KR100456395B1 - Method for monitoring process data of multi chamber equipment - Google Patents

Abstract

The present invention relates to a process data monitoring method of a multi-chamber facility which can interlock only a corresponding chamber when a process abnormality occurs by monitoring which chamber the wafer is processed when the process is performed using a multi-chamber during semiconductor manufacturing. The process data monitoring method for each chamber of the semiconductor manufacturing equipment using the multi-chamber during the main step process, the process of storing the chamber information for each slot in the database during the main step process, and the one step in the main step After the process is completed, retrieving the chamber information progressed in the main step from the slot information stored in the database based on one wafer slot number measured by sampling in the measurement process, and the retrieved chamber information. Determining which of the plurality of chambers the process has been performed in the main step by using the measured wafer, and comparing the measured data of the measured wafer with preset specification data when the measured wafer is specified out. It consists of the process of holding only the chamber which progressed the wafer process.

Description

Process data monitoring method for each chamber of multi-chamber facility {METHOD FOR MONITORING PROCESS DATA OF MULTI CHAMBER EQUIPMENT}

The present invention relates to a process data monitoring method of a semiconductor manufacturing facility. In particular, when a process is performed using a multi-chamber during semiconductor manufacturing, the wafer is monitored in which chamber the process is performed to hold only the corresponding chamber when a process abnormality occurs. The present invention relates to a process data monitoring method of a multi-chamber facility.

In general, a wafer for manufacturing a semiconductor device is repeatedly subjected to processes such as cleaning, diffusion, photoresist coating, exposure, development, etching, and ion implantation, and equipment for performing the corresponding process is used for each of these processes.

The equipment that processes these processes is arranged to process each unit process, and during each unit process, approximately 20 to 25 sheets of wafers are formed in a unit of lot, and the process is selected as an optimal process condition. Done. Parameters generated when the unit process for each step is in progress are communicated online and are stored in the base of the facility and host computer where the unit process for each step is performed. In the process of the conventional semiconductor equipment, the process proceeds to each step, and then the interlock is applied to the corresponding equipment for each step if it is determined that the product is defective in the measurement process. To do that.

However, since the semiconductor equipment has a structure in which the corresponding equipment for each step has a multi-chamber to perform the same process at the same time, it was not possible to recognize in which chamber the wafer sampled in the measurement process proceeded. As a result, when the sampled wafer is defective in the measurement process, the interlock is applied to all the multi-chambers of the corresponding step to hold the chamber, which inevitably leads to equipment downtime for a long time.

Accordingly, an object of the present invention is to provide a method for monitoring process data for each chamber in a semiconductor manufacturing facility using a multi-chamber to solve the above problems.

Another object of the present invention is to provide a process defect prevention method for monitoring the process data for each chamber in a semiconductor manufacturing equipment using a multi-chamber to hold only the chambers generated more than the process abnormalities to improve productivity and yield.

1 is a system configuration diagram for managing a semiconductor manufacturing facility according to an embodiment of the present invention

Figure 2a is an illustration of the trend used in SPC when there is a process spread between chambers according to the present invention,

Figure 2b is an illustration of the trend used in SPC when the process itself has a dispersion in accordance with the present invention.

3 is a graph showing the achievement rate of 3σ or more process capacity for a specific period of the production line applied in the embodiment of the present invention

Explanation of symbols on the main parts of the drawings

10: chamber equipment 12: chamber device server

14: rule packet server 16: measurement equipment

18: operating interface server 20: instrumentation server

22: SPC Server

Process data monitoring method of the semiconductor manufacturing equipment of the present invention for achieving the above object, the process of storing the chamber information or wafer identification information (ID) for each slot in the database during the main step process, and the process in the main step Retrieving the chamber information carried out in the main step from the slotted chamber information or wafer identification information (ID) stored in the database on the basis of one wafer slot number measured by sampling in the measurement process after completion; Determining which of the plurality of chambers the process has been performed in the main step by using the retrieved chamber information, and when the measurement data of the measured wafer is specified out, Characterized in that the process consists of holding only the chamber has been processed.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the following description of the present invention, if it is determined that a detailed description of a related known function or configuration may unnecessarily obscure the subject matter of the present invention, the detailed description thereof will be omitted.

1 is a system configuration diagram for managing a semiconductor manufacturing facility according to an embodiment of the present invention.

The chamber facility 10 inserts wafers into a plurality of chambers to perform a wafer processing process, and transfers chamber data (or wafer ID) for each slot to the chamber device server 12 when the wafer is inserted into each chamber. The chamber device server 12 configures the chamber data (wafer ID) received at the time of trackout from the chamber facility 10 in accordance with a predetermined format (for example, adding the slot slot information to the trackout message). Transfer to 14. The measurement facility 16 samples the wafer for each slot where the process is completed and transmits measurement slot data to the operating interface server 18 and the measurement facility server 20. The operating interface server 18 receives the lot information from the rule packet server 14 and transmits the measurement slot information to the measurement equipment server 20 at the time of track in replay. The measurement facility server 20 detects the chamber data which is processed by the chamber facility 10 using the lot information and the measurement slot information received from the operating interface server 18, and uses the rule packet server 14 to detect the information. To send). The rule packet server 14 stores the slot-specific chamber data (or wafer ID) input from the chamber device server 12 in the database, and the main step information and the advanced chamber information transmitted from the measurement equipment server 20 ( Or wafer ID information), the measured data is stored in a database, and the storage location information is transmitted to the SPC (Statistic Process Control) server 22, and when the stored information is requested from the SPC server 22, the SPC server ( 22) and then compare the data with the spec data and save the data in the database. The SPC server 22 requests the stored information to the rule packet server 14, receives the stored main step information, advanced chamber information (or wafer ID), and measured data, and compares the measured data with predetermined specification data. Is sent to the roll packet server 14, and the interlock signal for holding the chamber is determined by judging whether the specification is out for each chamber.

Figure 2a is an illustration of the trend used in SPC when there is a process spread between chambers according to the present invention,

Figure 2b is an illustration of the trend used in SPC when the process itself has a dispersion in accordance with the present invention.

3 is a graph showing the achievement rate of 3σ or more process capacity for a specific period of the production line applied in the embodiment of the present invention.

1 to 3 will be described in detail the operation of the preferred embodiment of the present invention.

Message formats used in the present invention are shown in Table 1 below.

First, the chamber facility 10 is composed of a plurality of chambers, and 25 wafers for one lot are supplied to the plurality of chambers one by one in a predetermined order to proceed with the process. The process is repeated by repeating the original position back to the grotto. During this process, the chamber facility 10 recognizes which chamber of the plurality of wafers the wafer located in the slot is supplied to, and keeps track of the information after keeping this information. At the time of (Track out), as shown in the DCOL of Table 1, the chamber slot information (or wafer ID) is data collected (DCOL), and the chamber information (or wafer ID) for each slot is transmitted to the chamber device server 12. The chamber device server 12 comprises the slot information of the slot and the slot ID and the chamber ID. The slot information is slot numbers 1 to 25 and the chamber information is a chamber ID. For example, A, B, C or 1 Can be 2,3. At this time, the chamber device server 12 adds the chamber slot information to the trackout message and sends it to the rule packet server 14 as shown in TKOUT in Table 1 above. The rule packet server 14 stores the chamber slot information (or wafer ID) transmitted from the chamber device server 12 in a database. As such, the wafers processed by slots may be processed by other processes, and the wafers by slots of which the process is completed are measured by the measurement facility 16. At this time, when the measurement equipment 16 inputs the chamber slot information (wafer ID) of the wafer to be measured, it tracks and transmits the chamber slot information (or wafer ID) to be measured by the operating interface 18. . The operating interface 18 then requests information related to the lot for measurement by the rule packet server 14, for example Main step ID, Chamber ID and the like. The rule packet server 14 transmits information related to the lot, for example, main step ID and chamber ID, to the operating interface 18 in response to the request for information related to the lot for measurement. At this time, the operating interface 18 transmits the lot information (Main step ID, Chamber ID) and the measurement chamber slot information received from the rule packet server 14 to the measurement equipment server 20. At this time, the measurement facility 16 transmits the data on the measured wafer to the measurement equipment server 20 by DCOL. When DCOL, the chamber information should be added to the header part and the item part, respectively. The header part is for SPC use, and the item is for EQ engineer's inquiry.

DCOL Header Format: ITEM1_CHAMBER_ID = THK: C1000: 2 ｜ C1020: 3, ITEM2_CHAMBER_ID = THK1: C1000: 2 ｜ C1010: 3

DCOL Item Format: Same as the DCOL Item message Format shown in Table 1 above.

DCOL Item should be added to DCSPEC.

At this time, the measurement equipment server 20 uses the chamber information and the chamber slot information received from the operating interface server 18 to find out the chamber information (or wafer ID) which has been processed from a plurality of chambers of the chamber facility 10, and find out this information. Main step information and measured data are transmitted to the rule packet server 14. The rule packet server 14 stores the transferred Main Step information and measured data in a database and informs the SPC server 22 of the location where the data is stored in the database. The SPC server 22 then requests the information stored in the location notified by the rule packet server 14 and receives the information. In addition, the SPC server 22 compares the received information with preset spec data to determine whether the data for each chamber and whether to download each chamber. Therefore, if it is determined that the spec-out is determined for each chamber, an interlock signal is generated to hold only the corresponding chamber among the plurality of chambers.

In this way, the interlock is generated by holding only the chamber that has processed the wafer that has been specified out in the measurement process among the plurality of chambers installed in the chamber facility 10, and if there is a process spread among the chambers, skew is performed according to the trend as shown in FIG. 2A. Skew can be adjusted to improve process dispersion. In addition, in the case of having the dispersion in the process itself, improvement activities were carried out in accordance with the direction of the process improvement to improve the process dispersion as shown in FIG. 2B.

Therefore, FIG. 3 shows a trend of achieving 3 s or more of process capability of the eighth and ninth production lines before and after application of the interlock for each chamber. Referring to FIG. 3, from January to March 2001, 84.7% of process capacity 3σ or more was achieved in the 8th production line and 71.2% of process capacity of the 9th production line was not applied with interlock for each chamber. Appeared. Also, from April to June when the interlock was applied to each chamber, the achievement rate of process capability 3σ and above was 90.9%, and the achievement rate of process capability 3σ and above of 8th production line was 87.9%. In July, the 8th production line achieved 86.0% of process capability above 3σ and the 9th production line achieved 3σ and above 88.4%. In August, the 8th production line achieved 89.5% or higher capability of 3σ or higher, and the 9th production line achieved 94.3% or higher. In September, the 8th production line achieved 96.5% of process capability above 3σ and the 9th production line achieved 95.3%. In October, the 8th production line achieved 96.5% or more of the 3rd process capability and 95.3% of the 9th production line. In the first week of November, the 8th production line's ability to achieve 3σ and above was 95.3%, and the 9th production line's ability to achieve 3σ and above was 94.2%, demonstrating that it is easier to improve process dispersion.

As described above, the present invention stores wafer-specific chamber information (or wafer ID) in a database in which a lot of wafers are processed in a plurality of chambers in a main step in a semiconductor manufacturing facility, and then measured in a measurement step. Based on the slot number of each slot, it finds out the stored slot information of each of the slots and checks which chamber among the plurality of chambers the process has been carried out in the main step. In addition, the process dispersion management for each chamber has an advantage that can easily improve the process dispersion.

Claims (6)

(delete) (Correction) A process data monitoring method for each chamber of a semiconductor manufacturing equipment using a multi-chamber which performs a main step process, Storing the chamber information for each slot in a database during the main step process; Retrieving the chamber information progressed in the main step from the slot information stored in the database on the basis of one wafer slot number measured by sampling in the measurement process after completion of one lot process in the main step; , Determining which of the plurality of chambers the process has been performed in the main wafer using the retrieved chamber information; The process data for each chamber of the multi-chamber facility further comprises the step of holding only the processed chamber of the specified measuring wafer when the measured data of the measured wafer is compared with the preset spec data. Monitoring method. The method of claim 2, The chamber-specific process data monitoring method of the multi-chamber facility, characterized in that the slot information is a wafer ID. In the process data monitoring method for each chamber of the multi-chamber facility, Storing the chamber information for each slot in the database during trackout during the process for each chamber in the main step; A process of sampling and measuring one of the wafers of one lot in a measurement process after the process of one lot is completed in the main step; The slot information for the measured one wafer slot number is found from the main step chamber information stored in the database, and the main step information and the advanced chamber information progressed in the main system are recognized, and the recognized main step information, advanced chamber information, and the like. Transmitting the measured data to the rule packet server, The rule packet server stores the transmitted main step information and measured data in a database and notifies the SPC server of the location where the data is stored in the database. Requesting information stored at a location notified by the rule packet server from the SPC server and receiving the information; Comparing the information received from the rule packet server with the spec data preset in the SPC server to determine whether the data for each chamber and whether to download each chamber; If it is determined that the spec out for each chamber as a result of the determination, the process data monitoring method for each chamber of the multi-chamber equipment, characterized in that the process of holding only the corresponding chamber of the plurality of chambers. The method of claim 4, wherein the storing of the slot information for each slot comprises: Transmitting the chamber information for each slot to the chamber device server by collecting the data of the slot slots during the track-out by performing the processes in the multi-chamber facility; Transmitting the slot information to the rule packet server by adding the slot slot information to the trackout message in the server device server by using the transmitted slot information about the slot; And a process of storing chamber slot information transmitted from the chamber device server in a database in the rule packet server. (Correction) The process according to claim 5, wherein the main step information, advanced chamber information, and measured data are transmitted to a rule packet server. After requesting the lot information about the measured one wafer slot number from the operating interface server, and receiving the lot information about the measured wafer slot number from the database, the received lot information and the measurement slot information to the measurement equipment server. Transfer process, Recognizing the main step information, advanced chamber information progressed from the main system using the lot information and the measurement slot information received from the measurement equipment server, the recognized main step information, advanced chamber information and measured data to the rule packet server Process data monitoring method for each chamber of the multi-chamber facility, characterized in that the transmission process.