KR100685429B1 - Organic electroluminescent display device and manufacturing method thereof - Google Patents

Abstract

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an organic light emitting display device and a method of manufacturing the same, wherein the first and second partition walls are spaced apart from each other at edges of an upper substrate for encapsulation when the organic light emitting display device is formed of a flexible substrate. Forming a coating, and applying an adhesive to the upper surface of the partition formed on the outside, and then sealing the upper substrate and the lower substrate can maintain a constant distance between the upper substrate and the lower substrate, and facilitate the width control of the adhesive and at the same time the organic electric field It is possible to prevent the penetration of the light emitting device and to form a partition on the upper substrate to reduce the stress of the lower substrate provided with the organic EL device.

Organic electroluminescent display, bulkhead, adhesive

Description

Organic light emitting display device and method for manufacturing the same {Organic light emitting display device and fabricating method of the same}

1 is a cross-sectional view of an organic light emitting display device according to the prior art.

2 is a cross-sectional view of an organic light emitting display device according to the present invention;

<Explanation of symbols for main parts of the drawings>

100, 300: lower substrate 110, 310: organic EL device

200, 400: Upper substrate 220, 420: Adhesive

410: a first partition 412: a second partition

The present invention relates to an organic light emitting display device and a method of manufacturing the same, and more particularly, it is possible to secure a certain distance between the substrates when encapsulating the organic light emitting display device using a flexible substrate, and to easily control the width of the adhesive. In addition, the present invention relates to an organic electroluminescent display device and a method of manufacturing the same, which can prevent the organic electroluminescent device from being degraded by the adhesive.

Among flat panel displays, organic light emitting displays (OLEDs) have a wider operating temperature range than other flat panel displays, are more resistant to shock and vibration, have a wider viewing angle, and have a higher response speed. As it has the advantage of providing fast moving images, it is attracting attention as a next generation flat panel display.

In general, an organic light emitting display device includes a pixel electrode, an organic layer including at least a light emitting layer, and a counter electrode on a lower substrate, and emits back light, top light, and double-side light according to the formation of the pixel electrode and the counter electrode. have.

1 is a cross-sectional view of an organic light emitting display device according to the related art.

Referring to FIG. 1, a conventional organic light emitting display device includes a lower substrate 100, an organic light emitting element 110 formed on the lower substrate 100, and an organic light emitting element formed on the lower substrate 100. It has a structure consisting of an upper substrate 200 for protecting the 110. The lower substrate 100 and the upper substrate 200 are attached by an adhesive 220. The adhesive 220 is selectively applied to the edge of the lower substrate 100.

However, with the development of new display elements, flexible display elements have come into the spotlight for easy portability and storage. The flexible display element has a different radius of curvature of the upper substrate and the lower substrate, so that when the substrate is bent or when pressure is applied to the upper substrate, the upper substrate contacts the organic electroluminescent element formed on the lower substrate, thereby deteriorating the device. There is a problem. In addition, when the adhesive is applied to the edge of the lower substrate and the upper substrate is attached and encapsulated, it is difficult to control the width W of the adhesive 220 due to capillary action, and the adhesive 220 is the organic electroluminescent device 110. It can penetrate to) and deteriorate an element. As a result, the organic electroluminescent display device panel is bent like the 'A' portion, so that the gap H between the edge and the center H where the organic electroluminescent device 110 is provided are different from each other. There is a problem of deteriorating the device by touching the organic light emitting device (110).

An object of the present invention is to solve the above problems of the prior art, the present invention is to form a barrier rib of a double structure spaced apart from each other on the edge of the upper substrate used as an encapsulation substrate when sealing the flexible organic electroluminescent display device Next, after applying an adhesive to the upper surface of the partition wall of the partition of the organic light emitting display device among the partition walls to seal the lower substrate and the upper substrate to maintain a constant distance between the lower substrate and the upper substrate, An object of the present invention is to provide an organic electroluminescent display device and a method of manufacturing the same, which can facilitate width adjustment and prevent the adhesive from penetrating into the inside.

In order to achieve the above object, the organic light emitting display device according to the present invention,

A lower substrate having an organic electroluminescent element comprising a pixel electrode, at least an organic layer including a light emitting layer, and an opposite electrode on one surface thereof;

In an organic light emitting display device comprising an upper substrate for sealing the lower substrate,

The upper substrate is provided with a first partition and a second partition of a double structure spaced apart from each other at its edge, the adhesive is provided around the partition provided on the outer side of the first partition and the second partition,

The lower substrate and the upper substrate is characterized in that made of a flexible material.

In addition, the manufacturing method of the organic light emitting display device according to the present invention for achieving the above object,

Forming a pixel electrode, an organic layer including at least an emission layer, and an opposite electrode on the lower substrate;

Forming a first partition wall and a second partition wall of a dual structure spaced apart from each other at the edge of the upper substrate;

Applying an adhesive to an upper surface of a partition wall provided at an outer side of the first partition wall and the second partition wall;

And aligning and sealing the lower substrate and the upper substrate.

Hereinafter, an organic light emitting display device and a method of manufacturing the same according to the present invention will be described with reference to the accompanying drawings.

2 is a cross-sectional view of an organic light emitting display device according to the present invention.

Referring to FIG. 2, an organic electroluminescent device 310 including a pixel electrode (not shown), an organic layer (not shown) including at least one light emitting layer, and an opposite electrode (not shown) is formed on the lower substrate 300. have. Here, one or more thin film transistors may be further provided between the lower substrate 300 and the pixel electrode. The lower substrate 300 and the upper substrate 400 may be formed of a flexible material, preferably a material having a radius of curvature of 300 mm or less. The lower substrate 300 may be made of poly (ethylene terephthalate) (PET), poly (ethylene naphthalate) (PEN), poly (carbonate) (PC), poly (ethersulfone), PES (polyarylate), and PSF (polysulfone). , COC (ciclic-olefin copolymer), PI (polyimide), PI-fluoro (fluoro) polymer compound, PEI (polyetherimide), epoxy resin (Epoxy resin), liquid crystalline polymer (LCP), metal foil It may be formed using one selected from the group consisting of thin glass and thin wafer. The lower substrate 300 may further include at least one polymer medium selected from the group consisting of organic or inorganic fillers, glass fibers, and silica particles. In addition, the lower substrate 300 may further include a barrier structure including one or more selected from the group consisting of an organic inorganic multilayer film, an inorganic thick film, an ultrathin metal film, a metal thin film, and a metal thick film, and the lower substrate 300. ) Need not be transparent.

The upper substrate 400 may be made of poly (ethylene terephthalate) (PET), poly (ethylene naphthalate) (PEN), poly (carbonate) (PC), poly (ethersulfone), PES (polyarylate), and PSF (polysulfone). And it may be formed using one selected from the group consisting of COC (ciclic-olefin copolymer). In addition, the upper substrate 400 may further include a barrier structure including at least one selected from the group consisting of an organic inorganic multilayer film, an inorganic thick film, and an ultrathin metal film, and the transparency of the upper substrate 400 is 70%. It is preferable that it is above.

The first partition 410 and the second partition 412 spaced apart from each other are provided at edges of one surface of the upper substrate 400. The first partition 410 and the second partition 412 may be formed of an inorganic material such as an Si oxide film, an Al oxide film, a Ta oxide film, an Si nitride film, or an Si oxide oxynitride film, or an organic resin having UV curability or thermosetting property. It may be formed of an organic material such as an organic material or a UV-curable or thermosetting silicone resin, a polymer resin containing silica particles, or a silica- or silica mixture derived therefrom. Examples thereof include SiO ₂ , SiN _x , SiON _x , Al ₂ O ₃ , Ta ₂ O ₅ , epoxy resins, acrylic resins, polyphenol resins, or polyimide resins. The first and second partitions 410 and 412 have high stiffness and high stiffness, but do not have ductility. However, the first and second partitions 410 and 412 do not need to have ductility because the area of the panel of the organic light emitting display device is very small. The first partition 410 and the second partition 412 is formed to a height of 1 to 20㎛, the width from the first partition 410 to the second partition 412 is formed within 0.1 to 20mm do. In this case, the first partition 410 and the second partition 412 may be formed to be spaced apart by about 20 to 2000㎛. In order to encapsulate the lower substrate 300 and the upper substrate 400, for example, an adhesive 420 is selectively applied on an upper surface of the first partition wall 410, for example. After encapsulation of the lower substrate 300 and the upper substrate 400, an adhesive 420 is formed around the first partition 410. In this case, the adhesive 420 may be prevented from penetrating into the organic light emitting display device panel by the second partition 412.

As described above, it can be seen that a predetermined gap is secured between the lower substrate 300 and the upper substrate 400, and in particular, the interval between the edge and the center of the center where the organic EL device 310 is provided are kept constant. have.

The organic light emitting display device is formed by the following method.

A pixel electrode is formed on the lower substrate 300. The pixel electrode may be formed as a transparent electrode or a reflective electrode. The lower substrate 300 is made of a flexible material, preferably a material having a radius of curvature of 300 mm or less. The lower substrate 300 may be made of poly (ethylene terephthalate) (PET), poly (ethylene naphthalate) (PEN), poly (carbonate) (PC), poly (ethersulfone), PES (polyarylate), and PSF (polysulfone). , COC (ciclic-olefin copolymer), PI (polyimide), PI-fluoro (fluoro) polymer compound, PEI (polyetherimide), epoxy resin (Epoxy resin), liquid crystalline polymer (LCP), metal foil , One selected from the group consisting of thin glass and thin wafer can be used. The lower substrate 300 may further include a polymer medium such as an organic or inorganic filler, glass fiber, or silica particles. In addition, a barrier structure including one or more selected from the group consisting of an organic inorganic multilayer film, an inorganic thick film, an ultra-thin metal film, a metal thin film, and a metal thick film may be further formed on the lower substrate 300. The lower substrate 300 need not be transparent.

Next, an organic layer including at least an emission layer is formed on the pixel electrode. The organic layer may be formed in a multilayer structure having at least one of a hole injection layer (HIL), a hole transport layer (HTL), a hole suppression layer, an electron transport layer (ETL), and an electron injection layer (EIL). .

Next, a counter electrode is formed on the organic layer. In this case, the counter electrode may be formed as a transparent electrode or a reflective electrode. The pixel electrode is formed of a reflective electrode when the organic light emitting display device is a top emission type, the counter electrode is formed of a transparent electrode, and vice versa in the case of a bottom emission type. In addition, when the organic light emitting display device is a double-sided light emitting type, the pixel electrode and the counter electrode may be formed as a transparent electrode.

After that, the upper substrate 400 is prepared. The upper substrate 400 may be made of poly (ethylene terephthalate) (PET), poly (ethylene naphthalate) (PEN), poly (carbonate) (PC), poly (ethersulfone), PES (polyarylate), and PSF (polysulfone). And one selected from the group consisting of COC (ciclic-olefin copolymer). In addition, a barrier structure including one or more selected from the group consisting of an organic inorganic multilayer film, an inorganic thick film, and an ultrathin metal film may be further formed on the upper substrate 400. In addition, the transparency of the upper substrate 400 is preferably 70% or more.

Next, a first partition 410 and a second partition 412 are formed on the upper substrate 400 to be spaced apart from each other. The upper substrate 400 may use the same material as the lower substrate 300. The first partition 410 and the second partition 412 may be formed of an inorganic material such as an Si oxide film, an Al oxide film, a Ta oxide film, a Si nitride film, or an Si oxide oxynitride film, or an organic resin having UV curability or thermosetting property. It may be formed of an organic material such as an organic material or a UV-curable or thermosetting silicone resin, a polymer resin containing silica particles, or a silica- or silica mixture derived therefrom. Examples thereof include SiO ₂ , SiN _x , SiON _x , Al ₂ O ₃ , Ta ₂ O ₅ , epoxy resins, acrylic resins, polyphenol resins, or polyimide resins. The first partition 410 and the second partition 412 is formed to a height of 1 to 20㎛. The total width from the first partition 410 to the second partition 412 is formed within 0.1 to 20 mm. In this case, the first partition 410 and the second partition 412 may be formed to be spaced apart from 20 to 2000㎛. Depending on the material, the barrier ribs 410 and 412 may be formed by a photo process or a photo etching process.

Next, an adhesive 420 is applied to an upper surface of the first partition 410.

Subsequently, the lower substrate 300 and the upper substrate 400 are pressurized and sealed to complete a panel of the organic light emitting display device. The second partition 412 prevents the adhesive 420 from penetrating into the panel. At this time, even if there is a very small gap between the second partition 412 and the lower substrate 300, the adhesive 420 does not penetrate into the panel.

As described above, according to the present invention, when the organic light emitting display device formed of a flexible substrate is encapsulated, partitions spaced apart from each other are formed at edges of the upper substrate for encapsulation, and the partitions are provided on the outer side of the partitions. After the adhesive is coated on the upper surface, the upper substrate and the lower substrate are encapsulated to maintain a constant distance between the upper substrate and the lower substrate, to facilitate the adjustment of the width of the adhesive, and to prevent the adhesive from penetrating into the panel. There is an advantage of preventing the light emitting device from deteriorating. In addition, by forming the barrier ribs on the upper substrate, there is an advantage of reducing the stress of the lower substrate having the organic EL device.

While the foregoing has been described with reference to preferred embodiments of the present invention, those skilled in the art will be able to variously modify and change the present invention without departing from the spirit and scope of the invention as set forth in the claims below. It will be appreciated.

Claims (33)

A lower substrate having an organic electroluminescent element comprising a pixel electrode, at least an organic layer including a light emitting layer, and an opposite electrode on one surface thereof; In an organic light emitting display device comprising an upper substrate for sealing the lower substrate, The upper substrate may have a first partition and a second partition having a dual structure spaced apart from each other at the edge thereof, and an adhesive is formed around the partition provided on the outer side of the first partition and the second partition. EL display device. The method of claim 1, At least one thin film transistor is further provided between the lower substrate and the pixel electrode. The method of claim 1, And the lower and upper substrates are made of a flexible material having a radius of curvature of 300 mm or less. The method of claim 1, The lower substrate is PET (poly (ethylene terephthalate)), PEN (poly (ethylene naphthalate)), PC (poly (carbonate)), PES (poly (ethersulfone)), PAR (polyarylate), PSF (polysulfone), COC ( ciclic-olefin copolymer (PI), polyimide (PI), PI-fluoro (high molecular weight) compound, polyetherimide (PEI), epoxy resin (Epoxy resin), liquid crystalline polymer (LCP), metal foil, thin glass An organic electroluminescent display device comprising one selected from the group consisting of thin glass and thin wafer. The method of claim 4, wherein The lower substrate may further include a polymer medium such as an organic or inorganic filler, glass fiber, or silica particles. The method of claim 1, And the lower substrate further comprises a barrier structure including at least one selected from the group consisting of an organic inorganic multilayer film, an inorganic thick film, an ultra-thin metal film, a metal thin film, and a metal thick film. The method of claim 1, The upper substrate is PET (poly (ethylene terephthalate)), PEN (poly (ethylene naphthalate)), PC (poly (carbonate)), PES (poly (ethersulfone)), PAR (polyarylate), PSF (polysulfone) and COC ( Organic electroluminescent display device comprising one selected from the group consisting of ciclic-olefin copolymer). The method of claim 1, The upper substrate is PET (poly (ethylene terephthalate)), PEN (poly (ethylene naphthalate)), PC (poly (carbonate)), PES (poly (ethersulfone)), PAR (polyarylate), PSF (polysulfone) and COC ( Organic electroluminescent display device, characterized in that one selected from the group consisting of ciclic-olefin copolymer). The method of claim 1, And the upper substrate further comprises a barrier structure including at least one selected from the group consisting of an organic inorganic multilayer film, an inorganic thick film, and an ultrathin metal film. The method of claim 1, And the upper substrate has 70% or more transparency. The method of claim 1, The partition wall is an organic light emitting display device, characterized in that made of inorganic, organic or non-machined material. The method of claim 11, The inorganic material is one selected from the group consisting of Si-based oxide film, Al-based oxide film, Ta-based oxide film, Si-based nitride film and Si-based oxynitride film. The method of claim 11, The organic material is an organic light emitting display device, characterized in that the organic resin having UV curable or thermosetting. The method of claim 11, The non-machined material is one selected from the group consisting of a silicone resin having UV curability or thermosetting, a polymer resin containing silica particles, or a silica and silica mixture derived therefrom. The method of claim 1, The height of the partition wall is an organic electroluminescent display device, characterized in that 1 to 20㎛. The method of claim 1, The total width from the first partition to the second partition wall is 0.1 to 20mm, the organic light emitting display device. The method of claim 1, And the first and second partitions are spaced apart from each other by 20 to 2000 μm. Forming a pixel electrode, an organic layer including at least an emission layer, and an opposite electrode on the lower substrate; Forming a first partition wall and a second partition wall of a dual structure spaced apart from each other at an edge of the upper substrate; Applying an adhesive to an upper surface of a partition wall provided at an outer side of the first partition wall and the second partition wall; And arranging and attaching the lower substrate and the upper substrate to each other. The method of claim 18, At least one thin film transistor is further formed between the lower substrate and the pixel electrode. The method of claim 18, And the lower substrate and the upper substrate are made of a flexible material having a radius of curvature of 300 mm or less. The method of claim 18, The lower substrate is PET (poly (ethylene terephthalate)), PEN (poly (ethylene naphthalate)), PC (poly (carbonate)), PES (poly (ethersulfone)), PAR (polyarylate), PSF (polysulfone), COC ( ciclic-olefin copolymer (PI), polyimide (PI), PI-fluoro (high molecular weight) compound, polyetherimide (PEI), epoxy resin (Epoxy resin), liquid crystalline polymer (LCP), metal foil, thin glass (thin glass) and a thin wafer (thin wafer) of the organic light emitting display device comprising a one selected from the group consisting of. The method of claim 18, The lower substrate further comprises a polymer medium such as an organic or inorganic filler, glass fiber or silica particles. The method of claim 18, And forming a barrier structure on the lower substrate, the barrier structure including one or more selected from the group consisting of an organic inorganic multilayer film, an inorganic thick film, an ultra-thin metal film, a metal thin film, and a metal thick film. The method of claim 18, The upper substrate is PET (poly (ethylene terephthalate)), PEN (poly (ethylene naphthalate)), PC (poly (carbonate)), PES (poly (ethersulfone)), PAR (polyarylate), PSF (polysulfone) and COC ( A method of manufacturing an organic light emitting display device, characterized in that the composition comprises one selected from the group consisting of ciclic-olefin copolymers). The method of claim 18, And forming a barrier structure on the upper substrate, the barrier structure including one or more selected from the group consisting of an organic inorganic multilayer film, an inorganic thick film, and an ultrathin metal film. The method of claim 18, The partition wall is a method of manufacturing an organic light emitting display device, characterized in that formed of inorganic, organic or non-machine material. The method of claim 26, The barrier rib is formed using one selected from the group consisting of an Si oxide film, an Al oxide film, a Ta oxide film, a nitride film, and an oxynitride film. The method of claim 26, The barrier rib is formed of an organic resin having UV curability or thermosetting. The method of claim 26, The barrier rib is formed by using one selected from the group consisting of a UV resin or a thermosetting silicone resin, a polymer resin containing silica particles, or a silica and silica mixture derived therefrom. Manufacturing method. The method of claim 18, The partition wall is a manufacturing method of an organic light emitting display device, characterized in that the height is formed in the size of 1 to 20㎛. The method of claim 18, The total width from the first partition to the second partition wall is 0.1 to 20mm manufacturing method of the organic light emitting display device. The method of claim 18, The first and second partitions are formed to be spaced apart from 20 to 2000㎛ method of manufacturing an organic light emitting display device. The method of claim 18, The barrier rib is formed by a photolithography process or a photolithography process.

Images