KR100971080B1 - Method for manufacturing anaerobic photocurable adhesive including anisotropic conductive balls and circuit connection method for flat panel display using anaerobic photocurable adhesive - Google Patents

Abstract

The present invention relates to a method of manufacturing an anaerobic photocurable adhesive including an anisotropic conductive ball and a circuit connecting method of a flat panel display using an anaerobic photocurable adhesive, wherein a mold plate 31 having an adhesive insertion groove 1a is prepared. And placing the anaerobic photocurable adhesive 32 on the mold plate 31, and the anaerobic photocurable adhesive 32 on the mold plate 31 is inserted into the adhesive of the mold plate 31. Inserting each of the anisotropic conductive balls 33 therein, and attaching the anaerobic photocurable adhesive 32 including the anisotropic conductive balls 33 to the uninterruptible silicon pad 34. It relates to a circuit connection method comprising a step, and connecting the circuit using an anaerobic photocurable adhesive comprising an anisotropic conductive ball produced by the manufacturing method in a circuit connection device.

Anisotropic Conductive Ball, Anaerobic, Photo Curing Adhesive, Mold Plate, Uninterruptible Silicon Pad, Coating Blade

Description

METHOD OF PHOTO HARDENING RESIN WITH ANISOTROPIC ELECTRIC BALL AND BONDING METHOD OF FLAT DISPLAY USING PHOTO HARDENING RESIN OF ANAEROBIC}

The present invention relates to a method of manufacturing an anaerobic photocurable adhesive including an anisotropic conductive ball and a circuit connection method of a flat panel display using an anaerobic photocurable adhesive, and in detail, an anisotropic conductive ball is included in an adhesive insertion groove of a mold plate. A method of manufacturing by inserting an anaerobic photocurable adhesive by printing and using an anaerobic photocurable adhesive including the anisotropic conductive ball, an anaerobic photocurable adhesive that electrically connects and fixes the lower plate of the flat panel display and the driving chip package to each other. The circuit connection method of the used flat panel display.

In the flat panel display which consists of the upper plate and the lower plate of a glass substrate, the drive chip package is connected by connecting the connection terminal part of the said flat panel display and the electrode part of the drive chip package, and the function of a display is realized by driving the said drive chip.

As a general method of joining the connection terminal portion of the flat panel display to the electrode portion of the driving chip package, anisotropic conductive tape is attached to the connection terminal portion and press-bonded to a temperature of about 120 degrees, and then driven on the conductive tape. The conductive tape is thermally cured at a temperature of about 180 degrees in the state where the electrode portion of the chip package is aligned so that the connecting terminal portion of the flat panel display and the electrode portion of the driving chip package are finally compressed and connected.

However, the connection by such a joining method causes an increase in manufacturing cost in that the conductive tape is expensive at about 1 million won per 100m and hardens the conductive tape by high temperature heat. There is a problem of short circuit or disconnection due to an increase, and in addition, the curing time of the conductive tape due to heat is required.

In addition, there is a limit in designing the electrode densely at a narrow pitch because of the problem that the defect rate is increased in the bonding process due to the pitch change of the electrode, which is increased by heat.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and its main purpose is to transmit the ultraviolet rays while allowing the connection terminal portion of the flat panel display and the electrode portion of the driving chip package to be bonded by curing with light of ultraviolet rays rather than thermocompression bonding. The part not used uses an anaerobic photocurable adhesive having a property of curing when the air is blocked, and the electrical connection is made by the anisotropic conductive ball included in the anaerobic photocurable adhesive. The anaerobic photocuring adhesive is inserted into the adhesive insertion groove by printing on a mold plate on which a plurality of adhesive insertion grooves are formed, and then attached with an uninterruptible silicon pad, wherein the anisotropic conductive ball includes an anisotropic conductive ball that forms a colony in the interior. Its purpose is to provide a method for producing anaerobic photocurable adhesives. The.

That is, an anaerobic photocurable adhesive that is cured by ultraviolet light and naturally cured when ultraviolet light is not transmitted without using a conductive tape conventionally used for electrical connection between the connecting terminal portion of the flat panel display and the electrode portion of the driving chip package. The electrical connection is characterized by a method of producing an anaerobic photocurable adhesive comprising an anisotropic conductive ball that is colonized in the photocurable adhesive.

Another object of the present invention is to provide a circuit connecting method for connecting the connecting terminal portion of a flat panel display and the electrode portion of a driving chip package to each other by using an anaerobic photocurable adhesive including an anisotropic conductive ball by the manufacturing method described above.

Anaerobic photo-curing adhesive comprising an anisotropic conductive ball according to the present invention for achieving the above object, preparing a mold plate formed with a plurality of adhesive insertion grooves on one side of the upper surface; Placing an anaerobic photocurable adhesive having a large amount of anisotropic conductive balls mixed on the other side of the mold plate; Anaerobic photocuring adhesive is coated on the mold plate by pushing the anaerobic photocurable adhesive from one side to the other, and the anaerobic photocurable adhesive is inserted into the adhesive insert groove of the mold plate, thereby filling the anaerobic view filled in each of the adhesive insert grooves. Making a colony of a plurality of anisotropic conductive balls in the adhesive; And attaching a plurality of anaerobic photocurable adhesives respectively inserted into the adhesive insertion grooves on the mold plate together with the colony of the anisotropic conductive balls to the lower surface of the uninterruptible silicon pad.

In addition, the plurality of adhesive insertion grooves formed on the mold plate are preferably arranged side by side in a row.

In addition, it is preferable that the plurality of adhesive insertion grooves formed on the mold plate are arranged at regular intervals side by side in a row.

In addition, the plurality of adhesive insertion grooves formed on the mold plate is preferably disposed at the position of the zigzag.

A circuit connecting method for connecting a circuit to a flat panel display consisting of an upper plate and a lower plate of a glass substrate, wherein the anaerobic photocuring adhesive comprising an anisotropic conductive ball attached to a lower surface of an uninterruptible silicon pad is produced by the manufacturing method. Forming a resin layer by applying to a connection terminal provided on a lower plate of the display; Positioning the electrode part of the driving chip package on the connection terminal part of the lower plate formed on the upper surface of the resin layer; Pressing the pressure bonding stand against the lower surface of the lower plate on which the drive chip package is aligned, press down while pressing the drive chip package with the pressure head disposed on the upper side, the anisotropic conductive ball of the resin layer formed on the connection terminal of the lower plate In the anaerobic photocurable adhesive comprising an anaerobic photocurable adhesive spreads around the connection terminal portion, at the same time, the connection portion of the lower plate and the electrode portion of the driving chip package is electrically connected by the anisotropic conductive ball Making it possible; And radiating ultraviolet rays with an ultraviolet irradiation device disposed under the pressure bonding zone to irradiate the ultraviolet rays through the pressure bonding zone to transmit the lower plate, so that the number between the lower plate and the driving chip package around the connection terminal part is caused by the ultraviolet rays. It is characterized in that it comprises a step of curing the ground layer and fixed to each other, and the resin layer between the connection terminal portion of the lower plate that is not transmitted through the ultraviolet ray and the electrode portion of the driving chip package to be fixed to each other by natural curing by the anaerobic nature of the adhesive. .

According to the manufacturing method of the anaerobic photocuring adhesive including the anisotropic conductive ball of the present invention, and the circuit connection method of the flat panel display using the anaerobic photocuring adhesive, the following various effects are exhibited.

1. Since the driving chip package can be bonded by pressing and exposure without heating, the deformation of the flexible printed circuit board due to heat can be eliminated, and the processing time due to heat curing or curing of the hydrophobic resin can be greatly shortened.

2. The effective utilization rate of ultraviolet rays can be improved.

3. It is possible to increase the connection accuracy because it does not heat the driving chip package.

4. It is possible to reduce material cost by applying anaerobic UV curable resin only effective area without using expensive anisotropic conductive tape.

5. The electrode can be prevented from being corroded by acid.

7. It is possible to adjust the positioning accuracy and connection resistance because it combines multiple irradiation with adjustable light pressure and pressure adjustment.

7. After UV curing, the epoxy resin is continuously applied with compressive stress due to hardening shrinkage, thereby preventing the connection resistance from changing.

9. It is possible to increase the utilization efficiency of ultraviolet rays.

10. It is possible to reduce the cost of the substrate and to shorten the manufacturing time due to UV curing.

11, can prevent the malfunction of the driving chip.

12. The area affected by ultraviolet rays is made as small as possible, so that UV bonding is possible even with a wide electrode.

13. Anaerobic photocurable adhesive can be spontaneously cured without UV due to the anaerobic character if only the non-ultraviolet part is blocked by air.

14. The electrical connection of the connection terminal part of the flat panel display and the electrode part of the driving chip package is made by anisotropic conductive balls, so that connection with almost no connection failure is achieved.

Hereinafter, a method of manufacturing an anaerobic photocurable adhesive including an anisotropic conductive ball according to a preferred embodiment of the present invention and a circuit connection method of a flat panel display using an anaerobic photocurable adhesive will be described in detail with reference to the accompanying drawings. .

Figures 1a to 1c shows a flow chart showing a method for producing an anaerobic photocurable adhesive comprising an anisotropic conductive ball in accordance with the present invention.

As shown in Figure 1a to 1c, the method for producing an anaerobic photocurable adhesive comprising an anisotropic conductive ball according to the present invention, preparing a mold plate 31, the adhesive insert groove (1a) is formed, Placing the anaerobic photocurable adhesive 32 on the mold plate 31, and the anaerobic photocurable adhesive 32 on the mold plate 31 in the adhesive insertion groove 31a of the mold plate 31; Each of which is inserted so that the anisotropic conductive ball 33 is included therein, and attaches the anaerobic photocurable adhesive 32 including the anisotropic conductive ball 33 to the uninterruptible silicon pad 34.

In the preparing of the mold plate 31, a plurality of adhesive inserting grooves 31a are formed side by side on one side of the upper surface of the mold plate 31, and the adhesive inserting grooves 31a formed side by side are fixed to the left and right sides. By forming a plurality of continuously at intervals, the adhesive inserting groove 31a is continuously formed in one direction on one side of the upper surface of the mold plate 31.

Here, the adhesive insertion groove (31a) is made of a circular shape is a very small groove 10 ~ 20㎛ diameter, 2 ~ 3㎛ depth.

In the step of placing the anaerobic photocurable adhesive 32 on the mold plate 31, a large amount of anisotropic conductive balls 33 on the other side of the upper surface of the mold plate 31, that is, opposite the adhesive inserting groove 31a. The mixed anaerobic photocuring adhesive 32 is placed.

In the step of inserting the photocurable adhesive 32 into the adhesive insertion groove 31a of the mold plate 31, the anaerobic photocurable adhesive 32 lying on the other side of the upper surface of the mold plate 31 is from one side to the other. Printed while being pushed by the coating blade 35 so as to move, the anaerobic photocurable adhesive 32 is inserted into each of the adhesive inserting groove 31a formed in all directions on one side of the upper surface of the mold plate 31, thereby inserting the respective adhesives. The anaerobic photocuring adhesive 32 is filled in the groove 31a, and 5-8 anisotropic conductive balls 33 having a diameter of 2-3 m are gathered together to form a colony.

In the step of attaching the anaerobic photocurable adhesive 32 to the uninterruptible silicon pad 34, while including a plurality of anisotropic conductive balls 33 forming a colony in each adhesive insertion groove 31a on the mold plate 31 Filled anaerobic photocurable adhesive 32 is lowered on the lower surface of the uninterruptible silicon pad 34 as the uninterruptible silicon pad 34 disposed on the upper portion of the mold plate 31, exactly the upper portion of the adhesive insertion groove 31a descends. The uninterruptible silicon pad 34 is lifted in a state where the anaerobic photocurable adhesive 32 is attached to the lower surface.

By the manufacturing method as described above, the anaerobic photocurable adhesive 32 including the anisotropic conductive balls 33 forming a colony on the bottom surface of the uninterruptible silicon pad 34 continuously adheres in all directions, thereby providing fine spacing from each other. A myriad of very small anaerobic photocuring adhesives 32, placed or glued together, are attached to the bottom surface of the uninterruptible silicon pad 34.

FIG. 2A illustrates a plan view of a photocurable adhesive in which a plurality of anisotropic conductive ball colonies are arranged side by side in a row.

As shown in FIG. 2A, for example, seven anisotropic conductive balls 33 disposed in the anaerobic photocurable adhesive 32 are formed by being attached side by side in a group form in a hexagonal form to form the anaerobic photocurable adhesive. (32) is also attached to the side by side in accordance with, the adhesive insertion groove (31a) formed on the upper surface of the mold plate 31 in order to achieve such a shape is also formed in a state that is arranged side by side in line as described above, such The shape is formed innumerably in succession from side to side at minute intervals on the mold plate 31.

2B illustrates a plan view of a photocurable adhesive in which a plurality of anisotropic conductive ball colonies are arranged at regular intervals in a row.

As shown in FIG. 2B, for example, seven anisotropic conductive balls 33 arranged inside the anaerobic photocurable adhesive 32 are formed in a hexagonal form and are arranged side by side at minute intervals so that the anaerobic The photocurable adhesives 32 are also formed side by side at minute intervals, and the adhesive inserting grooves 31a formed on the upper surface of the mold plate 31 are also lined up at minute intervals as described above. It is formed in a state arranged side by side, this form is formed on the mold plate 31 innumerably a large number in succession to the left and right at a slight interval.

FIG. 2C shows a plan view of a photocurable adhesive in which a plurality of anisotropic conductive ball colonies are disposed in a zigzag position.

As shown in FIG. 2C, for example, seven anisotropic conductive balls 33 arranged in the anaerobic photocurable adhesive 32 form a hexagonal group at a zigzag position along the longitudinal direction at minute intervals. Each of the anaerobic photocurable adhesives 32 is also formed at the position of the zigzag along the longitudinal direction according to the respective anaerobic photocurable adhesives 32, and the adhesive inserting groove 31a formed on the upper surface of the mold plate 31 to achieve such a shape. As described above is formed in a state arranged in each of the zigzag position along the longitudinal direction at a minute interval as described above, this form is formed innumerably a lot in succession from side to side at a minute interval on the mold plate (31).

In this case, since the anisotropic conductive ball 33 is disposed at the zigzag position along the longitudinal direction, the anisotropic conductive ball 33 is slightly deviated in the width direction when electrically connecting the connecting terminal portion of the flat panel display and the electrode portion of the driving chip package. It is possible to solve the problem of bad connection due to out of connection.

Figure 3 shows a schematic cross-sectional state diagram of a circuit connection device of a flat panel display using an anaerobic photocurable adhesive including an anisotropic conductive ball according to the present invention.

As shown in FIG. 3, the circuit connecting apparatus of the flat panel display of the present invention connects the lower plate 1 and the driving chip package 3 of the flat panel display made of the glass substrate of the upper plate 1 and the lower plate 2 to each other. To this end, the resin layer 4, pressure head 5, pressure crimp 6, ultraviolet irradiation device (coated with an anerobic photocurable adhesive containing a anisotropic conductive ball (main component: urethane methacrylate) is formed) 7) is the basic configuration.

The resin layer 4 is formed by applying an anaerobic photocurable adhesive including an anisotropic conductive ball to the connection terminal portion 2a of the lower plate 2 of the flat panel display and the lower plate around the lower plate 2, and the resin layer 4 is The electrode portion 3a of the driving chip package 3 is disposed and disposed on the connection terminal portion 2a of the lower plate 2 to which the lower plate 2 is disposed between the lower plate 2 and the driving chip package 3 and the lower plate ( The resin layer 4 is positioned between the connection terminal portion 2a of 2) and the electrode portion 3a of the driving chip package 3.

The pressing head 5 is disposed on the driving chip package 3 to press the driving chip package 3 downward to press the connecting terminal portion 2a of the lower plate 2 which is pressed against each other by the pressing. And the anisotropic conductive balls of an anaerobic photocurable adhesive including anisotropic conductive balls between the electrode portions 3a of the drive chip package 3.

The pressure crimp (6) is arranged while the upper part is in close contact with the lower surface of the lower plate (2) on which the connection terminal portion (2a) is installed, the bottom surface is made of a multi-layered film reflects heat and transmits ultraviolet rays The permeable membrane 23 is attached.

The ultraviolet irradiator 7 is disposed below the pressure crimp 6 and transmits ultraviolet rays by passing through the lower plate 2 including the connection terminal portion 2a through the pressure crimp 6. The anaerobic photocuring adhesive including the anisotropic conductive ball made of the ground layer 4 is cured.

At this time, since the ultraviolet radiation due to the operation of the ultraviolet irradiation device 7 is made after a predetermined time passes through preheating after operation, the ultraviolet irradiation device 7 is always operated while the circuit connection device of the present invention is in use. This is effective in terms of shortening the process time. Therefore, as shown in FIG. 1, the slide shutter 8 is arrange | positioned between the said press bonding stand 6 and the ultraviolet irradiation device 7, and this slide shutter 8 is made | formed by the slide apparatus 9 By allowing horizontal movement, it is preferable to block ultraviolet rays emitted from the ultraviolet irradiation device 7 as necessary.

In addition, the ultraviolet irradiation device 7 is any one of the LED (LED), lamp (Lamp), Flash (Flash) as an ultraviolet emitting device for emitting ultraviolet rays, and includes an anisotropic conductive ball by the irradiation of ultraviolet rays When the resin layer coated with the anaerobic photocurable adhesive is cured, it is possible to achieve a preferable bonding so that the curing shrinkage ratio is in the range of 3 to 10%.

In addition, as shown in FIG. 1, the bottom surface of the pressurizing head 5 attaches an ultraviolet reflecting mirror surface having a concave-convex shape to pass through the lower plate 2 of the flat panel display and is irradiated to the pressurizing head 5. The anaerobic photocuring adhesive including anisotropic conductive balls is reflected by ultraviolet rays, and the connection terminal portion 2a of the lower plate 2 with the resin layer 4 interposed therebetween and the electrode portion 3a of the driving chip package 3. When irradiated back to the junction of), irradiation of ultraviolet rays is made more efficiently, and the irregularities of the surface of the ultraviolet reflecting mirror are specifically a shape in which the shape of the shape and the shape of the shape are repeated or the shape of the shape and the shape of the shape is repeated. By doing so, the ultraviolet rays can be scattered and reflected smoothly.

Subsequently, ultraviolet rays are irradiated to the connection terminal portion 2a of the lower plate 2 and the electrode portion 3a portion of the driving chip package 3 with the ultraviolet dissipation mechanism of the ultraviolet irradiation device 7, but the connection facing each other is performed. The anaerobic photocurable adhesive including anisotropic conductive balls positioned between the anisotropic conductive balls 33 which are not in contact with each other between the terminal portion 2a and the electrode portion 3a does not receive ultraviolet rays and blocks air. Therefore, if air is not supplied due to the anaerobic nature, the hardening is spontaneously cured according to the hardening property to fix the driving chip package 3 to the lower plate 2, but only the lower plate 2 is Since the coupling force for fixing the driving chip package 3 may be regarded as somewhat weak, the anaerobic structure includes the connection terminal portion 2a of the lower plate 2 and the anisotropic conductive ball around the electrode portion 3a of the driving chip package 3. Photocurable adhesive of the ultraviolet light By hardening by irradiation, the driving chip package 3 is more securely coupled to the lower plate 2 to be fixed.

Next is a circuit connection method using an anaerobic photocurable adhesive comprising an anisotropic conductive ball prepared by the method for producing an anaerobic photocurable adhesive comprising the anisotropic conductive ball of the present invention as described above in a circuit connecting apparatus. It demonstrates in detail.

Referring to FIGS. 1A to 3, first, an anaerobic photocuring adhesive 32 including an anisotropic conductive ball 33 attached to a bottom surface of an uninterruptible silicon pad 34 is prepared by the manufacturing method of the flat panel display. The resin layer 4 is formed by applying to the connecting terminal portion 2a provided on the lower plate 2.

Next, the resin layer 4 is positioned on the connection terminal portion 2a of the lower plate 2 formed on the upper surface thereof so that the electrode portions 3a of the driving chip package 3 can be aligned and connected to each other.

Next, the pressure pressing stand 6 is brought into close contact with the lower surface of the lower plate 2 on which the driving chip package 3 is positioned, and the driving chip package 3 is pressed by the pressing head 5 disposed above. While pressing down, in the anaerobic photocuring adhesive comprising the anisotropic conductive ball of the resin layer 4 formed in the connecting terminal portion 2a of the lower plate 2, the anaerobic photocuring adhesive 32 is connected to the connecting terminal portion 2a. ), And the anisotropic conductive ball 33 allows the connection terminal portion 2a of the lower plate 2 and the electrode portion 3a of the driving chip package 3 to be electrically connected to each other. .

Next, the ultraviolet rays are radiated by the ultraviolet irradiation device 7 disposed below the pressing plate 6 to irradiate the ultraviolet rays to penetrate the lower plate 2 through the pressing plate 6, thereby generating the ultraviolet rays. By curing the anaerobic photocuring adhesive including the resin layer 4, that is, the anisotropic conductive ball, between the lower plate 2 and the driving chip package 3 around the connecting terminal portion 2a, and fixed to each other. The photocurable adhesive including the resin layer 4, that is, the anisotropic conductive ball, between the connection terminal portion 2a of the lower plate 2, which is not transmitted, and the electrode portion 3a of the driving chip package 3, is anaerobic of the adhesive. By fixing to each other by the natural curing, the connection of the circuit is made with an anaerobic photocurable adhesive comprising an anisotropic conductive ball prepared according to the present invention.

Although the present invention has been described with reference to the embodiments shown in the accompanying drawings, this may be regarded as exemplary, and a person of ordinary skill in the art may conceive various modifications and equivalent embodiments therefrom. It should be understood that such equivalent embodiments are also included within the claims of the present invention. Therefore, the true scope of protection of the present invention should be determined only by the appended claims.

1a to 1c is a flow chart showing a method for producing an anaerobic photocurable adhesive comprising an anisotropic conductive ball according to the present invention

2A is a plan view of a photocurable adhesive in which a plurality of anisotropic conductive ball communities are arranged side by side in a row;

2B is a plan view of a photocurable adhesive in which a plurality of anisotropic conductive ball colonies are arranged at regular intervals in a row;

2C is a plan view of a photocurable adhesive in which a plurality of anisotropic conductive ball colonies are disposed in a zigzag position;

Figure 3 is a schematic cross-sectional state diagram of a circuit connection device of a flat panel display using an anaerobic photocurable adhesive including an anisotropic conductive ball according to the present invention

<Explanation of symbols for the main parts of the drawings>

1: top plate 2: bottom plate

2a: connection terminal 3: drive chip package

3a: electrode portion 4: resin layer

5 pressure head 6 pressure crimp

7: ultraviolet irradiation device 8: slide shutter

9: slide device 23: UV-permeable membrane

31: Mold plate 31a: adhesive insert groove

32: Anaerobic Photocuring Adhesive 33: Anisotropic Conductive Ball

34: uninterruptible silicon pad 35: coated blade

Claims (5)

Preparing a mold plate having a plurality of adhesive insertion grooves formed on one side of an upper surface thereof; Placing an anaerobic photocurable adhesive having a large amount of anisotropic conductive balls mixed on the other side of the mold plate; Anaerobic photocuring adhesive is printed on the mold plate by pushing the anaerobic photocurable adhesive from one side to the other, and the anaerobic photocurable adhesive is inserted into the adhesive insert groove of the mold plate, thereby filling the anaerobic view filled in the respective adhesive insert grooves. Making a colony of a plurality of anisotropic conductive balls in the adhesive; And Attaching a plurality of anaerobic photocurable adhesives, which are respectively inserted together with a colony of anisotropic conductive balls in the adhesive insertion grooves on the mold plate, to the bottom surface of the uninterruptible silicon pad; Method for producing an anaerobic photocurable adhesive comprising an anisotropic conductive ball, characterized in that consisting of. The method of claim 1, wherein the plurality of adhesive insertion grooves formed on the mold plate are arranged side by side in a row. The method of claim 1, wherein the plurality of adhesive insertion grooves formed on the mold plate are arranged at a predetermined interval in parallel with each other. The method of claim 1, wherein the plurality of adhesive insertion grooves formed on the mold plate are disposed at zigzag positions. In a circuit connection method for connecting a circuit to a flat panel display consisting of a top plate and a bottom plate of a glass substrate, Resin layer by applying an anaerobic photocurable adhesive comprising an anisotropic conductive ball attached to the lower surface of the uninterruptible silicon pad by the manufacturing method of any one of claims 1 to 4 in the connection terminal provided on the lower plate of the flat panel display Forming a; Positioning the electrode part of the driving chip package on the connection terminal part of the lower plate formed on the upper surface of the resin layer; Pressing the pressure bonding stand against the lower surface of the lower plate on which the drive chip package is aligned, press down while pressing the drive chip package with the pressure head disposed on the upper side, the anisotropic conductive ball of the resin layer formed on the connection terminal of the lower plate In the anaerobic photocurable adhesive comprising an anaerobic photocurable adhesive spreads around the connection terminal portion, and the electrical connection between the connection terminal portion of the lower plate and the electrode portion of the driving chip package by the anisotropic conductive ball step; And The resin layer between the lower plate around the connection terminal portion and the driving chip package by the ultraviolet rays by radiating ultraviolet rays by the ultraviolet irradiation device disposed under the pressure bonding zone and irradiating the ultraviolet rays to pass through the lower plate through the pressure bonding zone. Curing and fixing the resin layers, and fixing the resin layers between the connection terminal portions of the lower plate through which the ultraviolet rays are not transmitted and the electrode portions of the driving chip package are naturally cured by the anaerobic nature of the adhesive; A circuit connection method of a flat panel display using an anaerobic photocurable adhesive comprising an anisotropic conductive ball comprising a.

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