KR100461845B1 - 액체운송장치의 안정성 확보 시스템 - Google Patents
액체운송장치의 안정성 확보 시스템 Download PDFInfo
- Publication number
- KR100461845B1 KR100461845B1 KR10-2002-0000779A KR20020000779A KR100461845B1 KR 100461845 B1 KR100461845 B1 KR 100461845B1 KR 20020000779 A KR20020000779 A KR 20020000779A KR 100461845 B1 KR100461845 B1 KR 100461845B1
- Authority
- KR
- South Korea
- Prior art keywords
- auxiliary
- auxiliary valve
- valve
- source material
- liquid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45561—Gas plumbing upstream of the reaction chamber
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/4401—Means for minimising impurities, e.g. dust, moisture or residual gas, in the reaction chamber
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical Vapour Deposition (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Feeding, Discharge, Calcimining, Fusing, And Gas-Generation Devices (AREA)
Abstract
Description
Claims (1)
- 웨이퍼의 공정과정을 위하여 공정 챔버 내부로 소스물질과 운반가스가 유입 시는 열리며 공정과정 진행 중에는 닫혀 소스물질과 운반가스의 유입을 조절하는 유입밸브와, 상기 유입밸브가 열린 경우에는 닫혀 있으며 닫힌 경우에는 열려서 소스물질과 운반가스를 외부로 배출시키기 위한 보조펌프와 보조밸브로 이루어지는 액체운송장치에 있어서,상기 보조밸브에 연결된 계전기를 포함하여 전원공급이 중단되는 경우에 상기 계전기의 작동에 의해 상기 보조밸브를 닫을 수 있게 함으로서 상기 보조밸브를 통한 백 스트림을 방지할 수 있는 액체운송장치.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2002-0000779A KR100461845B1 (ko) | 2002-01-07 | 2002-01-07 | 액체운송장치의 안정성 확보 시스템 |
| TW091138195A TWI279505B (en) | 2002-01-07 | 2002-12-31 | Liquid delivery system having safe unit and operating method thereof |
| US10/337,145 US6833030B2 (en) | 2002-01-07 | 2003-01-06 | Liquid delivery system having safe unit and operating method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2002-0000779A KR100461845B1 (ko) | 2002-01-07 | 2002-01-07 | 액체운송장치의 안정성 확보 시스템 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20030060227A KR20030060227A (ko) | 2003-07-16 |
| KR100461845B1 true KR100461845B1 (ko) | 2004-12-14 |
Family
ID=19718235
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR10-2002-0000779A Expired - Fee Related KR100461845B1 (ko) | 2002-01-07 | 2002-01-07 | 액체운송장치의 안정성 확보 시스템 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US6833030B2 (ko) |
| KR (1) | KR100461845B1 (ko) |
| TW (1) | TWI279505B (ko) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3543949B2 (ja) * | 1999-11-09 | 2004-07-21 | 東京エレクトロン株式会社 | 熱処理装置 |
| KR100461845B1 (ko) * | 2002-01-07 | 2004-12-14 | 주성엔지니어링(주) | 액체운송장치의 안정성 확보 시스템 |
| JP3988676B2 (ja) * | 2003-05-01 | 2007-10-10 | セイコーエプソン株式会社 | 塗布装置、薄膜の形成方法、薄膜形成装置及び半導体装置の製造方法 |
| DE10345824A1 (de) * | 2003-09-30 | 2005-05-04 | Infineon Technologies Ag | Anordnung zur Abscheidung von atomaren Schichten auf Substraten |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SE458749B (sv) * | 1988-05-18 | 1989-05-08 | Bengtsson Bengt Goeran | Foerfarande och anordning foer reglering av sprutning av belaeggningsmaterial |
| US5027661A (en) * | 1989-12-18 | 1991-07-02 | Master Flo Technology Inc. | Liquid flow metering |
| US5342580A (en) * | 1990-04-17 | 1994-08-30 | Alan Brenner | Apparatus and method for measuring the amount of gas adsorbed on or desorbed from a solid and reactions of a gas with a solid |
| US5443642A (en) * | 1993-10-22 | 1995-08-22 | Wagner Systems Inc. | Apparatus for electrostatic spray painting |
| JP3122311B2 (ja) * | 1994-06-29 | 2001-01-09 | 東京エレクトロン株式会社 | 成膜処理室への液体材料供給装置及びその使用方法 |
| US5954911A (en) * | 1995-10-12 | 1999-09-21 | Semitool, Inc. | Semiconductor processing using vapor mixtures |
| US5873388A (en) * | 1996-06-07 | 1999-02-23 | Atmi Ecosys Corporation | System for stabilization of pressure perturbations from oxidation systems for treatment of process gases from semiconductor manufacturing operations |
| US5826607A (en) * | 1996-11-25 | 1998-10-27 | Sony Corporation | Dual exhaust controller |
| TW583734B (en) * | 1999-04-28 | 2004-04-11 | Winbond Electronics Corp | Wafer cleaning equipment with function of preventing gas supply pipeline wall from being obstructed |
| US6892265B2 (en) * | 2001-02-14 | 2005-05-10 | Berkley Process Control, Inc. | Configurable connectorized I/O system |
| US6461436B1 (en) * | 2001-10-15 | 2002-10-08 | Micron Technology, Inc. | Apparatus and process of improving atomic layer deposition chamber performance |
| KR100461845B1 (ko) * | 2002-01-07 | 2004-12-14 | 주성엔지니어링(주) | 액체운송장치의 안정성 확보 시스템 |
-
2002
- 2002-01-07 KR KR10-2002-0000779A patent/KR100461845B1/ko not_active Expired - Fee Related
- 2002-12-31 TW TW091138195A patent/TWI279505B/zh not_active IP Right Cessation
-
2003
- 2003-01-06 US US10/337,145 patent/US6833030B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| TWI279505B (en) | 2007-04-21 |
| US6833030B2 (en) | 2004-12-21 |
| KR20030060227A (ko) | 2003-07-16 |
| TW200301809A (en) | 2003-07-16 |
| US20030127052A1 (en) | 2003-07-10 |
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