KR100849061B1 - Manufacturing method for 3d probe beam - Google Patents

Abstract

The present invention relates to a three-dimensional probe beam manufacturing method having at least one step in a section from the two-dimensional planar structure.

The manufacturing method disclosed in the present invention is largely a process for producing a two-dimensional planar structure of a conductive material, a process for manufacturing a three-dimensional substrate having a recessed portion to have a step, a press mold having a protrusion corresponding to the recessed portion And aligning the planar structure to the three-dimensional substrate, and compressing the planar structure so that the protrusion of the press mold is inserted into the recess.

Probe beam, 3d, pressing

Description

MANUFACTURING METHOD FOR 3D PROBE BEAM

1 is an exemplary view showing a conventional probe beam,

2 is a diagram illustrating a conventional probe beam manufacturing process;

3 is an exemplary view showing a resolution problem in the manufacturing process of FIG.

4 is an overall flowchart of a method for manufacturing a three-dimensional probe beam according to the present invention;

5a to 5c is an exemplary view showing a three-dimensional probe beam according to the present invention,

Figure 6a is a process diagram of a first embodiment of a planar structure manufacturing process of the present invention,

FIG. 6B is an illustration of some states for FIG. 6A;

Figure 7a is a process diagram of a second embodiment of the planar structure manufacturing process of the present invention,

FIG. 7B is an illustration of some states for FIG. 7A;

8A is a process diagram of a first embodiment of a three-dimensional substrate manufacturing process of the present invention;

FIG. 8B is an example of some states for FIG. 8A;

Figure 8c is an illustration of a three-dimensional substrate showing a plurality of steps,

9 is an exemplary view showing some states of a second embodiment of a three-dimensional substrate manufacturing process of the present invention;

Figure 10a is an illustration of a part of the state of the first embodiment of the press mold manufacturing process of the present invention,

Figure 10b is an illustration of some states of a second embodiment of the press mold manufacturing process of the present invention,

11 is an exemplary view illustrating some states of a three-dimensional probe beam manufacturing process of the present invention.

The present invention relates to a method for manufacturing a probe beam, and more particularly, to a series of methods for manufacturing a three-dimensional probe beam by modifying some sections of a planar structure manufactured in two dimensions to have at least one step.

As is well known, the 'probe beam' is a component of a probe card that detects an abnormality by detecting an electrical signal of a chip IC during a semiconductor manufacturing process. Referring to FIG. 1, a general structural feature of the probe beam may be seen that the probe beam 20 is bonded (or connected) on the probe head substrate 10. The probe beam 20 is provided between the connecting portion 22 to be connected to the head substrate 10, the contact portion 24 to which the base member B and the probe tip T are joined, and the connection portion and the contacting portion. An elastic portion 26 that provides an elastic force is configured.

Referring to Figure 2 attached to a series of processes for manufacturing the probe beam 20, first, a photoresist (PR) is applied to the three-dimensional substrate (S1, S2). The photoresist applied through the two-dimensional mask in which the opening is formed is patterned (S3, S4). Thereafter, electroplating is performed on the pattern region formed in the groove shape, and the photoresist is removed to separate the probe beam 20 shown in FIG. 1 (S5).

However, as illustrated in FIG. 3, the distance between the two-dimensional mask and the photoresist sections A, B, and C is different, which makes it difficult to implement the probe beam 20 of FIG. 1. Since the distance (d _B ) of the section _B and the distance (d _C ) of the section C are relatively far from the two-dimensional mask aligned with the section A (d _A ), the resolution in the section BC is reduced. In other words, it means that the photoresist applied to the sidewalls and the bottom of the groove portion is not subjected to accurate exposure. Furthermore, in the case where an optical system is used between the mask and the photoresist PR in FIG. 3, it is apparent that the resolution in the above-described section BC will be further reduced.

The present invention has been made to solve the above problems, the main object of the present invention is to provide a method for producing a three-dimensional probe beam by modifying a planar structure manufactured in two dimensions to have at least one or more steps.

The features and advantages of the present invention will become more apparent from the following detailed description based on the accompanying drawings. In the meantime, when it is determined that the detailed description of the known functions and configurations related to the present invention may unnecessarily obscure the subject matter of the present invention, it should be noted that the detailed description is omitted.

4 is a flowchart illustrating a three-dimensional probe beam manufacturing method, a two-dimensional planar structure manufacturing process (S100) of a conductive material, a three-dimensional substrate manufacturing process (S200) having at least one step, grooves formed in the three-dimensional substrate Press mold manufacturing process (S300) of the shape corresponding to the and the three-dimensional probe beam manufacturing process (S400) made by aligning the manufactured planar structure on the three-dimensional substrate and pressing with a press mold (S400).

The planar structure described above is basically a rectangular two-dimensional metal planar body, as illustrated in FIG. 5A, and is simple. When the planar structure of FIG. 5A undergoes pressing to be described below, a three-dimensional probe beam having a step may be implemented. In this case, the step may form a single step, but may be implemented to have one or more steps as shown in FIG. 5B. In addition, the present invention is not only applied to the simple type described above, but may also be set to a so-called composite type having a trapezoidal elastic portion as shown in FIG. 5C. In other words, when the planar structure of FIG. 5C is pressed, a step is formed in the same manner as that of FIG. 5A, wherein the elastic portion has a trapezoidal shape and improves the structural stability of the probe beam.

Hereinafter, it looks at in detail through the embodiments of the above-described processes (S100 ~ S400).

[ Planar Structure Manufacturing Process (S100)-Example 1]

6A is a flowchart illustrating a first embodiment of a planar structure manufacturing process, and FIG. 6B is a diagram illustrating some states thereof.

First, a photoresist (PR) is coated on one surface of a substrate such as a silicon wafer or glass (S110a).

Afterwards, the photoresist is patterned into a shape for a desired planar structure through photolithography (S120a), and a planar structure is formed in the pattern region through nickel (Ni) electroplating (S130a). The planar structure formed by removing the photoresist is separated (S140a).

[ Planar Structure Manufacturing Process (S100)-Second Embodiment]

FIG. 7A is a flowchart illustrating a second embodiment of a planar structure manufacturing process, and FIG. 7B is a diagram illustrating some states thereof.

Photoresist (PR) is applied to both surfaces of a substrate made of nickel (Ni) or copper (Cu) (S110b), and the photoresist on one surface of the substrate is patterned to have a shape with respect to a planar structure (S120b). Subsequently, the pattern region is etched (S130b), and photoresist remaining on both surfaces of the substrate is removed to obtain a planar structure (S140b).

This embodiment is distinguished from the first embodiment described above by using the material of the substrate as nickel (Ni) or copper (Cu), which is a material of the planar structure.

[ Having a step 3D substrate manufacturing process (S200)-Example 1]

FIG. 8A is a flowchart of a first embodiment of a three-dimensional substrate manufacturing process having a step, and FIG. 8B is a diagram illustrating some states thereof.

First, an oxide film is deposited on one surface of a silicon wafer substrate, and a photoresist PR is applied thereon (S210a). The applied PR is patterned as mentioned above (S220a). The pattern region formed by patterning is reactive ion etched or anisotropically etched (S230a). Here, step S230a may be understood to form a recess in the substrate. And when reactive ion etching forms a vertical step, anisotropic etching is suitable when forming an inclined step. Next, the three-dimensional substrate is completed by removing the photoresist remaining on the substrate (S240a).

The stepped portion of the 3D substrate may be modified to have a plurality of steps as well as a single step, as shown in the figure. To this end, a number of photolithography processes need to be repeated, but those skilled in the art will be able to implement it without any difficulty. 8C is illustrated for a three-dimensional substrate having a plurality of steps.

[ Having a step 3D substrate manufacturing process (S200)-Example 2]

Unlike the first embodiment described above, a three-dimensional substrate having a more free shape can be manufactured through machining. At this time, the substrate may be glass, ceramic or metal. 9 illustrates a three-dimensional substrate by machining.

[ Press mold manufacturing process (S300)-Example 1, Example 2]

10A is a diagram illustrating some states of a first embodiment of a press mold manufacturing process, and FIG. 10B is a diagram illustrating some states of a second embodiment. The press mold forms a protrusion corresponding to the recess of the three-dimensional substrate. To this end, the following two methods may be used.

First, as shown in Figure 10a to form a press mold by melting, injecting and curing the glass in the groove portion of the three-dimensional substrate provided through the S200 process. The surface of the formed press mold is polished.

Second, as shown in FIG. 10B, a press mold is formed by machining a substrate such as glass, ceramic, or metal to form a protrusion corresponding to the recess of the three-dimensional substrate.

[ Having a step 3D probe beam manufacturing process (S400)]

This process is a process of transforming the planar structure into a three-dimensional probe beam through pressing (pressing). Referring to FIG. 11 showing a part of the process, the planar structure prepared in S100 is aligned with the three-dimensional substrate, and the planar structure is pressed (compressed) so that the protrusion of the press mold is inserted into the recess of the planar structure. .

Accordingly, the two-dimensional planar structure is deformed into a shape corresponding to the step formed on the three-dimensional substrate, and completed with a three-dimensional probe beam to be implemented by the present invention.

According to the present invention described above, it is possible to manufacture a three-dimensional probe beam having at least one step in a section from a two-dimensional planar structure through pressing without having to consider the conventional resolution problem.

As described above and described with reference to a preferred embodiment for illustrating the technical idea of the present invention, the present invention is not limited to the configuration and operation as shown and described as described above, it is a deviation from the scope of the technical idea It will be understood by those skilled in the art that many modifications and variations can be made to the invention without departing from the scope of the invention. Accordingly, all such suitable changes and modifications and equivalents should be considered to be within the scope of the present invention.

Claims (7)

A method for manufacturing a probe beam having at least one step in some sections, A first step of manufacturing a two-dimensional planar structure of a conductive material; A second step of manufacturing a three-dimensional substrate having grooves formed to have a step; A third process of manufacturing a press mold having a protrusion corresponding to the groove; And A fourth process of aligning the planar structure to a three-dimensional substrate and compressing the planar structure so that the protrusion of the press mold is inserted into the recess portion; 3D probe beam manufacturing method comprising a. The method according to claim 1, The first process, Applying photoresist (PR) to one surface of the silicon wafer or the glass substrate; Patterning the photoresist through photolithography and forming a planar structure with nickel electroplating in the pattern region; And Removing the photoresist and separating the formed planar structure; 3D probe beam manufacturing method comprising a. The method according to claim 1, The first process, Applying photoresist (PR) on both sides of a nickel or copper substrate and patterning the photoresist applied on one surface of the substrate; And Etching the pattern region and removing photoresist on both sides of the substrate; 3D probe beam manufacturing method comprising a. The method according to claim 1, The second process, Depositing oxide film and photoresist (PR) on one surface of the silicon wafer substrate and patterning the applied photoresist; Reactive ion etching or anisotropic etching the pattern region to have the recessed portion; And Removing photoresist remaining on the substrate; 3D probe beam manufacturing method comprising a. The method according to claim 1, The second process, Machining glass, ceramic or metal to have the recesses; 3D probe beam manufacturing method comprising a. The method according to claim 1, The third process, Melting, injecting and curing glass into the recesses of the three-dimensional substrate; 3D probe beam manufacturing method comprising a. The method according to claim 1, The third process, Machining glass, ceramic or metal to form protrusions corresponding to recesses in the three-dimensional substrate; 3D probe beam manufacturing method comprising a.

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