US6712577B2 (en) * | 1994-04-28 | 2004-03-30 | Semitool, Inc. | Automated semiconductor processing system |
| US6723174B2 (en) | 1996-03-26 | 2004-04-20 | Semitool, Inc. | Automated semiconductor processing system |
| US6942738B1 (en) | 1996-07-15 | 2005-09-13 | Semitool, Inc. | Automated semiconductor processing system |
| TW344847B (en) * | 1996-08-29 | 1998-11-11 | Tokyo Electron Co Ltd | Substrate treatment system, substrate transfer system, and substrate transfer method |
| JPH10147432A (ja) * | 1996-11-20 | 1998-06-02 | Tokyo Electron Ltd | カセットチャンバ |
| US5957648A (en) * | 1996-12-11 | 1999-09-28 | Applied Materials, Inc. | Factory automation apparatus and method for handling, moving and storing semiconductor wafer carriers |
| US5964561A (en) * | 1996-12-11 | 1999-10-12 | Applied Materials, Inc. | Compact apparatus and method for storing and loading semiconductor wafer carriers |
| US6540466B2 (en) * | 1996-12-11 | 2003-04-01 | Applied Materials, Inc. | Compact apparatus and method for storing and loading semiconductor wafer carriers |
| US6280134B1 (en) * | 1997-06-17 | 2001-08-28 | Applied Materials, Inc. | Apparatus and method for automated cassette handling |
| NL1008143C2 (nl) * | 1998-01-27 | 1999-07-28 | Asm Int | Stelsel voor het behandelen van wafers. |
| US6079927A (en) * | 1998-04-22 | 2000-06-27 | Varian Semiconductor Equipment Associates, Inc. | Automated wafer buffer for use with wafer processing equipment |
| US6328809B1 (en) | 1998-10-09 | 2001-12-11 | Scp Global Technologies, Inc. | Vapor drying system and method |
| DE19921072A1 (de) * | 1999-05-08 | 2000-11-09 | Acr Automation In Cleanroom | Einrichtung zum Handhaben von Substraten innerhalb und außerhalb eines Reinstarbeitsraumes |
| US6318945B1 (en) * | 1999-07-28 | 2001-11-20 | Brooks Automation, Inc. | Substrate processing apparatus with vertically stacked load lock and substrate transport robot |
| AU2001268656A1 (en) * | 2000-07-07 | 2002-01-21 | Semitool, Inc. | Automated processing system |
| JP4180787B2 (ja) * | 2000-12-27 | 2008-11-12 | 東京エレクトロン株式会社 | 基板処理装置および基板処理方法 |
| WO2002059251A2 (de) * | 2001-01-26 | 2002-08-01 | Liconic Ag | Klimatisierter lagerschrank |
| JP4519348B2 (ja) * | 2001-03-29 | 2010-08-04 | 東京エレクトロン株式会社 | 熱処理装置および熱処理方法 |
| JP3862514B2 (ja) * | 2001-05-02 | 2006-12-27 | キヤノン株式会社 | ワーク搬送装置及びワーク搬送方法 |
| JP2003303869A (ja) * | 2002-04-05 | 2003-10-24 | Sankyo Seiki Mfg Co Ltd | 基板搬送装置における蓋部材開閉装置 |
| AU2003242422A1 (en) * | 2002-05-23 | 2003-12-12 | Anelva Corporation | Substrate processing device and substrate processing method |
| JP2004022940A (ja) * | 2002-06-19 | 2004-01-22 | Tokyo Seimitsu Co Ltd | 研磨装置、研磨方法、ウェーハ待避プログラム |
| CN1643322A (zh) * | 2002-07-15 | 2005-07-20 | 阿维扎技术公司 | 热处理系统和可成形的垂直腔 |
| JP2005026513A (ja) * | 2003-07-03 | 2005-01-27 | Tokyo Electron Ltd | 処理装置 |
| US7553516B2 (en) * | 2005-12-16 | 2009-06-30 | Asm International N.V. | System and method of reducing particle contamination of semiconductor substrates |
| FR2901546B1 (fr) | 2006-05-24 | 2010-10-15 | Cit Alcatel | Procede et dispositif de depollution d'environnement confine |
| JP4756372B2 (ja) * | 2006-09-13 | 2011-08-24 | 株式会社ダイフク | 基板処理方法 |
| JP4807579B2 (ja) * | 2006-09-13 | 2011-11-02 | 株式会社ダイフク | 基板収納設備及び基板処理設備 |
| EP1972874B1 (de) * | 2007-03-20 | 2019-02-13 | Liconic Ag | Automatisiertes Substanzenlager |
| KR101216000B1 (ko) * | 2007-08-23 | 2012-12-28 | 히라따기꼬오 가부시키가이샤 | 부품이송장치 및 방법 |
| JP4251580B1 (ja) * | 2008-01-08 | 2009-04-08 | Tdk株式会社 | 被収容物搬送システム |
| JP5410794B2 (ja) * | 2009-03-17 | 2014-02-05 | 東京エレクトロン株式会社 | 基板処理装置 |
| US8888434B2 (en) * | 2011-09-05 | 2014-11-18 | Dynamic Micro System | Container storage add-on for bare workpiece stocker |
| DE102012100929A1 (de) | 2012-02-06 | 2013-08-08 | Roth & Rau Ag | Substratbearbeitungsanlage |
| US9607873B2 (en) * | 2014-02-07 | 2017-03-28 | Taiwan Semiconductor Manufacturing Company Ltd. | Apparatus and operation method thereof |
| JP7048885B2 (ja) | 2018-03-15 | 2022-04-06 | シンフォニアテクノロジー株式会社 | Efem |
| CN114076522B (zh) * | 2022-01-19 | 2022-03-29 | 中电科风华信息装备股份有限公司 | 一种用于半导体封装的全自动压力固化设备 |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5261935A (en) * | 1990-09-26 | 1993-11-16 | Tokyo Electron Sagami Limited | Clean air apparatus |
| US5277579A (en) * | 1991-03-15 | 1994-01-11 | Tokyo Electron Sagami Limited | Wafers transferring method in vertical type heat treatment apparatus and the vertical type heat treatment apparatus provided with a wafers transferring system |
| JP3149206B2 (ja) * | 1991-05-30 | 2001-03-26 | 東京エレクトロン株式会社 | 熱処理装置 |
| JPH05114568A (ja) * | 1991-10-22 | 1993-05-07 | Kokusai Electric Co Ltd | 縦型拡散、cvd装置 |
| JPH05114567A (ja) * | 1991-10-22 | 1993-05-07 | Kokusai Electric Co Ltd | 縦型拡散、cvd装置 |
| JP3176104B2 (ja) * | 1991-10-22 | 2001-06-11 | 株式会社日立国際電気 | 半導体製造装置 |
| US5303671A (en) * | 1992-02-07 | 1994-04-19 | Tokyo Electron Limited | System for continuously washing and film-forming a semiconductor wafer |
| TW245823B (ko) * | 1992-10-05 | 1995-04-21 | Tokyo Electron Co Ltd | |
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| JP3372581B2 (ja) * | 1993-01-21 | 2003-02-04 | 東京エレクトロン株式会社 | 処理装置 |
| JP3330169B2 (ja) * | 1993-01-21 | 2002-09-30 | 東京エレクトロン株式会社 | ガスシャワーノズルを備えた縦型熱処理装置 |
| JP3176160B2 (ja) * | 1993-01-21 | 2001-06-11 | 東京エレクトロン株式会社 | 処理装置 |
| JP3258748B2 (ja) * | 1993-02-08 | 2002-02-18 | 東京エレクトロン株式会社 | 熱処理装置 |
| JP3218488B2 (ja) * | 1993-03-16 | 2001-10-15 | 東京エレクトロン株式会社 | 処理装置 |
| US5527390A (en) * | 1993-03-19 | 1996-06-18 | Tokyo Electron Kabushiki | Treatment system including a plurality of treatment apparatus |
| KR100221983B1 (ko) * | 1993-04-13 | 1999-09-15 | 히가시 데쓰로 | 처리장치 |
-
1995
- 1995-04-21 JP JP7120857A patent/JPH08213446A/ja active Pending
- 1995-12-06 US US08/568,335 patent/US5788448A/en not_active Expired - Fee Related
- 1995-12-07 TW TW084113061A patent/TW354405B/zh not_active IP Right Cessation
- 1995-12-08 KR KR1019950047685A patent/KR100367021B1/ko not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| TW354405B (en) | 1999-03-11 |
| US5788448A (en) | 1998-08-04 |
| KR960026535A (ko) | 1996-07-22 |
| JPH08213446A (ja) | 1996-08-20 |
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