KR100720419B1 - Fastening device - Google Patents

Abstract

The present invention relates to a bonding apparatus capable of adding an air blowing means to a lift bar to prevent static electricity generated between the substrate and the stage and to prevent scratches caused by friction of the substrate. The accommodating chamber, a lower stage having an upper stage and at least one accommodating portion installed in the upper and lower spaces of the accommodating chamber, and a support for supporting a substrate positioned on the lower stage. Lifting means for driving so that the receiving portion is accommodated or lifted therein, and the blowing means formed on the supporting portion for injecting gas or air.

Bonding apparatus for liquid crystal display elements, substrate lifting means, blowing means

Description

Bonding device for liquid crystal display device

1 and 2 is a schematic view showing a substrate assembly apparatus of the conventional manufacturing equipment of the liquid crystal display device

3 is a schematic view showing a vacuum bonding apparatus to which a substrate lifting means according to the present invention is applied;

4 is a plan view schematically showing a state of a lower stage in which a substrate lifting means is accommodated according to the present invention;

5A is an enlarged cross-sectional view of portion “A” of FIG. 3.

5B is a view illustrating a configuration of a first support base installed in a direction perpendicular to a carrying in / outing direction of the first substrate in a carrying in / outing direction of the first substrate;

6 is a configuration diagram of the supporting portion of the lifting means according to the first embodiment of the present invention

7 is a configuration diagram of the supporting portion of the lifting means according to the second embodiment of the present invention

Explanation of symbols for the main parts of the drawings

110: adapter chamber 121: upper stage

122: lower stage 300: loader portion

400: substrate lifting means 410a, 410b: support part

410c: Blowing hole 410d: Supply pipe                 

410e: Blowing slit 420: Lifting shaft

430 drive unit

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to equipment for manufacturing a liquid crystal display device. In particular, an air blowing means is added to a lift bar to prevent static electricity generated between the substrate and the stage and to prevent scratches caused by friction of the substrate. The present invention relates to a bonding apparatus for manufacturing a liquid crystal display device of a liquid crystal dropping method, which is advantageous for a large area liquid crystal display device.

As the information society develops, the demand for display devices is increasing in various forms, and in recent years, liquid crystal display devices (LCDs), plasma display panels (PDPs), electro luminescent displays (ELDs), and vacuum fluorescent (VFD) Various flat panel display devices such as displays have been studied, and some of them are already used as display devices in various devices.

Among them, LCD is currently being used most frequently as a substitute for CRT (Cathode Ray Tube) for mobile image display because of its excellent image quality and light weight, thinness and low power consumption. In addition to the mobile use, various types of monitors, such as televisions and computers that receive and display broadcast signals, have been developed.                         

As described above, although various technical advances have been made in the liquid crystal display device to serve as a screen display device in many fields, the operation of improving the image quality as the screen display device has many aspects and features. . Therefore, in order for a liquid crystal display device to be used in various parts as a general screen display device, the key to development is how much high quality images such as high definition, high brightness and large area can be realized while maintaining the characteristics of light weight, thinness and low power consumption. It can be said.

As a method for manufacturing a liquid crystal display device as described above, a conventional liquid crystal injection method in which a liquid crystal is injected through an injection hole of a sealant after the sealing agent is pattern-drawn to bond a substrate in a vacuum so as to form an injection hole on one substrate; The substrates prepared in Japanese Patent Laid-Open Nos. 11-089612 and 11-172903 are prepared by dropping a substrate into which a liquid crystal is dropped and another substrate, and can be broadly classified into a liquid crystal dropping method in which the upper and lower substrates are brought together and bonded in a vacuum. .

At this time, the liquid crystal dropping method of each of the above-described method is shorter than the liquid crystal injection method (for example, the formation of the liquid crystal injection hole, the injection of the liquid crystal, each process for sealing the liquid crystal injection hole, etc.) The advantage is that no additional equipment is required for the additional process.

Recently, a variety of equipment for using the liquid crystal dropping method has been studied.

1 and 2 illustrate a substrate assembly apparatus to which a conventional liquid crystal dropping method as described above is applied.                         

That is, the conventional substrate assembly apparatus includes a frame 10, stage portions 21 and 22, an sealant discharge portion (not shown), a liquid crystal dropping portion 30, and a chamber portion 31. 32, the chamber moving means 40, and the stage moving means 50 are large.

At this time, the stage portion is divided into an upper stage 21 and a lower stage 22, respectively, the sealant discharge portion and the liquid crystal dropping portion 30 is mounted on the side of the position where the bonding process of the frame is made, the chamber The part consists of the upper chamber unit 31 and the lower chamber unit 32 which can be merged with each other.

In addition, the chamber moving means 40 is composed of a drive motor for driving the lower chamber unit 32 to selectively move to a position where the bonding process is performed or a position where discharge of the sealant and dropping of the liquid crystal are performed. The stage moving means 50 is composed of a drive motor for driving the upper stage to selectively move to the upper or lower.

Hereinafter, the manufacturing process of the liquid crystal display device using the conventional substrate assembly apparatus will be described in more detail based on the process sequence.

First, any one substrate (hereinafter referred to as "second substrate") 52 is attached and fixed to the upper stage 21 in a loaded state, and another substrate (hereinafter referred to as "second substrate") is attached to the lower stage 22. 1 board ”51 is attached and fixed in a loaded state.

In this state, the lower chamber unit 32 having the lower stage 22 is moved onto the process position for applying the sealant and dropping the liquid crystal as shown in FIG. 1 by the chamber moving means 40.

Then, when the sealant is applied to the second substrate by the sealant discharge part and the liquid crystal dropping part 30 and the liquid crystal dropping is completed in the above state, the substrate is moved between the substrates as shown in FIG. It is moved onto the process position for bonding.

Thereafter, the chamber units 31 and 32 are bonded to each other by the chamber moving means 40 to seal the space in which the stages 21 and 22 are located, and to make the space vacuum by a separate vacuum means. do.

In addition, the upper substrate 21 moves downward by the stage moving means 50 in the vacuum state, and the second substrate 52 attached to the upper stage 21 is fixed to the lower stage 22. The adhesion of the first substrate 51 and the bonding between the substrates through continuous pressing are completed to manufacture the liquid crystal display device.

However, the conventional substrate assembly apparatus as described above causes each of the following problems.

First, the conventional substrate assembly apparatus is a device or a means for stably loading the substrate on which the thin film transistor or the color filter layer is formed on the lower stage, or unloading the bonded substrate on the lower stage stably. As there was no configuration, there was a high possibility of causing damage to the substrate during the import / export process of the substrate.

In particular, the bonded substrate may be partially attached to the upper surface of the lower stage during the bonding process, but the unloading of the bonded substrate is more likely to cause damage to the substrate without considering the problem thereof. It became big.

Second, even when the unloading of the bonded substrate after the bonding is completed, even though the specific portion (mainly, the central portion or the peripheral portion) of the bonded substrate should not be sag and the unloading should be performed, no consideration is given to this. Therefore, there is a problem that the failure rate due to the bending of the bonded substrate generated during the unloading is increased.

In particular, in recent years, in consideration of the fact that liquid crystal display devices are becoming larger in size, there is an urgent need for a configuration for preventing sagging during unloading of the bonded substrate.

Third, since the substrate is in direct contact with the stage, static electricity is generated in the substrate, which causes the internal circuit formed on the substrate to be destroyed.

Fourth, since the substrate is in direct contact with the stage, scratches are generated due to friction of the substrate, thereby lowering the yield.

The present invention has been made in order to solve the various problems as described above, in the process for vacuum bonding of the liquid crystal display device to prevent the occurrence of static electricity between the lower stage and the substrate during the loading and unloading of the substrate and scratches by friction of the substrate The purpose is to provide a cementation apparatus that can be prevented.

A bonding apparatus according to the present invention for achieving the above object, a lower stage having a combiner chamber for bonding the substrate, the upper stage and the at least one receiving portion installed in the upper space and the lower space of the combiner chamber And a lifting means for supporting the substrate positioned on the lower stage to drive the support portion to be accommodated or lifted in the receiving portion, and a blowing means formed on the support portion to inject gas or air. It is characterized by being provided with.

Here, the lifting means, the lifting shaft for moving up and down the supporting portion in a state integrated with the supporting portion, a drive unit connected to the lifting shaft to drive the lifting shaft is lifted, and the air to the support portion It is preferable to comprise the supply pipe which supplies.

Preferably, the accommodation part is formed at least one or more lengths along the long side or short side direction of the lower stage, and the support part is formed to correspond to the shape of the accommodation part.

The blowing means is preferably composed of a plurality of blowing holes.

The blowing means is preferably composed of blowing slits.

The support portion is preferably coated with a coating material of Teflon or peak, or a current that can flow.

Hereinafter, with reference to the accompanying drawings a preferred embodiment of the bonding apparatus of the liquid crystal display according to the present invention will be described in detail.

3 is a schematic view showing a vacuum bonding apparatus to which a substrate lifting means according to the present invention is applied, and FIG. 4 is a plan view schematically showing a state of a lower stage in which the substrate lifting means according to the present invention is accommodated. FIG. 5A is an enlarged cross-sectional view of part “A” of FIG. 3, and FIG. 5B is a state view of the structure of the pedestal installed in a direction perpendicular to the loading / exporting direction of the first substrate as viewed from the loading / exporting direction of the first substrate. .

6 is a configuration diagram of the support portion of the lifting means according to the first embodiment of the present invention, Figure 7 is a configuration diagram of the support portion of the lifting means according to the second embodiment of the present invention.

According to an exemplary embodiment of the present invention, a bonding apparatus for a liquid crystal display device includes a combiner chamber 110, an upper stage 121, a lower stage 122, a stage moving device, a vacuum device 200, and a loader unit 300. In addition, the substrate lifting means 400 is configured to further include.

The adhering chamber 110 constituting the adhering device of the present invention is formed so that the bonding operation between the substrates can be performed, the air discharge pipe 112 for transferring the air suction force to convert the interior into a vacuum state ) And a vent tube 113 for introducing air or other gas (N ₂ ) from the outside to switch the vacuum chamber chamber 110 in the vacuum state to the standby state, thereby selecting an internal space. It is configured to be able to form or release a vacuum state, the air discharge pipe 112 and the vent pipe 113 is provided with opening and closing valves (112a, 113a) for selectively opening and closing the pipe.

In addition, the upper stage 121 and the lower stage 122 constituting the bonding apparatus of the present invention are respectively installed in the upper space and the lower space in the combiner chamber 110, respectively, into the inside of the combiner chamber 110 Electrostatic adsorption of each of the substrates 510 and 520 is carried out to maintain a fixed state at a corresponding working position in the combiner chamber 110, and is capable of selective movement to perform bonding between the fixed substrates. . That is, the upper stage 121 is provided with at least one electrostatic chuck (ESC) 121a so as to provide a plurality of electrostatic powers on the bottom thereof so that the substrate can be fixed. Accordingly, a plurality of vacuum holes 121b are formed.

As described above, the electrostatic chuck 121a is provided to be paired with at least two different polarities so as to allow electrostatic attachment of each substrate by applying DC voltages having different polarities, respectively. The electrostatic chuck may be configured such that a single electrostatic chuck itself has two polarities at the same time while providing constant power.

In addition, in the configuration of the upper stage 121, each of the vacuum holes 121b is a single or a plurality of pipes (for receiving the vacuum force generated by the vacuum pump 123 connected to the upper stage 121) 121c) is formed to communicate with each other.

In addition, at least one electrostatic chuck 122a is mounted on the upper surface of the lower stage 122 as well as the bottom shape of the upper stage, and at least one vacuum hole 122b is formed along the circumference of the electrostatic chuck. It is done.

However, the electrostatic chuck 122a and the vacuum hole 122b mounted and formed on the upper surface of the lower stage 122 are not necessarily limited to those that can be implemented in the same shape as that of the upper stage 121. It is more preferable to arrange the electrostatic chuck and the vacuum hole in consideration of the general shape of the substrate to be worked or the application area of the liquid crystal applied to the substrate. In addition, the vacuum hole 122b formed in each stage is not limited to that which must be formed.

At this time, at least a portion of the upper surface of the lower stage 122 where a dummy region (hereinafter, referred to as a “first substrate”) placed on the surface of the lower stage 122 is located, is removed. One or more receiving portions 122d are formed.

However, the position of the accommodating part 122d is not limited to that which can be formed only at the position as described above, but may be any position where the first substrate 510 can be prevented from bending. Preferably, as described above, the lower surface of the dummy region between the cell regions formed on the upper surface of the first substrate 510 may be located.

The accommodating part 122d may not only be formed as a general groove, but may also be formed as a through hole penetrating the lower stage 122. In general, the receiving part 122d may have a shape of a groove, but only a specific portion of the groove is formed with a through hole. It can also be formed as a configuration.

In addition, the stage shifting device constituting the bonding apparatus of the present invention has a moving shaft 131 for driving the upper stage 121 to move up and down selectively, and a rotation shaft for driving the lower stage 122 to selectively rotate left and right. And a driving motor (133, 134) for selectively driving the respective axes in the state coupled to each of the stages (121, 122) on the inside or the outside of the adapter chamber (110). .

And, the vacuum device 200 constituting the bonding apparatus of the present invention serves to transfer the suction force so that the interior of the adapter chamber 110 can selectively achieve a vacuum state, and generates a conventional air suction force It consists of a suction pump for driving, and the space provided with the vacuum device 200 is formed to communicate with the air discharge pipe 112 of the adapter chamber 110.

And, the loader unit 300 constituting the bonding apparatus of the present invention is a separate device from the various components provided in the combiner chamber 110 and the combiner chamber 110, the combiner chamber 110 It is built on the outside of the), to selectively carry in each substrate into the interior of the adapter chamber 110, or to take out from the adapter chamber 110.

At this time, the loader unit as described above and any one arm (hereinafter referred to as "first arm") 310 for transporting the substrate (hereinafter referred to as "first substrate") 510 on which the liquid crystal is dropped and And another arm (hereinafter referred to as "second arm") for conveying the substrate coated with the seal material or the substrate on which the liquid crystal is not dropped (hereinafter referred to as "second substrate") 520. It is composed.

And, the substrate lifting means 400 constituting the bonding apparatus of the present invention is largely selectively accommodated in the interior of the receiving portion 122d, the support portion 410a for selectively supporting the first substrate 510, An elevating shaft 420 for selectively moving the supporting portion 410a up and down in a state of being integrated into one end of the supporting portion 410a by penetrating the receiving portion 122d from the lower side of the lower stage 122; It is configured to include a drive unit 430 connected to the shaft to drive the lifting shaft to selectively lift.

At this time, the receiving portion 122d is a portion of the upper surface of the lower stage 122 where the dummy region of the first substrate 510 is placed on the surface in the same direction as the loading / exporting direction of the first substrate. It is formed long along the length of the support portion 410a corresponding to the shape of the receiving portion 122d, which is applied to the equipment for manufacturing a large liquid crystal display device support portion 410a is the liquid crystal display device It is to be able to stably support up to each peripheral portion of the to prevent sagging of the peripheral portion.

However, it is not necessarily limited to forming the receiving part 122d and the supporting part 410a long as described above so that the contact with the substrate can make a surface contact, and the upper surface of the supporting part 410a. Forming a plurality of protrusions in the can be configured to minimize the contact area with the substrate.

However, the above-described configuration may cause damage to the substrate due to stress concentration at the localized portion when the substrate is enlarged, thereby preventing sagging of the substrate by applying the surface contact configuration as in the above-described embodiment. More preferably.

In addition, the accommodation portion 122d and the support portion 410a may be formed in at least two or more along the long side direction of the lower stage 122, or at least two along the short side direction of the lower stage 122. It may be formed as described above, one or more may be configured simultaneously in the long side direction and short side direction of the lower stage 122, respectively.                     

Specifically, as described above, the receiving portion 122d and the supporting portion 410a are not necessarily formed to face the same direction as the loading / exporting direction of the first substrate 510, but the first substrate ( 510 is additionally formed along the direction perpendicular to the import / export direction, as shown in FIG. 4 when viewed from the plane as a whole, such as “〓”, “≡”, “∥”, as well as “十”, “ By forming any one of various shapes such as “口” or “井”, sagging of both sides of the first substrate 510 can be prevented as much as possible.

In particular, the support position (or contact position) of the first substrate 510 by the support portion 410a may be any position where it is possible to prevent the bending of the first substrate 510. Is a lower surface of each cell formed on the upper surface of the first substrate 510 and a portion where the dummy region between the cells is located.

At this time, the installation interval between each support portion 410a installed to face the same direction as the loading / exporting direction of the first substrate 510 does not interfere with at least the movement path of each finger of the first arm 310. To avoid formation.

For example, when the first arm 310 is formed to have three fingers 311 at a predetermined interval as shown in FIG. 4, within the interval s formed by each of the fingers 311. Each base portion 410a is positioned so as not to interfere with the movement of the first arm 310.

In addition, each of the other supporting portions 410b installed to face in a direction perpendicular to the loading / exporting direction of the first substrate 510 may be a portion to which each finger 311 of the first arm 310 is carried. Bend downward to prevent interference with each of the fingers, or as shown in the embodiment, the center portion is bent downward to prevent interference with the central finger of the first arm 310. In addition, both side portions are formed to have a length such that they are not in contact with each of the fingers located on both sides of the first arm 310 (or the support portion 410b for each finger located on both sides of the first arm). Formed to have an interval so that it does not interfere with). Its state is as shown in Figure 5b.

On the other hand, if the length of the support portion (410a, 410b) is formed long so that the configuration of the support portion (410a, 410b) can be applied to the equipment for manufacturing a large liquid crystal display device as described above may occur Can be.

Accordingly, in the present invention, at least two or more lifting shafts 420 coupled to the supporting portions 410a and 410b and a driving unit 430 for driving the lifting shafts 420 to each of the supporting portions 410a and 410b. Each mounting position is further presented at the corresponding position.

For example, the point of intersection between each supporting portion 410a facing in the horizontal direction and each supporting portion 410b facing in the vertical direction when viewed in a plan view, or a portion between the ends of both supporting portions 410a and 410b from the center side of the supporting portions 410a and 410b. The lifting shafts 420 connected to the driving unit 430 are respectively mounted on portions corresponding to each other.

In addition, in the above configuration, the support parts 410a and 410b may be coated with a coating material (not shown) to cover each surface including a surface on which the contact with the first substrate 510 is made. When 410b is in contact with the first substrate 510, it is further suggested that various damages such as scratches due to contact between the support parts 410a and 410b and the substrate may be prevented in advance.

Particularly, in the present invention, the coating material is formed of Teflon, a peak, or a material through which current can flow, thereby preventing scratches or impact of the substrate and generation of static electricity in contact with the substrate.

In addition, the supporting parts 410a and 410b are formed to form a bar, a circular pin, or a hollow polygonal tube as an embodiment. The present invention is not limited thereto and may be formed in various configurations with reference to the above-described shapes.

In addition, the driving unit 430 constituting the substrate lifting means 400 is configured to include at least one of a cylinder or a step motor for moving the lifting shaft up and down using conventional pneumatic pressure or hydraulic pressure. It is fixed on the lower space in the 110, or penetrates the bottom of the adapter chamber 110 on the outer space of the adapter chamber 110 to have the ease of installation and prevention of interference with each drive equipment. Additionally suggests.

Here, as shown in Figure 6, the support portion 410a, 410b, by blowing air or gas to blow up the substrate located in the support portion (410a, 410b) blowing means, specifically a plurality of blowing holes ( Blowing holes 410c are formed, and a supply pipe 410d for supplying air or gas to the blowing hole 410c is formed at lower surfaces of the supporting parts 410a and 410b.

In addition, as shown in FIG. 7, the supporting parts 410a and 410b may be blown with a blowing means by blowing air or gas to push up the substrate positioned on the supporting parts 410a and 410b ( 410e is formed, and a supply pipe 410d for supplying air or gas to the blowing slit 410e is formed on the lower surfaces of the support parts 410a and 410b.

Here, although not shown in the drawing, similar effects can be obtained by separately forming a plurality of blowing holes to blow on the surface of the lower stage 122 and installing a supply pipe for supplying air or gas as described above. By injecting air or gas using the vacuum holes formed in the upper and lower stages 121 and 122, the effects as described above may be obtained.

The manufacturing method of the liquid crystal display device using the bonding apparatus of the present invention configured as described above will be described in more detail as follows.

First, as shown in FIG. 3, the loader unit 300 controls the arms 310 and 320 to select the first substrate 510 to be loaded into the lower stage 122 and the second substrate 520 to be loaded into the upper stage 121. Receive each.

In this state, the loader unit controls the second arm 320 so that the surface on which the liquid crystal is not coated is adhered to the second substrate 520 through the open portion of the adapter chamber 110 so that the combiner chamber faces downward. Bring in (110). In addition, the upper stage 121 descends close to the loaded second substrate 520, and the vacuum pump 123 connected to the upper stage 121 is operated to operate each vacuum hole formed in the upper stage 121 ( 121b) to transfer the vacuum force to adsorb the second substrate 520 carried by the second arm 320. And the upper stage 121 is raised.

In addition, the loader 300 controls the first arm 310 to bring the first substrate 510 into which the liquid crystal is dropped into the upper portion of the lower stage 122 installed in the lower space in the combiner chamber 110. Let's do it.

In this state, each driving unit 430 constituting the substrate lifting means 400 of the present invention is driven to move the lifting shaft 420 upward.

Accordingly, the support parts 410a and 410b connected to the respective lifting shafts 420 are mounted on the first arm 310 while gradually protruding upward from the receiving part 122d formed on the upper surface of the lower stage 122. The first substrate 510 is detached from the first arm 310 at the same time as the bottom surface of the first substrate 510 which is in contact with the bottom surface of the first substrate 510, and is raised by a predetermined height and then stopped. At this time, the air or gas is discharged to the blowing hole 410c or the blowing slit 410e by supplying air or gas to the supporting parts 410a and 410b through the supply pipe 410d to push the first substrate. As a result, even if the first substrate is placed on the support parts 410a and 410b, the first substrate 510 may not be directly contacted on the support parts 410a and 410b.

At this time, the first substrate 510 is placed on the upper surface of each of the supporting portion (410a, 410b) while performing contact with the supporting portion (410a, 410b) while the stress is not concentrated in a specific portion of the bottom surface In general, as the stress is supported by the dispersed state, problems such as deflection or deformation of a specific part do not occur.

The contact between the support parts 410a and 410b and the first substrate 510 may be any one of various types of contact such as surface contact, line contact, and point contact.

In addition, each of the support parts 410a and 410b is coated with a coating material (not shown) made of Teflon, peak, or a current that can flow, and the first substrate 510 and the first substrate 510 by the blowing hole 410c. Since the support parts 410a and 410b are not directly contacted, it can be understood that electrostatic discharge can be prevented when contacting the first substrate 510 and the substrate damage such as scratching of the substrate can be prevented.

In addition, when the above-described processes are completed and the first arm 310 is moved out of the adapter chamber 110 under the control of the loader unit 300, the respective driving units 430 perform the driving again, respectively. The lifting shaft 420 of the will be moved downward.

Accordingly, when the supporting portions 410a and 410b connected to the lifting shafts 420 are gradually received downward and accommodated in the receiving portions 122d, the first and second supporting portions 410a and 410b are placed on the supporting portions 410a and 410b. The substrate 510 is removed from the support parts 410a and 410b and placed on the upper surface of the lower stage 122.

In this state, while the vacuum pump connected to the lower stage 122 operates, the vacuum force is transmitted to each vacuum hole 122b to suck and fix the first substrate 510, or to apply power to each electrostatic chuck 122a. Loading of the substrates 510 and 520 is completed by electrostatically attaching the first substrate by electrostatic power generation through the substrate.

Then, in the state in which the interior of the adapter chamber 110 is sealed, the interior of the adapter chamber 110 is vacuumed by the driving of the vacuum apparatus 200, and the upper stage 121 is continuously driven by the driving of the stage moving apparatus. Bonding between the substrates 510 and 520 is performed by moving downward or upwardly of the lower stage 122.

If the bonding process is performed just before the loading of the second substrate 520 among the above-described processes, and the bonding substrate exists in the lower stage 122, the second arm into which the second substrate 520 is loaded More preferably, the 320 may unload the bonded substrate existing in the lower stage 122 after the second substrate 520 is loaded, and the process thereof will be described later.

First, each of the driving units 430 of the substrate lifting unit 400 is driven to move the lifting shafts 420 and the supporting units 410a and 410b upward, thereby adhering the bonded substrates mounted on the lower stage 122. The strips are removed from the lower stage 122 and continuously moved upward so as to be positioned on the upper space of the lower stage 122. In this case as well, at this time, the air or gas is supplied to the support parts 410a and 410b through the supply pipe 410d to discharge the air or gas into the blowing hole 410c or the blowing slit 410e, and thus the Since the substrate is pushed up, the substrate is not directly contacted with the support parts 410a and 410b even when the substrate bonded to the support parts 410a and 410b is mounted.

Thereafter, the loader 300 is controlled to carry the second arm 320 loaded with the second substrate 520 back into the adapter chamber 110. At this time, the loading position of the second arm 320 is positioned below the bonded substrate moved upward by the first substrate lifting means 400.

In this state, when each driving unit 430 of the substrate lifting unit 400 is driven to move the lifting shaft 420 and the supporting members 410a and 410b downward, the supporting members 410a and 410b. The adhered substrate, which was placed on the upper surface of the upper surface of the upper surface of the upper surface of the lower arm 122, is placed on the upper surface of the second arm 320, and each of the supporting portions 410a and 410b moves in the receiving portion 122d of the lower stage 122 by continuous downward movement. Are accepted.

Subsequently, the second arm 320 is carried out of the combiner chamber 110 by the control of the loader 300 to complete the unloading of the bonded substrate.

Of course, when the unloading process of the bonded substrate as described above is completed, it is natural that the loading process of the first substrate 510 by the first arm 310 and the first substrate lifting means 400 is performed. Omit according to one.

As described above, the following effects can be obtained by the configuration according to the substrate lifting means of the vacuum bonding device for liquid crystal display device of the present invention.

First, when the first substrate to which the liquid crystal is coated is loaded on the lower stage, or when the bonded substrate is unloaded on the lower stage, the inner portion of the substrate may be smoothly supported by the first substrate lifting means according to the present invention. It is possible to prevent the phenomena in the inner portion of the substrate, and the circumferential portion of the substrate can be smoothly supported by the second substrate lifting means to prevent the phenomena in the circumferential portion of the substrate Defects caused by sagging of the substrate can be prevented in advance.

In particular, the configuration of the first substrate lifting means and the second substrate lifting means according to the present invention is advantageous in that it is possible to effectively prevent the occurrence of defects due to the sag of the substrate when applied to the manufacturing process of the liquid crystal display device which is gradually enlarged.

Second, each support portion of each substrate lifting means according to the present invention is coated with a coating material made of a material that can flow current, or blow holes or blowing slits are formed in the support portion blows the substrate placed on the support portion It is possible not only to prevent the generation of static electricity that may be generated when the substrate and the support portion come into contact, but also to prevent scratches of the substrate due to the contact with each of the support portions, thereby minimizing damage to the substrate. It is possible to minimize the failure rate.

Third, the substrate lifting means according to the present invention can smoothly remove the bonded substrate from the lower stage without damaging the bonded substrate even when the adhesion between the bonded substrate and the lower stage occurs when the bonding process between the substrates is completed. There is an effect that can minimize the damage to the bonded substrate, such as static electricity and scratches that can be generated.

Fourth, since the air or gas is injected through the blowing means at the time when the substrate and the substrate lifting means are in contact, the substrate and the substrate lifting means act as a buffer to alleviate the impact of the substrate and the lifting means to protect the substrate.

Claims (6)

An adhering chamber for adhering the substrate, A lower stage having an upper stage and at least one receiving portion installed in an upper space and a lower space of the adapter chamber; Lifting means for supporting the substrate positioned on the lower stage and driving the support portion to be accommodated or lifted in the accommodation portion; And a blowing means formed in the support part and configured to blow gas or air toward the substrate. The method of claim 1, Lifting means A lifting shaft configured to move the supporting part up and down in an integrated state with the supporting part; A driving unit connected to the lifting shaft and driving to lift the lifting shaft; Bonding device comprising a supply pipe for supplying air or gas to the supporting portion. The method of claim 1, The accommodating portion is formed on the upper surface of the lower stage at least one or more along the long side or short side direction of the lower stage, Bonding device characterized in that the support is formed corresponding to the shape of the receiving portion. The method of claim 1, And the blowing means comprises a plurality of holes. The method of claim 1, And the blowing means comprise a blowing slit. The method of claim 1, The support unit is a bonding device, characterized in that the coating material is coated with Teflon or peak, or a current that can flow.

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