KR100895694B1 - Heat pipe type heat sink - Google Patents

Abstract

There is disclosed a heat pipe type heat dissipating device having a structure capable of securing a heat dissipating area without being restricted by the size of a heat source and capable of radiating noiseless or low noise.

The disclosed heat pipe type heat dissipating device includes a heat absorbing pipe portion disposed adjacent to a heat source and a heat radiating pipe portion for discharging the heat transferred from the heat absorbing pipe portion communicated to the outside, And a plurality of unit heat pipe loops to be injected, wherein the plurality of unit heat pipe loops are radially disposed adjacent to each other with respect to the heat source.

Description

[0001] Heat pipe type dissipating device [0002]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat dissipating device, and more particularly, to a heat pipe type heat dissipating device.

Electronic components such as a central processing unit (CPU), a video card chipset, a power transistor, a light-emitting diode (LED) Generates heat during operation. If the electronic component is overheated, an operation error may be caused or damaged, and a heat dissipating device for preventing overheating is indispensably required.

Generally, the heat dissipating device dissipates heat generated from a heat source such as the above-described electronic component to the outside, thereby preventing the heat source from being overheated.

As one example of the heat dissipating device applied to the above-described electronic component, a heat sink type heat dissipating device has been conventionally known.

This heat sink type heat dissipating device includes a heat absorbing portion and a heat dissipating portion. The heat absorbing portion is disposed adjacent to the heat source and absorbs the heat emitted from the heat source through the heat conduction. The heat dissipating part is formed of a heat dissipating fin integrally formed with the heat absorbing part and discharging the heat absorbed by heat exchange to the outside.

The heat dissipating efficiency of the heat sink type heat dissipating device is determined according to the distance between the heat absorbing portion and the heat dissipating portion, the heat dissipating area of the heat dissipating fin, and the thermal conductivity of the material.

In the meantime, it is practically difficult to keep the surface area of the heat dissipating fin wide in a situation where the size of the heat sink must be gradually reduced in accordance with the trend of integration and miniaturization of electronic components. Further, even if the surface area of the heat radiating fin is widened, the distance between the heat absorbing portion and the heat radiating portion is increased, so that there is a limit in improving the heat radiating efficiency.

The conventional heat dissipating device further includes a heat-dissipating fan that is rotated at a high speed. Accordingly, power consumption for driving the heat radiating fan is accompanied, and noise is generated when the heat radiating fan is driven.

In addition, the above conventional heat dissipating device has a limitation in that the thickness of the heat dissipating fin is reduced in view of securing the structural stability and the thermal conductivity, which is disadvantageous in that the manufacturing cost is high.

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems, and it is an object of the present invention to provide a heat pipe type heat exchange structure that can increase the heat radiation efficiency and secure the heat radiation area without restriction on the distance between the heat absorption part and the heat radiation part, And to provide a heat pipe type heat dissipating device that can dissipate heat with low noise and can secure a high structural stability with a small thickness.

In order to achieve the above object, a heat pipe type heat dissipating device according to the present invention includes a heat absorbing pipe portion disposed adjacent to a heat source, and a heat radiating pipe portion communicating with the heat absorbing pipe portion and discharging heat transmitted from the heat absorbing pipe portion And a plurality of vibrating tubular unit heat pipe loops into which the working fluid is injected into the heat absorbing pipe portion and the heat radiating pipe portion, wherein the plurality of unit heat pipe loops are radially disposed adjacent to each other with respect to the heat generating source , And the whole is communicated so as to form one loop.

Here, the unit heat pipe loops are communicated with each other to form one closed loop. The present invention may further include an auxiliary heat pipe loop disposed between the neighboring unit heat pipe loops to assist heat dissipation.

In addition, the present invention may further include a heat dissipating member coupled to the plurality of unit heat pipe loops. Here, the heat dissipating member may include a guide portion for guiding the flow of the discharged heat.

Further, the present invention provides a heat exchanger comprising: a mount provided adjacent to the heat source and provided with a plurality of radially adjacent unit heat pipe loops; And a holder coupled to the mount with the plurality of unit heat pipe loops interposed therebetween.

Further, the present invention may further include a heat radiating fan installed adjacent to the heat radiating pipe portion.

Each of the unit heat pipe loops includes a first pipe member and a second pipe member each having both ends, and one end of the first pipe member is coupled to one end of the second pipe member do. Here, the other end of the first pipe member may be coupled to the other end of the second pipe member of the neighboring unit pipe loop.

Further, any one of the ends of the first and second pipe members that are mutually coupled can be expanded, and the ends of the first and second pipe members that are mutually coupled can be coupled by soldering.

Since the heat pipe type heat dissipating device according to the present invention configured as described above uses heat pipes having excellent heat radiation efficiency, various sizes and shapes can be designed according to the space around the heat sources.

In addition, since the heat pipe has a hollow tube-like tubular structure, the thickness of the heat pipe is thinner than that of the conventional heat dissipation fin, and the rigidity can be maintained. Therefore, the heat dissipating device according to the present invention has a small amount of raw material consumption as compared with the conventional heat dissipating device, and thus has a material saving effect.

Further, the heat pipe type heat dissipater according to the present invention can radiate heat in all directions by adopting a heat pipe arranged in a radial structure with respect to a heat source, so that heat radiation efficiency can be improved without noise. Further, even when the heat radiating fan is further included, high heat radiation efficiency can be ensured with low noise.

In addition, since the first and second pipe members separated from each other are joined to each other in forming the unit heat pipe loop, productivity of the heat dissipating device can be improved.

Hereinafter, a heat pipe type heat dissipating device according to a preferred embodiment of the present invention will be described in detail with reference to the accompanying drawings. In describing different embodiments, the same or similar components may be omitted as necessary.

FIG. 1 is an exploded perspective view illustrating a heat pipe type heat dissipating device according to a first embodiment of the present invention. FIG. 2 is a perspective view illustrating a unit heat pipe loop and an auxiliary heat pipe of the heat pipe type heat dissipating device according to the first embodiment of the present invention. FIG. 3 is a plan view showing the unit heat pipe loop and the auxiliary heat pipe of FIG. 2. FIG.

Referring to the drawings, a heat pipe type heat sink according to the first embodiment of the present invention includes a plurality of unit heat pipe loops 20 disposed radially adjacent to each other. That is, each of the unit heat pipe loops 20 is arranged radially adjacent to the heat source (1 in FIG. 1). Therefore, the heat generated from the heat source 1 can be radiated radially and omnidirectionally, and the heat radiation efficiency can be increased.

The size and shape of the heat pipe type heat dissipating device are determined depending on the type and shape of the heat generating source 1, for example, It can be diversified.

As shown in FIG. 3, each unit heat pipe loop 20 includes a heat absorbing pipe portion 21 and a heat radiating pipe portion 23. A working fluid 15 is injected into the heat absorbing pipe portion 21 and the heat radiating pipe portion 23 together with the bubbles 13 as shown in FIG. The heat absorbing pipe portion 21 is disposed adjacent to the heat generating source 1 and absorbs heat generated from the heat generating source 1. The heat radiating pipe section 23 communicates with the outside of the radial structure from the heat absorbing pipe section 21 and discharges heat transferred from the heat absorbing pipe section 21. The unit heat pipe loops 20 Is preferably made of a metal material such as copper or aluminum with high thermal conductivity. This is to allow the unit heat pipe loop 20 to rapidly receive the heat generated from the heat source 1 and quickly cause a change in the volume of the bubbles injected into the unit heat pipe loop 20.

Each of the unit heat pipe loops 20 has an open loop shape and can be communicated with or separated from the adjacent unit heat pipe loops 20. That is, all or a part of the plurality of unit heat pipe loops 20 can communicate with the neighboring unit heat pipe loops 20. [

A plurality of unit heat pipe loops, all of which are in communication with each other, can have an open-loop or closed-loop shape as a whole as the design requires. In the case of an open loop, both ends of the unit heat pipe loop 20 are sealed.

Further, the plurality of unit heat pipe loops 20 are divided into two or more groups independently performing heat radiation functions, and a plurality of unit heat pipe loops 20 belonging to each group are structured to communicate with each other It is also possible.

Further, between the neighboring unit heat pipe loops 20, an auxiliary heat pipe loop 25 disposed apart from the heat source 1 may be disposed. FIG. 2 shows an example in which three auxiliary heat pipe loops 25 of different lengths are disposed between neighboring unit heat pipe loops 2. The auxiliary heat pipe loop 25 enhances the heat radiation efficiency by assisting the heat dissipation between the unit heat pipe loops 20. The number and length of the auxiliary heat pipe loops 25 can be variously modified as required by design. Here, the heat pipe type heat dissipating device is preferably a heat dissipating device using a vibrating tube heat pipe. Hereinafter, the basic operation principle of the heat dissipating device using the vibrating tubular heat pipe will be described.

As shown in FIG. 2, the vibrating tubular heat pipe has a structure in which a working fluid 15 is injected into the tubules 11 such that the bubbles 13 are generated at a predetermined ratio, and then the inside of the tubules 11 is sealed from the outside Structure. This heat pipe has a heat transfer mechanism for mass-transferring the heat into the latent heat form by volume expansion and condensation of the bubble 13 and the working fluid 15. [

In the basic principle, in the heat absorbing pipe portion 21, nucleate boiling occurs as much as the absorbed heat quantity, and the bubbles located in the heat absorbing pipe portion 21 are expanded in volume. At this time, since the tubules (11) maintain a constant internal volume, the bubbles located in the heat-radiating pipe portion (23) contract as the bubbles located in the heat-absorbing pipe portion (21) expand. As a result, the tubular-shaped heat pipe is accompanied by the flow including the vibrations of the working fluid 15 and the bubbles 13, and the temperature of the bubbles 13 due to the volume change of the bubbles 13 And performs heat dissipation function by performing latent heat transportation by ascending and descending.

This vibrating tubular heat pipe is easy to manufacture because it does not include a wick unlike a general heat pipe. In addition, since there is no restriction on the installation direction, there is an advantage that the restriction on the installation is less than that of the thermosyphon type heat pipe having a structure in which the heat radiation portion must be positioned below the heat absorption portion. In addition, since the heat transfer type is different from that of the heat sink type heat dissipating device, the size limit can be diversified according to the type and shape of the heat source since the size restriction due to the structural limitations of the heat pipe itself is not received.

Referring to FIG. 1, the heat pipe type heat sink according to the present embodiment may further include a mount 40 and a holder 50 for installing a plurality of unit heat pipe loops 20. The mount 40 has an upper surface formed with an installation groove 41 into which the unit heat pipe loop 20 is inserted. Therefore, by providing the unit heat pipe loop 20 in alignment with the installation groove 41, the heat dissipating device can be coupled while maintaining the overall shape. The heat source 1 may be coupled to the bottom surface of the mount 40.

The holder 50 is coupled to the mount 40 through the plurality of unit heat pipe loops 20 to support the unit heat pipe loop 20 and the unit heat pipe loops 20 Is fitted into the engaging groove 51. [0050] As shown in Fig. Therefore, by providing the unit heat pipe loop 20 in alignment with the mounting groove 41 of the mount 40 and the coupling groove 51 of the holder 50, a plurality of unit heat pipe loops 20 So that it can be firmly installed while maintaining the shape.

The auxiliary heat pipe loop 25 may also be coupled to the mount 40 and the holder 50 when the auxiliary heat pipe loop 25 is disposed between neighboring unit heat pipe loops 20. [

Referring to FIG. 4, the mount 140 according to the modification has a cylindrical structure, and an installation groove 141 in which the unit heat pipe loop 20 is inserted is formed on the outer circumferential surface. In this case, the heat source 1 'may be coupled to the upper surface or the lower surface of the mount 140. 4, the heat pipe type heat dissipating device differs from the unit heat pipe type heat dissipating device of FIG. 1 in the shape of the heat dissipating device and the shape of the heat generating source 1 '. That is, the shape of the mount can be variously changed depending on the shape of the heat dissipating device, the type and shape of the heat source. The auxiliary heat pipe loop 25 may be coupled to the mount 140 when the auxiliary heat pipe loop 25 is disposed between neighboring unit heat pipe loops 20.

FIG. 5 is a partial front view showing a main part of a heat pipe type heat radiation device according to a second embodiment of the present invention, and FIG. 6 is a sectional view taken along a line VI-VI in FIG.

Referring to FIGS. 5 and 6, the heat pipe type heat sink according to the second embodiment of the present invention further includes a heat dissipating member 30 coupled to the unit heat pipe loop 20 to assist heat dissipation. The heat dissipating member 30 may have a groove 31 into which the unit heat pipe loop 20 is inserted. The unit heat pipe loop 20 and the heat radiating member 30 may be combined in various known ways. The radiation member (30) may include a guide portion (35). The guide portion 35 is formed on one or both surfaces of the heat dissipating member 30 to extend the heat dissipating area of the heat dissipating member 30 and guide the flow of the heat dissipated. 7 shows the structure in which the guide portion 35 protrudes from the upper surface of the heat dissipating member 30. In this case, the flow of heat transmitted along the surface of the heat dissipating member 30 is indicated by arrow B It is possible to change the direction of the top surface of the heat dissipating member 30 as well. Accordingly, the heat radiation direction can be determined to be suitable for the arrangement structure of the apparatus to which the heat radiation apparatus according to the present invention is applied. Although not shown, the heat radiating member 30 may be installed between the unit heat pipe loops 20 as needed, and may also be installed in the auxiliary heat pipe loop 25. [

7 is an exploded perspective view showing a main part of a heat pipe type heat dissipating device according to a third embodiment of the present invention.

Referring to the drawings, each of the plurality of unit heat pipe loops 120 includes first and second pipe members 121 and 125. The first pipe member 121 has a structure in which the first pipe member 121 is bent to have open both end portions, that is, first and second end portions 121a and 121b.

The second pipe member 125 has both open end portions, that is, third and fourth end portions 125a and 125b, and is similarly bent. The second pipe member 125 is engaged with the first pipe member 121 to form an open loop.

More specifically, the first end 121a of the first pipe member 121 is coupled to the third end 125a of the second pipe member 125 of the same unit heat pipe loop 120, The second end portion 121b of the pipe member 121 is engaged with the fourth end portion 125b of the second pipe member 125 of the adjacent unit heat pipe loop 120 adjacent thereto.

Here, when the coupling between the first end portion 121a and the third end portion 125a and the coupling between the second end portion 121b and the fourth end portion 125b, the inner space of the unit heat pipe loop 20 The end portion of the first pipe member 121 is expanded through a blowing process or the like to such an extent that the end portion of the second pipe member 125 is fitted, ).

An adhesive member 129 may be attached to the outer circumference of the end of the second pipe member 125. The adhesive member may be, for example, a solder ring. Therefore, by joining opposite end portions of the first and second pipe members 121 and 125 by soldering, one unit heat pipe loop is formed.

8 and 9, according to the heat dissipating device of the fourth embodiment of the present invention, the heat radiating member 130 is coupled to at least one of the first pipe member 121 and the second pipe member 125 . That is, the heat dissipating member 130 includes a first heat dissipating member 131 coupled to the first pipe member 121 and a second support member 135 coupled to the second pipe member 125 .

Each of the first and second support members 131 and 135 has grooves 131a and 135a into which the first and second pipe members 121 and 125 are inserted. The first and second support members 131 and 135 may include a guide portion 137 that extends the heat dissipation area and guides the flow of heat.

By configuring the unit heat pipe loop 120 as described with reference to Figures 7-9, the process can be automated and productivity can be increased. Referring to FIG. 10, the heat pipe type heat dissipating device according to the fourth embodiment of the present invention may further include a heat dissipating fan 60. The heat dissipation fan 60 is disposed adjacent to the heat dissipation pipe portion 23 to promote diffusion of heat radiated from the heat dissipation pipe portion 23, thereby improving the heat radiation efficiency. The heat dissipation fan 60 is rotationally driven in a state of decelerating the rotational speed as compared with the conventional heat dissipating apparatus of the heat sink type. This is to reduce noise generated during rotation of the heat dissipating fan 60 and to reduce power consumption.

The above-described embodiments are merely illustrative, and various modifications and equivalent other embodiments are possible without departing from the scope of the present invention. Accordingly, the true scope of protection of the present invention should be determined by the technical idea of the invention described in the following claims.

1 is a perspective view showing a heat pipe type heat dissipating device according to a first embodiment of the present invention;

2 is a partial perspective view showing a unit heat pipe loop and an auxiliary heat pipe loop of a heat pipe type heat sink according to a first embodiment of the present invention;

Figure 3 is a plan view of the unit heat pipe loop and auxiliary heat pipe loop of Figure 2 of the present invention.

FIG. 4 is an exploded perspective view showing a heat pipe type heat dissipating device according to a first embodiment of the present invention including a mount according to a modification; FIG.

FIG. 5 is a partial front view showing a main part of a heat pipe type heat sink according to a second embodiment of the present invention; FIG.

6 is a sectional view taken along a line VI-VI in Fig. 5;

FIG. 7 is a partially exploded perspective view showing a unit heat pipe loop structure of a heat pipe type heat sink according to a third embodiment of the present invention; FIG.

8 is an exploded perspective view showing an example in which the first support member is coupled to the first pipe member in Fig.

9 is an exploded perspective view showing an example in which the second support member is coupled to the second pipe member in Fig.

10 is a perspective view showing a heat pipe type heat dissipating device according to a fourth embodiment of the present invention.

Description of the Related Art [0002]

1, 1 ': heat source 13: bubble

15: working fluid 20, 120: unit pipe loop

21: heat absorbing pipe portion 23: heat radiating pipe portion

25: auxiliary heat pipe loop 30, 130: heat dissipating member

31, 131a, 135a: grooves 35, 137:

40, 140: mount 50: holder

60: heat dissipating fan 121: first pipe member

125: second pipe member 131: first support member

135: second supporting member

Claims (12)

A heat absorbing pipe portion disposed adjacent to the heat source; and a heat radiating pipe portion communicating with the heat absorbing pipe portion and discharging heat transferred from the heat absorbing pipe portion, wherein a plurality of the working fluid is injected into the heat absorbing pipe portion and the heat radiating pipe portion A vibrating tubular unit comprising a heat pipe loop, Wherein the plurality of unit heat pipe loops are radially disposed adjacent to each other with respect to the heat source and are communicated with each other to form one loop. The method according to claim 1, Wherein the unit heat pipe loops communicate with each other to form one closed loop. 3. The method of claim 2, Further comprising an auxiliary heat pipe loop disposed between the neighboring unit heat pipe loops to assist heat dissipation. The method of claim 3, The heat pipe type heat dissipation apparatus according to claim 1, further comprising a heat dissipation member coupled to the plurality of unit heat pipe loops. 5. The method of claim 4, The heat- And a guide portion for guiding the flow of the discharged heat. 6. The method according to any one of claims 1 to 5, Further comprising a mount provided adjacent to the heat source and provided with a plurality of radially adjacent unit heat pipe loops. The method according to claim 6, Further comprising: a holder coupled to the mount with the plurality of unit heat pipe loops interposed therebetween. 8. The method of claim 7, The heat pipe type heat dissipating apparatus according to claim 1, further comprising a heat dissipating fan disposed adjacent to the heat dissipating pipe section. 6. The method according to any one of claims 1 to 5, Wherein each unit heat pipe loop includes: A first pipe member and a second pipe member each having first and second end portions, And a first end of the first pipe member is coupled to a first end of the second pipe member. 10. The method of claim 9, And the second end of the first pipe member is coupled to the second end of the second pipe member of the neighboring unit heat pipe loop. 11. The method of claim 10, Wherein one of the ends of the first and second pipe members that are mutually coupled is expanded. 12. The method of claim 11, And the end portions of the first and second pipe members which are mutually coupled are coupled by soldering.

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