[go: up one dir, main page]

KR100964561B1 - Conductive adhesive composition - Google Patents

Conductive adhesive composition Download PDF

Info

Publication number
KR100964561B1
KR100964561B1 KR1020090047931A KR20090047931A KR100964561B1 KR 100964561 B1 KR100964561 B1 KR 100964561B1 KR 1020090047931 A KR1020090047931 A KR 1020090047931A KR 20090047931 A KR20090047931 A KR 20090047931A KR 100964561 B1 KR100964561 B1 KR 100964561B1
Authority
KR
South Korea
Prior art keywords
graphene
adhesive composition
fatty acid
sensitive adhesive
pressure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020090047931A
Other languages
Korean (ko)
Inventor
박기호
정한모
조윤복
Original Assignee
박기호
울산대학교 산학협력단
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 박기호, 울산대학교 산학협력단 filed Critical 박기호
Priority to KR1020090047931A priority Critical patent/KR100964561B1/en
Application granted granted Critical
Publication of KR100964561B1 publication Critical patent/KR100964561B1/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02Non-macromolecular additives
    • C09J11/04Non-macromolecular additives inorganic
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/02Elements
    • C08K3/04Carbon
    • C08K3/042Graphene or derivatives, e.g. graphene oxides
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04Homopolymers or copolymers of esters
    • C09J133/06Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/08Homopolymers or copolymers of acrylic acid esters
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/20Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22Plastics; Metallised plastics
    • C09J7/25Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/255Polyesters
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02Electrically-conducting adhesives
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00Additional features of adhesives in the form of films or foils
    • C09J2301/40Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/408Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2467/00Presence of polyester
    • C09J2467/006Presence of polyester in the substrate

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Inorganic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

PURPOSE: An acryl conductive adhesive composition is provided to effectively improve conductivity and adhesion by having graphene with a conductive filler. CONSTITUTION: A conductive adhesive composition contains 100.0 weight parts of acrylic adhesive, 0.1-15 weight parts of graphene powder, and 0.1-10 weight parts of cross-linking agent. The composition further contains 0.001-30 weight parts of fatty acid having 5 or more carbon atoms. The cross-linking agent is a compound having two or more epoxy groups, isocyanate groups, amine groups, or aziridine groups. A method for adding fatty acid to the composition comprises a step of dispersing graphene in 20-200 times of solvent, a step of adding fatty acid having 5 or more fatty acid, a step of stirring strongly, and a step of treating the surface of the graphene.

Description

도전성 점착제 조성물 {Conductive Adhesive Composition}Conductive Adhesive Composition

본 발명은 도전성 점착제 조성물, 특히 그라펜을 함유한 도전성 점착제 조성물 및 이러한 조성물이 베이스 필름에 코팅된 점착성 보호필름에 관한 것이다.The present invention relates to a conductive adhesive composition, in particular a conductive adhesive composition containing graphene, and an adhesive protective film coated on the base film.

전자 부품 혹은 전자 기기들은 수송, 보관, 조립 중 표면의 손상을 최소화하기 위하여 보호 필름을 부착하여 관리한다. 이 보호 필름은 정전기 발생에 의한 기기의 손상이 없도록 도전성을 부여하여야 하며, 이를 위해서는 점착제에 도전성을 부여할 필요가 있다. Electronic components or devices are attached with a protective film to minimize surface damage during transportation, storage and assembly. The protective film should be provided with conductivity so as not to damage the device caused by the generation of static electricity.

점착제에 도전성을 부여하기 위하여 첨가하는 물질로는 계면활성제, 전도성 고분자 등이 있다. 그러나 계면활성제는 습도가 낮은 경우 대전방지기능이 감소하며, 도전성 부여 정도가 크지 않은 단점이 있다. 또한 전도성 고분자는 점착제와의 혼화성이 좋지 못하여 효과적으로 전도성을 향상시키기가 쉽지 않은 문제가 있다. 이밖에 금속 섬유, 금속 박편, 카본블랙, 흑연 등과 같은 도전성 충진제를 첨가할 수도 있으나 이들 대부분 다량 첨가 시 점착력 약화나 점착제와의 혼화성 문제가 발생할 수 있다.Substances added to impart conductivity to the pressure-sensitive adhesive include surfactants, conductive polymers, and the like. However, the surfactant has a disadvantage that the antistatic function is reduced when the humidity is low, and the degree of conductivity provision is not large. In addition, the conductive polymer is poor in compatibility with the pressure-sensitive adhesive has a problem that it is not easy to effectively improve the conductivity. In addition, conductive fillers such as metal fibers, metal flakes, carbon black, graphite, and the like may be added, but most of them may cause a weakening of adhesive strength or miscibility with the adhesive.

도전성 충진제는 입자의 크기가 작을수록 표면적이 커지므로 동일량을 첨가 하는 경우 더 높은 전도도 향상 효과를 얻을 수 있으므로 최근 나노 크기의 도전성 물질, 예를 들면 카본나노튜브와 같은 물질들을 이용하는 연구가 활발히 진행되고 있으나, 카본나노튜브 역시 점착제와의 혼화성이 좋지 못하여 균일하게 분산시키기기 쉽지 않은 문제가 있다.Since the conductive filler has a larger surface area as the particle size decreases, a higher conductivity improvement effect can be obtained when the same amount is added. Accordingly, researches actively using nano-sized conductive materials such as carbon nanotubes have been actively conducted. However, carbon nanotubes also have a problem that it is not easy to be uniformly dispersed due to poor compatibility with the pressure-sensitive adhesive.

본 발명은 전도도와 접착력이 효과적으로 발현되는 아크릴계 전도성 점착제 조성물을 제공하기 위한 것이다. The present invention is to provide an acrylic conductive pressure-sensitive adhesive composition effectively expressing conductivity and adhesion.

또한, 본 발명은 도전성이 양호하고 접착력이 우수한 점착성 보호필름을 제공하기 위한 것이다. In addition, the present invention is to provide an adhesive protective film having good conductivity and excellent adhesion.

본 발명자들은 그라펜을 도전성 필러로 사용하면 점착제의 전도성을 효과적으로 향상시킬 수 있으며, 또 그라펜의 표면처리로 접착력도 향상시킬 수 있음을 관찰하고 본 발명의 내용을 완성하게 되었다.The present inventors have observed that the use of graphene as the conductive filler can effectively improve the conductivity of the pressure-sensitive adhesive, and can also improve the adhesion by the surface treatment of the graphene to complete the contents of the present invention.

본 발명에 의하여, 아크릴계 점착제 100중량부; 그라펜 분말 0.1 내지 15중량부; 및 가교제 0.1 내지 10 중량부를 포함하는 도전성 점착제 조성물이 제공된다.According to the present invention, 100 parts by weight of the acrylic pressure-sensitive adhesive; 0.1 to 15 parts by weight of graphene powder; And 0.1 to 10 parts by weight of the crosslinking agent is provided.

또한, 본 발명에 의하여, 아크릴계 점착제 100중량부; 그라펜 분말 0.1 내지 15중량부; 탄소수 5 이상의 지방산 0.001 내지 30중량부; 및 가교제 0.1 내지 10중량부를 포함하는 도전성 점착제 조성물이 제공된다. In addition, according to the present invention, 100 parts by weight of the acrylic pressure-sensitive adhesive; 0.1 to 15 parts by weight of graphene powder; 0.001 to 30 parts by weight of fatty acid having 5 or more carbon atoms; And 0.1 to 10 parts by weight of the crosslinking agent is provided.

또한, 본 발명에 의하여, 베이스 필름에 상기 도전성 점착제 조성물이 코팅된 전자부품의 보호용 필름이 제공된다. In addition, according to the present invention, there is provided a protective film for an electronic component coated with the conductive adhesive composition on a base film.

상기 도전성 점착제 조성물에서 조성 성분비는 고형물 기준이며 조성물 제조 시 사용되는 용매 및 분산액은 최종 점착제 시트 또는 필름에는 전부 증발 제거(건 조)되는 것으로 간주한다.The compositional component ratio in the conductive adhesive composition is based on solids, and the solvents and dispersions used in the preparation of the composition are considered to be completely evaporated (dried) to the final adhesive sheet or film.

상기 아크릴계 점착제는 아크릴계 단량체를 주성분으로 용매 속에서 라디칼 중합하여 제조한다. 아크릴계 단량체는 유리전이온도가 상온 이하로 점착성을 부여하는 2-에틸헥실 아크릴레이트 (2-ethylhexyl acrlate), 부틸 아크릴레이트 (butyl acrylate) 등과 같은 지방족 알코올과 아크릴산 혹은 메타크릴산의 축합물을 주성분으로 한다. 이외에 접착력에 상승효과를 부여하고 내열성 증대를 위한 가교점을 제공하는 카르복실산기를 갖는 비닐화합물, 예를 들면 아크릴산, 메타크릴산, 이타콘산 (itaconic acid) 등을 함께 공중합 한다. 카르복실산기를 갖는 비닐화합물은 1 내지 20 중량 퍼센트 범위에서 사용하며, 사용량이 이보다 적은 경우 내열성과 접착력이 감소하며, 과다한 경우는 점착제의 유리전이온도가 증가하여 접착력이 감소하게 된다. 기타 비닐아세테이트와 같은 비닐계 단량체를 일부 공중합 할 수 있는데, 그 사용량은 40 중량 퍼센트 미만이다. 중합 개시제로는 벤조일 페록사이드와 같은 과산화물, 2,2'-아조비스이소부티로니트릴 (AIBN)과 같은 아조화합물 등을 사용할 수 있으며, 기타 라디칼 생성이 가능한 화합물 혹은 이들의 조합을 사용할 수도 있다.The acrylic pressure-sensitive adhesive is prepared by radical polymerization in a solvent with an acrylic monomer as a main component. Acrylic monomers are mainly composed of condensates of aliphatic alcohols such as 2-ethylhexyl acrylate, butyl acrylate and acrylic acid or methacrylic acid, which have a glass transition temperature of less than room temperature. do. In addition, a vinyl compound having a carboxylic acid group, for example, acrylic acid, methacrylic acid, itaconic acid, and the like are copolymerized together to give a synergistic effect to adhesion and provide a crosslinking point for increasing heat resistance. The vinyl compound having a carboxylic acid group is used in the range of 1 to 20% by weight. When the amount is less than this, heat resistance and adhesive strength decrease, and in excessive cases, the glass transition temperature of the pressure-sensitive adhesive increases to decrease the adhesive strength. Some vinyl-based monomers, such as other vinyl acetates, can be copolymerized, and their amount is less than 40 weight percent. As the polymerization initiator, a peroxide such as benzoyl peroxide, an azo compound such as 2,2'-azobisisobutyronitrile (AIBN), or the like can be used. Other compounds capable of generating radicals or a combination thereof can also be used.

용액 중합된 아크릴계 점착제 용액을 도전성 접착제 조성물 제조 시와 제조된 점착제 조성물을 베이스 필름에 코팅 시에는 고분자의 함량. 즉, 고형 함량을 10 내지 70 퍼센트 범위에서 사용하는 것이 바람직하다. 함량이 이보다 적은 경우는 점착제를 코팅한 후 용매 제거에 오랜 시간이 소요되며, 점도가 너무 낮아 필름에 코팅 후 흘러내리는 문제가 발생할 수 있다. 함량이 이 범위 보다 많은 경우는 점도가 너무 높아 코팅이 쉽지 않는 문제가 발생한다. Solution Contents of the polymer when the polymerized acrylic pressure-sensitive adhesive solution is prepared and the pressure-sensitive adhesive composition is coated on the base film. That is, it is preferable to use the solids content in the range of 10 to 70 percent. If the content is less than this, it takes a long time to remove the solvent after coating the pressure-sensitive adhesive, the viscosity is too low may cause a problem flowing down after coating on the film. If the content is more than this range, the viscosity is too high, the coating is not easy to occur.

본 발명에서 그라펜은, 바람직하게는, 매질에 분산하여 용액상의 점착제에 혼합된다. 그라펜은 산화흑연을 순간적으로 고온으로 가열하여 산화흑연을 구성하는 층들을 팽윤 박리시켜 제조한다. 즉, 산화 흑연을 순간적으로 300℃ 이상의 고온으로 가열하면 산화에 의해 생성된 표면의 관능기들이 환원 분해되어 생성되는 이산화탄소와 같은 기체생성물들이 순간적으로 기화하면서 산화흑연의 각 층들이 박리되어 박리된 흑연, 즉 그라펜이 만들어진다. 박리에 사용된 산화흑연의 산화 정도에 따라 박리되는 정도가 달라지며, 추가의 초음파 처리로 박리 정도를 향상시킬 수도 있다. 산화흑연에 부착되었던 극성기들이 분해 이탈되면서 이산화탄소를 발생하고도 일부 극성기가 잔존하여 극성을 띄게 되고 조성물에서 분산을 양호하게 하는 역할을 한다. 그라펜은 카본나노튜브를 평판 상태로 펼친 구조이므로 카본나노튜브에 상응하는 높은 전도도를 가지며 기계적 물성이 우수하고, 두께 대비 가로 및 세로의 길이가 길어 표면적이 아주 큰 물질로 고분자 재료에 분산시키는 경우 소량의 첨가로도 전도도와 기계적 물성의 큰 향상을 얻을 수 있다. 그라펜은 천연에 흔하게 존재하는 흑연을 원료로 사용하면 제조비가 저렴하다. 산화흑연으로부터 제조되는 그라펜은 2θ=26.5°에서의 흑연의 X-선 회절 피크, 그리고 2θ=13° 부근에서의 산화흑연의 X-선 회절피크가 최소화될수록 박리 정도가 큰 것으로 판단할 수 있다. 박리된 흑연의 표면적은 10~3000 m2/g 범위이며, 표면적이 클수록 동일량을 균일하게 분산시켰을 경우 전도도 향상효과가 크게 나타나나, 상대적으로 균일 한 분산이 어려운 경향이 있다. In the present invention, the graphene is preferably dispersed in a medium and mixed with the pressure-sensitive adhesive. Graphene is produced by swelling and peeling the layers constituting the graphite oxide by heating the graphite oxide to a high temperature instantaneously. That is, when graphite oxide is instantaneously heated to a high temperature of 300 ° C. or higher, gaseous products such as carbon dioxide generated by reduction and decomposition of functional groups on the surface generated by oxidation are vaporized instantaneously, and each layer of graphite oxide is peeled off to remove the graphite, That is, graphene is made. The degree of peeling varies depending on the degree of oxidation of the graphite oxide used for peeling, and the degree of peeling may be improved by further ultrasonication. As the polar groups attached to the graphite oxide decompose and decompose, carbon dioxide is generated and some polar groups remain polarized and serve to improve dispersion in the composition. Graphene is a structure in which carbon nanotubes are laid out in a flat state, and thus have high conductivity corresponding to carbon nanotubes, excellent mechanical properties, and long horizontal and vertical lengths compared to thickness, and thus have a very large surface area. Even small additions can achieve significant improvements in conductivity and mechanical properties. Graphene is inexpensive to produce if graphite is used as a raw material. Graphene prepared from graphite oxide can be judged to have a greater degree of peeling as the X-ray diffraction peak of graphite at 2θ = 26.5 ° and the X-ray diffraction peak of graphite oxide at 2θ = 13 ° are minimized. . The surface area of the exfoliated graphite is in the range of 10 to 3000 m 2 / g, and the larger the surface area, the greater the conductivity enhancement effect when uniformly dispersed in the same amount, but relatively uniform dispersion tends to be difficult.

상기 산화흑연은 흑연 분말을 질산, NaClO3, KClO3, KMnO4, 혹은 기타 산화제들을 단독 혹은 조합하여 사용하여 산화하여 제조하며, 전기화학적 방법으로 산화시켜 제조할 수도 있다. 산화흑연 분말 중 탄소/산소의 수의 비는 1~20/1 범위이나 산화정도에 따라 이보다 작거나 큰 값을 가질 수도 있다. 산화흑연 분말은 보통 층간 거리가 7Å 전후이므로 광각 X-선 회절 분석에서 2θ=13° 주위에서 피크를 나타내나, 산화정도와 수분의 흡수 정도에 따라 그 값들은 달라질 수 있다.The graphite oxide is prepared by oxidizing graphite powder using nitric acid, NaClO 3 , KClO 3 , KMnO 4 , or other oxidizing agents alone or in combination, and may be prepared by oxidizing by electrochemical method. The ratio of the number of carbon / oxygen in the graphite oxide powder may be in the range of 1 to 20/1 but may be smaller or larger than this depending on the degree of oxidation. Graphite oxide powder usually has peaks around 2θ = 13 ° in wide-angle X-ray diffraction analysis because the distance between layers is about 7Å, but the values may vary depending on the degree of oxidation and absorption of moisture.

본 발명에서 탄소수 5개 이상의 지방산은 탄소수 5개 이상의 방향족, 지방족, 혹은 지환족 화합물에 카르복실산기가 부착된 화합물이다. 상기 지방산은 방향족 구조가 많을수록 그라펜 표면에 물리적 흡착이 용이하여 본 특허의 목적인 접착력 향상에 유리하다. 대표적인 방향족 카르복실산 구조의 지방산은 파이렌카르복시 산, 파이렌아세트 산, 파이렌부티르 산 등이 있다. 지방족 지방산으로는 스테아르 산, 라우르 산(lauric acid) 등이 있다. 지방산은 그라펜 100 부 당 0.1 내지 200 부 범위에서 사용하는 것이 적당하며, 이보다 적은 경우는 접착력 향상 효과가 뚜렷하지 않으며, 이보다 많은 경우는 추가의 접착력 향상 효과가 미미하다.In the present invention, the fatty acid having 5 or more carbon atoms is a compound having a carboxylic acid group attached to an aromatic, aliphatic, or alicyclic compound having 5 or more carbon atoms. As the fatty acid has more aromatic structure, physical adsorption on the graphene surface is easier, which is advantageous for improving the adhesive force, which is the purpose of the present patent. Representative aromatic carboxylic acid structure fatty acids include pyrenecarboxylic acid, pyreneacetic acid, pyrenebutyric acid and the like. Aliphatic fatty acids include stearic acid and lauric acid. Fatty acid is suitably used in the range of 0.1 to 200 parts per 100 parts of graphene, less than this is not noticeable adhesion improvement effect, more than this is insignificant additional adhesion improvement effect.

지방산을 접착제 조성물에 첨가하는 방법은, 바람직하게는, 그라펜을 20 내지 200중량 배의 용매에 분산시킨 후, 지방산을 첨가하고 강하게 교반하여 그라펜을 표면 처리한 후 첨가한다. 이때 초음파 등을 조사하여 에너지를 부과하면 그라펜의 표면에 부착되는 지방산의 양을 증대시킬 수 있다. 처리시간은 10분 내지 2 시간 정도가 적절하다.The method of adding a fatty acid to the adhesive composition is preferably, after dispersing the graphene in a solvent of 20 to 200 times by weight, the fatty acid is added and then vigorously stirred to add the surface after the graphene is surface treated. In this case, by applying energy by irradiating ultrasonic waves, the amount of fatty acids attached to the surface of the graphene may be increased. The treatment time is preferably about 10 minutes to 2 hours.

상기 가교제는 점착제의 카르복실산과 반응하여 가교를 형성하여 점착제의 내열성을 증대시키고 점착 시트 또는 점착 필름의 제거 시에 점착제 성분이 일체로 제거되게 하는 역할도 수행한다. 이러한 가교제는, 바람직하게는, 분자 내에 2개 이상의 에폭시기, 이소시아네이트기, 아민기, 아지리딘기 등을 가진 화합물이다. 예를 들면 N,N,N',N'-테트라글리시딜-m-자일렌디아아민 (N,N,N',N'-tetraglycidyl-m-xylenediamine), 이소부틸레이티드 멜라민(iso-butylated melamine) 수지, 다관능성 아지리딘 화합물(polyfunctional aziridine) 등이 있다. 또, 금속 킬레이트 결합을 가교에 이용하는 알루미늄 아세틸아세토네이터(aluminum acetylacetonate)와 같은 화합물도 이용될 수 있다.The crosslinker reacts with the carboxylic acid of the pressure-sensitive adhesive to form a crosslink, thereby increasing heat resistance of the pressure-sensitive adhesive and also removing the pressure-sensitive adhesive component upon removal of the pressure-sensitive adhesive sheet or pressure-sensitive adhesive film. Such crosslinking agents are preferably compounds having two or more epoxy groups, isocyanate groups, amine groups, aziridine groups and the like in the molecule. For example N, N, N ', N'- tetraglycidyl - m - xylene, Boutique amine (N, N, N', N'-tetraglycidyl- m -xylenediamine), iso-butylated melamine (iso- butylated melamine), polyfunctional aziridine, and the like. In addition, compounds such as aluminum acetylacetonate, which uses metal chelate bonds for crosslinking, may also be used.

본 발명에서 점착제 조성물은 상기 아크릴계 점착제 용액, 그라펜 분산액 혹은 그라펜을 지방산으로 표면 처리한 분산액 그리고 가교제를 혼합한 후, 용매를 증발시켜 제조한다. 용매 제거 시 온도를 100 ℃ 이상으로 유지하여 점착제의 카르복실산기와 가교제 사이의 반응이 일어나도록 하는 것이 바람직하다.In the present invention, the pressure-sensitive adhesive composition is prepared by mixing the acrylic pressure-sensitive adhesive solution, the graphene dispersion or the dispersion obtained by surface treatment of the graphene with a fatty acid and a crosslinking agent, and then evaporating the solvent. When the solvent is removed, the temperature is preferably maintained at 100 ° C. or higher so that a reaction between the carboxylic acid group of the pressure-sensitive adhesive and the crosslinking agent occurs.

본 발명의 도전성 점착제 조성물은, 바람직하게는, 베이스 필름에 코팅되어 전자부품의 보호용 필름에 사용될 수 있다. 상기 베이스 필름은 일반적으로 고분자 필름으로, 예를 들면, 폴리에틸렌 필름 또는 폴리에스테르 필름 등이다. 이러한 보호용 필름의 이면에는 사용 시에 제거되는 이형 필름을 더 가질 수 있다.The conductive adhesive composition of the present invention is preferably coated on the base film and can be used for the protective film of the electronic component. The base film is generally a polymer film, for example, a polyethylene film or a polyester film. The back side of this protective film may further have a release film removed at the time of use.

본 발명에 의하여 그라펜에 의해 전도성이 효과적으로 향상되면서, 접착력도 향상된 아크릴계 점착제 조성물을 제조할 수 있다.According to the present invention, while the conductivity is effectively improved by the graphene, it is possible to prepare an acrylic pressure-sensitive adhesive composition with improved adhesion.

하기의 실시예에 의하여 본 발명을 예시하여 상세히 설명한다. 다만, 본 발명의 범위가 이러한 실시예에 한정되는 것으로 해석되어서는 아니된다.The following examples illustrate the invention in detail. However, the scope of the present invention should not be construed as being limited to these examples.

제조예Production Example

도전성 점착제 조성물의 각 성분을 다음과 같이 제조한다.Each component of an electroconductive adhesive composition is manufactured as follows.

아크릴계 점착액의 제조Preparation of Acrylic Adhesive

반응조에 에틸아세테이트 144 g, 톨루엔 68 g, 그리고 이타콘산 3.3 g을 투입하고 70 ℃로 가열한다. 2-에틸헥실 아크릴레이트 210 g, 부틸 아크릴레이트 134 g, 비닐아세테이트 44 g, 아크릴산 9.0 g, 그리고 벤조일 페록사이드 0.56 g을 혼합한 액 중 100 g을 반응조에 먼저 투입하고 나머지는 약 1시간 30분에 걸쳐 서서히 투입한다. 투입이 끝난 후 1 시간 정도 반응시키고, 이어서 톨루엔 12 g에 2,2'-아조비스이소부티로니트릴 0.16 g을 녹인 용액을 투입하고 다시 3 시간 더 반응시킨다. 반응 후 톨루엔 252 g, 메탄올 123 g을 추가 투입하여, 고형물 함량이 40 중량 퍼센트인 점착제 용액 1000 g을 제조하였다.144 g of ethyl acetate, 68 g of toluene, and 3.3 g of itaconic acid were added to the reactor and heated to 70 ° C. 100 g of a mixture of 210 g of 2-ethylhexyl acrylate, 134 g of butyl acrylate, 44 g of vinyl acetate, 9.0 g of acrylic acid, and 0.56 g of benzoyl peroxide was first introduced into the reactor and the rest was about 1 hour and 30 minutes. Feed slowly over. After the addition was completed, the reaction was carried out for about 1 hour, and then a solution of 0.16 g of 2,2'-azobisisobutyronitrile was added to 12 g of toluene, followed by further 3 hours of reaction. After the reaction, 252 g of toluene and 123 g of methanol were further added to prepare 1000 g of a pressure-sensitive adhesive solution having a solid content of 40 weight percent.

그라펜의 제조Preparation of Graphene

교반기, 온도계 등이 부착된 500 mL 반응조에 흑연분말 (현대코마사 HC-908, 평균입자크기 8 μm) 5 g과 발연질산 100 mL를 투입하여 0℃를 유지하면서 교반하여 섞고, 이어서 염소산칼륨 40 g을 2 시간에 걸쳐 천천히 투입한 뒤, 상온에서 24 시간 동안 교반하면서 흑연을 산화시켰다. 산화된 흑연은 여과하여 거르고, pH가 6 정도 될 때까지 증류수로 세척하였다. 여과된 산화 흑연은 50 ℃ 진공에서 2일간 건조한 후 파쇄하고 100 메시 채를 통과한 것을 그라펜 제조에 사용하였다. 원소분석결과 원자 조성은 C10O3 .55H1 . 32 이었다.Into a 500 mL reactor equipped with a stirrer, a thermometer, etc., 5 g of graphite powder (Hyundai Cooma Co., Ltd. HC-908, average particle size of 8 μm) and 100 mL of fuming nitric acid were added and stirred while maintaining at 0 ° C., followed by 40 g of potassium chlorate. Was slowly added over 2 hours, and the graphite was oxidized while stirring at room temperature for 24 hours. The oxidized graphite was filtered off and washed with distilled water until the pH was about 6. The filtered graphite oxide was dried for 2 days at 50 ° C. in vacuum, then crushed and passed through 100 mesh. The elemental analysis showed that the atomic composition was C 10 O 3 .55 H 1 . It was 32 .

상기 방법으로 제조된 건조한 산화흑연을 석영관에 넣고 질소 가스를 흘린 후 1100℃의 전기로에 1 분간 투입하여, 흑연의 각 층이 얇은 박판 형태의 대부분 박리된 그라펜을 얻었다. 그라펜의 원자 조성은 C10O0.76H0.91 이었으며, 겉보기 부피는 320 cm3/g 이었다.The dried graphite oxide prepared by the above method was put in a quartz tube, flowed with nitrogen gas, and then put into an electric furnace at 1100 ° C. for 1 minute to obtain graphene in which each layer of graphite was thinly thin. The atomic composition of graphene was C 10 O 0.76 H 0.91 and the apparent volume was 320 cm 3 / g.

그라펜Graphene 분산액의 제조 Preparation of Dispersion

실시예에 따라 각각 그라펜 분말 1 내지 5g을 100 중량 배의 에틸아세테이트에 투입한 후, 상온에서 2 시간 동안 초음파를 부가하여 그라펜 분산액을 얻었다.According to the embodiment, 1 to 5 g of graphene powder were added to 100 wt. Times of ethyl acetate, and then ultrasonic waves were added at room temperature for 2 hours to obtain a graphene dispersion.

표면 처리된 Surface treatment 그라펜의Graphene 분산액의 제조 Preparation of Dispersion

하기 실시예 6 내지 12에 사용하기 위하여 그라펜 분말 4 g을 400 g의 에틸아세테이트에 분산시키고, 파이렌부티르 산의 양을 0.04 내지 0.60g 투입한 후 상온에서 2 시간 동안 초음파를 부가하여 표면 처리된 그라펜 분산액을 얻었다.4 g of graphene powder was dispersed in 400 g of ethyl acetate for use in Examples 6 to 12, 0.04 to 0.60 g of pyrenebutyric acid was added thereto, and surface treatment was performed by adding ultrasonic wave at room temperature for 2 hours. The prepared graphene dispersion was obtained.

비교예Comparative example 1 One

상기 제조예에서 제조된 점착제 용액 250g(고형물 기준으로 100g), 가교제인 N,N,N',N'-테트라글리시딜-m-자일렌디아아민 3g을 1500 rpm으로 10분간 교반하여 혼합한 후, 이형지 위에 혼합액을 부은 후, 120 ℃에서 35 분간 건조하여 두께 75 μm의 점착제 조성물 필름을 얻고, 이를 폴리에틸레테레프탈레이트 (PET) 필름에 압착한 후 이형지를 제거하여, PET 필름에 점착제 조성물이 코팅된 보호 필름을 제조하였다. 250 g of the pressure-sensitive adhesive solution prepared in the above preparation (100 g on a solid basis) and 3 g of a crosslinking agent, N, N, N ', N'-tetraglycidyl- m -xylenediaamine, were stirred and mixed at 1500 rpm for 10 minutes. Then, after pouring the mixed solution on the release paper, and dried at 120 ℃ 35 minutes to obtain a pressure-sensitive adhesive composition film of 75 μm, it was pressed on a polyethylene terephthalate (PET) film and then removed the release paper, the pressure-sensitive adhesive composition to PET film This coated protective film was prepared.

코팅된 점착제 표면 저항을 일본 Simco사의 표면저항계 (ST-3)로 측정하였다.The coated adhesive surface resistance was measured by the surface resistance meter (ST-3) of Simco, Japan.

접착력은 폭 1 cm인 보호 필름을 스테인레스 스틸에 부착하고 666 g 롤러로 10차례 압착한 후 오리엔탈사의 인장시험기 (OTU-2)로 200 mm/min로 180° 박리하면서 측정하였다. 그 물성을 표1에 정리하였다. Adhesion was measured by attaching a 1 cm wide protective film to stainless steel, pressing 10 times with a 666 g roller, and peeling 180 ° at 200 mm / min with an Oriental tensile tester (OTU-2). The physical properties are summarized in Table 1.

실시예Example 1 One

상기 제조예에서 제조된 점착제 용액 250g(고형물 기준으로 100g), 가교제인 N,N,N',N'-테트라글리시딜-m-자일렌디아아민 3g과 그라펜 분산액 101g(그라펜 기준으로 1g)을 1500 rpm으로 10분간 교반하여 혼합한 후, 이형지 위에 혼합액을 부은 후, 120 ℃에서 35 분간 건조하여 두께 75 μm의 점착제 조성물 필름을 얻고, 이를 폴리에틸레테레프탈레이트 (PET) 필름에 압착한 후 이형지를 제거하여, PET 필름에 점착제 조성물이 코팅된 보호 필름을 제조하였다. 250 g of the pressure-sensitive adhesive solution prepared in the preparation example (100 g on a solids basis), 3 g of N, N, N ', N'-tetraglycidyl- m -xylenediaamine as a crosslinking agent and 101 g of a graphene dispersion (based on graphene) 1 g) was stirred at 1500 rpm for 10 minutes, mixed, poured onto a release paper, and then dried at 120 ° C. for 35 minutes to obtain a 75 μm-thick pressure-sensitive adhesive composition film, which was then pressed onto a polyethylene terephthalate (PET) film. After removing the release paper, a protective film coated with a pressure-sensitive adhesive composition on a PET film was prepared.

코팅된 점착제 표면 저항을 일본 Simco사의 표면저항계 (ST-3)로 측정하였다.접착력은 폭 1 cm인 보호 필름을 스테인레스 스틸에 부착하고 666 g 롤러로 10차례 압착한 후 오리엔탈사의 인장시험기 (OTU-2)로 200 mm/min로 180° 박리하면서 측정하였다. 그 물성을 표1에 정리하였다. Coated adhesive surface resistance was measured by Simco, Japan's Surface Resistance Meter (ST-3). Adhesion was measured by attaching a protective film of 1 cm width to stainless steel, pressing it ten times with a 666 g roller, and then using a tensile tester (OTU-) of Oriental. It measured while peeling 180 degrees at 200 mm / min in 2). The physical properties are summarized in Table 1.

실시예Example 2~5 2 ~ 5

상기 제조예에서 제조된 그라펜 분산액을 그라펜 기준으로 각각 2 내지 5g으 로 달리 하는 것을 제외하고 실시예1`과 같이 실시하였다. 조성물의 성분비(용매를 제외한 고형물 기준으로)와 그 물성을 표1에 정리하였다. The graphene dispersion prepared in the above Preparation Example was carried out as in Example 1` except that the graphene dispersion was changed to 2 to 5g, respectively. The composition ratio of the composition (based on the solid matter except the solvent) and its physical properties are summarized in Table 1.

실시예Example 6 6

상기 제조예에서 제조된 점착제 용액 250g(고형물 기준으로 100g), 가교제인 N,N,N',N'-테트라글리시딜-m-자일렌디아아민 3g과 그라펜 4 g을 400 g의 에틸아세테이트에 분산시키고 파이렌부티르 산의 양을 0.04g 가하여 표면처리된 그라펜 분산액 404.04g을 1500 rpm으로 10분간 교반하여 혼합한 후, 이형지 위에 혼합액을 부은 후, 120 ℃에서 35 분간 건조하여 두께 75 μm의 점착제 조성물 필름을 얻고, 이를 폴리에틸렌테레프탈레이트(PET) 필름에 압착하여 전사한 후 이형지를 제거하여, PET 필름에 점착제 조성물이 코팅된 보호 필름을 제조하였다. 250 g of the pressure-sensitive adhesive solution prepared in the above preparation (100 g on a solids basis), 3 g of N, N, N ', N'-tetraglycidyl- m -xylenediaamine and 4 g of graphene, which are crosslinking agents, 400 g of ethyl After dispersing in acetate and adding 0.04 g of pyrenebutyric acid and stirring 404.04 g of the surface-treated graphene dispersion at 1500 rpm for 10 minutes, the mixture was poured onto a release paper, dried at 120 ° C. for 35 minutes, and then dried to a thickness of 75 A pressure-sensitive adhesive composition film was obtained, which was pressed onto a polyethylene terephthalate (PET) film to be transferred, and then the release paper was removed to prepare a protective film coated with the adhesive composition on a PET film.

코팅된 점착제 표면 저항을 일본 Simco사의 표면저항계 (ST-3)로 측정하였다.The coated adhesive surface resistance was measured by the surface resistance meter (ST-3) of Simco, Japan.

접착력은 폭 1 cm인 보호 필름을 스테인레스 스틸에 부착하고 666g 롤러로 10차례 압착한 후 오리엔탈사의 인장시험기 (OTU-2)로 200 mm/min로 180° 박리하면서 측정하였다. 조성물의 물성을 표2에 정리하였다. Adhesion was measured by attaching a protective film having a width of 1 cm to stainless steel, pressing 10 times with a 666 g roller, and peeling 180 ° at 200 mm / min with an Oriental tensile tester (OTU-2). The physical properties of the composition are summarized in Table 2.

실시예Example 7~12 7-12

파이렌부티르산을 각각 0.08 내지 0.60g을 가하여 제조된 표면처리된 그라펜 분산액을 사용하는 것을 제외하고는 실시예 6과 같이 실시하였다. 조성물의 성분비(용매를 제외한 고형물 기준으로)와 그 물성을 표2에 정리하였다. Except for using the surface-treated graphene dispersion prepared by adding 0.08 to 0.60 g of pyrene butyric acid, respectively, it was carried out as in Example 6. The composition ratio of the composition (based on solid matter except solvent) and its physical properties are summarized in Table 2.

실시예Example 13 13

상기 제조예에서 제조된 점착제 용액 250g(고형물 기준으로 100g), 가교제인 N,N,N',N'-테트라글리시딜-m-자일렌디아아민 3g과 그라펜 분산액 404g(그라펜 기준으로 4g)을 1500 rpm으로 10분간 교반하여 혼합한 뒤, 파이렌부티르산 0.04g을 추가로 투입하고 다시 1500 rpm으로 10분간 교반하여 혼합하고, 이형지 위에 혼합액을 부은 후, 120 ℃에서 35 분간 건조하여 두께 75 μm의 점착제 조성물 필름을 얻고, 이를 폴리에틸레테레프탈레이트 (PET) 필름에 압착한 후 이형지를 제거하여, PET 필름에 점착제 조성물이 코팅된 보호 필름을 제조하였다. 250g of the pressure-sensitive adhesive solution prepared in the preparation example (100g on a solids basis), 3g of N, N, N ', N'-tetraglycidyl- m -xylenediaamine as a crosslinking agent and 404g of a graphene dispersion (based on graphene) 4 g) was stirred and mixed at 1500 rpm for 10 minutes, and then 0.04 g of pyrenebutyric acid was further added, and stirred and mixed at 1500 rpm for 10 minutes. The mixed solution was poured on a release paper, dried at 120 ° C. for 35 minutes, and then dried. A 75 μm pressure-sensitive adhesive composition film was obtained, and the resultant was pressed onto a polyethylene terephthalate (PET) film, and then release paper was removed to prepare a protective film coated with a pressure-sensitive adhesive composition on a PET film.

코팅된 점착제 표면 저항을 일본 Simco사의 표면저항계 (ST-3)로 측정하였다.The coated adhesive surface resistance was measured by the surface resistance meter (ST-3) of Simco, Japan.

접착력은 폭 1 cm인 보호 필름을 스테인레스 스틸에 부착하고 666 g 롤러로 10차례 압착한 후 오리엔탈사의 인장시험기 (OTU-2)로 200 mm/min로 180° 박리하면서 측정하였다. 조성물의 물성을 표3에 정리하였다. Adhesion was measured by attaching a 1 cm wide protective film to stainless steel, pressing 10 times with a 666 g roller, and peeling 180 ° at 200 mm / min with an Oriental tensile tester (OTU-2). The physical properties of the composition are summarized in Table 3.

실시예Example 14~16 14-16

파이렌부티르산의 중량을 각각 달리하여 가하는 것을 제외하고는 실시예 13과 같이 실시하였다. 조성물의 성분비(용매를 제외한 고형물 기준으로)와 그 물성을 표3에 정리하였다. The same procedure as in Example 13 was carried out except that the weight of pyrenebutyric acid was added differently. Table 3 shows the composition ratio (based on solid matter except solvent) and the physical properties of the composition.

평가분석Analysis

표 1의 비교예 1과 실시예1 내지 5에서 보면 점착제 조성물 중 그라펜의 함량이 증가함에 따라 표면 저항이 뚜렷이 감소함을 볼 수 있으며 이는 그라펜이 점착제의 전도성을 효과적으로 향상시킴을 보여준다. 그러나 접착력은 그라펜의 함량 이 증가함에 따라 감소함을 볼 수 있다.In Comparative Example 1 and Examples 1 to 5 of Table 1 it can be seen that the surface resistance is significantly reduced as the graphene content increases in the pressure-sensitive adhesive composition, which shows that the graphene effectively improves the conductivity of the pressure-sensitive adhesive. However, it can be seen that the adhesion decreases with increasing graphene content.

표 2의 실시예 6 내지 12에서 보면 파이렌부티르 산으로 표면 처리한 그라펜을 사용하는 경우 처리하지 않은 그라펜을 사용한 경우(실시예 4)와 표면 저항값은 비슷하나 접착력이 증가함을 볼 수 있다. 이러한 접착력 향상 효과는 그라펜을 소량의 파이렌부티르 산으로 처리하여도 뚜렷이 나타남을 실시예 6에서 볼 수 있다. 이것은 탄화수소카르복시산, 특히, 파이렌부티르 산과 같은 방향족 환을 하나 이상 포함한 방향족 카르복시산이 그라펜 구조(평면 다 방향족 환 구조)와의 유사성으로 인하여 그라펜에 흡착되고 이러한 흡착에 의하여 특히 높은 접착력을 발현하는 것으로 추정한다. In Examples 6 to 12 of Table 2, when using graphene surface-treated with pyrenebutyric acid, surface resistance was similar to that of untreated graphene (Example 4), but the adhesion was increased. Can be. This adhesion improvement effect can be seen in Example 6 that even if the graphene is treated with a small amount of pyrene butyric acid. This is because the aromatic carboxylic acid containing at least one aromatic ring such as hydrocarbon carboxylic acid, in particular pyrenebutyric acid, is adsorbed to the graphene due to its similarity to the graphene structure (flat polyaromatic ring structure) and expresses particularly high adhesion by such adsorption. Estimate.

그러나, 그라펜을 먼저 점착제와 섞은 후 파이렌부티르 산을 후첨한 실시예 13 ~16의 경우는 표면저항 값은 비슷하게 감소하나 접착력 향상 효과가 관찰되지 않음을 볼 수 있다. 이러한 결과는 파이렌부티르 산이 초음파 혼합과 같은 방법으로 그라펜의 표면에 잘 흡착된 경우에 접착력 향상 효과를 발현할 수 있음을 보여 준다.However, in Examples 13 to 16, in which graphene was first mixed with the adhesive, followed by pyrenebutyric acid, the surface resistance values were similarly reduced, but no improvement in adhesion was observed. These results show that when pyrenbutyric acid is well adsorbed on the surface of the graphene by the same method as the ultrasonic mixing, it is possible to express an adhesion improving effect.

표 1. 점착제 조성과 물성Table 1. Adhesive composition and physical properties

Figure 112009032789574-pat00001
Figure 112009032789574-pat00001

표 2. 점착제 조성과 물성Table 2. Adhesive Composition and Physical Properties

Figure 112009032789574-pat00002
Figure 112009032789574-pat00002

표 3. 점착제 조성과 물성Table 3. Adhesive Composition and Physical Properties

Figure 112009032789574-pat00003
Figure 112009032789574-pat00003

Claims (6)

아크릴계 점착제 100중량부; 그라펜 분말 0.1 내지 15중량부; 및 가교제 0.1 내지 10 중량부를 포함하는 도전성 점착제 조성물100 parts by weight of an acrylic adhesive; 0.1 to 15 parts by weight of graphene powder; And 0.1 to 10 parts by weight of a crosslinking agent. 제1항에 있어서, 탄소수 5 이상의 지방산 0.001 내지 30중량부를 더 포함하는 도전성 점착제 조성물The conductive pressure-sensitive adhesive composition of claim 1, further comprising 0.001 to 30 parts by weight of a fatty acid having 5 or more carbon atoms. 제1항 또는 제2항에 있어서, 상기 가교제가 분자 내에 2개 이상의 에폭시기, 이소시아네이트기, 아민기 또는 아지리딘기을 가진 화합물인 도전성 점착제 조성물The conductive adhesive composition according to claim 1 or 2, wherein the crosslinking agent is a compound having two or more epoxy groups, isocyanate groups, amine groups or aziridine groups in the molecule. 제2항에 있어서, 상기 지방산을 접착제 조성물에 첨가하는 방법은 그라펜을 20 내지 200배의 용매에 분산시킨 후, 탄소수 5개 이상을 갖는 지방산을 첨가하고 강하게 교반하여 그라펜을 표면 처리하는 방법으로 첨가하는 도전성 점착제 조성물The method of claim 2, wherein the fatty acid is added to the adhesive composition, and the graphene is dispersed in 20 to 200 times the solvent, and then, the fatty acid having 5 or more carbon atoms is added and vigorously stirred to surface-treat the graphene. Conductive adhesive composition to be added 제4항에 있어서, 상기 탄소수 5개 이상을 갖는 지방산이 방향족 지방산이고 상기 방향족 지방산 첨가 시에 초음파를 가하는 도전성 점착제 조성물The conductive adhesive composition according to claim 4, wherein the fatty acid having 5 or more carbon atoms is an aromatic fatty acid and an ultrasonic wave is applied when the aromatic fatty acid is added. 제2항에 있어서, 베이스 필름에 제2항의 상기 도전성 점착제 조성물이 코팅된 전자부품의 보호용 필름The protective film for electronic parts according to claim 2, wherein the conductive adhesive composition of claim 2 is coated on a base film.
KR1020090047931A 2009-06-01 2009-06-01 Conductive adhesive composition Expired - Fee Related KR100964561B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020090047931A KR100964561B1 (en) 2009-06-01 2009-06-01 Conductive adhesive composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020090047931A KR100964561B1 (en) 2009-06-01 2009-06-01 Conductive adhesive composition

Publications (1)

Publication Number Publication Date
KR100964561B1 true KR100964561B1 (en) 2010-06-21

Family

ID=42370194

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020090047931A Expired - Fee Related KR100964561B1 (en) 2009-06-01 2009-06-01 Conductive adhesive composition

Country Status (1)

Country Link
KR (1) KR100964561B1 (en)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101021805B1 (en) 2010-07-21 2011-03-17 권원현 Method for producing conductive polymer compound
KR101258441B1 (en) * 2011-01-14 2013-04-26 전북대학교산학협력단 Adhesives of Improved Electrical and Thermal Conductivities and Method of Using the Same
KR101305438B1 (en) * 2011-05-13 2013-09-06 현대자동차주식회사 Adhesives for Bonding Polyurethane and Aluminium
KR101357604B1 (en) 2010-11-12 2014-02-03 연세대학교 산학협력단 Conductive transparent adhesive composition and adhesive prepared by using the same
KR101378352B1 (en) 2012-11-15 2014-03-28 충남대학교산학협력단 Photo-curing psa composition comprising modified graphene and manufacturing thereof
KR101520437B1 (en) * 2013-05-06 2015-05-14 박기호 Protecting Film with Pressure Sensitive Adhesion and Conductivity
US20220081508A1 (en) * 2018-05-09 2022-03-17 Niagara Bottling, Llc Poly(ethylene terephthalate)-graphene nanocomposites from improved dispersion
EP2844713B1 (en) * 2012-05-03 2023-01-25 PPG Industries Ohio, Inc. Adhesive compositions containing graphenic carbon particles
US11629276B2 (en) 2010-11-19 2023-04-18 Ppg Industries Ohio, Inc. Structural adhesive compositions
CN116218086A (en) * 2023-02-08 2023-06-06 苏州海聚高分子材料有限公司 High-strength conductive polyolefin composite material and preparation method thereof

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008146014A2 (en) 2007-06-01 2008-12-04 Hexcel Composites Limited Improved structural adhesive materials

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008146014A2 (en) 2007-06-01 2008-12-04 Hexcel Composites Limited Improved structural adhesive materials

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101021805B1 (en) 2010-07-21 2011-03-17 권원현 Method for producing conductive polymer compound
KR101357604B1 (en) 2010-11-12 2014-02-03 연세대학교 산학협력단 Conductive transparent adhesive composition and adhesive prepared by using the same
US12031064B2 (en) 2010-11-19 2024-07-09 Ppg Industries Ohio, Inc. Structural adhesive compositions
US11629276B2 (en) 2010-11-19 2023-04-18 Ppg Industries Ohio, Inc. Structural adhesive compositions
US12049574B2 (en) 2010-11-19 2024-07-30 Ppg Industries Ohio, Inc. Structural adhesive compositions
US12043768B2 (en) 2010-11-19 2024-07-23 Ppg Industries Ohio, Inc. Structural adhesive compositions
KR101258441B1 (en) * 2011-01-14 2013-04-26 전북대학교산학협력단 Adhesives of Improved Electrical and Thermal Conductivities and Method of Using the Same
KR101305438B1 (en) * 2011-05-13 2013-09-06 현대자동차주식회사 Adhesives for Bonding Polyurethane and Aluminium
EP2844713B1 (en) * 2012-05-03 2023-01-25 PPG Industries Ohio, Inc. Adhesive compositions containing graphenic carbon particles
KR101378352B1 (en) 2012-11-15 2014-03-28 충남대학교산학협력단 Photo-curing psa composition comprising modified graphene and manufacturing thereof
KR101520437B1 (en) * 2013-05-06 2015-05-14 박기호 Protecting Film with Pressure Sensitive Adhesion and Conductivity
US20220081508A1 (en) * 2018-05-09 2022-03-17 Niagara Bottling, Llc Poly(ethylene terephthalate)-graphene nanocomposites from improved dispersion
US12338320B2 (en) * 2018-05-09 2025-06-24 Niagara Bottling, Llc Poly(ethylene terephthalate)-graphene nanocomposites from improved dispersion
CN116218086B (en) * 2023-02-08 2024-03-05 苏州海聚高分子材料有限公司 High-strength conductive polyolefin composite material and preparation method thereof
CN116218086A (en) * 2023-02-08 2023-06-06 苏州海聚高分子材料有限公司 High-strength conductive polyolefin composite material and preparation method thereof

Similar Documents

Publication Publication Date Title
KR100964561B1 (en) Conductive adhesive composition
Jiao et al. Photothermal healable, stretchable, and conductive MXene composite films for efficient electromagnetic interference shielding
Liu et al. RAFT controlled synthesis of graphene/polymer hydrogel with enhanced mechanical property for pH-controlled drug release
Deshmukh et al. Thermo-mechanical properties of poly (vinyl chloride)/graphene oxide as high performance nanocomposites
KR102022399B1 (en) Carbon nanotube dispersed solution and method for preparing the same
Dao et al. Water-dispersible graphene designed as a Pickering stabilizer for the suspension polymerization of poly (methyl methacrylate)/graphene core–shell microsphere exhibiting ultra-low percolation threshold of electrical conductivity
Tang et al. Highly wrinkled cross‐linked graphene oxide membranes for biological and charge‐storage applications
Quan et al. Facile preparation and thermal degradation studies of graphite nanoplatelets (GNPs) filled thermoplastic polyurethane (TPU) nanocomposites
Ou et al. Covalent functionalization of graphene with poly (methyl methacrylate) by atom transfer radical polymerization at room temperature
Liu et al. Controllable reduction of graphene oxide and its application during the fabrication of high dielectric constant composites
CN103608288A (en) Functional group modified carbon material and manufacturing method thereof
Huynh et al. Polymer coating of graphene oxide via reversible addition–fragmentation chain transfer mediated emulsion polymerization
JP6201164B2 (en) Active energy ray-curable nanocarbon dispersion, method for producing the same, and active energy ray-curable coating agent using the same
Cheng et al. Interfacial π–π interactions induced ultralight, 300° C-stable, wideband graphene/polyaramid foam for electromagnetic wave absorption in both gigahertz and terahertz bands
CN104947227B (en) Polyvinylpyrrolidone/Graphene composite nano-fiber material and preparation method thereof
CN106700110A (en) Preparation method of graphene oxide/nano cellulose/polyvinyl alcohol composite film
CN103842410B (en) Manufacturing method of carbon material-polymer composite material and carbon material-polymer composite material
Peng et al. Building up polymer architectures on graphene oxide sheet surfaces through sequential atom transfer radical polymerization
CN102516829A (en) Ultrasonic-assisted method for preparing polymer functionalized graphene
US20170233621A1 (en) Graphene-containing epoxy adhesives
Manivel et al. Rheological behavior‐Electrical and thermal properties of polypyrrole/graphene oxide nanocomposites
JP5937812B2 (en) Isocyanate group-modified carbon material and method for producing the same
Su et al. Bioinspired, layered GNS/PNF nanocomposite film with electromagnetic interference shielding and fire-retardant properties
KR101520437B1 (en) Protecting Film with Pressure Sensitive Adhesion and Conductivity
Lee et al. Nanocomposite films of poly (vinyl alcohol)-grafted graphene oxide/poly (vinyl alcohol) for gas barrier film applications

Legal Events

Date Code Title Description
A201 Request for examination
PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

A302 Request for accelerated examination
PA0302 Request for accelerated examination

St.27 status event code: A-1-2-D10-D17-exm-PA0302

St.27 status event code: A-1-2-D10-D16-exm-PA0302

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U11-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

FPAY Annual fee payment

Payment date: 20130321

Year of fee payment: 4

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

PN2301 Change of applicant

St.27 status event code: A-5-5-R10-R13-asn-PN2301

St.27 status event code: A-5-5-R10-R11-asn-PN2301

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

FPAY Annual fee payment

Payment date: 20140319

Year of fee payment: 5

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 6

FPAY Annual fee payment

Payment date: 20160404

Year of fee payment: 7

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 7

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000

FPAY Annual fee payment

Payment date: 20170320

Year of fee payment: 8

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 8

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 9

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000

FPAY Annual fee payment

Payment date: 20190601

Year of fee payment: 10

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 10

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 11

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 12

PN2301 Change of applicant

St.27 status event code: A-5-5-R10-R13-asn-PN2301

St.27 status event code: A-5-5-R10-R11-asn-PN2301

PN2301 Change of applicant

St.27 status event code: A-5-5-R10-R13-asn-PN2301

St.27 status event code: A-5-5-R10-R11-asn-PN2301

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 13

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 14

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

PC1903 Unpaid annual fee

St.27 status event code: A-4-4-U10-U13-oth-PC1903

Not in force date: 20240611

Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

PC1903 Unpaid annual fee

St.27 status event code: N-4-6-H10-H13-oth-PC1903

Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

Not in force date: 20240611

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000