KR100879002B1 - Insulated wire comprising an insulating coating composition comprising polyamideimide and an insulating coating coated thereon - Google Patents
Insulated wire comprising an insulating coating composition comprising polyamideimide and an insulating coating coated thereon Download PDFInfo
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- KR100879002B1 KR100879002B1 KR1020060074108A KR20060074108A KR100879002B1 KR 100879002 B1 KR100879002 B1 KR 100879002B1 KR 1020060074108 A KR1020060074108 A KR 1020060074108A KR 20060074108 A KR20060074108 A KR 20060074108A KR 100879002 B1 KR100879002 B1 KR 100879002B1
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- 229920002312 polyamide-imide Polymers 0.000 title claims abstract description 89
- 239000004962 Polyamide-imide Substances 0.000 title claims abstract description 88
- 238000000576 coating method Methods 0.000 title claims abstract description 23
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- 239000000203 mixture Substances 0.000 claims description 7
- 239000000126 substance Substances 0.000 claims description 4
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- 125000003545 alkoxy group Chemical group 0.000 claims description 2
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- 125000000524 functional group Chemical group 0.000 claims description 2
- 125000005843 halogen group Chemical group 0.000 claims description 2
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- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 2
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- 150000003949 imides Chemical class 0.000 description 20
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- 230000015556 catabolic process Effects 0.000 description 5
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- 239000000654 additive Substances 0.000 description 3
- WKDNYTOXBCRNPV-UHFFFAOYSA-N bpda Chemical compound C1=C2C(=O)OC(=O)C2=CC(C=2C=C3C(=O)OC(C3=CC=2)=O)=C1 WKDNYTOXBCRNPV-UHFFFAOYSA-N 0.000 description 3
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- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 2
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- CZZYITDELCSZES-UHFFFAOYSA-N diphenylmethane Chemical compound C=1C=CC=CC=1CC1=CC=CC=C1 CZZYITDELCSZES-UHFFFAOYSA-N 0.000 description 2
- 239000000314 lubricant Substances 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- KDYFGRWQOYBRFD-UHFFFAOYSA-N succinic acid Chemical compound OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 2
- 239000002966 varnish Substances 0.000 description 2
- 239000008096 xylene Substances 0.000 description 2
- RTTZISZSHSCFRH-UHFFFAOYSA-N 1,3-bis(isocyanatomethyl)benzene Chemical compound O=C=NCC1=CC=CC(CN=C=O)=C1 RTTZISZSHSCFRH-UHFFFAOYSA-N 0.000 description 1
- OHLKMGYGBHFODF-UHFFFAOYSA-N 1,4-bis(isocyanatomethyl)benzene Chemical compound O=C=NCC1=CC=C(CN=C=O)C=C1 OHLKMGYGBHFODF-UHFFFAOYSA-N 0.000 description 1
- VLDPXPPHXDGHEW-UHFFFAOYSA-N 1-chloro-2-dichlorophosphoryloxybenzene Chemical compound ClC1=CC=CC=C1OP(Cl)(Cl)=O VLDPXPPHXDGHEW-UHFFFAOYSA-N 0.000 description 1
- QZWKEPYTBWZJJA-UHFFFAOYSA-N 3,3'-Dimethoxybenzidine-4,4'-diisocyanate Chemical compound C1=C(N=C=O)C(OC)=CC(C=2C=C(OC)C(N=C=O)=CC=2)=C1 QZWKEPYTBWZJJA-UHFFFAOYSA-N 0.000 description 1
- VQVIHDPBMFABCQ-UHFFFAOYSA-N 5-(1,3-dioxo-2-benzofuran-5-carbonyl)-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(C(C=2C=C3C(=O)OC(=O)C3=CC=2)=O)=C1 VQVIHDPBMFABCQ-UHFFFAOYSA-N 0.000 description 1
- JVERADGGGBYHNP-UHFFFAOYSA-N 5-phenylbenzene-1,2,3,4-tetracarboxylic acid Chemical compound OC(=O)C1=C(C(O)=O)C(C(=O)O)=CC(C=2C=CC=CC=2)=C1C(O)=O JVERADGGGBYHNP-UHFFFAOYSA-N 0.000 description 1
- UXVMQQNJUSDDNG-UHFFFAOYSA-L Calcium chloride Chemical compound [Cl-].[Cl-].[Ca+2] UXVMQQNJUSDDNG-UHFFFAOYSA-L 0.000 description 1
- KXDHJXZQYSOELW-UHFFFAOYSA-M Carbamate Chemical compound NC([O-])=O KXDHJXZQYSOELW-UHFFFAOYSA-M 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 101150046432 Tril gene Proteins 0.000 description 1
- 230000005856 abnormality Effects 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 150000008064 anhydrides Chemical class 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 239000004305 biphenyl Substances 0.000 description 1
- 235000010290 biphenyl Nutrition 0.000 description 1
- 125000006267 biphenyl group Chemical group 0.000 description 1
- 229910001628 calcium chloride Inorganic materials 0.000 description 1
- 239000001110 calcium chloride Substances 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 239000007806 chemical reaction intermediate Substances 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000001530 fumaric acid Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 229940057995 liquid paraffin Drugs 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 125000000962 organic group Chemical group 0.000 description 1
- 239000012188 paraffin wax Substances 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N phenylbenzene Natural products C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 1
- 239000002798 polar solvent Substances 0.000 description 1
- 229920003055 poly(ester-imide) Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000001294 propane Substances 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 239000012748 slip agent Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 239000001384 succinic acid Substances 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- 239000001993 wax Substances 0.000 description 1
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Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D179/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09D161/00 - C09D177/00
- C09D179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C09D179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B7/00—Insulated conductors or cables characterised by their form
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- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Insulated Conductors (AREA)
- Organic Insulating Materials (AREA)
- Paints Or Removers (AREA)
Abstract
본 발명은 폴리아미드이미드를 포함하는 절연 도료 조성물 및 이를 도포시킨 절연피막을 포함하는 절연전선으로서, 폴리아미드이미드로서 아마이드 결합:이미드 결합의 비율이 30:70~70:30몰%인 것을 사용함으로써, 폴리아미드이미드 내의 아미드기의 성분비를 조절함으로써 내마모 특성을 향상시킬 수 있으며, 가소성이 좋아 내가공 특성이 우수하다. The present invention relates to an insulated wire comprising an insulating coating composition comprising polyamideimide and an insulating coating coated thereon, wherein polyamideimide has an amide bond: imide bond ratio of 30:70 to 70:30 mol%. Thereby, abrasion resistance can be improved by adjusting the component ratio of the amide group in a polyamideimide, and it is excellent in plasticity and excellent in workability.
폴리아미드이미드*내마모성*가소성*절연전선 Polyamideimide * Abrasion Resistance * Plasticity * Insulated Wire
Description
도 1은 일반적인 폴리아미드이미드가 코팅된 피막의 가교밀도를 도식한 것이고,1 is a diagram illustrating the crosslinking density of a film coated with a general polyamideimide,
도 2는 다관능성 블록화된 이소시아네이트를 사용한 폴리아미드이미드가 코팅된 피막의 가교밀도를 도식한 것이다.2 is a diagram showing the crosslinking density of a polyamideimide coated film using a polyfunctional blocked isocyanate.
본 발명은 폴리아미드이미드를 포함하는 절연 도료 조성물 및 이를 도포시킨 절연피막을 포함하는 절연전선, 더욱 상세하게는 폴리아미드이미드계 도료를 도포시킨 절연 피막을 구성하는 절연도료로서, 폴리아미드이미드 내의 아미드와 이미드 성분비를 조절하여 아마이드이미드 수지를 강직구조로 변형하여 가소성이 뛰어나고, 손상되기 어려운 절연 피막을 형성하여, 내가공성이 뛰어난 폴리아마이드이미 드를 도포한 절연 피막을 포함하는 절연전선에 관한 것이다.The present invention provides an insulating coating composition comprising an insulating coating composition comprising a polyamideimide, and an insulating wire comprising an insulating coating coated thereon, and more particularly an insulating coating comprising a polyamideimide coating applied therein, the amide in the polyamideimide. It relates to an insulated wire comprising an insulating film coated with a polyamide imide excellent in plasticity by forming an insulating film that is excellent in plasticity and hardly damaged by modifying the amide-imide resin into a rigid structure by controlling the ratio of the imide component. .
종래에는 전기모터나 발전기(Alternator) 등의 산업용 기기 등에 사용되는 절연전선의 제조시 빠른 권취로 인한 와이어 절연피막의 손상을 없애기 위하여 와이어 코팅의 최종공정에 미끄럼성이 있는 권취유를 첨가하거나, 권취작업의 속도를 감소하여 불량을 최소화하였다. 그러나, 빠른 권취시의 와이어 손상 문제는 완벽하게 개선되기 어려우며, 권취유에 함유되어 있는 미끄럼성을 부여하는 슬립제들은 함침 바니시와의 접착성에 문제가 있어 업체에서 그 사용을 꺼리는 경우가 발생하였고, 작업속도 저하로 인한 생산비용의 증가를 없애기 위한 노력을 지속적으로 하여왔다. Conventionally, slippery winding oil is added to the final process of wire coating or wound in order to eliminate the damage of the wire insulation film due to rapid winding during the manufacture of insulated wire used in industrial equipment such as electric motors or alternators. The speed of work was reduced to minimize defects. However, the problem of wire damage at the time of fast winding is difficult to be completely improved, and slip agents that impart slipperiness contained in the winding oil have a problem in adhesiveness with the impregnated varnish, so that the company has been reluctant to use it. Efforts have been made to eliminate the increase in production costs due to the slow speed.
특히, 근래 들어서는 자동차 내부에 장착되는 모든 전기장치들이 복잡해지고 경량화, 소형화가 되어 지면서 그 작업성을 향상시키기 위한 노력들이 경주되어졌다.In particular, in recent years, as all the electric devices mounted inside the vehicle become more complicated, lighter and smaller, efforts have been made to improve its workability.
고마모성 폴리아마이드이미드 절연전선에 도포되는 절연피막의 조성은 내가공성 및 마모성을 동시에 만족시킬 수 있고, 이는 최근에 요구되어지는 전동모타 등의 소형화 경량화에 따른 친환경자동차 및 미래지향적 자동차의 주요부품으로의 응용이 가능하며, 그 사용범위가 자동차에 국한되지 않고 일상에 사용되어지는 모든 전동기기를 사용하는 가전제품이나 산업용품 등의 다양한 용도로의 응용가능성이 크다.The composition of the insulation coating applied to the high-abrasion polyamide imide insulated wire can satisfy the workability and abrasion at the same time, and this is the main component of the eco-friendly and future-oriented cars due to the miniaturization and lightweight of electric motors, which are recently required. Its application is possible, and its use range is not limited to automobiles, but it is highly applicable to various uses such as home appliances or industrial products using all electric devices used in daily life.
최근의 기술은 기기의 소형화, 경량화의 경향이 있어, 모터에 대해서도 보다 소형화, 경량화 되어지면서도 기능은 기존 제품에 비하여 월등히 우수한 고성능화 가 절실히 요구되어지고 있다. 이 요구를 만족시키기 위해서는 모터의 코어에 의해 많은 절연전선을 권선할 필요가 있지만, 기존의 일반 와이어로는 코어의 슬롯 내에 절연전선을 강인하게 감게 되어, 권선공정 중의 절연피막에 손상을 줄 위험성이 크다. 그리고, 절연피막에 손상이 생기면 레이어(Layer)-불량이나 아스 불량 등이 발생하여, 모터의 전기특성에 심각한 영향을 일으키는 문제가 있다.The recent technology tends to be smaller and lighter, and the motor is more compact and lighter in weight, but its performance is much higher than that of existing products. In order to satisfy this requirement, it is necessary to wind many insulated wires by the core of the motor, but the existing common wires strongly wrap the insulated wires in the slots of the core, and there is a danger of damaging the insulating film during the winding process. Big. In addition, when the insulation film is damaged, there is a problem that a layer defect or a defect is generated, which seriously affects the electrical characteristics of the motor.
통상, 폴리아미드이미드계의 도료의 도포, 소부에 의해 형성된 절연피막을 가지는 절연전선이 상기 용도에 사용되어지고 있다. Usually, the insulated wire which has the insulation film formed by application | coating and baking of polyamide-imide-type paint is used for the said use.
상기 폴리아마이드이미드는 일반적으로 이소시아네이트(Isocyanate;-NCO)와 산(Acid;-COOH) 성분 또는 산 무수물(Anhydride;-CO-O-CO-)의 반응으로 반응중간체인 카바메이트(Carbamate;-OC-O-OC-N-OC)를 거쳐 이산화탄소가 부가생성물로 발생되면서 아마이드(Amide;-NHCO-)와 이미드(Imide;-OC-N-CO-)결합이 형성된다. The polyamideimide is generally a reaction intermediate of carbamate (-OC) by isocyanate (-NCO) and an acid (Acid; -COOH) component or an anhydride (-CO-O-CO-). Carbon dioxide is generated as an adduct via -O-OC-N-OC, and an amide (-NHCO-) and imide (-OC-N-CO-) bond is formed.
최근에의 소형, 경량으로 성능이 좋은 모터가 요구되어 거기에 대응하고, 절연전선의 권선량이 한층 더 증대하는 경향이 있어, 폴리아미드이미드계의 절연피막에서도 손상을 일으키는 경우가 많아졌다. 이러한 절연피막의 손상을 조금이라도 감소시키기 위하여 일반적으로 유기 또는 무기윤활제 등의 첨가제를 도료에 배합해, 절연피막의 표면에 윤활성을 부여하는 것이 검토되고 있지만, 이 방법만으로는 절연피막의 손상을 근본적으로 해결할 수 없다.In recent years, small size, light weight, and good performance motors are required to cope with this, and the amount of windings of the insulated wire tends to increase further, and the polyamide-imide-based insulating film is often damaged. In order to reduce the damage of the insulating film even a little, in general, additives such as organic or inorganic lubricants are added to the paint to impart lubricity to the surface of the insulating film, but this method alone can fundamentally damage the insulating film. Can't solve it.
절연피막의 기계적 강도를 한층 더 향상시키면 절연피막이 손상되는 문제를 감소시킬 수 있지만, 단지 기계적 강도를 향상시키면 피막이 강직해 가소성에 뒤떨어지는 것이 되어 전선을 구부렸을 때에 갈라지거나 박리하기 쉬워지는 크 랙(Crack)이 발생하여, 절연전선의 가공성이 더욱 악화되는 문제가 있다. Increasing the mechanical strength of the insulating film further reduces the problem of damaging the insulating film.However, only by increasing the mechanical strength, the film becomes rigid and inferior to plasticity, making it easy to crack or peel off when the wire is bent. Crack) occurs, and the workability of the insulated wire is further deteriorated.
이에 본 발명자들은 상기와 같은 종래 폴리아미드이미드를 포함하는 절연 도료 조성물을 절연피막으로 도포시킨 절연전선에 있어서 발생되는 여러 가지 문제들을 해결하기 위하여 연구하던 중, 폴리아미드이미드 내에 아미드 성분과 이미드 성분의 함량비를 조절함으로써, 즉, 아미드 성분의 함량을 증가시킴으로써 내마모성이 향상될 뿐만 아니라, 가소성이 뛰어나 가공성이 개선된다는 사실을 알게 되어 본 발명에 도달하게 되었다.Accordingly, the present inventors have been studying to solve various problems occurring in the insulated wire in which the insulating coating composition including the conventional polyamideimide is coated with an insulating coating, and the amide component and the imide component in the polyamideimide By adjusting the content ratio of ie, that is, by increasing the content of the amide component, it was found that not only the wear resistance was improved, but also the plasticity was improved and the workability was improved.
따라서, 본 발명은 내마모성과 가소성이 우수하고, 쉽게 손상되지 않는 절연피막을 가져, 내가공성이 우수한 절연 도료 조성물을 제공하는 것을 그 목적으로 한다. Therefore, an object of the present invention is to provide an insulating coating composition which is excellent in wear resistance and plasticity and which is not easily damaged, and which is excellent in workability.
또한, 본 발명은 상기 절연 도료 조성물을 도포시킨 절연 피막을 포함하는 절연 전선을 제공하는 데도 그 목적이 있다.Moreover, an object of this invention is also to provide the insulated wire containing the insulating film which apply | coated the said insulating coating composition.
상기한 목적을 달성하기 위하여, 본 발명의 폴리아미드이미드 절연 도료 조성물은 전체 디이소시아네이트 성분 중 다음 화학식 1로 표시되는 방향족 디이소시아네이트 화합물 60~90몰%, 다음 화학식 2로 표시되는 트릴렌-디이소시아네이트(TDI) 10~40몰%, 전체 산 성분 중 다음 화학식 4로 표시되는 디카르복시산 10~30몰%, 산무수물 70~90몰% 및 관능기가 3개이상인 다관능 블록화 이소시아네이트를 제공한다. In order to achieve the above object, the polyamide-imide insulating coating composition of the present invention is 60 to 90 mol% of the aromatic diisocyanate compound represented by the following general formula (1) of the total diisocyanate component, triylene diisocyanate represented by the following general formula (2) (TDI) 10 to 40 mol%, 10 to 30 mol% of dicarboxylic acid, 70 to 90 mol% of acid anhydride and 3 or more functional groups of the total acid component is provided.
또한, 본 발명은 상기 절연 도료 조성물을 도포시킨 절연 피막을 포함하는 절연전선을 제공한다. Moreover, this invention provides the insulated wire containing the insulating film which apply | coated the said insulating coating composition.
이하, 본 발명을 더욱 상세하게 설명하면 다음과 같다. Hereinafter, the present invention will be described in more detail.
본 발명은 폴리아미드이미드를 포함하는 절연 도료 조성물과 이를 도포시켜 형성된 절연피막을 포함하는 절연전선에 관한 것이다.The present invention relates to an insulated wire comprising an insulating coating composition comprising polyamideimide and an insulating coating formed by applying the same.
본 발명의 절연 도료 조성물은 폴리아미드이미드를 주재료로 포함하는 것으로서, 여기에 용매 및 기타 도료 조성물에 통상 첨가되는 여러 가지 첨가제들을 포함한다. The insulating coating composition of the present invention contains polyamideimide as a main material, and includes various additives which are usually added to solvents and other coating compositions.
본 발명의 폴리아미드이미드는 통상적인 제조방법에 따르는 바, 구체적으로 디이소시아네이트 성분과 산 성분 또는 산 무수물의 반응에 의한다. 특별히 본 발명에서는 원하는 물성을 얻기 위하여 폴리아미드이미드 내의 아마이드 성분과 이미드 성분비를 조절하는 데 특징이 있다.The polyamideimide of the present invention is in accordance with a conventional production method, specifically by reaction of a diisocyanate component with an acid component or an acid anhydride. In particular, the present invention is characterized by adjusting the amide component and imide component ratio in the polyamideimide in order to obtain desired physical properties.
본 발명의 폴리아미드이미드의 제조시 사용되는 디이소시아네이트 성분은 다음 화학식 1로 표시되는 방향족 디이소시아네이트 화합물을 전체 디이소시아네이트 성분 중 10 내지 90몰%로 함유한다.The diisocyanate component used in the preparation of the polyamideimide of the present invention contains an aromatic diisocyanate compound represented by the following formula (1) in 10 to 90 mol% of the total diisocyanate component.
상기 식에서, R1과 R2는 서로 같거나 또는 다른 것으로서, 각각 수소원자, 알 킬기, 알콕시기 또는 할로겐 원자를 나타낸다.In the above formula, R 1 and R 2 are the same as or different from each other, and each represent a hydrogen atom, an alkyl group, an alkoxy group or a halogen atom.
상기 화학식 1로 표시되는 방향족 디이소시아네이트 화합물의 구체적인 예를 들면, 바이페닐-4,4'-디이소시아네이트, 바이페닐-3,3'-디이소시아네이트, 바이페닐-3,4'-디이소시아네이트, 3,3'-디메틸바이페닐-4,4'-디이소시아네이트, 3,3'-디에틸바이페닐-4,4'-디이소시아네이트, 2,2'-다이메틸바이페닐-4,4'-디이소시아네이트, 2,2'-다이에틸바이페닐-4,4'-디이소시아네이트, 3,3'-디메톡시바이페닐-4,4'-디이소시아네이트, 2,2'-디메톡시비페닐-4,4'-디이소시아네이트 등이 있으며, 이들을 단독으로 또는 2종 이상을 혼합하여 사용할 수 있다. Specific examples of the aromatic diisocyanate compound represented by Formula 1 include biphenyl-4,4'-diisocyanate, biphenyl-3,3'-diisocyanate, biphenyl-3,4'-diisocyanate, 3 , 3'-dimethylbiphenyl-4,4'-diisocyanate, 3,3'-diethylbiphenyl-4,4'-diisocyanate, 2,2'-dimethylbiphenyl-4,4'-di Isocyanate, 2,2'-diethylbiphenyl-4,4'-diisocyanate, 3,3'-dimethoxybiphenyl-4,4'-diisocyanate, 2,2'-dimethoxybiphenyl-4, 4'- diisocyanate etc., These can be used individually or in mixture of 2 or more types.
또한, 상기 방향족 디이소시아네이트 화합물과 혼용될 수 있는 다른 디이소시아네이트로는, 다이페닐메탄-4,4'-디이소시아네이트, 다이페닐메탄-3,3'-디이소시아네이트, 다이페닐메탄, 3,4'-디이소시아네이트, 다이페닐에테르-4,4'-디이소시아네이트, 벤조페논-4,4'-디이소시아네이트, 디페닐설폰-4,4'-디이소시아네이트, 트릴렌-2,4-디이소시아네이트, 트릴렌-2,6-디이소시아네이트, m-크실렌 디이소시아네이트, p-크실렌 디이소시아네이트, 나프탈렌-2,6-디이소시아네이트, 4,4'-[2,2-비스(vis)(4-페녹시페닐)프로판]디이소시아네이트, 테트라메틸렌-1,4-디이소시아네이트, 헥사메틸렌-1,6-디이소시아네이트 등이 있다. Further, other diisocyanates that can be mixed with the aromatic diisocyanate compound include diphenylmethane-4,4'-diisocyanate, diphenylmethane-3,3'-diisocyanate, diphenylmethane, 3,4 ' -Diisocyanate, diphenyl ether-4,4'- diisocyanate, benzophenone-4,4'- diisocyanate, diphenylsulfone-4,4'- diisocyanate, triylene-2,4-diisocyanate, tril Lene-2,6-diisocyanate, m-xylene diisocyanate, p-xylene diisocyanate, naphthalene-2,6-diisocyanate, 4,4 '-[2,2-bis (4-phenoxyphenyl ) Propane] diisocyanate, tetramethylene-1,4-diisocyanate, hexamethylene-1,6-diisocyanate, etc. are mentioned.
상기 화학식 1로 표시되는 방향족 디이소시아네이트 화합물의 비율은 전체 디이소시아네이트 성분 중 10 내지 90몰%의 범위로 포함되는 것이 바람직한 바, 10몰% 미만일 경우는 내마모 특성의 효과가 적고, 90몰%를 초과할 경우 사슬 내의 강직 구조의 함량이 너무 높아져 가소성이 저하되어 크랙 등의 문제가 있을 수 있다. The ratio of the aromatic diisocyanate compound represented by the formula (1) is preferably included in the range of 10 to 90 mol% of the total diisocyanate component, when less than 10 mol% has less effect of wear resistance properties, 90 mol% If exceeded, the content of the rigid structure in the chain is too high, the plasticity is lowered, there may be a problem such as cracks.
또한, 본 발명에서는 상기 방향족 디이소시아네이트 화합물 이외에 이소시아네이트 성분이 분자 중에 꺽인 구조를 가지는 메틸기를 가진 이소시아네이트를 사용하여 내마모성 및 가소성의 특성에 기인할 수가 있다. 대표적인 것으로서, 다음 화학식 2로 표시되는 트릴렌-디이소시아네이트(TDI)를 사용시 일반적으로 사용되는 디페닐메탄-4,4'―디이소시아네트(MDI)보다 분자길이가 짧아 강직구조를 갖기 때문에 내마모성을 향상시킬 수가 있으며, 두 개의 이소시아네이트가 벤젠고리에 꺽인 구조를 갖음으로써 가소성을 보완할 수 있다.In addition, in the present invention, the isocyanate component, in addition to the aromatic diisocyanate compound, may be due to the characteristics of wear resistance and plasticity using an isocyanate having a methyl group having a structure bent in the molecule. As a representative example, when the triylene-diisocyanate (TDI) represented by the following formula (2) is used, the molecular length is shorter than that of diphenylmethane-4,4'-diisocyanate (MDI), which is generally used, and thus has a rigid structure. It can be improved, and plasticity can be compensated by having a structure in which two isocyanates are bent in the benzene ring.
상기 꺾인 구조의 트릴렌-디이소시아네이트는 전체 디이소시아네이트 성분 중 10~40몰%의 범위 내에서 함유되는 것이 바람직하다. 10몰% 보다 적으면 그 효과를 기대하기 어렵고, 40몰%를 초과하면 강직구조가 증가되고 가소성이 뒤떨어져 갈라지거나 박리되어지기 쉬운 것이 되어버린다.It is preferable to contain the trilene diisocyanate of the said curved structure in 10 to 40 mol% of all the diisocyanate components. When less than 10 mol%, the effect is hard to expect, and when it exceeds 40 mol%, a rigid structure will increase and it will be inferior to plasticity, and will be easy to crack or peel off.
바람직하기로는, 상기 화학식 1로 표시되는 방향족 디이소시아네이트 화합물 60~90몰%와 분자 중에 꺽인 구조를 가진 이소시아네이트 화합물을 10~40몰%로 포함하는 디이소시아네이트 화합물을 사용하는 것이 바람직하다. Preferably, it is preferable to use the diisocyanate compound containing 60-90 mol% of aromatic diisocyanate compounds represented by the said Formula (1), and 10-40 mol% of isocyanate compounds which have a structure bent in a molecule | numerator.
또한, 본 발명의 디이소시아네이트 성분으로는 다음 화학식 3으로 표시되는 다관능성 이소시아네이트 화합물을 포함할 수 있다. In addition, the diisocyanate component of the present invention may include a polyfunctional isocyanate compound represented by the following formula (3).
상기 식에서, R은 방향족기를 함유한 유기기이다. Wherein R is an organic group containing an aromatic group.
상기 화학식 3으로 표시되는 다관능성 이소시아네이트 화합물의 구체적인 예를 들면 CT-Stable, Polymellic MDI 등이 있다. 다음 도 1과 2에서 확인할 수 있는 바와 같이, 일반적인 폴리아미드이미드로부터 도포된 피막의 가교밀도에 비해 상기와 같은 다관능성 이소시아네이트 화합물을 포함할 경우, 코팅시 가교밀도가 높아지는 것을 확인할 수 있으며, 이러한 가교 밀도의 향상으로 내열성이 저하되는 문제를 해결할 수 있다. 또한, 상기 다관능성 이소시아네이트 화합물을 사용할 경우 상온에서 혼합이 가능하여 가공성이 우수하다. Specific examples of the polyfunctional isocyanate compound represented by Formula 3 include CT-Stable, Polymellic MDI, and the like. As can be seen in Figures 1 and 2, when the polyfunctional isocyanate compound as described above compared to the crosslinking density of the coating film from a general polyamideimide, it can be seen that the crosslinking density increases during coating, such crosslinking It is possible to solve the problem of lowering heat resistance by improving the density. In addition, when the polyfunctional isocyanate compound is used, mixing is possible at room temperature, and thus excellent workability.
한편, 본 발명은 폴리아미드이미드 내의 아미드 결합과 이미드 결합성분의 함량비를 조절할 수 있는 바, 그 구성의 비율이 30:70~70:30몰% 사이의 범위 내에서 함유되는 것이 바람직하다. On the other hand, the present invention can adjust the content ratio of the amide bond and the imide bond component in the polyamideimide, it is preferable that the ratio of the composition is contained within the range between 30:70 ~ 70:30 mol%.
아미드 구조는 내마모성에 있어서 이미드 구조보다 현격하게 우수한 특성을 갖고 있어 일반적으로 아마이드 성분과 이미드의 성분비율 조성에 있어서 비율이 50:50으로 설계하는 것이 보통이다. 그러나, 분자구조 내 아미드기를 증가시킴으로서 내마모 특성을 향상시킬 수 있다. 이때 적용 비율은 아마이드 결합과 이미드 결합 조성에 있어서 30:70~70:30몰% 사이의 범위 이내에서 적용하는 것이 바람직하 다. 아미드 구조가 70몰%를 초과할 경우 열적 특성이 떨어지게 된다. 또한 이미드 구조가 70% 이상인 경우는 가소성이 떨어져 굴곡 등의 내가공 특성을 저해한다. 즉, 아미드구조와 이미드 구조를 수지구조상에 조합함으로서 아미드 구조의 내마모성, 내가공성 등의 물리적 특성과 이미드구조의 내연화 등의 열적특성을 적절히 조절할 수가 있다.The amide structure has significantly superior characteristics in the wear resistance than the imide structure. Generally, the ratio of the amide structure to the component ratio composition of the amide component and the imide is generally designed to be 50:50. However, the wear resistance can be improved by increasing the amide group in the molecular structure. In this case, the application ratio is 30:70 to 70:30 mol% in the amide bond and imide bond composition. It is desirable to apply within the range between. If the amide structure exceeds 70 mol%, the thermal properties will be degraded. In addition, when the imide structure is 70% or more, plasticity is lowered, which inhibits processing characteristics such as bending. That is, by combining the amide structure and the imide structure on the resin structure, physical properties such as abrasion resistance and porosity of the amide structure and thermal properties such as softening of the imide structure can be appropriately adjusted.
또한, 본 발명의 폴리아미드이미드의 제조시 산 성분 또는 산 무수물 성분으로는 특별히 다음 화학식 4로 표시되는 카르복실기가 2개인 디카르복실산이나 이무수물을 사용하는 것이 바람직한 바, 이는 디이소시아네이트와 동일 당량으로 반응하면서도, 아마이드의 성분비를 증가시킬 수 있기 때문이다. 이러한 디카르복실산의 예를 들면, 테레프탈산, 이소프탈산, 아디핀산, 푸마릭산, 세바식산, 및 숙신산으로 이루어진 그룹으로부터 선택된 것이다. 폴리아미드이미드 구조 내에 아미드기가 많아짐으로서 마모성의 효과를 증대시킬 수 있다.In the preparation of the polyamideimide of the present invention, it is preferable to use dicarboxylic acid or dianhydride having two carboxyl groups represented by the following general formula (4) as the acid component or acid anhydride component, which is equivalent to diisocyanate. This is because it can increase the component ratio of the amide while reacting with. Examples of such dicarboxylic acids are from the group consisting of terephthalic acid, isophthalic acid, adipic acid, fumaric acid, sebacic acid, and succinic acid. It is selected. By increasing the number of amide groups in the polyamideimide structure, the abrasion effect can be increased.
상기 식에서, A는 탄소수 2 내지 12 의 탄화수소이다. Where A is a C2-C12 hydrocarbon.
상기와 같이 양 말단에 산을 포함한 산 성분의 사용에 따른 내열성 저하문제는 상기 다관능성 블록화된 이소시아네이트를 사용함으로써 해결할 수 있다. As described above, the problem of lowering the heat resistance according to the use of an acid component including an acid at both ends can be solved by using the polyfunctional blocked isocyanate.
또한, 상기와 같은 디카르복실산은 카르복실기가 A(예를 들면, 벤젠 고리)를 기준으로 파라(para)의 위치에 치환되어 있지만, 본 발명의 절연피막의 가소성을 향상시키기 위한 일환으로서, 상기 카르복실기가 올쏘(ortho) 또는 메타(meta)의 위치에 치환되어 있는 디카르복실산을 사용하는 것도 가능하다. 이러한 디카르복실산 화합물은 분자구조상에 꺽어지는 구조를 가지는 산을 원료로서의 산성분 중에 상기 산 성분을 함유시켜 폴리아미드이미드의 구조중에 상기 산 성분에 기인한 굴곡부분이 생겨 절선피막의 가소성이 향상된다. In addition, although the carboxylic group is substituted at the position of para with respect to A (for example, a benzene ring), such dicarboxylic acid is a part for improving the plasticity of the insulating film of this invention. It is also possible to use dicarboxylic acids in which is substituted at the ortho or meta position. The dicarboxylic acid compound contains an acid having a structure that is bent on a molecular structure, and the acid component is contained in an acid component as a raw material, thereby forming a bent portion due to the acid component in the polyamideimide structure, thereby improving plasticity of the cutting film. do.
또한 본 발명의 산 무수물로는 TMA(Trimellitic anhydride)과 같은 산 무수물 및 PMDA(Pyromellitic anhydride), BTDA(3.3',4.4'-Benzophenone tetracarboxylic dianhydride), BPDA(3.3',4.4'-Biphenyl tetracarboxylic acid dianhydride)와 같은 이무수물을 사용하는 바, 아마이드결합과 이미드결합의 함량(몰%)을 효과적으로 조절하기 위해서 이무수물을 사용하는 것이 바람직하다. Acid anhydrides of the present invention also include acid anhydrides such as trimellitic anhydride (TMA) and pyromellitic anhydride (PMDA), BTDA (3.3 ', 4.4'-Benzophenone tetracarboxylic dianhydride), BPDA (3.3', 4.4'-Biphenyl tetracarboxylic acid dianhydride) When using an dianhydride such as, it is preferable to use a dianhydride in order to effectively control the content (mol%) of the amide bond and the imide bond.
또한, 폴리아미드이미드의 제조시에는 상기 디이소시아네이트 성분과 산 성분 또는 산 무수물을 적당한 유기용매 중에서 공중합시켜, 종래의 폴리아미드이미드계 도료와 같은 제조방법을 채용하는 것이 가능하다. 상기 유기용매로는, 특별히 한정되지는 않지만, N-메틸-2-피롤리돈, N,N-디메틸 포름아마이드, 자이렌 등의 극성 용매를 사용하는 것이 바람직하다. In the production of the polyamideimide, it is possible to copolymerize the diisocyanate component with an acid component or an acid anhydride in a suitable organic solvent and employ a production method similar to a conventional polyamideimide paint. Although it does not specifically limit as said organic solvent, It is preferable to use polar solvents, such as N-methyl- 2-pyrrolidone, N, N- dimethyl formamide, and xylene.
상기와 같은 조성을 이용하여 방향족 디이소시아네이트 화합물을 배합한 디이소시아네이트 성분을 산 성분 또는 산 무수물과 적당한 유기용매 중에서 0~180℃의 온도로 1~24시간 반응시키면 디이소시아네이트 성분과 산 성분 또는 산 무수물과의 공중합체로 폴리아미드이미드가 유기용매 중에 용해 또는 분산된 폴리아미드이미드 절연 도료 조성물을 얻을 수 있다. When the diisocyanate component blended with the aromatic diisocyanate compound using the above composition is reacted for 1 to 24 hours in an acid component or an acid anhydride and a suitable organic solvent at a temperature of 0 to 180 ° C., the diisocyanate component and the acid component or acid anhydride The polyamide-imide insulating coating composition obtained by dissolving or dispersing polyamideimide in an organic solvent can be obtained.
본 발명의 상기 폴리아미드이미드는 전체 절연 도료 조성물 중 10 내지 100 중량%로 포함되지만, 이에 한정되는 것은 아니다. The polyamideimide of the present invention is included in 10 to 100% by weight of the total insulating coating composition, but is not limited thereto.
이러한 절연 도료 조성물은 통상의 도료 조성물에 포함되는 용제, 유·무기물 및 기타 여타의 첨가제를 포함할 수 있음은 물론이다 Such an insulating coating composition may of course include solvents, organic and inorganic substances and other additives contained in conventional coating compositions.
한편, 본 발명은 상기 폴리아미드이미드를 포함하는 절연 도료 조성물을 전선의 표면에 도포시킨 절연피막을 포함하는 절연전선을 포함한다. On the other hand, the present invention includes an insulated wire comprising an insulating coating obtained by applying the insulating coating composition containing the polyamideimide to the surface of the electric wire.
본 발명의 절연전선은, 상기 폴리아미드이미드계 도료를 전선의 표면에 도포시킨 다음, 용제를 소부시켜 절연피막이 형성됨으로써 제조된다. The insulated wire of this invention is manufactured by apply | coating the said polyamide-imide coating material to the surface of an electric wire, and baking an solvent and forming an insulating film.
상기 전선의 표면에 도포되는 절연피막의 두께에 대해서는 본 발명에서는 특정하게 한정되지 않고, 사용되는 절연전선의 용도에 따라 변경 가능하다. The thickness of the insulating coating applied to the surface of the electric wire is not particularly limited in the present invention, and may be changed depending on the use of the insulating wire used.
절연피막의 기재(Base)에는 해당 절연피막 및 전선과의 밀착성의 좋은 재료로부터 된 기재층을 마련할 수도 있다. 이러한 기재층(일차 코팅층: 밀착바니시)으로는, 폴리우레탄계, 폴리에스테르계, 폴리에스테르이미드계, 폴리에스테르아미드이미드계, 폴리아미드이미드계, 폴리이미드계등 종래 알려져 있는 여러 가지의 절연도료의 도포, 소부에 의해 형성되는 절연막을 들 수 있다. 그 중에서 전선이나 절연피막과의 내열성, 혹은 피막의 기계적 강도 등의 관점으로부터 디페닐메탄메탄-4ㅇ4'-디이소시아네이트와 트리멜리트산무수물을 포함한 폴리아미드이미드계도료의 도포, 소부에 의해 형성되는 Base층이 양호하다.The base material of an insulating film can also be provided with the base material layer from the favorable material of adhesiveness with this insulating film and an electric wire. As such a base material layer (primary coating layer: adhesion varnish), application of various conventionally known insulating paints such as polyurethane, polyester, polyesterimide, polyesteramideimide, polyamideimide, and polyimide And an insulating film formed by baking. Among them, the polyamideimide-based coatings containing diphenylmethane methane-4-4'-diisocyanate and trimellitic anhydride are applied and baked from the viewpoints of heat resistance with the wires and the insulating coating, or mechanical strength of the coating. Base layer is good.
절연피막의 상층에는, 절연피막의 표면에 윤활성을 부여하기 위하여, 표면윤활층을 갖는 것도 좋다. 표면윤활층으로서는, 유동 파라핀, 고형 파라핀 등의 파라 핀류를 사용할 수 있지만, 내구성 등을 고려하면, 각종 왁스, 폴리에틸렌, 불소 수지, 실리콘 수지 등의 윤활제를 바인더수지에 적용시킨 표면윤활층이 보다 바람직하다.In order to provide lubricity to the surface of an insulating film, the upper layer of an insulating film may have a surface lubricating layer. As the surface lubricating layer, paraffins such as liquid paraffin and solid paraffin can be used. However, in view of durability, a surface lubricating layer obtained by applying various lubricants such as wax, polyethylene, fluorine resin and silicone resin to the binder resin is more preferable. Do.
이하 본 발명을 실시예에 의거하여 더욱 상세하게 설명하면 다음과 같은 바, 본 발명이 이에 한정되는 것은 아니다.Hereinafter, the present invention will be described in more detail with reference to the following Examples, but the present invention is not limited thereto.
실시예 1Example 1
온도계, 냉각관, 염화칼슘 충전관, 교반기, 질소투입관을 구비한 플라스크에 매분 150ml의 질소가스를 흘리면서 96.06g(0.5몰)의 트리멜리트산무수물(이하, TMA라고 한다)과 87.25g(0.4몰)의 피로메리트산2무수물(이하, PMDA라고 한다) 그리고16.61g(0.1몰)의 테레프탈산(이하, TPA라 한다)을 먼저 투입하여 전체 산성분 중96.06 g (0.5 mole) of trimellitic anhydride (hereinafter referred to as TMA) and 87.25 g (0.4 mole) flowing 150 ml of nitrogen gas per minute into a flask equipped with a thermometer, a cooling tube, a calcium chloride filling tube, a stirrer and a nitrogen injection tube. Pyromellitic dianhydride (hereinafter referred to as PMDA) and 16.61 g (0.1 mol) of terephthalic acid (hereinafter referred to as TPA)
TMA:PMDA:TPA의 비율이 50:40:10몰%이 되게 하였다. 그리고 이소시아네이트로서, 221.66g(0.9몰)의 3,3'―디메틸바이페닐-4,4'-디이소시아네이트(이하, TODI라고 한다)와 트릴렌-디이소시아네이트(이하, TDI 라고 한다.) 17.42g(0.1몰)를 투입하였다. 상기 TODI의 전 디이소시아네이트중에 차지하는 비율은 90몰% 이다.The ratio of TMA: PMDA: TPA was 50:40:10 mol%. And 221.66 g (0.9 mol) of 3,3'-dimethylbiphenyl-4,4'-diisocyanate (hereinafter referred to as TODI) and triylene-diisocyanate (hereinafter referred to as TDI) as the isocyanate. (0.1 mol) was added. The ratio of all the diisocyanates in the TODI is 90 mol%.
다음에, 상기 플라스크에 637g의 N-메틸-2-피로리돈을 넣어 교반기로 교반하면서 85℃로 2시간 동안 가열 승온하고, 3시간동안 유지한 뒤 130℃로 1시간 동안 온도 상승한 후, 점도를 관찰하였다. 그리고 1시간 경과한 단계에서 가열을 멈추고 N-메틸-2-피롤리돈, 자이렌, N,N-디메틸포름아마이드 용제를 순서대로 투입 교반하 고 냉각하여, 23%의 폴리아미드이미드계 도료를 얻었다. 얻어진 폴리아미드이미드 내의 아미드 성분:이미드 성분의 함량비는 35:65몰%였다. 이의 폴리아미드이미드계 도료를 직경 1.0mm의 동선 표면에, 통상의 조건에 따라 도포, 소부해, 피막두께 35㎛의 절연 피막을 가지는 절연전선을 제작하였다.Next, 637 g of N-methyl-2-pyrrolidone was added to the flask and heated to 85 ° C. for 2 hours while stirring with a stirrer, held for 3 hours, and then heated to 130 ° C. for 1 hour, and then the viscosity was increased. Observed. After 1 hour, the heating was stopped, and N-methyl-2-pyrrolidone, xylene, and N, N-dimethylformamide solvents were sequentially added and stirred, followed by cooling to obtain 23% of polyamideimide paint. Got it. The content ratio of the amide component: imide component in the obtained polyamideimide was 35:65 mol%. This polyamide-imide paint was applied and baked on a copper wire surface having a diameter of 1.0 mm in accordance with ordinary conditions to produce an insulated wire having an insulating film having a thickness of 35 µm.
실시예 2Example 2
PMDA 대신에 비페닐테트라카르복실산2무수물(이하, BTDA 라고 한다) 128.90g(0.4몰)을 투입하여 전체 산성분 중 TMA, BTDA와 TPA의 비율을 50:40:10몰%로 한 것 이외는, 상기 실시예 1과 동일한 방법에 따라 폴리아미드이미드계 도료를 얻었다. 얻어진 폴리아미드이미드 내의 아미드 성분:이미드 성분의 함량비는 35:65몰%였다. 또한, 이러한 폴리아미드이미드계 도료를 이용하여 상기 실시예 1과 동일한 방법으로 절연전선을 제작하였다.128.90 g (0.4 mole) of biphenyltetracarboxylic dianhydride (hereinafter referred to as BTDA) was added instead of PMDA to make 50:40:10 mole% of TMA, BTDA and TPA in the total acid component. Obtained the polyamide-imide paint according to the same method as in Example 1. The content ratio of the amide component: imide component in the obtained polyamideimide was 35:65 mol%. In addition, an insulated wire was produced in the same manner as in Example 1 using the polyamide-imide paint.
실시예 3Example 3
PMDA 대신에 벤조페논테트라카르복실산2무수물(이하, BPDA 라고 한다) 117.69g(0.4몰)을 투입하여 전체 산성분 중 TMA, BPDA와 TPA의 비율을 50:40:10몰%로 한 것 이외는, 상기 실시예 1과 동일한 방법에 따라 폴리아미드이미드계 도료를 얻었다. 얻어진 폴리아미드이미드 내의 아미드 성분:이미드 성분의 함량비는 35:65몰%였다. 또한, 이러한 폴리아미드이미드계 도료를 이용하여 상기 실시예 1과 동일한 방법으로 절연전선을 제작하였다.117.69 g (0.4 mol) of benzophenone tetracarboxylic dianhydride (hereinafter referred to as BPDA) was added instead of PMDA, and the ratio of TMA, BPDA and TPA in the total acid components was 50:40:10 mol%. Obtained the polyamide-imide paint according to the same method as in Example 1. The content ratio of the amide component: imide component in the obtained polyamideimide was 35:65 mol%. In addition, an insulated wire was produced in the same manner as in Example 1 using the polyamide-imide paint.
실시예 4Example 4
이소프탈산(이하, IPA 라고 한다)과 TMA만을 사용하여 IPA 66.46g(0.4몰)을 투입하여 TMA와 IPA의 비율을 60:40몰%로 한 것 이외는, 상기 실시예 1과 동일한 방법에 따라 폴리아미드이미드계 도료를 얻었다. 얻어진 폴리아미드이미드 내의 아미드 성분:이미드 성분의 함량비는 70:30몰%였다. 또한, 이러한 폴리아미드이미드계 도료를 이용하여 상기 실시예 1과 동일한 방법으로 절연전선을 제작하였다.According to the same method as in Example 1, except that 66.46 g (0.4 mol) of IPA was added using only isophthalic acid (hereinafter referred to as IPA) and TMA to make the ratio of TMA and IPA 60:40 mol%. Polyamide-imide paint was obtained. The content ratio of the amide component: imide component in the obtained polyamideimide was 70:30 mol%. In addition, an insulated wire was produced in the same manner as in Example 1 using the polyamide-imide paint.
실시예 5Example 5
TPA를 66.46g(0.4몰)을 투입하여 TMA와 TPA의 비율을 60:40몰%로 한 것 이외는, 상기 실시예 1과 동일한 방법에 따라 폴리아미드이미드계 도료를 얻었다. 얻어진 폴리아미드이미드 내의 아미드 성분:이미드 성분의 함량비는 70:30몰%였다. 또한, 이러한 폴리아미드이미드계 도료를 이용하여 상기 실시예 1과 동일한 방법으로 절연전선을 제작하였다.66.46 g (0.4 mol) of TPA was added, and the polyamide-imide coating material was obtained by the same method as Example 1 except having changed the ratio of TMA and TPA into 60:40 mol%. The content ratio of the amide component: imide component in the obtained polyamideimide was 70:30 mol%. In addition, an insulated wire was produced in the same manner as in Example 1 using the polyamide-imide paint.
실시예 6Example 6
실시예 1에서, TODI 와 TDI의 투입량을 TODI=185.00g(0.7몰), TDI=52.25g(0.3몰)로 변화시켜, 전체 이소시아네이트 중에 차지하는 TODI의 비율을 70몰%로 하고, TMA=172.91g(0.90몰), TPA= 16.61(0.1몰)을 사용한 것 이외는, 상기 실시예 1과 동일한 방법으로 폴리아미드이미드계 도료를 얻었다. 얻어진 폴리아미 드이미드 내의 아미드 성분:이미드 성분의 함량비는 55:45몰%이였다. 또한, 이러한 폴리아미드이미드계 도료를 이용하여 상기 실시예 1과 동일한 방법으로 절연전선을 제작하였다. In Example 1, the doses of TODI and TDI were changed to TODI = 185.00 g (0.7 mol) and TDI = 52.25 g (0.3 mol), so that the ratio of TODI in the total isocyanate was 70 mol%, and TMA = 172.91 g. Polyamide-imide paint was obtained in the same manner as in Example 1 except that (0.90 mol) and TPA = 16.61 (0.1 mol) were used. The content ratio of the amide component: imide component in the obtained polyamidimide was 55:45 mol%. In addition, an insulated wire was produced in the same manner as in Example 1 using the polyamide-imide paint.
실시예 7Example 7
TODI=132.15g(0.5몰), TDI=87.08g(0.5몰)로 하여, 전체 이소시아네이트 중에 차지하는 TODI의 비율을 50몰%로 한 것 이외는, 상기 실시예 6과 동일한 방법으로 폴리아미드이미드계 도료를 얻었다. 얻어진 폴리아미드이미드 내의 아미드 성분:이미드 성분의 함량비는 55:45몰%이였다. 또한, 이러한 폴리아미드이미드계 도료를 이용하여 상기 실시예 1과 동일한 방법으로 절연전선을 제작하였다.Polyamideimide-based paint in the same manner as in Example 6 except that TODI = 1.15 g (0.5 mol) and TDI = 87.08 g (0.5 mol), and the ratio of TODI in the total isocyanate was 50 mol%. Got. The content ratio of the amide component: imide component in the obtained polyamideimide was 55:45 mol%. In addition, an insulated wire was produced in the same manner as in Example 1 using the polyamide-imide paint.
실시예 8Example 8
실시예 1에서, 172.91g(0.9몰)의 TMA, 16.61g(0.1몰)의 TPA를 사용하는 것을 제외하고는, 상기 실시예 1과 동일한 방법에 따라 폴리아미드이미드계 도료를 얻었다. 얻어진 폴리아미드이미드 내의 아미드 성분:이미드 성분의 함량비는 55:45몰%였다. 또한, 이러한 폴리아미드이미드계 도료를 이용하여 상기 실시예 1과 동일한 방법으로 절연전선을 제작하였다.In Example 1, a polyamide-imide paint was obtained in the same manner as in Example 1, except that 172.91 g (0.9 mol) of TMA and 16.61 g (0.1 mol) of TPA were used. The content ratio of the amide component: imide component in the obtained polyamideimide was 55:45 mol%. In addition, an insulated wire was produced in the same manner as in Example 1 using the polyamide-imide paint.
실시예 9Example 9
실시예 1에서, 182.51g(0.95몰)의 TMA, 8.31g(0.05몰)의 TPA를 사용하는 것 을 제외하고는, 상기 실시예 1과 동일한 방법에 따라 폴리아미드이미드계 도료를 얻었다. 얻어진 폴리아미드이미드 내의 아미드 성분:이미드 성분의 함량비는 52.5:47.5몰%였다. 또한, 이러한 폴리아미드이미드계 도료를 이용하여 상기 실시예 1과 동일한 방법으로 절연전선을 제작하였다.In Example 1, except that 182.51 g (0.95 mole) of TMA and 8.31 g (0.05 mole) of TPA were used, the polyamide-imide paint was obtained in the same manner as in Example 1. The content ratio of the amide component: imide component in the obtained polyamideimide was 52.5: 47.5 mol%. In addition, an insulated wire was produced in the same manner as in Example 1 using the polyamide-imide paint.
실시예 10Example 10
실시예 1에서, 144.09g(0.75몰)의 TMA, 41.54g(0.25몰)의 TPA를 사용하는 것을 제외하고는, 상기 실시예 6과 동일한 방법에 따라 폴리아미드이미드계 도료를 얻었다. 얻어진 폴리아미드이미드 내의 아미드 성분:이미드 성분의 함량비는 62.5:37.5몰%였다. 또한, 이러한 폴리아미드이미드계 도료를 이용하여 상기 실시예 1과 동일한 방법으로 절연전선을 제작하였다.In Example 1, a polyamide-imide paint was obtained in the same manner as in Example 6, except that 144.09 g (0.75 mol) of TMA and 41.54 g (0.25 mol) of TPA were used. The content ratio of the amide component: imide component in the obtained polyamideimide was 62.5: 37.5 mol%. In addition, an insulated wire was produced in the same manner as in Example 1 using the polyamide-imide paint.
실시예 11Example 11
실시예 1에서, 172.91g(0.9몰)의 TMA, 16.61g(0.1몰)의 TPA를 사용하고 158.57g(0.6몰)의 TODI, 69.66g(0.4몰)의 TDI를 사용하는 제외하고는, 상기 실시예 1과 동일한 방법에 따라 폴리아미드이미드계 도료를 얻었다. 얻어진 폴리아미드이미드 내의 아미드 성분:이미드 성분의 함량비는 55:45몰%였다. 또한, 이러한 폴리아미드이미드계 도료를 이용하여 상기 실시예 1과 동일한 방법으로 절연전선을 제작하였다.In Example 1, except for using 172.91 g (0.9 mole) of TMA, 16.61 g (0.1 mole) of TPA and 158.57 g (0.6 mole) of TODI, 69.66 g (0.4 mole) of TDI, A polyamide-imide paint was obtained in the same manner as in Example 1. The content ratio of the amide component: imide component in the obtained polyamideimide was 55:45 mol%. In addition, an insulated wire was produced in the same manner as in Example 1 using the polyamide-imide paint.
실시예 12Example 12
실시예 11에서 얻어진 절연도료에 다관능성 이소시아네이트(CT-STABLE)를 SOLID의 5%를 첨가하는 것을 제외하고 실시예 1과 동일한 방법으로 절연전선을 제작하였다. An insulated wire was prepared in the same manner as in Example 1 except that polyfunctional isocyanate (CT-STABLE) was added 5% of SOLID to the insulating paint obtained in Example 11.
비교예 1Comparative Example 1
폴리아미드이미드계 도료 제조시에 합성원료로써 TODI와 TMA만을 사용하여 264.29g(1.0몰)의 TODI, 192.12g(1.0몰)의 TMA를 사용한 것 이외는 상기 실시예 1과 동일한 방법으로 폴리아미드이미드계 도료를 얻었다. 얻어진 폴리아미드이미드 내의 아미드 성분:이미드 성분의 함량비는 50:50 몰%였다. 또한, 이러한 폴리아미드이미드계 도료를 이용하여 상기 실시예 1과 동일한 방법으로 절연전선을 제작하였다.Polyamideimide was prepared in the same manner as in Example 1, except that 264.29 g (1.0 mole) of TODI and 192.12 g (1.0 mole) of TMA were used using only TODI and TMA as synthetic raw materials when preparing a polyamide-imide paint. System paint was obtained. The content ratio of the amide component: imide component in the obtained polyamideimide was 50:50 mol%. In addition, an insulated wire was produced in the same manner as in Example 1 using the polyamide-imide paint.
비교예 2Comparative Example 2
폴리아미드이미드계 도료 제조시에 합성원료로써 MDI와 TMA만을 사용하여 250.26g(1.0몰)의 MDI, 192.12g(1.0몰)의 TMA를 사용한 것 이외는 상기 실시예 1과 동일한 방법으로 폴리아미드이미드계 도료를 얻었다. 얻어진 폴리아미드이미드 내의 아미드 성분:이미드 성분의 함량비는 50:50 몰%였다. 또한, 이러한 폴리아미드이미드계 도료를 이용하여 상기 실시예 1과 동일한 방법으로 절연전선을 제작하였다.Polyamideimide was prepared in the same manner as in Example 1, except that 250.26 g (1.0 mole) of MDI and 192.12 g (1.0 mole) of TMA were used using only MDI and TMA as synthetic raw materials when preparing a polyamide-imide paint. System paint was obtained. The content ratio of the amide component: imide component in the obtained polyamideimide was 50:50 mol%. In addition, an insulated wire was produced in the same manner as in Example 1 using the polyamide-imide paint.
비교예 3Comparative Example 3
폴리아미드이미드계 도료 제조시에 합성원료로써 TODI와 TDI, TMA만을 사용하여 79.29g(0.3몰)의 TODI, 121.91g(0.7몰)의 TDI, 192.12g(1.0몰)의 TMA를 사용한 것 이외는 상기 실시예 1과 동일한 방법으로 폴리아미드이미드계 도료를 얻었다. 얻어진 폴리아미드이미드 내의 아미드 성분:이미드 성분의 함량비는 50:50 몰%였다. 또한, 이러한 폴리아미드이미드계 도료를 이용하여 상기 실시예 1과 동일한 방법으로 절연전선을 제작하였다.Use only TODI, TDI, and TMA as synthetic raw materials when manufacturing polyamide-imide paint A polyamide-imide paint was obtained in the same manner as in Example 1, except that 79.29 g (0.3 mol) of TODI, 121.91 g (0.7 mol) of TDI, and 192.12 g (1.0 mol) of TMA were used. The content ratio of the amide component: imide component in the obtained polyamideimide was 50:50 mol%. In addition, an insulated wire was produced in the same manner as in Example 1 using the polyamide-imide paint.
상기 실시예와 비교예에 따라 제조된 절연전선에 대하여 다음과 같은 물성시험을 실시하였으며, 그 결과를 다음 표 1에 나타내었다. The following physical properties were tested for the insulated wires prepared according to the above Examples and Comparative Examples, and the results are shown in Table 1 below.
- 외관평가 : 각 절연 전선의 외관을 육안으로 관찰하였다.-Appearance evaluation: The appearance of each insulated wire was visually observed.
- 절연파괴전압 : 절연파괴 측정은 KS C 3006, 11에 의거하여 측정하였다. 전압은 약 500V/s의 비율로 될 수 있는 대로 같은 속도로 상승시켜 파괴전압치를 측정한다. 다만, 5초이내에 파괴될 경우에는 승압의 속도를 낮추어 5초 이상에서 파괴되도록 측정한다. -Insulation breakdown voltage: Insulation breakdown was measured according to KS C 3006,11. The voltage rises at the same rate as possible at a rate of approximately 500 V / s and the breakdown voltage value is measured. However, if it is destroyed within 5 seconds, lower the speed of the boost and measure it to be destroyed more than 5 seconds.
본 실험에서는 두줄꼬임법으로 실험을 실시하며, 방법은 다음과 같다. 동일한 보빈으로부터 길이 약 50cm의 시험편 3개를 취하여 그의 각각을 두 개로 접엇 합치고, 와이어의 끝단에 KS 규격에 정해진 인장력을 가하면서 약 12cm 길이의 부분을 KS 규격에 정해진 꼬임수로 꼰 후 인장력을 제거하고서 접은 부분을 자르고 60Hz의 정현파에 가까운 교류전압을 가한다. 또한 이 실험에서 사용되는 변압기의 용량은 500VA이상으로 한다.In this experiment, the experiment is conducted by the two-line twisting method, and the method is as follows. Take three test pieces of about 50cm in length from the same bobbin, fold each of them in two pieces, apply a tensile force specified in KS standard to the ends of the wire, twist the part of length about 12cm with the twist number specified in KS standard, and remove the tensile force. Cut off the fold and apply AC voltage close to sine wave of 60Hz. In addition, the capacity of the transformer used in this experiment is 500VA or more.
- 가소성 시험 : 각 절연전선에, 직경 1.0mm 로부터 1mm씩 단계적으로 직경이 커지는 복수의 환봉에 차례차례 전선을 환봉의 외형에 대응시켜 굽혔을 때의, 절연피막의 분열이나 박리를 관찰해, 절연 피막에 이상을 볼 수 있는 최소의 환봉의 직경 d(mm)를 기록했다.-Plasticity test: For each insulated wire, observe the breakdown or peeling of the insulation film when the wire is bent in order to correspond to the outer shape of the round rod, in order to plural round bars that increase in diameter step by step from 1.0mm in diameter to 1mm. The diameter d (mm) of the minimum round bar which an abnormality is seen in the film was recorded.
- 일방향식 내마모 시험 : 각 절연전선에 직교시킨 피아노선을 겹쳐서 피아노선에 여러 가지의 무게의 하중을 걸친 상태로 측정하는 일방향식 내마모 시험에서 절연피막이 손상하는 하중을 기록했다.-One-way wear test: The load damaged by the insulation film was recorded in the one-way wear test in which the piano wires orthogonal to each insulated wire were superimposed and the piano wires were loaded with various weights.
- 내연화성 시험 : 각 절연전선에 KS C 3006에 준하여 교차법으로 수행하였으며, 시험은 각각 도체 사이 또는 도체와 강구 사이에 60㎐의 정현파에 가까운 교류전압 100V를 가하고 그 상태에서 약 2℃/min의 비율로 온도를 상승시켜 단락하는 온도를 시료에 가장 가까운 부분에 열전대를 고정하고 측정한다. 그때의 단락전류는 5~20㎃로 한다.-Test for softening resistance: Each insulated wire was carried out by the cross method in accordance with KS C 3006.The test was applied with an AC voltage of 100 V close to 60 sine wave between the conductors or between the conductors and the steel balls, respectively. The thermocouple is fixed to the part closest to the sample by measuring the temperature by raising the temperature at the ratio of. The short circuit current at that time is 5-20 mA.
이상에서 상세히 설명한 바와 같이, 폴리아미드이미드를 도포시킨 절연피막을 포함하는 절연전선에서, 아미드 성분과 이미드 성분비를 조절시킨 폴리아마이드이미드 수지를 강직구조로 변형하여 가소성이 뛰어나고, 손상되기 어려운 절연 피막을 형성하여, 내가공성이 뛰어난 폴리아마이드이미드를 도포한 절연 피막을 포함하는 절연전선에 관한 것이다.As described in detail above, in an insulated wire including an insulated coating coated with polyamideimide, the polyamideimide resin in which the amide component and the imide component ratio is controlled is deformed into a rigid structure to have excellent plasticity and hard to be damaged. The present invention relates to an insulated wire comprising an insulating film coated with polyamideimide having excellent porosity.
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| KR100195431B1 (en) * | 1991-11-22 | 1999-06-15 | 구라우 ㅣ 조리따까 | Insulated wire |
| KR20030050837A (en) * | 2001-12-19 | 2003-06-25 | 엘지전선 주식회사 | Polyamideimide polymer for enamel copper wire covering and enamel copper wire manufacturing method |
| KR20040111183A (en) * | 2003-06-19 | 2004-12-31 | 가부시키가이샤 도요다 지도숏키 | Coating composition for use in sliding members |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| KR100195431B1 (en) * | 1991-11-22 | 1999-06-15 | 구라우 ㅣ 조리따까 | Insulated wire |
| KR20030050837A (en) * | 2001-12-19 | 2003-06-25 | 엘지전선 주식회사 | Polyamideimide polymer for enamel copper wire covering and enamel copper wire manufacturing method |
| KR20040111183A (en) * | 2003-06-19 | 2004-12-31 | 가부시키가이샤 도요다 지도숏키 | Coating composition for use in sliding members |
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