KR100914891B1 - Solid electrolytic condenser and method for manufacturing the same - Google Patents

Abstract

The present invention simplifies the structure and process of the solid electrolytic capacitors, thereby reducing the manufacturing cost of the solid electrolytic capacitors, miniaturizing them, maximizing the capacitance, and implementing low ESR (Equivalent Series Resistance) characteristics to improve stability and reliability. It is to improve.

To this end, the present invention, a capacitor having a polarity of the anode; An anode wire inserted into and connected to a lower portion of the capacitor element; A cathode lead layer formed on a surface of the capacitor element; A conductive bump formed on a surface of the cathode lead layer; An anode lead frame provided on the lower side of the capacitor element to be electrically insulated from the cathode lead layer, and having an insertion portion into which the protruding lower portion of the anode wire is inserted; A cathode lead frame provided to be electrically insulated from the cathode lead layer on the other side of the lower portion of the capacitor element; A molding part formed to surround the condenser element, the molding part being configured to expose a bottom surface of the anode wire, an end portion of the conductive bump, a bottom surface of the anode lead frame, and a bottom surface of the cathode lead frame; A cathode lead terminal provided in the molding part to be electrically connected to an exposed bottom surface of the anode wire and a bottom surface of the anode lead frame; And a cathode lead terminal provided in the molding part to be electrically connected to the exposed end of the conductive bump and the lower surface of the anode lead frame.

Description

Solid electrolytic condenser and method for manufacturing the same

The present invention relates to a solid electrolytic capacitor, and more particularly, it is possible to reduce the manufacturing cost by simplifying the structure and the process, to realize the miniaturization and to maximize the capacitance, and low ESR (Equivalent Series Resistance) characteristics The present invention relates to a solid electrolytic capacitor and a method for manufacturing the same, which may improve stability and reliability by implementing the same.

In general, solid electrolytic capacitors are electronic components used for the purpose of blocking DC current and passing alternating current in addition to the function of accumulating electricity, and the most representative tantalum capacitors among these solid electrolytic capacitors use rated voltage as well as general industrial equipment. It is used in low-range application circuits, and is especially used for noise reduction in circuits or portable communication devices where frequency characteristics are problematic.

As shown in FIGS. 1 and 2, the solid electrolytic capacitor 10 includes a capacitor element 11 and a printed circuit board (PCB) made of a dielectric powder that determines the capacitance and characteristics of the capacitor. Epoxy and anode lead frames 13 and 14 connected to the condenser element 11 so as to be easily mounted on the condenser element 11 and an epoxy to protect the condenser element 11 from an external environment and to form a condenser element. It is composed of an epoxy case 15 molded into.

At this time, the condenser element 11 has a rod-shaped anode wire 12 protruding to a predetermined length on one side.

In addition, the anode wire 12 is provided with a pressure surface 12a having a flat outer surface to increase the contact ratio with the anode lead frame 13 and to prevent left and right shake during welding.

Here, in the process of manufacturing the condenser element 11, the dielectric powder is formed into a rectangular parallelepiped in the press process and sintered, a dielectric oxide film is formed on the outer surface during the chemical conversion process, and then impregnated with an aqueous manganese nitrate solution. The outer surface is formed by thermal decomposition of a manganese dioxide layer of solid electrolyte.

The process of connecting the positive and negative lead frames 13 and 14 to the condenser element 11 manufactured as described above includes a rod-shaped positive electrode wire 12 protruding to one side of the condenser element 11 at a predetermined length. Welding the plate-shaped positive electrode lead frame 13 to the pressure-sensitive surface 12a of the plate) to draw the positive electrode terminal, and the conductive adhesive applied to the outer surface of the capacitor element 11 or the negative electrode lead frame 14 Withdrawal of the negative electrode terminal through a medium.

In addition, the capacitor element 11 electrically connected to the anode and cathode lead frames 13 and 14, respectively, is molded with an epoxy in an exterior process to form an epoxy case 15, and then subjected to other subsequent assembly processes. Complete with electrolytic capacitor

However, the conventional solid electrolytic capacitor as described above has the following problems.

In the conventional solid electrolytic capacitor, high temperature heat is generated in the process of directly welding the anode wire 12 and the anode lead frame 13, and the generated heat is transferred to the capacitor element 11 through the anode wire 12. There was a problem of damaging the condenser element 11 susceptible to heat.

As such, the dielectric is destroyed by the thermal shock applied to the condenser element 11, and thus, there is a problem in that the manufacturing cost increases because product degradation and defects occur.

In addition, the conventional solid electrolytic capacitor is relatively condenser element 11 in the same epoxy case 15 because the space occupied by the anode lead frame 13 and the cathode lead frame in the epoxy case 15 forming the overall appearance. There is a problem that the capacitance is reduced because the size of the) can only be formed small.

Accordingly, the present invention has been made to solve the above disadvantages and problems according to the prior art, the object of the present invention is to simplify the structure and the process to reduce the manufacturing cost, to realize the miniaturization and to increase the capacitance The present invention provides a solid electrolytic capacitor capable of maximizing and improving stability and reliability by implementing low equivalent series resistance (ESR) characteristics and a method of manufacturing the same.

According to one embodiment of the present invention for achieving the above object, a condenser element having a polarity of an anode; An anode wire inserted into and connected to a lower portion of the capacitor element; A cathode lead layer formed on a surface of the capacitor element; A conductive bump formed on a surface of the cathode lead layer; An anode lead frame provided on the lower side of the capacitor element to be electrically insulated from the cathode lead layer, and having an insertion portion into which the protruding lower portion of the anode wire is inserted; A cathode lead frame provided to be electrically insulated from the cathode lead layer on the other side of the lower portion of the capacitor element; A molding part formed to surround the condenser element, the molding part being configured to expose a bottom surface of the anode wire, an end portion of the conductive bump, a bottom surface of the anode lead frame, and a bottom surface of the cathode lead frame; A cathode lead terminal provided in the molding part to be electrically connected to an exposed bottom surface of the anode wire and a bottom surface of the anode lead frame; And a cathode lead terminal provided on the molding part to be electrically connected to the exposed end of the conductive bump and the lower surface of the anode lead frame.

Preferably, the positive lead frame and the negative lead frame are bonded to the capacitor element through an insulating adhesive.

The anode lead frame and the cathode lead frame may be formed of a conductive material.

The insertion part of the positive lead frame may be formed in the shape of a hole or in the form of a groove opened toward the negative lead frame.

The cathode lead layer may include a dielectric oxide film layer, a solid electrolyte layer, and a cathode reinforcement layer sequentially formed on the surface of the capacitor device.

The conductive bumps are formed of silver (Ag), copper (Cu), zinc (Zn), tin (Sn) -based metal materials, and a plurality of dots are dispensed on the surface of the negative electrode extraction layer. It may be provided in the form.

In this case, the conductive bumps are formed of an ink or paste containing silver (Ag), copper (Cu), zinc (Zn), tin (Sn) -based metal materials, and inkjet on the surface of the negative electrode extraction layer. May be provided in a manner.

The positive electrode lead terminal and the negative electrode lead terminal may be formed of a plating layer formed by an electroless plating method.

The plating layer preferably comprises an inner plating layer formed of electroless nickel phosphorus (Ni / P) plating, and an outer plating layer formed of copper (Cu) or tin (Sn) plating on the inner plating layer.

The anode wire may be located at the center of the condenser element.

On the other hand, according to another aspect of the present invention for achieving the above object, (a) forming a capacitor element having a polarity of the anode; (b) inserting an anode wire into the lower portion of the capacitor element; (c) forming a cathode withdrawing layer on the surface of the capacitor element; (d) forming a conductive bump on the surface of the cathode lead layer; (e) a positive lead frame is inserted into the protruding lower part of the positive electrode wire to an insertion part of the positive lead frame and electrically insulated from the negative lead drawing layer on a lower side of the condenser element; Providing a negative lead frame on the other side to be electrically insulated from the negative lead drawing layer; (f) forming a molding part to surround the capacitor element; (g) exposing a bottom surface of the anode wire, a bottom surface of the anode lead frame and a bottom surface of the conductive bump and the cathode lead frame; And (h) forming a cathode lead terminal electrically connected to a lower surface of the anode wire and a lower surface of the anode lead frame, and a cathode lead terminal electrically connected to the conductive bump and a cathode surface of the cathode lead frame. There is provided a method of manufacturing a solid electrolytic capacitor comprising the step of forming.

The manufacturing method of the solid electrolytic capacitor may be performed after the step (b), and may further include cutting the lower portion of the anode wire such that the protruding lower portion of the anode wire is close to the surface of the capacitor element. .

In this case, the step of insulating coating the surface of the anode wire may be further included before cutting the protruding lower portion of the anode wire.

In addition, the lower portion of the anode wire is preferably cut by an ultraviolet (UV) laser.

In the step (c), the cathode withdrawal layer may be formed by sequentially forming a dielectric oxide film layer, a solid electrolyte layer, and a cathode reinforcement layer on the surface of the capacitor element.

In the step (d), the conductive bumps are formed of silver (Ag), copper (Cu), zinc (Zn), tin (Sn) -based metal materials, and a plurality of dispensing on the surface of the negative electrode extraction layer ( It may be provided in the form of dispensing dots.

In this case, in the step (d), the conductive bump is formed of an ink or paste containing silver (Ag), copper (Cu), zinc (Zn), tin (Sn) -based metal material, It may be provided on the surface of the negative electrode extraction layer by an inkjet method.

Here, step (d) may be performed after step (e).

In the step (e), it is preferable that the positive electrode lead frame and the negative electrode lead frame are each bonded to the capacitor element through an insulating adhesive.

In this case, when the anode lead frame or the cathode lead frame is compressed to the capacitor element, the capacitor element and the respective lead frames in a state in which the insulating adhesive is semi-cured by applying heat to the anode lead frame or the cathode lead frame. It is more preferable to fully harden the said insulating adhesive agent after adjusting the bonding position of a liver.

In the step (f), the molding part may be formed to seal the anode wire, the conductive bump, the anode lead frame, and the cathode lead frame.

In this case, the molding part may be formed of an epoxy-based resin.

The step (g) may be performed by dicing the molding part to expose a bottom surface of the anode wire, an end portion of the conductive bump, a bottom surface of the anode lead frame, and a bottom surface of the cathode lead frame.

In this case, the diced portion is preferably ground or polished or sand blasted.

In the step (h), the conductive bump is formed by forming a plating layer by an electroless plating method on the exposed bottom surface of the anode wire, the bottom surface of the anode lead frame and a molding portion adjacent to the anode lead frame. The method may include forming a cathode lead terminal by forming a plating layer by an electroless plating method on an exposed end of the cathode lead frame and a lower surface of the cathode lead frame and a molding part adjacent to the molding part adjacent thereto.

In this case, the plating layer may be formed by forming an inner plating layer by electroless nickel phosphorus (Ni / P) plating and then forming an outer plating layer by copper (Cu) or tin (Sn) plating on the inner plating layer.

As described above, according to the solid electrolytic capacitor and the manufacturing method thereof according to the present invention, there is an effect that can reduce the manufacturing cost by simplifying the structure and the process of the solid electrolytic capacitor.

In addition, according to the solid electrolytic capacitor according to the present invention and a method of manufacturing the same, there is an effect that can realize a miniaturization of the solid electrolytic capacitor and maximize the capacitance.

In addition, according to the solid electrolytic capacitor and the method of manufacturing the same according to the present invention, there is an effect that can implement a low ESR (Equivalent Series Resistance) characteristics of the solid electrolytic capacitor.

Particularly, in the present invention, the cathode lead frame is also bonded to the capacitor element through the insulating adhesive in the same way as the anode lead frame, thereby bringing the unification of the material and improving the unstable electrical characteristics, that is, the ESR numerical deviation that may occur when using the conductive adhesive. There is an effect that can implement better stability and reliability.

1 is a perspective view showing a solid electrolytic capacitor according to the prior art;

2 is a cross-sectional view showing a solid electrolytic capacitor according to the prior art;

3 is a front sectional view showing a solid electrolytic capacitor according to an embodiment of the present invention;

FIG. 4 is a bottom view of the solid electrolytic capacitor of FIG. 3 with the positive lead terminal and the negative lead terminal removed; FIG.

5 to 11 are cross-sectional views sequentially illustrating a method of manufacturing a solid electrolytic capacitor according to an embodiment of the present invention.

5 is a cross-sectional view showing a capacitor device in which an anode wire and a cathode withdrawing layer are formed;

6 is a cross-sectional view showing a state in which conductive bumps are formed;

7 is a cross-sectional view showing a positive electrode lead frame and a negative electrode lead frame each provided with an insulating adhesive;

8 is a cross-sectional view illustrating a state in which the condenser element of FIG. 6 and the positive lead frame and the negative lead frame of FIG. 7 are bonded to each other;

9 is a sectional view showing a state in which a molding part is formed;

10 is a sectional view showing a dicing line of a molding part;

11 is a cross-sectional view showing a state in which a positive lead terminal and a negative lead terminal are formed;

12 is a cross-sectional view showing another embodiment of the positive lead terminal and the negative lead terminal of FIG. 11;

Explanation of symbols on the main parts of the drawings

100: solid electrolytic capacitor 110: capacitor element

120: anode wire 130: cathode lead layer

140: conductive bump 150: anode lead frame

150a: inserting portion 155: insulating adhesive

160: cathode lead frame 165: insulating adhesive

170: molding portion 180: positive lead terminal

190: negative lead terminal

Hereinafter, exemplary embodiments of a solid electrolytic capacitor and a method of manufacturing the same according to the present invention will be described in more detail with reference to the accompanying drawings.

Solid electrolytic capacitors

First, a solid electrolytic capacitor according to an embodiment of the present invention will be described in more detail with reference to FIGS. 3 and 4.

3 is a front sectional view showing a solid electrolytic capacitor according to a first embodiment of the present invention, and FIG. 4 is a bottom view showing the solid electrolytic capacitor of FIG. 3 with the positive lead terminal and the negative lead terminal removed.

As shown in FIG. 3, the solid electrolytic capacitor 100 according to an exemplary embodiment of the present invention includes a capacitor element 110 having a polarity of an anode and an anode wire inserted into a lower portion of the capacitor element 110. 120, the cathode withdrawal layer 130 formed on the surface of the condenser element 110, the conductive bump 140 formed on the surface of the cathode withdrawal layer 130, and the condenser element 110. The anode lead frame 150 and the condenser element 110 provided on the lower side thereof to be electrically insulated from the cathode lead layer 130 and have an insertion portion 150a into which the protruding lower portion of the anode wire 120 is inserted. A negative lead frame 160 provided to be electrically insulated from the negative electrode drawing layer 130 and the condenser element 110 on the other side of the lower side, and the lower surface of the positive electrode wire 120 and the conductive An end of the bump 140 and the anode lead frame 150. The molding part 170 exposing a lower surface and a lower surface of the negative lead frame 160, the exposed lower surface of the positive electrode wire 120, and the molding part so as to be electrically connected to the lower surface of the positive lead frame 140. The anode lead terminal 180 provided to the 170, and the cathode lead terminal provided to the molding unit 170 to be electrically connected to the exposed end of the conductive bump 140 and the lower surface of the cathode lead frame 160. And 190.

The cathode lead layer 130 may be configured to have a polarity of the cathode by being formed of a dielectric oxide film layer, a solid electrolyte layer, and a cathode reinforcement layer sequentially formed on the surface of the capacitor device 110.

In this case, in order to prevent the anode wire 120 and the cathode extracting layer 130 from being electrically connected, the cathode extracting layer 130 may include the anode wire 120 of the surface of the capacitor element 110. It is preferable to form in the surface except the surface formed.

Of course, it may be configured to be insulated from the cathode lead layer 130 by applying an insulating coating on the protruding lower surface of the anode wire 120.

The anode lead frame 150 and the cathode lead frame 160 are preferably bonded to the capacitor device 110 through insulating adhesives 155 and 165, respectively.

In this case, although the negative lead frame 160 may be bonded to the capacitor element 110 through a conductive adhesive, the insulating adhesive 165 in the same way as the positive lead frame 150 as in the embodiment of the present invention By bonding to the condenser element 110 through, it is possible to bring the unification of the material and improve the unstable electrical characteristics that may occur when using a conductive adhesive, that is, ESR numerical deviation can be implemented to better stability and reliability.

Here, the insulating adhesives 155 and 165 may use an epoxy-based liquid adhesive or a silicon-based die bonding adhesive.

In addition, the anode lead frame 150 and the cathode lead frame 160 may be formed of a conductive material.

On the other hand, the insertion portion 150a of the positive lead frame 150 may be formed in a hole shape, as shown in FIG. It may be formed.

The conductive bump 140 is a medium for electrically connecting the negative lead terminal 190 and the negative electrode withdrawing layer 130, and includes silver (Ag), copper (Cu), zinc (Zn), and tin (Sn). It may be formed of a metal material of a series and may be provided in the form of a plurality of dots (dispensing) on the surface of the cathode lead layer 130 facing the anode wire 120.

In this case, the conductive bump 140 is formed of an ink or a paste containing a metal material of silver (Ag), copper (Cu), zinc (Zn), tin (Sn), and the cathode withdrawing layer. The surface of the 130 surface which is opposite to the anode wire 120 may be provided by an inkjet method.

The positive lead terminal 180 and the negative lead terminal 190 may be formed of a plating layer formed by an electroless plating method.

In this case, the plating layer is preferably composed of an inner plating layer formed by electroless nickel phosphorus (Ni / P) plating, and an outer plating layer formed by copper (Cu) or tin (Sn) plating on the inner plating layer.

Manufacturing method of solid electrolytic capacitor

Hereinafter, a method of manufacturing a solid electrolytic capacitor according to an embodiment of the present invention will be described in detail with reference to FIGS. 5 to 11.

5 to 11 are cross-sectional views sequentially illustrating a method of manufacturing a solid electrolytic capacitor according to an embodiment of the present invention. FIG. 5 is a cross-sectional view illustrating a capacitor device in which an anode wire and a cathode withdrawing layer are formed, and FIG. 6 is a conductive bump. 7 is a cross-sectional view illustrating a cathode lead frame and an anode lead frame each having an insulating adhesive, and FIG. 8 is a view showing bonding between the capacitor device of FIG. 6 and the anode lead frame and cathode lead frame of FIG. 7. FIG. 9 is a cross-sectional view showing a molding portion, FIG. 10 is a cross-sectional view showing a dicing line of the molding portion, and FIG. 11 is a cross-sectional view showing a state where the positive lead terminal and the negative lead terminal are formed.

In the method of manufacturing a solid electrolytic capacitor according to an embodiment of the present invention, referring to FIG. 3, forming a capacitor element 110 having a polarity of an anode, and forming a cathode wire under the capacitor element 110. Inserting and connecting 120, forming a cathode withdrawing layer 130 on the surface of the capacitor element 110, and forming a conductive bump 140 on the surface of the cathode drawing layer 130; In addition, the protruding lower portion of the anode wire 120 is inserted into the insertion portion 150a of the anode lead frame 150 and electrically insulated from the cathode lead layer 130 on the lower side of the capacitor element 110. And a cathode lead frame 160 to be electrically connected to the cathode lead layer 130 on the other side of the lower portion of the capacitor element 110, and the capacitor element 110. Forming the molding unit 170 to surround the, Exposing a bottom surface of the anode wire 120, an end portion of the conductive bump 140, a bottom surface of the anode lead frame 150, and a bottom surface of the cathode lead frame 160, and the anode wire 120. And a positive electrode lead terminal 180 electrically connected to a lower surface of the lower surface and a lower surface of the positive electrode lead frame 150, the exposed end of the conductive bump 140 and the lower surface of the negative electrode lead frame 160. And forming a negative lead terminal 190 that is electrically connected.

In more detail, first, as shown in FIG. 5, the anode wire 120 is inserted and connected to the lower portion of the capacitor element 110 having the polarity of the anode, and the cathode is drawn out on the surface of the capacitor element 110. Form layer 130.

Here, the negative electrode withdrawal layer 130 may include a dielectric oxide film layer, a solid electrolyte layer, and a negative electrode reinforcement layer sequentially formed on the surface of the capacitor device 110 to have a polarity of the negative electrode.

In this case, in order to prevent the anode wire 120 and the cathode extracting layer 130 from being electrically connected, the cathode extracting layer 130 may include the anode wire 120 of the surface of the capacitor element 110. It is preferably formed on the surface except the protruding surface.

Of course, the insulating lower surface may be insulated from the cathode lead layer 130 by applying an insulating coating on the protruding lower surface of the anode wire 120.

On the other hand, after the anode wire 120 is inserted into the condenser element 110, the convex lower portion of the anode wire 120 may be formed to reduce the size or increase the capacitance of the solid electrolytic capacitor 100. Can be cut so as to be close to the surface.

Here, the protruding lower portion of the anode wire 120 may be cut by an ultraviolet (UV) laser.

At this time, before cutting the protruding lower portion of the anode wire 120, it is preferable to insulate the surface of the anode wire 120.

This is to prevent LC defects that may occur during the cutting of the anode wire 120.

Next, as shown in FIG. 6, a conductive bump 140 is formed on a surface of the surface of the cathode lead layer 130 that faces the anode wire 120.

Here, the conductive bump 140 is formed of silver (Ag), copper (Cu), zinc (Zn), tin (Sn) -based metal material, and a plurality of dispensing on the surface of the cathode lead layer 130. It may be provided in the form of dispensed dots.

In addition, the conductive bump 140 is formed of an ink or a paste containing a metal material of silver (Ag), copper (Cu), zinc (Zn), tin (Sn), and the cathode withdrawing layer. 130 may be provided on the surface in an inkjet manner.

On the other hand, the conductive bump 140 is preferably formed in a size of approximately 10 ~ 500㎛ diameter, more preferably in the size of 50 ~ 200㎛ diameter.

Next, as shown in FIG. 7, the insulating adhesive 155 is provided on the upper surface of the anode lead frame 150 having the insertion portion 150a, and the insulating adhesive 155 is formed on the upper surface of the cathode lead frame 160. ) And a unitary insulating adhesive 165.

Then, as shown in FIG. 8, the anode lead frame 150 is bonded to the lower side of the condenser element 110 through the insulating adhesive 155 and the condenser through the conductive adhesive 165. The cathode lead frame 160 is bonded to the other lower side of the device 110.

That is, the protruding lower portion of the anode wire 120 is inserted into the insertion portion 150a of the anode lead frame 150, and the anode lead frame 150 is inserted through the insulating adhesive 155. The anode lead frame 150 is bonded to the condenser element 110 by being compressed to 110.

In addition, the negative electrode lead frame 160 is pressed onto the capacitor element 110 through the insulating adhesive 165 to bond the negative electrode lead frame 160 to the capacitor element 110.

Here, the compressive force applied to bond the positive lead frame 150 and the negative lead lead frame 160 to the condenser element 110 is such that the thickness of the insulating adhesives 155 and 165 has a thickness of approximately 10 to 70 μm. It is preferred to work.

The condenser element 110 may be moved by semi-curing the insulating adhesives 155 and 165 while applying heat to the anode lead frame 150 and the cathode lead frame 160 as necessary. The position can be adjusted accurately, and then the insulating adhesives 155 and 165 are completely cured through a closed oven or a reflow curing process, so that the positive lead frame 150 and the negative lead frame 160 are disposed on the condenser element 110. Can be fixed respectively.

In this case, the insulating adhesives 155 and 165 may be cured for about 40 to 60 minutes at a temperature of about 150 degrees to 170 degrees.

Next, as shown in FIG. 9, the molding unit 170 is formed to surround the capacitor element 110 to form the anode wire 120, the conductive bump 140, the anode lead frame 150, and the like. The negative lead frame 160 is sealed.

Here, the molding part 170 may be formed of an epoxy resin.

In this case, the molding part 170 is preferably cured at a temperature of approximately 170 degrees, and may be a post-curing process of curing the molding part 170 for about 30 to 60 minutes at a temperature of 160 degrees if necessary.

Next, as shown in FIG. 10, the molding unit 170 is diced through a designed dicing line (dotted line) to protrude the bottom surface of the anode wire 120 and the conductive bump 140. An end portion, a lower surface of the anode lead frame 150 and a lower surface of the cathode lead frame 160 are exposed, and the size of the solid electrolytic capacitor is minimized.

In this case, the diced portion is preferably ground, polished, or sand blasted for removing foreign matters.

Finally, as shown in FIG. 11, the anode lead terminal is exposed to the exposed bottom surface of the anode wire 110, the bottom surface of the anode lead frame 150, and the molding unit 170 adjacent thereto by electroless plating. And forming a negative electrode lead terminal 190 on the exposed end of the conductive bump 140, the lower surface of the negative electrode lead frame 160, and the molding unit 170 adjacent thereto by an electroless plating method. do.

In this case, the plating layer is preferably composed of an inner plating layer formed by electroless nickel phosphorus (Ni / P) plating, and an outer plating layer formed by copper (Cu) or tin (Sn) plating on the inner plating layer.

Here, the thickness of the inner plating layer is preferably formed to a thickness of 0.1 ~ 20㎛, more preferably 0.3 to 3㎛ thickness.

In addition, the thickness of the outer plating layer is preferably formed in a thickness of 0.1 ~ 10㎛.

12 is a cross-sectional view illustrating another embodiment of the positive lead terminal and the negative lead terminal of FIG. 11, and as shown in FIG. 12, the positive lead terminal 180 and the negative lead terminal 190 have a '-' shape. Instead of being formed as a 'b' shape may be formed.

Preferred embodiments of the present invention described above are disclosed for the purpose of illustration, and various substitutions, modifications, and changes within the scope of the technical spirit of the present invention for those skilled in the art to which the present invention pertains. It will be possible, but such substitutions, changes and the like should be regarded as belonging to the following claims.

Claims (25)

A condenser element having a polarity of an anode; An anode wire inserted into and connected to a lower portion of the capacitor element; A cathode lead layer formed on a surface of the capacitor element; A conductive bump formed on a surface of the cathode lead layer; An anode lead frame provided on the lower side of the capacitor element to be electrically insulated from the cathode lead layer, and having an insertion portion into which the protruding lower portion of the anode wire is inserted; A cathode lead frame provided to be electrically insulated from the cathode lead layer on the other side of the lower portion of the capacitor element; A molding part formed to surround the condenser element, the molding part being configured to expose a bottom surface of the anode wire, an end portion of the conductive bump, a bottom surface of the anode lead frame, and a bottom surface of the cathode lead frame; A cathode lead terminal provided in the molding part to be electrically connected to an exposed bottom surface of the anode wire and a bottom surface of the anode lead frame; And And a negative lead terminal provided in the molding part to be electrically connected to the exposed end of the conductive bump and the lower surface of the negative lead frame. And the anode lead frame and the cathode lead frame are bonded to the capacitor element through an insulating adhesive, respectively. delete The method of claim 1, And the anode lead frame and the cathode lead frame are made of a conductive material. The method of claim 1, The insert portion of the anode lead frame is formed in the shape of a hole or a solid electrolytic capacitor, characterized in that formed in the form of a groove opening toward the cathode lead frame side. The method of claim 1, And the cathode lead layer comprises a dielectric oxide film layer, a solid electrolyte layer, and a cathode reinforcement layer sequentially formed on the surface of the capacitor element. The method of claim 1, The conductive bumps are formed of silver (Ag), copper (Cu), zinc (Zn), tin (Sn) -based metal materials, and a plurality of dots are dispensed on the surface of the negative electrode extraction layer. Solid electrolytic capacitor, characterized in that provided in the form. The method of claim 1, The conductive bumps are formed of ink or paste containing silver (Ag), copper (Cu), zinc (Zn), and tin (Sn) -based metal materials, and are formed on the surface of the negative electrode extraction layer by an inkjet method. Solid electrolytic capacitor, characterized in that provided. The method of claim 1, The positive electrode lead terminal and the negative electrode lead terminal is a solid electrolytic capacitor, characterized in that the plating layer formed by the electroless plating method. The method of claim 8, The plating layer is a solid electrolytic capacitor comprising an inner plating layer formed by electroless nickel phosphorus (Ni / P) plating, and an outer plating layer formed by copper (Cu) or tin (Sn) plating on the inner plating layer. (a) forming a capacitor element having a polarity of the anode; (b) inserting an anode wire into the lower portion of the capacitor element; Cutting the lower portion of the anode wire such that the protruding lower portion of the anode wire is close to the surface of the capacitor element; (c) forming a cathode withdrawing layer on the surface of the capacitor element; (d) forming a conductive bump on the surface of the cathode lead layer; (e) a positive lead frame is inserted into the protruding lower part of the positive electrode wire to an insertion part of the positive lead frame and electrically insulated from the negative lead drawing layer on a lower side of the condenser element; Providing a negative lead frame on the other side to be electrically insulated from the negative lead drawing layer; (f) forming a molding part to surround the capacitor element; (g) exposing a bottom surface of the anode wire, a bottom surface of the anode lead frame and a bottom surface of the conductive bump and the cathode lead frame; And (h) forming a cathode lead terminal electrically connected to a lower surface of the anode wire and a lower surface of the anode lead frame, and a cathode lead terminal electrically connected to a bottom surface of the conductive bump and the cathode lead frame; Making; Method for producing a solid electrolytic capacitor comprising a. delete The method of claim 10, The method of manufacturing a solid electrolytic capacitor, which is performed before cutting the protruding lower portion of the anode wire, and further comprising insulating coating the surface of the anode wire. The method of claim 10, The lower portion of the anode wire is a method of manufacturing a solid electrolytic capacitor, characterized in that the cutting by ultraviolet (UV) laser. The method of claim 10, In the step (c), And the cathode lead-out layer is formed by sequentially forming a dielectric oxide film layer, a solid electrolyte layer, and a cathode reinforcement layer on a surface of the capacitor element. The method of claim 10, The step (d), the method of manufacturing a solid electrolytic capacitor, characterized in that carried out after the step (e). The method of claim 10, In step (d), The conductive bumps are formed of silver (Ag), copper (Cu), zinc (Zn), tin (Sn) -based metal materials, and a plurality of dots are dispensed on the surface of the negative electrode extraction layer. Method for producing a solid electrolytic capacitor, characterized in that provided in the form. The method of claim 10, In step (d), The conductive bumps are formed of ink or paste containing silver (Ag), copper (Cu), zinc (Zn), and tin (Sn) -based metal materials, and are formed on the surface of the negative electrode extraction layer by an inkjet method. Method for producing a solid electrolytic capacitor, characterized in that provided. The method of claim 10, In the step (e), And the anode lead frame and the cathode lead frame are bonded to the capacitor element through an insulating adhesive, respectively. The method of claim 18, When the positive electrode lead frame or the negative electrode lead frame is compressed to the capacitor element, bonding between the capacitor element and each lead frame in a state in which the insulating adhesive is semi-hardened by applying heat to the positive electrode lead frame or the negative electrode lead frame. A method of manufacturing a solid electrolytic capacitor, characterized in that the insulating adhesive is completely cured after adjusting the position. The method of claim 10, In the step (f), And the molding part is formed to seal the anode wire, the conductive bump, the anode lead frame, and the cathode lead frame. The method of claim 20, The molding part is a method of manufacturing a solid electrolytic capacitor, characterized in that formed of an epoxy resin. The method of claim 10, The step (g) is a step of dicing the molding to expose the lower surface of the anode wire, the end of the conductive bump, the lower surface of the anode lead frame and the lower surface of the cathode lead frame, characterized in that the solid electrolyte Method for manufacturing a capacitor The method of claim 22, And said diced portion is ground or polished or sand blasted. The method of claim 10, In the step (h), the conductive bump is formed by forming a plating layer by an electroless plating method on the exposed bottom surface of the anode wire, the bottom surface of the anode lead frame and a molding portion adjacent to the anode lead frame. And forming a negative electrode lead terminal by forming a plating layer by an electroless plating method on an exposed end of the negative electrode and a lower surface of the negative electrode lead frame and a molding portion adjacent thereto. The method of claim 24, The plating layer is formed by forming an inner plating layer by electroless nickel phosphorus (Ni / P) plating, and then forming an outer plating layer by copper (Cu) or tin (Sn) plating on the inner plating layer. Manufacturing method.