KR100931855B1 - Substrate cleaning device and method - Google Patents

Abstract

The substrate cleaning apparatus includes a support plate for supporting the substrate, a suction unit provided on the support plate, and a mask for protecting the substrate. The mask is provided on top of the substrate and prevents the generated plum and residual beam from being incident on the substrate along with the shock wave for cleaning the substrate. In addition, the mask discharges the guide gas, and the guide gas induces particles generated by damaging the mask by the plum and the residual beam toward the suction part. As a result, the substrate cleaning apparatus can prevent recontamination of the substrate due to damage of the mask and improve the cleaning efficiency.

Description

Substrate cleaning apparatus and its method {APPARATUS AND METHOD OF CLEANING SUBSTRATE}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to semiconductor manufacturing equipment, and more particularly, to a substrate cleaning apparatus using a laser shock wave and a method thereof.

In general, the manufacturing process of the semiconductor substrate is formed through a thin film deposition process, an etching process and a cleaning process. In particular, the cleaning step removes residual substances, particles, and the like generated during the manufacturing process of the semiconductor substrate.

The cleaning process can be divided into wet cleaning and dry cleaning. Wet cleaning uses substrates to clean substrates and uses a large amount of chemicals, such as environmental pollution, slow working speed, and large equipment.

On the other hand, dry cleaning uses a plasma or a laser to clean the substrate without damaging the substrate. Dry cleaning with plasma cleans the substrate by reacting radicals with contaminants on the substrate surface. Dry cleaning using a laser provides a laser shock wave to the substrate to remove foreign material from the substrate surface without damaging the substrate.

Specifically, dry cleaning using a laser focuses a laser beam to generate a shock wave at the top of the substrate, and foreign matter on the substrate is removed by the shock wave. However, in generating such a shock wave, a plume or a residual beam is generated together with the shock wave, and the plume or the high temperature residual beam causes damage to the substrate.

To prevent this, a mask is placed on top of the substrate to prevent the plume and the residual beam from entering the substrate. However, when cleaning the substrate, only the substrate is rotated while the focus and the mask of the laser are fixed, so that the plume and the residual beam are continuously incident only on a certain portion of the mask. As a result, the mask is damaged and fragments of the mask fall to the substrate, causing contamination of the substrate.

It is an object of the present invention to provide a substrate cleaning apparatus which prevents the substrate from being recontaminated in the cleaning process.

It is also an object of the present invention to provide a method for cleaning a substrate using the substrate cleaning apparatus described above.

According to one aspect of the present invention, a substrate cleaning apparatus includes a rotatable support plate, a beam generator, a lens, a suction unit, and a mask.

The support plate supports the substrate, and the beam generator emits light for generating shock waves for cleaning the substrate. The lens focuses the light emitted from the beam generator on an upper portion of the substrate. The suction part is provided above the substrate, and sucks the foreign matter on the substrate and discharges it to the outside. The mask is disposed above the substrate, and discharges a guide gas that guides particles falling from the upper surface to the suction part side, and protects the substrate.

In detail, a gas flow path for guiding the guide gas to the suction part is formed in the mask, and a discharge hole is connected to the gas flow path to discharge the guide gas.

In addition, the substrate cleaning method according to one feature for realizing the above object of the present invention is as follows. First, the substrate is placed on a support plate, and a mask and a suction part are disposed on the substrate. A shock wave for cleaning the substrate is formed on the substrate, and together with the mask, a guide gas is discharged to guide particles generated from the mask to the suction part, and the suction part is formed together with the foreign matter of the substrate. Inhale particles and discharge them to the outside.

According to the present invention described above, the mask discharges guide gas which guides particles generated by damage of the mask to the suction part side. Accordingly, the substrate cleaning apparatus can prevent recontamination of the substrate due to damage to the mask and can improve the cleaning efficiency.

Hereinafter, with reference to the accompanying drawings will be described in detail a preferred embodiment of the present invention.

1 is a view showing a substrate cleaning apparatus according to an embodiment of the present invention, Figure 2 is a plan view showing the positional relationship between the mask and the focus shown in Figure 1,

1 and 2, the substrate cleaning apparatus 300 of the present invention includes a support unit 100 for supporting a substrate and a cleaning unit 200 for providing a shock wave (SW) for cleaning the substrate. ) May be included.

In detail, the support unit 100 may include a support plate 110, a rotation shaft 120, and a fixed shaft 130. The support plate 110 has a disk shape, the substrate is mounted on the upper surface. Here, the back surface of the substrate faces the support plate 110. In addition, the support plate 110 may include a plurality of chucking pins 111 and a plurality of support pins 113. The chucking pins 111 are provided on the upper surface of the support plate 110 and support the end of the substrate to fix the substrate. The support pins 113 are positioned inside the chucking pins 111 and support a lower portion of the substrate.

The rotating shaft 120 and the fixed shaft 130 is installed below the support plate 110. The rotation shaft 120 is coupled to the support plate 110, and is connected to the external drive device (not shown) to rotate. The rotational force of the rotation shaft 120 is transmitted to the support plate 110, the support plate 110 rotates together with the rotation shaft 120. The rotating shaft 120 is coupled to the fixed shaft 130. One end of the fixed shaft 130 is coupled to the rotating shaft 120, supports the rotating shaft 120, and does not rotate together with the rotating shaft 120.

Meanwhile, the cleaning unit 200 generates the shock wave SW on the support plate 110 to clean the substrate.

In detail, the cleaning unit 200 includes a beam generation unit 210, a lens 220, a mask 230, a gas supply unit 240, a supply line 250, and a suction unit 260. The beam generator 210 generates and provides a laser beam LB to the lens 220, and the lens 220 focuses the laser beam LB on the support plate 110. Accordingly, the shock wave SW is generated on the support plate 110. The shock wave SW propagates in all directions around a focal point FP where the laser beam LB is collected by the lens 220, and strikes the surface of the substrate 10 to face the substrate. Foreign matters are separated into the substrate. As a result, foreign matter on the substrate is removed.

In one example of the present invention, the focal point FP of the lens 220 is positioned above the support plate 110, is located at the center point of the support plate 110 when viewed in plan view, and the substrate is cleaned. Is fixed.

On the other hand, the mask 230 is provided on the support plate 110. The mask 230 blocks a residual beam and plume generated together with the shock wave SW from being provided to the substrate.

3 is a perspective view illustrating the mask illustrated in FIG. 1, and FIG. 4 is a cross-sectional view taken along the line II ′ of FIG. 3.

1 to 3, the mask 230 has a rear surface facing the top surface of the support plate 110 and is positioned adjacent to the support plate 110. In one example of the present invention, the mask 230 has a rod shape and is located at one side of the focal point FP.

The plume and the residual beam generated together with the shock wave SW travel from the focal point FP toward the support plate 110 and are incident on the upper surface of the mask 230. Thus, the mask 230 may prevent the substrate on the support plate 110 from being damaged by the plume and the residual beam.

However, if the plume and the residual beam is continuously incident to a specific area of the mask 230, the mask 230 may also be damaged. As such, when the mask 230 is damaged, the fragments of the mask 230 may fall toward the support plate 110.

To prevent this, the mask 230 discharges a guide gas that guides such debris to move upward of the mask 230.

In detail, a gas flow path 231 through which the guide gas GG is introduced is formed in the mask 230, and one side discharges the guide gas GG introduced into the gas flow path 231 to the outside. The discharge hole 232 is formed.

2 to 4, the gas flow path 231 is formed in the longitudinal direction of the mask 230 and communicates with the discharge hole 232. A portion of the gas flow passage 231 adjacent to the discharge hole 232 is inclined upward toward the suction part 260. In one example of the present invention, nitrogen gas is used as the guide gas GG flowing into the gas flow path 231. The discharge hole 232 is formed at an upper end of one side of the mask 230, and is formed at a side of the mask 230 adjacent to the focal point FP. In this embodiment, the discharge hole 232 is formed on one side of the mask 230, but may be formed on the upper surface.

The guide gas GG introduced into the gas flow path 231 flows along the gas flow path 231 and is discharged through the discharge hole 232. The guide gas GG discharged from the mask 230 travels upwardly of the mask 230. Fragments of the mask 230, that is, particles, are guided upward of the mask 230 by the guide gas GG. Accordingly, the mask 230 may prevent the particles from falling on the substrate on the support plate 110 and prevent recontamination of the substrate.

1 and 2, the mask 230 is connected to the supply line 240, and the supply line 240 is connected to the gas supply unit 250. The gas supply unit 250 supplies the guide gas GG, and the supply line 240 supplies the guide gas GG provided from the gas supply unit 250 to the mask 230.

On the other hand, the suction part 260 is installed on the support plate 110. The suction part 260 is positioned adjacent to the discharge hole 232 of the mask 230 at an upper portion of the mask 230, and sucks foreign matter separated from the substrate by the shock wave SW to the outside. Discharge. The suction unit 260 also sucks particles generated from the mask 230 and discharges them to the outside. In this case, particles of the mask 230 are guided to the suction part 260 by the guide gas GG.

Hereinafter, a process of inducing particles generated from the mask 230 to the suction part 260 will be described in detail with reference to the accompanying drawings.

5 is a view illustrating a substrate cleaning process in the substrate cleaning apparatus shown in FIG. 1, and FIG. 6 is a view illustrating a process in which particles are guided to the suction unit illustrated in FIG. 5.

5 and 6, first, the substrate 10 is seated on the support plate 110, and the rotating shaft 120 is rotated to rotate the substrate 10 on the support plate 110.

The beam generator 210 generates the laser beam LB and provides the laser beam LB to the lens 220, and the lens 220 focuses the laser beam LB on the substrate 10. Generates a shock wave (SW). The focal point FP of the lens 220 is positioned at the center point of the substrate 10.

The shock wave (SW) hits the surface of the substrate 10 to separate the foreign material from the substrate (10). While the substrate 10 is cleaned by the shock wave SW, the suction unit 260 sucks and discharges the foreign matter PC separated in a particle form to the outside.

During the cleaning of the substrate 10, the mask 230 blocks the plume and the residual beam from entering the substrate 10. Specifically, the mask 230 covers a portion of the substrate 10 and is located at one side of the focal point FP. In addition, the mask 230 is spaced apart from the substrate 10, and a rear surface thereof faces the substrate 10.

During the cleaning of the substrate 10, the gas supply unit 240 provides the guide gas GG to the mask 230 through the supply line 250. The guide gas GG introduced into the mask 230 flows along the gas flow path 231 and is discharged through the discharge hole 232. Since the movement direction of the guide gas GG via the mask 230 is guided to the upper direction of the mask 230 by the gas flow path 231 and the discharge hole 232, the suction part ( 260) to the side. Accordingly, the particles PC generated by the damage of the mask 230 are moved to the suction part 260 by the guide gas GG. The suction part 260 sucks the particle PC of the mask 230 together with the foreign material of the substrate 10 and discharges it to the outside.

As described above, since the particle PC of the mask 230 is guided to the suction part 260 by the guide gas GG, the substrate cleaning apparatus 300 may generate particles generated from the mask 230. PC) can be prevented from falling on the substrate 10, and re-contamination of the substrate 10 can be prevented.

Although described with reference to the embodiments above, those skilled in the art will understand that the present invention can be variously modified and changed without departing from the spirit and scope of the invention as set forth in the claims below. Could be.

1 is a view showing a substrate cleaning apparatus according to an embodiment of the present invention.

FIG. 2 is a plan view illustrating a positional relationship between a mask and a focal point illustrated in FIG. 1.

3 is a perspective view illustrating the mask shown in FIG. 1.

4 is a cross-sectional view taken along the line II ′ of FIG. 3.

5 is a view illustrating a substrate cleaning process in the substrate cleaning apparatus of FIG. 1.

6 is a view illustrating a process in which particles are guided to the suction unit illustrated in FIG. 5.

Explanation of symbols on the main parts of the drawings

100 support unit 200 cleaning unit

210: beam generator 210: lens

230: mask 240: gas supply unit

250: supply line 260: suction part

300: substrate cleaning device

Claims (7)

A support plate supporting the substrate and rotatable; A beam generator for emitting light for generating shock waves for cleaning the substrate; A lens for focusing the light emitted from the beam generator on an upper portion of the substrate; A suction part provided at an upper portion of the substrate and sucking foreign substances on the substrate and discharging them to the outside; And A mask disposed above the substrate and discharging a guide gas for guiding particles falling from an upper surface to the suction part and protecting the substrate; The mask has a substrate cleaning apparatus, characterized in that a gas flow path for guiding the guide gas to the suction side is formed therein, and a discharge hole for communicating with the gas flow path to discharge the guide gas therein. The method of claim 1, The gas flow path cleaning apparatus, characterized in that the portion adjacent to the discharge hole is inclined upward toward the suction portion. The method according to claim 1 or 2, The mask has a rod shape, The gas flow path extends in the longitudinal direction of the mask, The discharge hole is substrate cleaning apparatus, characterized in that formed in the upper end of one side of the mask. The substrate cleaning apparatus of claim 3, wherein the suction unit is positioned adjacent to the discharge hole at an upper portion of the mask. A support plate supporting the substrate and rotatable; A beam generator for emitting light for generating shock waves for cleaning the substrate; A lens for focusing the light emitted from the beam generator on an upper portion of the substrate; A suction part provided at an upper portion of the substrate and sucking foreign substances on the substrate and discharging them to the outside; And A mask disposed on the substrate and discharging a guide gas for inducing particles falling from an upper surface to the suction part and protecting the substrate; A gas supply unit providing the guide gas; And And a supply line connected to the gas supply unit and the mask and supplying the guide gas provided from the gas supply unit to the mask. delete Mounting the substrate on a support plate; Disposing a mask and a suction unit on the substrate; And A shock wave for cleaning the substrate is formed on the substrate, and together with the mask, a guide gas is discharged to guide particles generated from the mask to the suction part, and the suction part is formed together with the foreign matter of the substrate. Inhaling the particles and discharging them to the outside, And the guide gas is guided to the suction part by a gas flow path formed inside the mask.

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