KR100918059B1 - Organic light emitting display - Google Patents

Abstract

An organic light emitting diode display according to an exemplary embodiment includes a display panel including a display area and a pad area, a first bezel for receiving the display panel, and a second bezel coupled to a side of the display panel on which the pad area is formed. It includes.

OLED display, bezel, shock absorbing, side bezel

Description

Organic light emitting display device {ORGANIC LIGHT EMITTING DIODE DISPLAY}

The present invention relates to an organic light emitting display device, and more particularly, to a module of an organic light emitting display device.

Recently, display panels using organic light emitting diodes (OLEDs) have been attracting attention due to rapidly developing semiconductor technologies among various display panels applied to display devices.

In an active driving type organic light emitting display using organic light emitting diodes, pixels, which are basic units of image expression, are arranged on a substrate in a matrix manner, and thin film transistors (TFTs) and organic light emitting diodes are disposed for each pixel. Control the pixels independently. The organic light emitting device includes a hole injection electrode, an organic emission layer, and an electron injection electrode, and is formed by energy generated when an exciton generated by combining electrons and holes in an organic emission layer falls from an excited state to a ground state. Light emission is achieved.

In this manner, the organic light emitting diode display has a self-luminous property and, unlike the liquid crystal display, does not require a separate light source, thereby reducing thickness and weight. In addition, the organic light emitting diode display has high quality characteristics such as low power consumption, high luminance, and high response speed, and thus is suitable for use in mobile electronic devices.

In general, an organic light emitting diode display includes a display panel including two substrates fixed by a sealant, a bezel coupled to the display panel, and a printed circuit board electrically connected to the display panel through a flexible circuit board. Configure the module.

Unlike the liquid crystal display in which a structure such as a backlight unit is positioned between the display panel and the bezel, there is no other structure between the display panel and the bezel. Thus, when an accident occurs such as a drop, an impact is applied to the display panel. There is a vulnerability that can be transmitted as it is, the display panel can be easily broken.

In particular, when an external impact is applied, the mechanical strength of the flexible circuit board may be weaker than that of other bezels as the impact is concentrated to a portion of the bezel in which a portion of the flexible circuit board is bent without interference.

Accordingly, the organic light emitting display device may perform an excellent function as a display device only when the organic light emitting display device has a property that is not easily broken due to a fall due to a user's mistake according to its use environment.

An organic light emitting display device having excellent mechanical strength characteristics is provided.

An organic light emitting diode display according to an exemplary embodiment includes a display panel including a display area and a pad area, a first bezel for receiving the display panel, and a second bezel coupled to a side of the display panel on which the pad area is formed. It includes.

The second bezel may be detachably coupled to a side of the first bezel.

The second bezel may be coupled to only the side surface of the first bezel corresponding to the pad region.

The first bezel includes a bottom portion, a first cut portion protruding from an edge of the bottom portion, and a cut portion formed by cutting a portion of the first cut portion toward the pad region, and the second bezel includes a second cut portion. And a bending portion bent from the second cut portion.

An additional cut part having a locking step may be formed at a side of the first cut part, and a banding part may be inserted into the locking step.

The first cut part may include a plurality of protrusions, and the second cut part may include a plurality of holes corresponding to the plurality of protrusions, and the protrusion may be fastened to the hole.

The tip of the bending portion may be bent to be parallel to the bottom portion to form a support portion.

The support may be located above the pad area.

The touch panel may further include a touch panel disposed on the display panel, and the touch panel may be supported by the support unit.

The first bezel includes a bottom portion, a first cut portion protruding from an edge of the bottom portion, and a cut portion formed by cutting a portion of the first cut portion, and the second bezel includes a cover portion covering the pad area; It may include a second cut portion protruding from the edge of the cover portion.

The first cut portion and the cut cut portion include a plurality of protrusions, and a plurality of holes corresponding to the plurality of protrusions are formed in the second cut portion, and the protrusions may be fastened to the holes.

The strength of the first bezel and the strength of the second bezel may be different.

The first bezel may include a material selected from the group consisting of stainless steel (SUS), cold plate cold commercial (SPCC), aluminum and nickel-silver alloys.

The display apparatus may further include a buffer tape disposed between the display panel and the first bezel.

The display device may be portable.

According to an exemplary embodiment of the present invention, the display panel is accommodated using the bottom bezel and the side bezel, and the side bezel compensates for the strength of the portion where the mechanical strength is weak compared to other portions of the bottom bezel. Accordingly, when the display panel is dropped due to user's carelessness, the impact is distributed to all parts of the bezel, and the bezel absorbs the shock before the display panel, thereby effectively protecting the display panel and the mechanical characteristics of the organic light emitting display device. Strength can be improved.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art may easily implement the present invention. As those skilled in the art would realize, the described embodiments may be modified in various different ways, all without departing from the spirit or scope of the present invention.

In order to clearly describe the present invention, parts irrelevant to the description are omitted, and like reference numerals designate like elements throughout the specification.

In the drawings, the thickness of layers, films, panels, regions, etc., are exaggerated for clarity. When a portion of a layer, film, region, plate, or the like is said to be "on" or "on" another portion, this includes not only when the other portion is "right over" but also when there is another portion in the middle. On the contrary, when a part is "just above" another part, there is no other part in the middle.

In addition, when a part of the specification is said to be "connected" to another part, this includes the case where it is "directly connected". In addition, when a part is said to "include" a certain component, which means that it may further include other components, except to exclude other components unless otherwise stated.

FIG. 1 is an exploded perspective view illustrating an organic light emitting diode display 100 according to a first exemplary embodiment of the present invention, and FIG. 2 is a view illustrating a display panel 10 of FIG. It is a perspective view which shows the state accommodated in 30).

1 and 2, the organic light emitting diode display 100 may include a display panel 10 displaying an image, a first bezel 50 accommodating the display panel 10, and the first bezel 50. And a second bezel 30 coupled to protect the display panel 10.

The display panel 10 may be provided for a mobile such as a mobile phone of a touch panel (or screen) type, for example. However, in the present invention, the display panel 10 may be provided for a large display such as a television in addition to the mobile.

The display panel 10 includes a first substrate 12 and a second substrate 14 formed smaller in size than the first substrate 12. The display panel 10 is provided with a display area DA in which actual image display is performed. For example, when the display device 100 has an active matrix (AM) structure, the organic light emitting diode and the thin film transistors driving the organic light emitting diode and the thin film transistor may be formed on the first substrate 12 corresponding to the display area DA. Electrically connected wiring can be formed. In addition, a pad region PA is formed in a portion of the first substrate 12 that extends from the second substrate 14, and in the pad region PA, pads (not shown) extending from wirings of the display area DA are formed. Is located. These pads are electrically connected to the printed circuit board 20 through the flexible printed circuit board 18.

The integrated circuit chip 16 is mounted on the pad area PA of the first substrate 12 to control the display panel 10. The integrated circuit chip 16 generates a plurality of timing signals for applying the data driving signal and the gate driving signal at an appropriate time. The signals are applied to the data line and the gate line of the display panel 10, respectively. A protective film (not shown) is formed around the integrated circuit chip 16 to protect the integrated circuit chip 16.

Electronic components (not shown) for processing driving signals are mounted on the printed circuit board 20, and connectors (not shown) for transmitting external signals to the printed circuit board 20 are installed. Although the display panel 10 is accommodated in the first bezel 50, the flexible printed circuit board 18 fixed to the display panel 10 may be bent to the rear of the first bezel 50, although not shown in FIG. 2. The circuit board 20 is positioned on the rear surface of the first bezel 50.

The first bezel 50 is positioned below the display panel 10 and accommodates the display panel 10 and is fixedly installed in a case of a real application product.

The first bezel 50 has a bottom portion 502 corresponding to the size of the display panel 10 and a first cut portion 504 formed by being disposed at a right angle with a predetermined height from an edge of the bottom portion 502. It includes. Here, the first cut part 504 on the side where the flexible printed circuit board 18 is disposed is cut in consideration of its size so that the flexible printed circuit board 18 can be positioned without interference.

When the first cut part 504 on the side where a part of the first cut parts 504 is cut is called the cut cut part 504 ', a plurality of protrusions 5041 are provided on the cut cut part 504'. Is formed. The projection 5041 is formed convexly from the outer surface of the cut cut portion 504 'toward the + y axis direction in FIG. Further, as shown in the enlarged circle of FIG. 1, an additional cut portion 5022 having a locking jaw 5043 is formed on the side of the cut cut portion 504 '.

The second bezel 30 is positioned at the cut cut portion 504 ′ of the first bezel 50 and is coupled to the first bezel 50. As a result, as shown in FIG. 2, the second bezel 30 surrounds and protects the cut portion 504 ′ in a state where the display panel 10 is accommodated in the first bezel 50.

The second bezel 30 is parallel to the incision cut portion 504 ′ from the second cut portion 302 and the second cut portion 302 toward the -z axis direction of FIG. 1. A bending portion 304 bent inwardly. Here, a part of the bending portion 304 forms the support portion 306 bent again from the bending portion 304 toward the -y axis of FIG. 1.

A plurality of holes 3021 are formed in the second cut portion 302 corresponding to the protrusions 5041 formed in the cut cut portion 504 '. Combination of the first bezel 50 and the second bezel 30 is a projection 5051 when the bending portion 304 of the second bezel 30 is pushed so as to be inserted into the engaging jaw (5043) of the first bezel 50 When the second bezel 30 is lowered along the inclined surface of the), the protrusion 5041 is inserted into the hole 3021, and the end of the protrusion 5041 is caught by the hole 3021. Thus, the second bezel 30 may be fixed to the first bezel 50 while being fastened to the cut cut portion 504 ′ of the first bezel 50. Of course, the fastening method of the first bezel 50 and the second bezel 30 is not limited thereto.

The structure in which the second bezel 30 is engaged with the first bezel 50 and encloses the incision cut portion 504 ′ may provide a space in which the incision cut portion provided between the incision cut portions 504 ′ is not formed. Bezel 30 will be replaced. As a result, the second cut portion 302 of the second bezel 30 disposed at the position with respect to the exposed space portion based on the z-axis is connected to the incision cut portion 504 '. Therefore, even when an external shock such as a drop is applied to the organic light emitting diode display 100, the impact is uniform on all four sides (+ x axis, −x axis, + y axis, and −y axis) of the first bezel 50. It can be dispersed to prevent the concentration of impact to the incision cut portion 504 'side.

Meanwhile, the first bezel 50 and the second bezel 30 may be formed of the same material or may be formed of materials having different strengths from each other.

Since the first bezel 50 supports and accommodates internal parts including the display panel 10, the first bezel 50 may be formed of a material having a relatively high strength to protect the internal parts well. For example, the first bezel 50 may be made of a metal material such as stainless steel (SUS), steel plate cold commercial (SPCC), aluminum, and nickel-silver alloy having a certain strength. have. Therefore, the display panel 10 can be effectively protected from external shock. Of course, the material of the first bezel 50 is not limited to those described above.

The second bezel 30 may be made of a metallic material or a resin material like the first bezel 50.

3A is a cross-sectional view taken along line III-III of FIG. 2, and FIG. 3B is a cross-sectional view taken along line III′-III ′ of FIG. 2.

3A and 3B, the display panel 10 is accommodated in the first bezel 50, and the second bezel 30 is fastened to one side of the first bezel 50. At this time, the second cut portion 302 of the second bezel 30 abuts the cut cut portion 504 ′ of the first bezel 50, and the tip of the bending portion 304 is an additional cut portion 5042. ) Is inserted into the locking jaw (5043). A portion of the bending portion 304, that is, the portion of the bending portion 304 positioned corresponding to the cut portion of the first bezel 50, forms the support portion 306 bent toward the -y axis direction to form the flexible printing. It is located on the circuit board 18.

That is, as shown in FIG. 3B, the second bezel 30 covers the flexible printed circuit board 18 while the second cut portion 302 surrounds the cut portion between the cut cut portions 504 ′. Protect. As a result, the mechanical strength of the cut-out cut portion 504 'is reinforced, and the flexible printed circuit board 18 can be protected from the outside to prevent damage to the flexible printed circuit board 18.

In addition, the banding portion of the second bezel 30 formed by the bending portion 304 has a top height higher than that of the light emitting surface 141 of the display panel 10 based on the z-axis of FIG. 3B. As a result, when the organic light emitting diode display 100 is inadvertently dropped by the user, the bending portion may be brought into contact with the floor prior to the display panel 10 to absorb external shocks first.

On the other hand, the organic light emitting diode display 100 according to the present exemplary embodiment includes a buffer tape (not shown), for example, a buffer tape called a phorone tape in order to buffer external impact. It may be further arranged between the bottom portion 502 of 50).

4 is a perspective view illustrating an organic light emitting diode display 200 according to a second exemplary embodiment of the present invention, and FIG. 5 illustrates that the display panel 10 illustrated in FIG. 4 is accommodated in a first bezel 50. 3 is a perspective view illustrating a state in which the third bezel 31 is engaged with the first bezel 50. 4 and 5, the same reference numerals are used for the same configuration as the organic light emitting diode display 100 illustrated in FIGS. 1 and 2, and description thereof will be omitted.

4 and 5, the organic light emitting diode display 200 includes a third bezel 31.

The third bezel 31 is coupled to the first bezel 50 and covers and protects the pad area PA of the display panel 10 while covering a part of the first cut portion 504 of the first bezel 50. do.

The third bezel 31 includes a cover portion 312 parallel to the bottom portion 504 of the first bezel 50 and covering a part of the pad area PA and the light emitting surface 141, and the cover portion 312. It includes a third cut portion 314 is disposed at a right angle from the edge of the.

The third cut part 314 and the first cut part 504 protrude from the cover part 312 and the bottom part 502 in opposite directions. That is, the third cut portion 314 may protrude from the cover portion 312 toward the -z axis direction, and the first cut portion 504 may protrude from the bottom portion 502 toward the + z axis direction. have. Here, a part of the third cut portion 314 is formed to protrude from the outer surface of the third cut portion 314, and this portion corresponds to the cut portion of the cut cut portion 504 '. As a result, the protruding portion 3142 of the third cut portion 314 is in contact with the flexible printed circuit board 18 without the third bezel 31 being fastened to the first bezel 50. The substrate 18 may be positioned outside the substrate 18.

In addition, second holes 3141 are formed in the third cut part 314 to correspond to the positions of the cutout parts 504 ′ and the protrusions 5041 formed in the first cut part 504. The method of fastening the protrusions 5041 and the second holes 3141 is the same as the method of fastening the protrusions 5041 and the first holes 3021 of the first embodiment described above.

As such, the structure having the third bezel 31 not only reinforces the mechanical strength of the cut portion 504 ′, but also allows the flexible printed circuit board 18 to be provided. It can be protected from outside exposure. In addition, since the cover part 312 of the third bezel 31 covers the pad area PA, the integrated circuit chip 16 and the like located in the pad area PA are not exposed to the outside and are damaged by an impact or the like. Can be prevented.

Meanwhile, the first bezel 50 and the third bezel 31 may be formed of the same material or may be formed of materials having different strengths from each other. That is, the third bezel 31 may be made of a metal material or a resin material like the first bezel 50.

FIG. 6 is a cross-sectional view taken along the line VI-VI of FIG. 5.

Referring to FIG. 6, the display panel 10 is accommodated in the first bezel 50, and the third bezel 31 is fastened to one side of the first bezel 50. In this case, the third cut portion 314 of the third bezel 31 is positioned outside the cut cut portion 504 ′ of the first bezel 50 and the flexible printed circuit board 18 to protect them. The cover 312 of the third bezel 31 is positioned on the integrated circuit chip 16 and covers a portion of the light emitting surface 141 of the display panel 10. As a result, the mechanical strength of the cutout portion 504 'is reinforced, and the flexible printed circuit board 18 and the integrated circuit chip 16 are not exposed to the outside, thereby protecting them.

In addition, the top height of the cover 312 is positioned higher than the height of the light emitting surface 141 based on the z-axis of FIG. 6. As a result, when the organic light emitting display device 100 is inadvertently dropped by the user, the cover 312 may reach the floor before the display panel 10 to absorb external shocks first.

7 is a cross-sectional view of an organic light emitting diode display 300 according to a third exemplary embodiment of the present invention. The organic light emitting diode display 300 of FIG. 7 is an example in which the touch panel 70 is applied to the organic light emitting diode display 100 of FIG. 1, and the same reference numerals are used for the same configuration as that of FIG. 1. The description thereof will be omitted.

Referring to FIG. 7, the organic light emitting diode display 300 includes a fourth bezel 32 and a touch panel 70.

The touch panel 70 is positioned on the display panel 10. For example, when a user presses the touch panel 70, a corresponding signal is transmitted to the integrated circuit chip 16 of the display panel 10 according to the pressure thereof. An image may be displayed on the display panel 10. The touch panel 70 may be coupled to the display panel 10 through a separate adhesive tape 71 or the like. Of course, the method of coupling the touch panel 70 and the display panel 10 is not limited thereto. In addition, a more detailed description of the touch panel is omitted since it can be easily understood by those skilled in the art.

The fourth bezel 32 has a shape similar to that of the second bezel 30 of the first embodiment shown in FIG. 1, and includes the second cut portion 302, the bending portion 304, and the second bezel 30. The third cut part 322, the third bending part 324, and the third support part 326 corresponding to the support part 306 are included. Here, the third support part 326 is bent from the third bending part 324 toward the -y axis direction.

In this case, the touch panel 70 may be positioned on the third support part 326 so that the third support part 326 may support the load of the touch panel 70. Thus, the fourth bezel 32 not only protects the flexible printed circuit board 18 while reinforcing the strength of the relatively incised cut portion 504 'like the second bezel 30 of the first embodiment. The touch panel 70 positioned on the display panel 10 may be supported to effectively prevent the display panel 10 from being damaged by the load of the touch panel 70.

The organic light emitting display devices 100, 200, and 300 formed as described above are installed in a case constituting a real product to display an image desired by a user.

Meanwhile, the organic light emitting diode display 100, 200, 300 according to the exemplary embodiment of the present invention is formed by the other bezels 30, 31, 32 coupled to the first bezel 50 as described above. It is possible to enhance the mechanical strength, which will be described below.

The inventor of the present invention mounts the organic light emitting diode display of the comparative example, which does not have side bezels such as the organic light emitting diode display 100 and the second bezel 30 of the first embodiment, to a separate banding test device, thereby bending strength. Was measured.

The banding test is to mount the organic light emitting display device to a separate test device (in which both ends of the organic light emitting display device are supported by a rod located at the bottom thereof), and apply a force to the center of the organic light emitting display device by applying a force of 5 mm / min. Pressurized at the rate of. As a result, when the central portion of the organic light emitting diode display sag in the pressing direction, the amount of deflection (displacement) and the repulsive force (intensity) are measured. Here, the amount of deflection and the force were measured until the organic light emitting diode display was damaged. In the bending test, 20 organic light-emitting display devices corresponding to Examples and Comparative Examples were prepared, respectively, and the test results were performed. The results (maximum value, minimum value, average, and standard deviation of measured values) are shown in Table 1 below.

Deflection amount (displacement) [mm] Repulsive force (strength) [kg] Example Comparative example Example Comparative example Value 3.3 3.5 13.13 10.16 Minimum value 2.1 1.7 9.28 5.82 Average 2.5 2.8 10.64 8.68 Standard Deviation 0.3 0.4 0.94 1.10

Referring to Table 1, the embodiment shows a deflection amount of 2.5 mm and a standard deviation of 0.3, and a repulsive force of 10.64 kg and a standard deviation of 0.94. In comparison, the comparative example showed a deflection of 2.8 mm and a standard deviation of 0.4, and a repulsive force of 8.68 kg and a standard deviation of 1.10. That is, since the Example shows a small deflection amount and a large strength value in the bending test result compared to the Comparative Example, it can be confirmed that the mechanical strength with respect to the physical force is improved compared to the Comparative Example.

Although the preferred embodiments of the present invention have been described above, the present invention is not limited thereto, and various modifications and changes can be made within the scope of the claims and the detailed description of the invention and the accompanying drawings. Naturally, it belongs to the range of.

1 is an exploded perspective view of an organic light emitting diode display according to a first exemplary embodiment of the present invention.

FIG. 2 is a combined perspective view of the organic light emitting diode display illustrated in FIG. 1.

3A is a cross-sectional view taken along the line III-III of FIG. 2.

FIG. 3B is a cross-sectional view taken along the line III′-III ′ of FIG. 2.

4 is an exploded perspective view of an organic light emitting diode display according to a second exemplary embodiment of the present invention.

FIG. 5 is a combined perspective view of the organic light emitting diode display illustrated in FIG. 4.

FIG. 6 is a cross-sectional view taken along the line VI-VI of FIG. 5.

7 is a cross-sectional view of an organic light emitting diode display according to a third exemplary embodiment of the present invention.

<Description of reference numerals for the main parts of the drawings>

100,200,300; An organic light emitting display device 10; Display panel 50; First bezel

30; Second bezel 31; Third bezel 32; Fourth bezel

Claims (15)

A display panel including a display area and a pad area; A first bezel accommodating the display panel; And A second bezel coupled to the first bezel toward the display panel on which the pad region is formed Including, The first bezel may have a bottom portion, a first cut portion formed by being disposed at a right angle with a predetermined height from an edge of the bottom portion, and a cut portion formed by cutting a portion of the first cut portion toward the pad region. Including, The second bezel is positioned on the cut cut portion side of the first bezel, and includes a second cut portion formed in parallel with the cut cut portion, and a bending portion bent from the second cut portion. Display device. The method of claim 1, And a second bezel detachably coupled to a side surface of the first bezel. The method according to claim 1 or 2, And a second bezel coupled only to a side surface of the first bezel corresponding to the pad area. delete The method of claim 1, An organic light emitting display device having an additional cut portion having a locking step formed on a side surface of the first cut part, and the banding part inserted into the locking step. The method according to claim 1 or 5, The first cut portion includes a plurality of protrusions, and the second cut portion includes a plurality of holes corresponding to the plurality of protrusions, and the protrusion is coupled to the hole. The method according to claim 1 or 5, And a support portion formed by bending the tip of the bending portion parallel to the bottom portion. The method of claim 7, wherein The organic light emitting diode display of which the support is positioned on the pad area. The method of claim 7, wherein And a touch panel disposed on the display panel, wherein the touch panel is supported by the support part. A display panel including a display area and a pad area; A first bezel accommodating the display panel; And A third bezel coupled to the first bezel toward the display panel on which the pad region is formed Including, The first bezel includes a bottom portion, a first cut portion formed to protrude from an edge of the bottom portion, and a cut portion formed by cutting a portion of the first cut portion. The third bezel includes a cover part covering the pad area and a third cut part protruding from an edge of the cover part. The method of claim 10, The first cut portion and the incision cut portion include a plurality of protrusions, the third cut portion is formed with a plurality of holes corresponding to the plurality of protrusions, the organic light emitting the projection is fastened to the hole Display device. The method of claim 1, The organic light emitting diode display of which the strength of the first bezel is different from that of the second bezel. The method of claim 1, And the first bezel comprises a material selected from the group consisting of stainless steel (SUS), cold plate cold commercial (SPCC), aluminum and nickel-silver alloys. The method of claim 1, And a buffer tape disposed between the display panel and the first bezel. The method of claim 1, An organic light emitting display device in which the display device is portable.

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