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KR100685656B1 - A nozzle for reflow soldering apparatus - Google Patents

A nozzle for reflow soldering apparatus Download PDF

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Publication number
KR100685656B1
KR100685656B1 KR1020050087344A KR20050087344A KR100685656B1 KR 100685656 B1 KR100685656 B1 KR 100685656B1 KR 1020050087344 A KR1020050087344 A KR 1020050087344A KR 20050087344 A KR20050087344 A KR 20050087344A KR 100685656 B1 KR100685656 B1 KR 100685656B1
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South Korea
Prior art keywords
air
perforated nozzle
blower
reflow soldering
motor
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Korean (ko)
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이종호
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주식회사 티에스엠
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08—Auxiliary devices therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/008—Soldering within a furnace
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/012—Soldering with the use of hot gas
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

A perforated nozzle equipment for a reflow soldering machine, comprising a pair of perforated nozzle plates in which a plurality of ejection holes are formed and suction pipes installed at both sides of the perforated nozzle plates, is provided to reduce soldering defective portion by sucking air flowing to a printed circuit board, thereby uniformly heating the printed circuit board after performing a soldering operation by ejecting heated air through the ejection holes. A perforated nozzle equipment for reflow soldering machine comprises: a motor(300) for driving a blowing fan(320); a blower(310) connected to an upper portion of the motor and driven by the motor to suck and circulate air; a heater(350) for heating circulating air sucked from the blower; air induction parts(330) that are flowing passages of air heated by the heater; suction pipes(380) which is installed in an upper part of the air induction parts to suck an external air and air circulated through the air induction parts, and which is installed on lower portions of side faces of the perforated nozzle plates to suck air flowing to the perforated nozzle plates; and a pair of perforated nozzle plates(370) which are connected to upper parts of the suction pipes, have a plurality of ejection holes(390) formed on a front face thereof, and are separably formed as flat plates.

Description

리플로우 납땜기의 타공노즐장치{A NOZZLE FOR REFLOW SOLDERING APPARATUS}Perforated nozzle device of reflow soldering machine {A NOZZLE FOR REFLOW SOLDERING APPARATUS}

도 1는 종래기술에 따른 리플로우 납땜기의 분해 사시도.1 is an exploded perspective view of a reflow soldering machine according to the prior art.

도 2는 종래기술에 따른 리플로우 납땜기의 사시도.2 is a perspective view of a reflow soldering machine according to the prior art.

도 3은 본 발명에 따른 타공노즐장치 분해 사시도.Figure 3 is an exploded perspective view of the perforation nozzle device according to the present invention.

도 4는 본 발명에 따른 타공노즐장치의 사시도.Figure 4 is a perspective view of a perforating nozzle device according to the present invention.

<도면의 주요부분에 대한 부호의 설명><Description of Symbols for Main Parts of Drawings>

110, 310 : 송풍기 120, 320 : 송풍기 팬110, 310: blower 120, 320: blower fan

130, 330 : 공기유도부 140, 340 : 분배 타공판130, 330: air induction section 140, 340: punching plate

150, 350 : 히터 170 : 노즐판150, 350: heater 170: nozzle plate

390 : 분출구멍 380 : 흡입관390: blowout hole 380: suction pipe

370 : 타공노즐판370: perforated nozzle plate

종래기술에 따른 리플로우 납땜기는, 가열로 내부에 전자부품이 탑재된 프린트기판이 컨베이어에 의해 반송되면서 순환하는 열풍을 사용하여 납땜을 행하는 장치이다.The reflow soldering machine according to the prior art is a device for soldering using hot air circulated while a printed circuit board on which electronic components are mounted inside a heating furnace is conveyed by a conveyor.

일반적인 리플로우 납땜기는, 전자부품을 탑재한 프린트기판이 컨베이어체인에 의하여 반송되며 가열로 내부에서 가열되고, 크림땜납을 용융시켜, 전자부품을 프린트기판상에 납땜하는 장치이다. 이 리플로우 납땜기는, 송풍기와 히터가 배치되어 가열된 공기에 의해 전자부품을 납땜하는 것이다. A general reflow soldering machine is a device in which a printed circuit board on which electronic components are mounted is conveyed by a conveyor chain, heated inside a heating furnace, and melted cream solder to solder the electronic components onto a printed circuit board. This reflow soldering machine solders an electronic component by the air which the blower and a heater are arrange | positioned and heated.

이 방식의 리플로우 납땜기는, 일반적으로 복수의 예비가열실과 1개의 리플로우 납땜실을 컨베이어 체인의 반송방향을 따라 순차로 가지고 있으며, 각 예비가열실과 리플로우 납땜실에는 각각 송풍기와 히터가 설치된다. 송풍기와 히터는 컨베이어체인을 사이에 두고 상하로 배치되어 있고, 송풍기에 의해 히터를 통하여 가열된 열풍이 각 실내에 형성되어 있는 공기유도부로 안내되어 컨베이어체인 상의 전자부품이 탑재된 프린트기판으로 내뿜어진다. This type of reflow soldering machine generally has a plurality of preheating chambers and one reflow soldering chamber sequentially in the conveying direction of the conveyor chain, and each preheating chamber and the reflow soldering chamber are provided with a blower and a heater, respectively. . The blower and the heater are arranged up and down with the conveyor chain in between, and the hot air heated by the heater is guided to the air induction part formed in each room, and is blown out onto the printed board on which the electronic parts on the conveyor chain are mounted. .

상기 공기유도부는 컨베이어체인 상의 프린트기판에 간격을 두고 수평으로 배치되는 노즐판을 구비하고 있으며, 이 노즐판에 형성되어 있는 복수의 분출구멍을 통하여 분출되는 가열된 공기가 전자부품을 탑재한 프린트기판 상으로 내뿜어져 프린트기판상에 페이스트가 용융되면서 납땜이 이루어지게 된다.The air induction part includes a nozzle plate arranged horizontally at intervals on the printed circuit board on the conveyor chain, and the printed board on which the heated air ejected through the plurality of ejection holes formed in the nozzle plate is mounted with the electronic component. The paste is melted onto the printed circuit board and soldered as the paste melts.

상술한 바와 같은 리플로우 납땜기의 종래 노즐장치에 대한 구성은 도 1에 도시된 바와 같다. The configuration of the conventional nozzle apparatus of the reflow soldering machine as described above is as shown in FIG.

먼저, 도 1는 종래기술에 따른 납땜기 노즐장치의 구조를 도시한 분해 사시도이다.First, Figure 1 is an exploded perspective view showing the structure of a soldering machine nozzle apparatus according to the prior art.

도시된 바와같이, 종래의 노즐장치는 히터(150)에서 공기를 가열시키며, 송풍기(110)는 가열된 공기를 노즐판(170)까지 불어내기 위해서 가열실 상부에 설치된 모터(100)에 접속되어 있다. 상기 송풍기(110)는, 멀티블레이드 팬(multiblade fan)이나 터보 팬(turbo fan) 등으로 구성될 수 있으며, 상기 모터(100)로부터 동력을 얻어 송풍기 팬(120)이 구동하며 상기 송풍기(110) 하부측으로 공기를 흡입한다. As shown in the drawing, the conventional nozzle apparatus heats air in the heater 150, and the blower 110 is connected to a motor 100 installed in the upper portion of the heating chamber to blow the heated air to the nozzle plate 170. have. The blower 110 may be configured of a multiblade fan, a turbo fan, or the like. The blower fan 120 is driven by the power from the motor 100, and the blower 110 is driven. Inhale air to the lower side.

상기 송풍기(110)의 하부측으로 흡입된 공기는 히터(150)에 의해 가열되며, 공기유도부(130)를 통하여 노즐판(170)까지 유동된다. 상기 노즐판(170)까지 유동되어 온 공기는 상기 노즐판(170)상의 노즐구멍(180)으로 분출되어 프린트기판(도면에 미도시)상의 페이스트가 용융되면서 납땜이 이루어지게 된다.The air sucked into the lower side of the blower 110 is heated by the heater 150 and flows to the nozzle plate 170 through the air induction unit 130. The air that has flowed up to the nozzle plate 170 is blown into the nozzle hole 180 on the nozzle plate 170 and the solder on the printed circuit board (not shown) is melted.

또한, 도 2는 종래기술에 따른 리플로우 납땜기의 노즐장치 사시도이다.2 is a perspective view of a nozzle apparatus of a reflow soldering machine according to the prior art.

도 2에 도시된 바와같이, 상기 송풍기(110)는 하부측에 설치된 모터(100)에 의해 송풍기 팬(120)이 구동되며 공기유도부(130) 외부의 공기를 송풍기(110) 내부로 흡입한다. As shown in FIG. 2, the blower 110 is driven by the motor 100 installed on the lower side of the blower fan 120 to suck air from the outside of the air induction unit 130 into the blower 110.

상기 송풍기(110) 하부측으로부터 흡입된 공기는 송풍기(110) 상부에 결합되어 있는 히터(150)에 의해서 가열되며, 상기 히터(150)에서 가열된 공기는 송풍기(110) 외측부에 위치한 공기유도부(130)의 유동통로를 따라 유동하게 된다. The air sucked from the lower side of the blower 110 is heated by the heater 150 coupled to the upper part of the blower 110, and the air heated in the heater 150 is an air induction part located outside the blower 110 ( 130 flows along the flow path.

상기 공기유도부(130)를 유동하는 공기는 공기유도부 내부에 결합되어 있는 분배타공판(140)을 관통한다. 상기 분배타공판(140)을 관통한 가열된 공기는 프린트기판상의 전자부품을 납땜하기 위해 노즐판(170)의 분출구멍(180)으로 분출되어 프린트기판상에 페이스트가 용융되면서 납땜이 이루어지게 된다.The air flowing through the air induction part 130 passes through the distribution punching plate 140 coupled to the inside of the air induction part. The heated air passing through the distribution punching plate 140 is ejected to the ejection hole 180 of the nozzle plate 170 in order to solder the electronic component on the printed board, and the solder is melted while the paste is melted on the printed board.

그러나, 상기 노즐판(170)은 V자 형태의 구조이며, V자형의 볼록한 부분에는 노즐구멍(180)이 구성되어 있고, 오목하게 들어간 부분에는 흡입구멍(185)이 구성되어 있다. 이러한 구조의 노즐판(170)에서 분출되는 가열된 공기는 프린트기판의 전면에 일정한 풍량과 온도의 공기를 공급하지 못하여 땜납 페이스트의 가열 및 용융이 불균일하게 되어 납땜 불량율을 상승시키는 요인이 되었다.However, the nozzle plate 170 has a V-shaped structure, the nozzle hole 180 is formed in the V-shaped convex portion, and the suction hole 185 is formed in the recessed part. The heated air ejected from the nozzle plate 170 having such a structure fails to supply air with a constant air volume and temperature to the front surface of the printed board, resulting in uneven heating and melting of the solder paste, thereby increasing the solder failure rate.

본 발명은 상술한 문제점을 해결하기 위한 것으로서, 본 발명의 리플로우 납땜기의 타공노즐장치는 리플로우 내부를 관통 이송하는 프린트기판이 균일하게 가열될 수 있도록 한쌍의 평판으로 구성되어 전면에 다수의 분출구멍이 형성됨과 아울러 측하부에 별도의 흡입관이 구비된 노즐이 장착됨으로써 상기 노즐을 통해 송풍되는 공기의 흐름이 원활하게 이루어지도록 한 리플로우 납땜기의 타공노즐장치를 제공하는 것을 그 목적으로 한다.The present invention is to solve the above-described problems, the perforated nozzle device of the reflow soldering machine of the present invention is composed of a pair of flat plate so that the printed board for passing through the reflow inside uniformly heated a plurality of ejection on the front It is an object of the present invention to provide a perforated nozzle device of a reflow soldering machine in which a hole is formed and a nozzle having a separate suction pipe is mounted at the side and bottom thereof so that air flowing through the nozzle is smoothly made.

본 발명은 상기 목적을 달성하기 위한 리플로우 납땜기의 타공노즐장치로서, 가열된 공기를 전달하기 위한 모터, 상기 모터에 의해 회전되며 공기를 발생시키는 송풍기, 상기 송풍기로부터 발생되는 공기를 가열시키는 히터부, 상기 히터부로부터 가열된 공기의 통로가 되는 공기유도부, 상기 공기유도부로부터 유동되어 온 가열된 공기를 프린트기판으로 분출하는 타공노즐판, 및 상기 타공노즐판의 측하부에 설치되어 외부의 공기를 흡입하는 흡입관으로 구성된 것을 특징으로 한다.The present invention is a perforated nozzle device of a reflow soldering machine for achieving the above object, a motor for delivering heated air, a blower rotated by the motor to generate air, a heater unit for heating the air generated from the blower An air induction part serving as a passage of the air heated from the heater part, a perforated nozzle plate for ejecting the heated air flowed from the air induction part to a printed board, and a lower side of the perforated nozzle plate to be installed outside Characterized in that composed of a suction pipe for suction.

또한, 상기 흡입관은 타공노즐판 양측하부에 형성되어 순환공기를 흡입하는 것이 특징이다. In addition, the suction pipe is formed on both lower sides of the perforated nozzle plate to suck the circulating air.

상기 타공노즐판은 일정한 간격으로 분출구가 형성된 평판으로 구성되며, 한쌍으로 분리가능하게 구성된 것이 특징이다.The perforated nozzle plate is composed of a flat plate formed with a jet port at regular intervals, characterized in that configured in a pair separated.

본 발명의 타공노즐판이 구비된 자동납땜기의 상기 목적에 대한 기술적 구성을 비롯한 작용효과에 관한 사항은 본 발명의 바람직한 실시예가 도시된 아래의 도면을 참조한 상세한 설명에 의해서 명확하게 이해될 것이다.Matters relating to the operational effects including the technical configuration for the above object of the automatic soldering machine equipped with the perforated nozzle plate of the present invention will be clearly understood by the detailed description with reference to the following drawings in which preferred embodiments of the present invention are shown.

도 3은 본 발명에 따른 분해 사시도이고, 도 4는 본 발명에 따른 리플로우 납땜기의 타공노즐장치 사시도이다. Figure 3 is an exploded perspective view according to the present invention, Figure 4 is a perspective view of the perforated nozzle device of the reflow soldering machine according to the present invention.

먼저, 도 3은 본 발명에 따른 리플로우 납땜기의 노즐장치 구조를 도시한 분해 사시도이다. First, Figure 3 is an exploded perspective view showing a nozzle device structure of a reflow soldering machine according to the present invention.

도 3에 도시된 바와같이, 타공노즐장치의 하측부에는 송풍기 팬(320)을 구동시키기 위한 모터(300)가 설치되어 있다. 상기 모터(300)는 송풍기(310)에 설치되 어 있는 송풍기 팬(320)을 회전시켜 송풍기(310)의 하부로부터 공기를 흡입한다.As shown in FIG. 3, a motor 300 for driving the blower fan 320 is installed at the lower side of the perforating nozzle device. The motor 300 sucks air from the lower part of the blower 310 by rotating the blower fan 320 installed in the blower 310.

상기 송풍기(310)의 하부로부터 흡입된 공기는 송풍기(310)의 상부에 결합되어 있는 히터(350)로 유동하게 된다. 상기 히터(350)로 유동되어 온 공기는 가열되고, 가열된 공기는 송풍기(310)의 양측부에 결합된 바람유도부(330)을 통하여 타공노즐판(370)까지 유동하게 된다. The air sucked from the bottom of the blower 310 flows to the heater 350 coupled to the top of the blower 310. The air flowed to the heater 350 is heated, and the heated air flows to the perforated nozzle plate 370 through the wind induction part 330 coupled to both sides of the blower 310.

상기 바람유도부(330)의 내부로 유동되는 가열된 공기는 분배타공판(340)을 통과하여 프린트기판(도면 미도시)상의 전자부품을 납땜하기 위해 분출구멍(390)으로 분출하게 된다.The heated air flowing into the wind induction part 330 passes through the distribution punching plate 340 and blows out to the ejection hole 390 to solder the electronic component on the printed board (not shown).

또한, 상기 타공노즐판(370)의 양측부에는 전자부품을 납땜하기 위해 분출되었던 공기가 다시 순환하여 타공노즐판(370) 방향으로 유동하는 공기를 흡입하기 위한 흡입관(380)으로 구성되어 있다.In addition, both sides of the perforated nozzle plate 370 are composed of a suction pipe 380 for sucking air flowing in the direction of the perforated nozzle plate 370 by circulating air again to solder the electronic component.

도 4는 본 발명에 따른 리플로우 납땜장치의 타공노즐장치를 도시한 사시도이다.Figure 4 is a perspective view showing a perforated nozzle device of the reflow soldering apparatus according to the present invention.

도 4에 도시된 바와같이, 송풍기(310)는 가열된 공기를 타공노즐판(370)까지 불어내기 위해서 노즐타공장치의 하부에 설치된 모터(300)에 접속되어 있다. 상기 송풍기(310)는 상기 모터(300)로부터 동력을 얻어 송풍기 팬(320)을 회전시키며 송풍기(310) 하부로부터 공기를 흡입한다.As shown in FIG. 4, the blower 310 is connected to a motor 300 installed in the lower portion of the nozzle perforation device for blowing the heated air to the perforated nozzle plate 370. The blower 310 receives power from the motor 300, rotates the blower fan 320, and sucks air from the bottom of the blower 310.

상기 송풍기(310)의 하부로부터 흡입된 공기는 송풍기(310)의 상부에 결합되어 있는 히터(350)로 유동하게 된다. 상기 히터(350)로 유동되어 온 공기는 가열되 고, 가열된 공기는 상기 송풍기(310)에 결합되어 있는 송풍기 팬(320)의 회전에 의해 송풍기(310) 양측부에 위치한 공기유도부(330)로 이동하게 된다. The air sucked from the bottom of the blower 310 flows to the heater 350 coupled to the top of the blower 310. The air flowed to the heater 350 is heated, the heated air is the air induction unit 330 located on both sides of the blower 310 by the rotation of the blower fan 320 coupled to the blower 310 Will be moved to.

상기 공기유도부(330)는 프린트기판(도면에 미도시)상의 전자부품을 납땜하기 위해 타공노즐판(370)까지 연결되어 있어 가열된 공기는 상기 공기유도부를 통하여 타공노즐판(370)까지 유동한다.The air induction part 330 is connected to the perforated nozzle plate 370 to solder the electronic component on the printed board (not shown in the drawing) so that heated air flows to the perforated nozzle plate 370 through the air induction part. .

상기 공기유도부(330)를 통과한 공기는 분배타공판(340)을 관통한다. 상기 분배타공판(340)을 관통한 가열된 공기는 타공노즐판(370)으로 유동한다. 상기 타공노즐판(370)으로 유동되어 온 가열된 공기는 프린트기판상의 전자부품을 납땜하기 위해 타공노즐판(370)의 분출구멍(390)으로 분출된다. The air passing through the air induction part 330 passes through the distribution punching plate 340. The heated air passing through the distribution punching plate 340 flows to the punching nozzle plate 370. The heated air that has flowed into the perforated nozzle plate 370 is blown into the blowing hole 390 of the perforated nozzle plate 370 to solder the electronic component on the printed circuit board.

상기 타공노즐판(370)의 양측하부에는 프린트기판상의 전자부품들을 납땜하기 위해 분출구멍(390)을 통해 분출된 공기가 다시 순환하여 타공노즐판(370) 방향으로 유동되는 공기를 흡입하는 흡입관(380)이 형성되어 있다.On both lower sides of the perforated nozzle plate 370, the air blown through the jet hole 390 circulates again to suck the air flowing in the direction of the perforated nozzle plate 370 to solder the electronic components on the printed board ( 380 is formed.

또한, 상기 타공노즐판(370)은 일정한 간격으로 가열된 공기를 분출하는 분출구멍(390)이 형성되어 있으며, 한쌍으로 분리가능하게 구성되어 있다.In addition, the perforated nozzle plate 370 is formed with a blowing hole 390 for ejecting the heated air at regular intervals, it is configured to be separated in a pair.

이상의 본 발명은 상기에 기술된 실시예에 의해 한정되지 않고, 당업자들에 의해 다양한 변형 및 변경을 가져올 수 있으며, 이는 첨부된 특허청구범위에서 정의되는 본 발명의 취지와 범위에 포함되는 것으로 보아야 할 것이다.The present invention is not limited to the above-described embodiments, and various modifications and changes can be made by those skilled in the art, which should be regarded as included in the spirit and scope of the present invention as defined in the appended claims. will be.

이상에서 설명한 바와같이, 본 발명에 따른 리플로우 납땜기의 타공노즐장치는, 한쌍의 평판으로 구성되어 일정한 간격으로 구비된 분출구멍이 타공노즐판이 상부에 결합되어 있고, 상기 타공노즐판의 양측부에는 순환공기를 흡입하는 흡입관이 구성되어 있어 분출구멍으로 가열된 공기를 분출하여 납땜이 이루어지고, 납땜 후 프린트기판 방향으로 유동되는 공기를 흡입하여, 프린트기판을 균일하게 가열시킴으로써 납땜 불량률을 감소시킬 수 있다.As described above, the perforated nozzle device of the reflow soldering machine according to the present invention is composed of a pair of flat plates, the ejection holes provided at regular intervals, the perforated nozzle plate is coupled to the upper portion, the both sides of the perforated nozzle plate It is composed of a suction pipe that sucks circulating air, so that soldering is performed by ejecting the heated air through the ejection hole, and the soldering defect rate can be reduced by uniformly heating the printed circuit board by sucking air flowing in the direction of the printed circuit board after soldering. have.

Claims (3)

리플로우 납땜기의 타공노즐장치에 있어서,In the perforated nozzle device of a reflow soldering machine, 상기 송풍기 팬을 구동시키기 위한 모터;A motor for driving the blower fan; 상기 모터의 상부에 결합되며, 모터에 의해 구동되어 공기를 흡입 및 순환Is coupled to the top of the motor, driven by the motor to suck and circulate air 시키기 위한 송풍기;Blower to make; 상기 송풍기로부터 흡입된 순환공기를 가열시키는 히터;A heater for heating circulating air sucked from the blower; 상기 히터로부터 가열된 공기의 유동 통로가 되는 공기유도부;An air induction part that becomes a flow path of air heated from the heater; 상기 공기유도부 상부에 설치되어 외부 공기와 상기 공기 유도부를 통해 순Installed in the upper portion of the air induction unit through the outside air and the air induction unit 환되는 공기가 흡입되며, 타공노즐판 방향으로 유동하는 공기가 흡입되도록 The return air is sucked in, and the air flowing in the direction of the perforated nozzle plate is sucked in. 타공노즐판 측하부에 위치하는 흡입관; 및A suction pipe positioned at the lower side of the perforated nozzle plate; And 상기 흡입관 상부에 결합되어 전면에 다수의 분출구멍이 형성되며, 한 쌍의 Coupled to the upper portion of the suction pipe is formed a plurality of ejection holes in the front, a pair of 평판으로 형성되어 분리가능하게 구성된 타공노즐판;A perforated nozzle plate formed in a flat plate and detachably formed; 을 포함하는 리플로우 납땜기의 타공노즐장치.Perforated nozzle device of a reflow soldering machine comprising a. 삭제delete 삭제delete
KR1020050087344A 2005-09-20 2005-09-20 A nozzle for reflow soldering apparatus Expired - Fee Related KR100685656B1 (en)

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Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20020013712A (en) * 2000-08-14 2002-02-21 요코타 야쓰하루 Reflow soldering apparatus

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20020013712A (en) * 2000-08-14 2002-02-21 요코타 야쓰하루 Reflow soldering apparatus

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
1020020013712

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