KR100875981B1 - Support Spacing Device - Google Patents

Abstract

The present invention relates to a support spacing device, comprising a pair of first and second racks interlocked with a first rotating gear, the first rotating gear and disposed to face each other with the first rotating gear interposed therebetween, And a pair of first and second fixing members coupled to the pair of first and second racks, respectively, and driving means for driving the first rotary gear.

According to the present invention, the support interval can be changed by a simple configuration, and the support interval can be adjusted more precisely and accurately, and the support interval can be widely used not only in the field of manufacturing semiconductor wafers but also in the manufacture of LCD panels. An adjustment device can be provided.

Description

Support interval adjusting device {SUPPORTING INTERVAL ADJUSTION DEVICE}

1 is a perspective view showing the front of the support interval adjusting device according to the present invention,

2 is a perspective view showing the rear of the support interval adjusting device according to the present invention;

3 is a perspective view illustrating a first rotary gear, first and second racks and first and second fixing members interlocked with the first rotary gear,

4 is a perspective view showing the second rotary gear and the third and fourth racks and the third and fourth fixing members engaged thereto;

5 is an exploded perspective view showing the seating member;

Figure 6 is a perspective view showing a state in which the seating member is installed in the support interval adjusting apparatus according to the present invention to support the wafer.

Explanation of symbols on the main parts of the drawings

10: first rotating gear 12: first rack

13: first fixing member 14: second rack

15: second fixing member 20: driving means

30: second rotary gear 32: third rack

33: third fixing member 34: fourth rack

35: fourth fixing member 40: fifth fixing member

The present invention relates to an apparatus capable of adjusting a support interval for supporting a plate such as a semiconductor wafer, and more particularly, to a support interval adjustment apparatus capable of accurately and precisely adjusting a support interval while having a simple configuration.

Recently, with the rapid spread of information media such as computers, semiconductor devices are also rapidly developing.

In light of today's rapidly increasing integration of semiconductor devices, the role of the manufacturing apparatus becomes more important.

The manufacturing apparatus of the semiconductor device has been improved to more accurately reflect the demands of the process that changes day by day with the flow of the times.

In order to manufacture a semiconductor device, not only the operations in each process performed for such manufacturing must be precisely performed in a clean state, but also a transfer device that accurately moves the devices between the processes is also an important factor in the manufacturing operation.

Such a transfer device is widely required not only in the manufacturing technology of semiconductor devices but also in the LCD (Liquid Crystal Display) manufacturing technology and various precision machine manufacturing fields.

In general, since the wafer is moved into a boat in a lot unit in a storage container such as a cassette or a front opening unified pod (FOUP), which is a kind of carrier, a transfer device for transferring the wafer is essential. do.

A wafer transfer device for transferring such wafers usually supports 1 to 5 wafers simultaneously and transfers them.

However, since the storage space in the wafer storage container is partitioned at predetermined intervals as necessary, and the wafer is placed in the storage space partitioned at the predetermined interval, the wafer support interval of the transfer device corresponds to the interval in the storage space. Should be adjusted as possible.

However, the conventional support gap adjusting device included in such a wafer transfer device has a problem in that it is difficult to manufacture and maintain due to the mechanical complexity thereof, and is also difficult to miniaturize due to its bulkiness and increases in manufacturing cost.

The present invention has been made to solve the above problems, it is an object of the present invention to provide a support spacing device that can change the support spacing by a simple configuration.

Still another object of the present invention is to provide a support spacing adjusting device capable of adjusting the support spacing more precisely and accurately.

It is still another object of the present invention to provide a support gap adjusting device which has a compact configuration and can be widely used not only in the field of manufacturing semiconductor wafers but also in the manufacture of LCD panels.

In order to achieve the above object, the support spacing adjusting device according to the present invention comprises a pair of first and second rotary gears interlocked with the first rotary gear and disposed to face each other with the first rotary gear interposed therebetween. And a second rack, a pair of first and second fixing members respectively coupled to the pair of first and second racks, and driving means for driving the first rotary gear.

Here, the support interval adjusting device is a pair of third and third interlocked with the second rotary gear disposed behind the first rotary gear and the second rotary gear and faced with the second rotary gear interposed therebetween. And a pair of third and fourth fastening members coupled to the fourth rack and the third and fourth racks, respectively, wherein the first and second fastening members and the third and fourth fastening members are arranged to cross each other. Can be.

Preferably, the first rotary gear and the second rotary gear include gears of the same module and pitch.

Alternatively, the first rotary gear and the second rotary gear may include gears of different modules and pitches.

In this case, preferably, the second rotary gear includes a gear tooth having a module and pitch of 1.5 times or more and twice or less with respect to the module and pitch of the first rotary gear gear tooth.

Meanwhile, a fifth fixing member which is not interlocked with the first and second rotating gears may be additionally disposed at the center of the first, second, third and fourth fixing members.

Preferably, it may further include a position sensor for detecting the position of the first, second, third, fourth fixing member.

In addition, the first, second, third, fourth, and fifth fixing members may be provided with first, second, third, fourth, and fifth mounting members for mounting the semiconductor wafer, respectively.

Hereinafter, with reference to the accompanying drawings will be described in detail the support interval adjusting device according to the present invention.

1 is a perspective view showing the front of the support interval adjusting apparatus according to the present invention, Figure 2 is a perspective view showing the rear of the support interval adjusting apparatus according to the present invention, Figure 3 is a first rotary gear and the first Fig. 4 is a perspective view showing a first rack, a second rack, and first and second fastening members, and Fig. 4 is a perspective view showing a second rotary gear and third, fourth racks, and third and fourth fastening members engaged therewith.

1 to 4, the support interval adjusting device according to the present invention is interlocked with the first rotary gear 10 and the first rotary gear 10, and faces the first rotary gear 10 therebetween. A pair of first racks 12 and second racks 14 arranged so as to be coupled with the pair of first fixing members 13 respectively coupled to the pair of first racks 12 and second racks 14, And a second fixing member 15 and driving means 20 for driving the first rotary gear 10.

Here, the support interval adjusting device is a pair of third rack which is interlocked with the second rotary gear 30, the second rotary gear 30 and disposed to face each other with the second rotary gear 30 therebetween ( 32), the fourth rack 34 and the third rack 32, the fourth rack 34 and a pair of third fixing member 33, the fourth fixing member 35 is further included, respectively, The first fixing member 13, the second fixing member 15, the third fixing member 33, and the fourth fixing member 35 are disposed cross each other.

The first rotary gear 10 is disposed in the center of the support interval adjusting device according to the present invention, the first rack 12 and the second rack 14 are mutually centered around the first rotary gear 10. Are arranged opposite.

The first rotary gear 10 is rotated by the power from the drive means 20 composed of, for example, a servo motor and a timing belt for transmitting power from the servo motor.

By the rotation of the first rotary gear 10 rotated by the drive means 20, the first rack 12 and the second rack 14 linked thereto are moved in opposite directions to each other.

That is, when the first rotary gear 10 is rotated in the clockwise direction, the first rack 12 is moved upward, the second rack 14 is moved downward, the first rotary gear ( When 10) is rotated counterclockwise, the first rack 12 is moved downward, and the second rack 14 is moved upward.

Thus, the first fixing member 13 coupled to the first rack 12 and the second rack 14 coupled to each other by the clockwise or counterclockwise rotation of the first rotary gear 10. 2 can adjust the gap between the fixing member (15).

Meanwhile, a second rotary gear 30 is disposed at the rear of the first rotary gear 10, and the third rack 32 and the fourth rack 34 are positioned around the second rotary gear 30. They are arranged opposite each other.

The second rotary gear 30 is also rotated by the power from the drive means 20, although in the present description, the second rotary gear 30 is the same drive means as the first rotary gear 10 ( Although described as being driven by 20, it can of course be driven by a separate drive means (not shown).

By the rotation of the second rotary gear 30 rotated by the drive means 20, the third rack 32 and the fourth rack 34 linked thereto are moved in opposite directions.

That is, when the second rotary gear 30 is rotated in the clockwise direction, the third rack 32 is moved upward, the fourth rack 34 is moved downward, the second rotary gear ( When 30 is rotated counterclockwise, the third rack 32 is moved downward, and the fourth rack 14 is moved upward.

Thus, the third fixing member 33 coupled to the third rack 32 and the fourth rack 34 coupled to each other by the clockwise or counterclockwise rotation of the second rotary gear 30. 4 It is possible to adjust the interval between the fixing member (35).

As described above, the second rotating gear 30 is disposed behind the first rotating gear 10 and the first fixing member 12 and the second fixing member 14 interlocked with the first rotating gear 10. And the third fixing member 33 and the fourth fixing member 35 which are interlocked with the second rotary gear 30 are arranged to cross each other with a predetermined height difference, thereby arranging four fixing members in a narrower space. It is possible to implement a support spacing device that can adjust the spacing between the four fixing members.

Here, the first rotary gear 10 and the second rotary gear 30 may be configured to include a gear tooth having the same module and pitch.

If the first rotary gear 10 and the second rotary gear 30 include gears of the same module and pitch, the first, second, and second moving gears are moved by a predetermined angle of rotation of the two rotary gears. The third, fourth racks 12, 14, 32, and 34 and the first, second, third, and fourth fixing members 13, 15, 33, 35 coupled thereto are identical.

Alternatively, the first rotary gear 10 and the second rotary gear 30 may be configured to include gear teeth having different modules and pitches.

In this case, the second rotary gear 30 is preferably configured to have a module and the pitch of 1.5 times or more and 3 times or less with respect to the module and the pitch of the first rotary gear 10. same.

That is, the third fixing member 33 is disposed at a lower position than the second fixing member 15, and the fourth fixing member 35 is disposed at a higher position than the first fixing member 13. .

The first fixing member 13 and the second fixing member 15 are closer or farther away from each other by the same distance from the center of the first rotary gear 10. In order to maintain a distance equal to or similar to the distance to the first fixing member 13 between the first fixing member 13 and the fourth fixing member 35, the module of the second rotary gear 30 This is because the pitch must be greater than the pitch of the module of the first rotary gear 10.

In this case, the distance between the first fixing member 13 and the second fixing member 15 and the first fixing member 13 or the second fixing member 13 based on the center height of the first rotary gear 10 as described above. In order to maintain the same or similar distance from the fixing member 15 to the fourth fixing member 35 or the third fixing member 33, the module and the pitch of the second rotating gear 30 are equal to the first rotating gear. It is preferable to be comprised in the range of 1.5-3 times with respect to the module and pitch of (10).

Meanwhile, the first and second rotary gears 10 and 30 are positioned at the center position between the first fixing member 13 and the second fixing member 15, that is, the center height of the first rotating gear 10. The fifth fixing member 40 which is not interlocked with the additionally disposed.

The fifth fixing member 40 is fixedly disposed at the center of the first, second, third, and fourth fixing members 13, 15, 33, and 35, and the first, second, third, and third fixing members 40 are fixed. A total of five fixing members are formed together with the four fixing members 13, 15, 33, and 35.

In addition, the support interval adjusting device according to the present invention further includes a position detecting sensor 50 for detecting the position of the first, second, third, fourth fixing member (13, 15, 33, 35). .

The position detecting sensor 50 is for detecting whether the fixing members 13, 15, 33, and 35 are disposed at a predetermined position. For example, the position detecting sensor 50 includes a photo sensor including a light emitting element and a light receiving element. However, the type of such sensor is not limited.

5 is an exploded perspective view showing a seating member 70 installed on the fixing members 13, 15, 33, 35, and 40, respectively, and FIG. 6 is a view illustrating a seating member in a support interval adjusting device according to the present invention. It is a perspective view which shows the state which installed and supported the wafer.

5 and 6, the seating member 70 includes a support member 72 coupled to the fixing members 13, 15, 33, and 35, and a mounting member 76 for mounting a wafer. And a coupling member 74 for coupling the mounting member 76 to the support member 72.

One side of the support member 72 is coupled to the fixing member, the other side of the support member 72 is coupled to the mounting member 76 and the coupling member 74.

Here, the mounting member 76 is to be aligned in a vertical direction in a state coupled to the support member 72, the four fixing members (13, 15, 33, 35) are cross-positioned with each other Therefore, one side 73 of the support member 72 coupled to the four fixing members 13, 15, 33, and 35 is biased in a left or right direction based on the center of the support member 72. have.

Although the seating member 70 is illustrated as a type capable of simply mounting the wafer in FIG. 5, the present invention is not limited thereto, and the seating member 70 may be configured to adsorb the wafer by vacuum.

The present invention has been made to solve the above problems, it is an object of the present invention to provide a support spacing device that can change the support spacing by a simple configuration.

Still another object of the present invention is to provide a support spacing adjusting device capable of adjusting the support spacing more precisely and accurately.

It is still another object of the present invention to provide a support gap adjusting device which has a compact configuration and can be widely used not only in the field of manufacturing semiconductor wafers but also in the manufacture of LCD panels.

Claims (8)

A first rotary gear; A pair of first and second racks interlocked with the first rotary gear and disposed to face each other with the first rotary gear therebetween; A pair of first and second fixing members coupled to the pair of first and second racks, respectively; A second rotary gear disposed behind the first rotary gear; A pair of third and fourth racks interlocked with the second rotary gears and disposed to face each other with the second rotary gears interposed therebetween; A pair of third and fourth fixing members coupled to the pair of third and fourth racks, respectively; Drive means for driving the first rotary gear; And the first and second fixing members and the third and fourth fixing members are arranged to cross each other. delete The method of claim 1, And said first rotary gear and said second rotary gear comprise gears of the same module and pitch. The method of claim 1, And the first rotary gear and the second rotary gear comprise gears of different modules and pitches. The method of claim 4, wherein And the second rotary gear includes a gear tooth having a module and a pitch of 1.5 times or more and 3 times or less with respect to the module and pitch of the first rotary gear gear. The method according to claim 3 or 4, And a fifth fixing member which is not interlocked with the first and second rotating gears is disposed at the center of the first, second, third and fourth fixing members. The method of claim 5, wherein And a position detecting sensor for detecting a position of the first, second, third and fourth fixing members. The method of claim 6, The first, second, third, fourth, and fifth fixing members are provided with first, second, third, fourth, and fifth mounting members for mounting the semiconductor wafer, respectively. Spacing device.

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